Fairchild FNE41060 Smart power module Datasheet

Motion-SPM
FNE41060
TM
Smart Power Module
Features
General Description
• 600V-10A 3-phase IGBT inverter bridge including control ICs
for gate driving and protection
It is an advanced motion-smart power module (Motion-SPMTM)
that Fairchild has newly developed and designed to provide
very compact and high performance ac motor drives mainly targeting low-power inverter-driven application like air conditioner
and washing machine. It combines optimized circuit protection
and drive matched to low-loss IGBTs. System reliability is further enhanced by the integrated under-voltage lock-out protection, short-circuit protection, and temperature monitoring. The
high speed built-in HVIC provides opto-coupler-less single-supply IGBT gate driving capability that further reduce the overall
size of the inverter system design. Each phase current of
inverter can be monitored separately due to the divided negative dc terminals.
• Easy PCB layout due to built-in bootstrap diode and VS output
• Divided negative dc-link terminals for inverter current sensing
applications
• Single-grounded power supply due to built-in HVIC
• Built-in thermistor for over-temperature monitoring
• Isolation rating of 2000Vrms/min.
Applications
Additional Information
• AC 100V ~ 253V three-phase inverter drive for small power
ac motor drives
For further infomation, please see AN-9070 and FEB306-001 in
http://www.fairchildsemi.com
• Home appliances applications like air conditioner and washing machine
Figure 1.
©2010 Fairchild Semiconductor Corporation
FNE41060 Rev. C
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FNE41060 Smart Power Module (Samsung Refrigerator only)
September 2010
FNE41060 Smart Power Module (Samsung Refrigerator only)
Integrated Power Functions
• 600V-10A IGBT inverter for three-phase DC/AC power conversion (Please refer to Figure 3)
Integrated Drive, Protection and System Control Functions
• For inverter high-side IGBTs: Gate drive circuit, High voltage isolated high-speed level shifting
Control circuit under-voltage (UV) protection
• For inverter low-side IGBTs: Gate drive circuit, Short circuit protection (SC)
Control supply circuit under-voltage (UV) protection
• Fault signaling: Corresponding to UV (Low-side supply) and SC faults
• Input interface: 3.3/5V CMOS compatible, Schmitt trigger input
Pin Configuration
Top View
Figure 2.
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FNE41060 Smart Power Module (Samsung Refrigerator only)
Pin Descriptions
Pin Number
Pin Name
Pin Description
1
N.C.
No Connection
2
N.C.
No Connection
3
P
4
U
Output for U Phase
5
V
Output for V Phase
6
W
Output for W Phase
7
NU
Negative DC–Link Input for U Phase
Positive DC–Link Input
8
NV
Negative DC–Link Input for V Phase
9
NW
Negative DC–Link Input for W Phase
10
CSC
Capacitor (Low-pass Filter) for Short-Current Detection Input
11
VFO
Fault Output
12
IN(WL)
Signal Input for Low-side W Phase
13
IN (VL)
Signal Input for Low-side V Phase
14
IN(UL)
Signal Input for Low-side U Phase
15
COM
Common Supply Ground
16
VCC(L)
Low-Side Common Bias Voltage for IC and IGBTs Driving
17
V CC(H)
High-Side Common Bias Voltage for IC and IGBTs Driving
18
IN(WH)
Signal Input for High-side W Phase
19
IN (VH)
Signal Input for High-side V Phase
20
IN(UH)
Signal Input for High-side U Phase
21
VS(W)
High-side Bias Voltage Ground for W Phase IGBT Driving
22
VB(W)
High-side Bias Voltage for W Phase IGBT Driving
23
V S(V)
High-side Bias Voltage Ground for V Phase IGBT Driving
24
V B(V)
High-side Bias Voltage for V Phase IGBT Driving
25
VS(U)
High-side Bias Voltage Ground for U Phase IGBT Driving
26
VB(U)
High-side Bias Voltage for U Phase IGBT Driving
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FNE41060 Smart Power Module (Samsung Refrigerator only)
Internal Equivalent Circuit and Input/Output Pins
N.C. (1)
N.C. (2)
(26) VB(U)
(25) VS(U)
(24) VB(V)
(23) VS(V)
(22) VB(W)
(21) VS(W)
(20) IN(UH)
(19) IN(VH)
(18) IN(WH)
(17) VCC(H)
(16) VCC(L)
(15) COM
(14) IN(UL)
(13) IN(VL)
(12) IN(WL)
(11) VFO
(10) CSC
P (3)
UVB
UVS
OUT(UH)
VVB
UVS
U(4)
VVS
WVB
WVS
IN(UH)
OUT(VH)
VVS
V (5)
IN(VH)
IN(WH)
VCC
OUT(WH)
COM
WVS
W(6)
VCC
OUT(UL)
COM
NU (7)
IN(UL)
IN(VL)
IN(WL)
OUT(VL)
NV (8)
VFO
C(SC)
OUT(WL)
NW (9)
Note:
1) Inverter high-side is composed of three IGBTs, freewheeling diodes and one control IC for each IGBT.
