Material Content Data Sheet Sales Product Name IPW50R199CP MA# MA000908624 Package PG-TO247-3-41 Issued 29. August 2013 Weight* 6048.29 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal non noble metal noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel antimony silver tin 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7440-36-0 7440-22-4 7440-31-5 8.809 0.15 3.972 0.07 wire encapsulation leadfinish plating solder *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.15 1456 1456 657 1.192 0.02 3967.074 65.57 65.66 655900 197 656754 3.929 0.06 0.06 650 650 19.982 0.33 3304 379.655 6.28 1598.546 26.43 33.04 264297 62771 330372 31.874 0.53 0.53 5270 5270 29.065 0.48 0.48 4805 4805 0.420 0.01 1.049 0.02 2.728 0.05 69 173 0.08 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 451 693 1000000