Marktech MT3101N-UR-A Round led lamp Datasheet

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SPECIFICATION
PART NO. : M7185$
.0mm ROUND LED LAMP
ATTENTION
OBSERVE PRECAUTION
FOR HANDLING
ELECTRO STATIC
SENSITIVE
DEVICES
3.0 mm ROUND LED
LAMP
07185$
Description
This hyper red lamp is made with AlGaInP chip and water clear epoxy
resin.
3.0
1.0MAX.
A
K
Notes:
1. All dimensions are in mm.
2. Tolerance is±0.25mm unless otherwise noted.
Description
LED Chip
Part
No.
Material
MT3101N-UR-A
AlGaInP
Emitting Color
Hyper red
VER.: 01
Lens Color
Water clear
Date: 2013/08/02
Page: 1/
3.0 mm ROUND LED
LAMP
07185$
Absolute Maximum Ratings at Ta=25℃
Parameter
Symbol
Rating
Unit
Power Dissipation
PD
75
mW
Reverse Voltage
VR
5
V
D.C. Forward Current
If
30
mA
Reverse (Leakage) Current
Ir
100
μA
If(Peak)
100
mA
Operating Temperature Range
Topr.
-25 to +85
℃
Storage Temperature Range
Tstg.
-40 to +100
℃
Soldering Temperature(1.6mm from body)
Tsol.
Electrostatic discharge
ESD.
Peak Current(1/10Duty Cycle,0.1ms Pulse Width.)
Dip Soldering : 260℃ for 5 sec.
Hand Soldering : 350℃ for 3 sec.
6000
V
Electrical and Optical Characteristics:
Parameter
Symbol
Condition
Min.
Typ.
Luminous Intensity
IV
If=20mA
3000
7000
Forward Voltage
Vf
If=20mA
2.1
Peak Wavelength
λp
If=20mA
632
nm
Dominant Wavelength
λd
If=20mA
625
nm
Reverse (Leakage) Current
Ir
Vr=5V
2θ1/2
If=20mA
30
deg
∆λ
If=20mA
20
nm
Viewing Angle
Spectrum Line Halfwidth
Max.
Unit
mcd
2.5
100
V
µA
Notes:1. The datas tested by IS tester.
2. Customer’s special requirements are also welcome.
VER.: 01
Date: 2013/08/02
Page: 2/
3.0 mm ROUND LED
LAMP
07185$
Typical Electrical / Optical Characteristics Curves :
10000
Relative Luminous Intensity
Forward Current IF(mA)
50
40
30
20
10
1.2
1.6
2.0
2.4
2.8
8000
6000
4000
2000
3.0
0.0
Applied Voltage (V)
FORWARD CURRENT VS.APPLIED VOLTAGE
30.0
FORWARD CURRENT VS. LUMINOUS INTENSITY
0°
50
Forward Current IF(mA)
20.0
10.0
Forward Current (mA)
20°
10°
30°
40
40°
30
1.0
20
60°
0.8
10
0
50°
0.9
20
40
60
Temperature(°C)
80
100
70°
80°
90°
0.7
0.5
FORWARD CURRENT VS. AMBIENT TEMPERATURE
0.3
0.1
0.2
0.4
0.6
RADIATION DIAGRAM
VER.: 01
Date: 2013/08/02
Page: 3/
3.0 mm ROUND LED
LAMP
07185$
Precautions:
TAKE NOTE OF THE FOLLOWING IN USE OF LED
1.
Temperature in use
Since the light generated inside the LED needs to be emitted to outside efficiently, a resin with
high light transparency is used; therefore, additives to improve the heat resistance or moisture
resistance (silica gel , etc) which are used for semiconductor products such as transistors
cannot be added to the resin.
Consequently, the heat resistant ability of the resin used for LED is usually low; therefore,
please be careful on the following during use.
Avoid applying external force, stress, and excessive vibration to the resins and terminals at
high temperature. The glass transition temperature of epoxy resin used for the LED is
approximately 120-130℃.
At a temperature exceeding this limit, the coefficient of liner expansion of the resin doubles or
more compared to that at normal temperature and the resin is softened.
If external force or stress is applied at that time, it may cause a wire rupture.
2. Soldering
Please be careful on the following at soldering.
After soldering, avoided applying external force, stress, and excessive vibration until the
products go to cooling process (normal temperature), <Same for products with terminal leads>
(1)
Soldering measurements:
Distance between melted solder side to bottom of resin shall be 1.6mm or longer.
(2)
Dip soldering :
Pre-heat: 90℃ max. (Backside of PCB), Within 60 seconds.
Solder bath: 260± 5℃ (Solder temperature), Within 5 seconds.
(3)
Hand soldering: 350℃ max. (Temperature of soldering iron tip), Within 3 seconds.
3. Insertion
Pitch of the LED leads and pitch of mounting holes need to be same.
4. Others
Since the heat resistant ability of the LED resin is low, SMD components are used on the same
PCB, please mount the LED after adhesive baking process for SMD components. In case
adhesive baking is done after LED lamp insertion due to a production process reason, make
sure not to apply external force, stress, and excessive vibration to the LED and follow the
conditions below.
Baking temperature: 120℃ max.
Baking time: Within 60 seconds.
If soldering is done sequentially after the adhesive baking, please perform the soldering after cooling down
the LED to normal temperature.
VER.: 01
Date: 2013/08/02
Page: 4/
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