2) Inverter low-side is composed of three IGBTs, freewheeling diodes and one control IC for each IGBT. It has gate drive and protection functions.
3) Inverter power side is composed of four inverter dc-link input terminals and three inverter output terminals.
Figure 3.
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Unless Otherwise Specified)
Inverter Part
Symbol
VPN
V PN(Surge)
Parameter
Conditions
Rating
Units
Supply Voltage
Applied between P- NU, N V, NW
450
V
Supply Voltage (Surge)
Applied between P- NU, N V, NW
500
V
600
V
VCES
Collector-emitter Voltage
IO,25
Output Phase Current
TC = 25°C, TJ < 150°C (Note 1)
10
A
IO,100
Output Phase Current
TC = 100°C, TJ < 150°C (Note 1)
5
A
Ipk
Output Peak Phase Current
TC = 25°C, TJ < 150°C, Under 1ms Pulse Width
15
A
PC
Collector Dissipation
TC = 25°C per One Chip
32
W
TJ
Operating Junction Temperature
(Note 2)
-40 ~ 150
°C
Rating
Units
Note:
1. Sinusoidal PWM at VPN=300V, VCC=VBS=15V, TJ < 150°℃, FSW=20kHz, MI=0.9, PF=0.8
2. The maximum junction temperature rating of the power chips integrated within the SPM is 150°C.
Control Part
Symbol
Parameter
Conditions
VCC
Control Supply Voltage
Applied between V CC(H), V CC(L) - COM
20
V
VBS
High-side Control Bias
Voltage
Applied between VB(U) - VS(U), V B(V) - VS(V),
VB(W) - VS(W)
20
V
VIN
Input Signal Voltage
Applied between IN(UH), IN(VH), IN(WH), IN(UL), -0.3~VCC +0.3
IN(VL), IN(WL) - COM
VFO
Fault Output Supply Voltage
Applied between V FO - COM
IFO
Fault Output Current
Sink Current at VFO Pin
VSC
Current Sensing Input Voltage
Applied between CSC - COM
V
-0.3~VCC +0.3
V
1
mA
-0.3~VCC +0.3
V
Rating
Units
600
V
0.5
A
1
A
-40 ~ 150
°C
Rating
Units
400
V
-40 ~ 125
°C
2000
Vrms
Bootstrap Diode Part
Symbol
Parameter
VRRM
Maximum Repetitive Reverse Voltage
Conditions
IF
Forward Current
TC = 25°C
IFP
Forward Current (Peak)
TC = 25°C, Under 1ms Pulse Width
TJ
Operating Junction Temperature
Total System
Symbol
VPN(PROT)
Parameter
Self Protection Supply Voltage Limit
(Short Circuit Protection Capability)
TSTG
Storage Temperature
V ISO
Isolation Voltage
Conditions
VCC = VBS = 13.5 ~ 16.5V
TJ = 150°C, Non-repetitive, less than 2ms
60Hz, Sinusoidal, AC 1 minute, Connection
Pins to heat sink plate
Thermal Resistance
Symbol
Rth(j-c)Q
Rth(j-c)F
Parameter
Junction to Case Thermal
Resistance
Conditions
Min.
Typ. Max. Units
Inverter IGBT part (per 1/6 module)
-
-
3.8
°C/W
Inverter FWD part (per 1/6 module)
-
-
4.8
°C/W
Note:
3. For the measurement point of case temperature(TC), please refer to Figure 2.
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Absolute Maximum Ratings (TJ = 25°C,
Inverter Part
Symbol
Parameter
VCE(SAT)
Collector-Emitter Saturation
Voltage
VCC = VBS = 15V
VIN = 5V
FWD Forward Voltage
VIN = 0V
Switching Times
VPN = 300V, V CC = VBS = 15V, IC = 5A
TJ = 25°C
VIN = 0V « 5V, Inductive Load
(Note 4)
VF
HS
tON
Conditions
tC(ON)
tOFF
Min.
Typ.
IC = 5A, TJ = 25°C
-
1.5
2.0
V
IF = 5A, TJ = 25°C
-
1.5
2.0
V
0.45
0.75
1.25
ms
-
0.20
0.45
ms
-
0.70
1.20
ms
-
0.15
0.40
ms
-
0.15
-
ms
0.35
0.65
1.15
ms
tC(OFF)
trr
LS
tON
VPN = 300V, V CC = VBS = 15V, IC = 5A
TJ = 25°C
VIN = 0V « 5V, Inductive Load
(Note 4)
Max. Units
-
0.15
0.40
ms
-
0.65
1.15
ms
tC(OFF)
-
0.15
0.40
ms
trr
-
0.15
-
ms
-
-
1
mA
tC(ON)
tOFF
ICES
Collector-Emitter
Leakage Current
VCE = VCES
Note:
4. tON and tOFF include the propagation delay time of the internal drive IC. tC(ON) and tC(OFF) are the switching time of IGBT itself under the given gate driving condition internally.
For the detailed information, please see Figure 4.
100% IC 100% IC
t rr
V CE
IC
IC
V IN
V IN
t ON
10% IC
V IN(ON )
V CE
tO FF
tC(O N)
90% IC
t C(OFF)
V IN (OF F)
10% V C E
10% V C E
10% I C
(b) turn-off
(a) turn-on
Figure 4. Switching Time Definition
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Electrical Characteristics (TJ = 25°C, Unless Otherwise Specified)
Inductive Load, VPN=300V, VCC=15V, TJ=25℃
400
IGBT Turn-ON, Eon
IGBT Turn-OFF, Eoff
300
FRD Turn-OFF, Erec
250
200
150
100
IGBT Turn-OFF, Eoff
FRD Turn-OFF, Erec
300
250
200
150
100
50
0
IGBT Turn-ON, Eon
350
SWITCHING LOSS, ESW [uJ]
SWITCHING LOSS, ESW [uJ]
350
Inductive Load, VPN=300V, VCC=15V, TJ=150℃
400
50
0
1
2
3
4
0
5
0
1
2
3
4
5
COLLECTOR CURRENT, Ic [AMPERES]
COLLECTOR CURRENT, Ic [AMPERES]
Figure 5. Switching Loss Characteristics
Control Part
Symbol
Parameter
Min.
Typ.
IQCCH
Quiescent V CC Supply
Current
VCC(H) = 15V, IN(UH,VH,WH) = 0V
V CC(H) - COM
-
-
0.10
mA
VCC(L) = 15V, IN (UL,VL, WL) = 0V
V CC(L) - COM
-
-
2.65
mA
Operating VCC Supply
Current
VCC(H) = 15V, fPWM = 20kHz, V CC(H) - COM
duty=50%, applied to one PWM
signal input for High-side
-
-
0.15
mA
VCC(L) = 15V, fPWM = 20kHz, V CC(L) - COM
duty=50%, applied to one PWM
signal input for Low-side
-
-
3.65
mA
IQCCL
IPCCH
IPCCL
Conditions
Max. Units
IQBS
Quiescent V BS Supply
Current
VBS = 15V, IN(UH, VH, WH) = 0V
V B(U) - VS(U), VB(V) V S(V), V B(W) - VS(W)
-
-
0.30
mA
IPBS
Operating VBS Supply
Current
VCC = V BS = 15V, fPWM = 20kHz, V B(U) - VS(U), VB(V) duty=50%, applied to one PWM V S(V), V B(W) - VS(W)
signal input for High-side
-
-
2.00
mA
VFOH
Fault Output Voltage
VSC = 0V, V FO Circuit: 4.7kW to 5V Pull-up
4.5
-
-
V
VSC = 1V, V FO Circuit: 4.7kW to 5V Pull-up
-
-
0.5
V
VCC = 15V (Note 5)
0.45
0.5
0.55
V
Detection Level
10.5
-
13.0
V
VFOL
VSC(ref)
UVCCD
UVCCR
UV BSD
Short Circuit Trip Level
Supply Circuit
Under-Voltage
Protection
UV BSR
tFOD
Fault-out Pulse Width
VIN(ON)
ON Threshold Voltage
VIN(OFF)
OFF Threshold Voltage
Reset Level
11.0
-
13.5
V
Detection Level
10.0
-
12.5
V
Reset Level
10.5
-
13.0
V
30
-
-
ms
-
-
2.6
V
0.8
-
-
V
Applied between IN(UH), IN (VH), IN (WH), IN(UL), IN(VL),
IN(WL) - COM
Note:
5. Short-circuit current protection is functioning only at the low-sides.
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FNE41060 Smart Power Module (Samsung Refrigerator only)
Switching Loss (Typical)
Symbol
Parameter
Conditions
Min.
Typ.
Max.
Units
VF
Forward Voltage
IF = 0.1A, TC = 25°C
-
2.5
-
V
trr
Reverse Recovery Time
IF = 0.1A, TC = 25°C
-
80
-
ns
Built in Bootstrap Diode VF-IF Characteristic
1.0
0.9
0.8
0.7
IF [A]
0.6
0.5
0.4
0.3
0.2
0.1
0.0
TC=25℃
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
VF [V]
Note:
6. Built in bootstrap diode includes around 15 Ω resistance characteristic.
Figure 6. Built in Bootstrap Diode Characteristic
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FNE41060 Smart Power Module (Samsung Refrigerator only)
Bootstrap Diode Part
Symbol
V PN
Parameter
Value
Conditions
Supply Voltage
Units
Min.
Typ.
Max.
-
300
400
V
Applied between P - NU , NV, N W
VCC
Control Supply Voltage
Applied between V CC(H), VCC(L)-COM
13.5
15
16.5
V
VBS
High-side Bias Voltage
Applied between VB(U)-VS(U), V B(V)-VS(V) ,VB(W)-VS(W)
13.0
15
18.5
V
dVCC/dt,
dVBS/dt
Control supply variation
-1
-
1
V/ms
1.5
-
-
ms
-
20
kHz
4
V
ms
tdead
Blanking Time for
Preventing Arm-short
For Each Input Signal
fPWM
PWM Input Signal
-40°C < TJ < 150°C
-
V SEN
Voltage for Current
Sensing
Applied between N U, NV, N W - COM
(Including surge voltage)
-4
Minimun Input Pulse
Width
(Note 7)
0.5
-
-
0.5
-
-
PWIN(ON)
P WIN(OFF)
Note:
7. SPM might not make response if input pulse width is less than the recommanded value.
Allowable Maximum Output Current
Allowable Output Current, IOrms [Arms]
10
9
fSW=5kHz
8
7
6
5
4
TJ < 150℃ , TC ≤ 125℃
2
M.I.=0.9, P.F.=0.8
Sinusoidal PWM
1
0
fSW=15kHz
VDC=300V, VCC=VBS=15V
3
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
Case Temperature, TC [℃]
Note:
8. The allowable output current value may be different from the actual application.
Figure 7. Allowable Maximum Output Current
Package Marking and Ordering Information
Device Marking
Device
Package
Reel Size
Tape Width
Quantity
FNE41060
FNE41060
SPM26-AAA
-
-
12
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FNE41060 Smart Power Module (Samsung Refrigerator only)
Recommended Operating Conditions
Parameter
Device Flatness
Mounting Torque
Limits
Conditions
Note Figure 8
Min.
Typ.
Max.
0
-
+120
Units
mm
Mounting Screw: - M3
Recommended 0.7N•m
0.6
0.7
0.8
N•m
Note Figure 9
Recommended 7.1kg•cm
6.2
7.1
8.1
kg•cm
-
11
-
g
Weight
Figure 8. Flatness Measurement Position
Pre - Screwing : 1→2
2
Final Screwing : 2→1
1
Note:
9. Do not make over torque when mounting screws. Much mounting torque may cause ceramic cracks, as well as bolts and Al heat-sink destruction.
10. Avoid one side tightening stress. Fig.9 shows the recommended torque order for mounting screws. Uneven mounting can cause the SPM ceramic substrate to be damaged.
The Pre-Screwing torque is set to 20~30% of maximum torque rating.
Figure 9. Mounting Screws Torque Order
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Mechanical Characteristics and Ratings
Input Signal
Protection
Circuit State
RESET
SET
RESET
UVCCR
a1
Control
Supply Voltage
a6
UVCCD
a3
a2
a7
a4
Output Current
a5
Fault Output Signal
a1 : Control supply voltage rises: After the voltage rises UVCCR, the circuits start to operate when next input is applied.
a2 : Normal operation: IGBT ON and carrying current.
a3 : Under voltage detection (UVCCD).
a4 : IGBT OFF in spite of control input condition.
a5 : Fault output operation starts.
a6 : Under voltage reset (UVCCR ).
a7 : Normal operation: IGBT ON and carrying current.
Figure 10. Under-Voltage Protection (Low-side)
Input Signal
Protection
Circuit State
RESET
SET
RESET
UVBSR
Control
Supply Voltage
b1
UVBSD
b5
b3
b6
b2
b4
Output Current
High-level (no fault output)
Fault Output Signal
b1 : Control supply voltage rises: After the voltage reaches UVBSR, the circuits start to operate when next input is applied.
b2 : Normal operation: IGBT ON and carrying current.
b3 : Under voltage detection (UVBSD).
b4 : IGBT OFF in spite of control input condition, but there is no fault output signal.
b5 : Under voltage reset (UVBSR )
b6 : Normal operation: IGBT ON and carrying current
Figure 11. Under-Voltage Protection (High-side)
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Time Charts of SPMs Protective Function
c6
Protection
Circuit state
SET
Internal IGBT
Gate-Emitter Voltage
c3
FNE41060 Smart Power Module (Samsung Refrigerator only)
Lower arms
control input
c7
RESET
c4
c2
SC
c1
c8
Output Current
SC Reference Voltage
Sensing Voltage
of the shunt
resistance
Fault Output Signal
c5
CR circuit time
constant delay
(with the external shunt resistance and CR connection)
c1 : Normal operation: IGBT ON and carrying current.
c2 : Short circuit current detection (SC trigger).
c3 : Hard IGBT gate interrupt.
c4 : IGBT turns OFF.
c5 : Input “L” : IGBT OFF state.
c6 : Input “H”: IGBT ON state, but during the active period of fault output the IGBT doesn’t turn ON.
c7 : IGBT OFF state
Figure 12. Short-Circuit Current Protection (Low-side Operation only)
Input/Output Interface Circuit
5V-Line (MCU or Control power)
SPM
R PF=10kΩ
IN(UH) , IN (VH) , IN(W H)
IN (UL) , IN (VL) , IN(WL)
MCU
VFO
COM
Note:
1) RC coupling at each input (parts shown dotted) might change depending on the PWM control scheme used in the application and the wiring impedance of the application’s
printed circuit board. The SPM input signal section integrates 5kW (typ.) pull-down resistor. Therefore, when using an external filtering resistor, please pay attention to the signal voltage drop at input terminal.
2) The logic input is compatible with standard CMOS outputs.
Figure 13. Recommended CPU I/O Interface Circuit
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CBSC
RS
(25) VS(U)
(20) IN (UH)
Gating UH
(24) VB(V)
CBSC
CBS
RS
(23) VS(V)
(19) IN (VH)
Gating VH
(22) VB(W)
CBSC
CBS
M
C
U
RS
Gating WH
(18) IN (WH)
(17) VCC(H)
15V line
C PS
(21) VS(W)
C PS
C PS
CSP15
CSPC15
(15) COM
HVIC
VS(U)
VS(V)
IN(VH)
RS
Gating VL
Gating WL
OUT(VH)
VS(V)
M
V (5)
VB(W)
VS(W)
IN(WH)
CDCS
OUT(WH)
VCC
VS(W)
VDC
W (6)
COM
LVIC
VCC
OUT(UL)
CSPC05
NU (7)
CSP05
(11) VFO
Fault
Gating UL
U (4)
VS(U)
VB(V)
RPF
C BPF
OUT(UH)
IN(UH)
5V line
(16) VCC(L)
P (3)
VB(U)
RSU
VFO
C PF
RS
(14) IN (UL )
RS
(13) IN (VL)
RS
(12) IN (WL)
CSC
(10) CSC
C PS C PS C PS
RF
OUT(VL)
IN(UL)
NV (8)
RSV
IN(VL)
IN(WL)
COM
OUT(WL)
CSC
N W (9)
RSW
(1) N.C.
(2) N.C.
U-Phase Current
V-Phase Current
W-Phase Current
Input Signal for
Short-Circuit Protection
Note:
1) To avoid malfunction, the wiring of each input should be as short as possible. (less than 2-3cm)
2) By virtue of integrating an application specific type HVIC inside the SPM, direct coupling to CPU terminals without any opto-coupler or transformer isolation is possible.
3) VFO output is open drain type. This signal line should be pulled up to the positive side of the MCU or control power supply with a resistor that makes IFO up to 1mA. Please refer
to Figure14.
4) CSP15 of around 7 times larger than bootstrap capacitor CBS is recommended.
5) Input signal is High-Active type. There is a 5kW resistor inside the IC to pull down each input signal line to GND. RC coupling circuits is recommanded for the prevention
of input signal oscillation. RSCPS time constant should be selected in the range 50~150ns. (Recommended RS=100 Ω , CPS=1nF)
6) To prevent errors of the protection function, the wiring around RF and C SC should be as short as possible.
7) In the short-circuit protection circuit, please select the RFCSC time constant in the range 1.5~2ms.
8) Each capacitor should be mounted as close to the pins of the SPM as possible.
9) To prevent surge destruction, the wiring between the smoothing capacitor and the P&GND pins should be as short as possible. The use of a high frequency non-inductive
capacitor of around 0.1~0.22mF between the P&GND pins is recommended.
10) Relays are used at almost every systems of electrical equipments of home appliances. In these cases, there should be sufficient distance between the CPU and the relays.
11) The zener diode should be adopted for the protection of ICs from the surge destruction between each pair of control supply terminals. (Recommanded zener diode=24V/1W)
12) Please choose the electrolytic capacitor with good temperature characteristic in CBS. Also, choose 0.1~0.2mF R-category ceramic capacitors with good temperature and
frequency characteristics in CBSC.
13) For the detailed information, please refer to the AN-9070 and FEB306-001.
Figure 14. Typical Application Circuit
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(26) VB(U)
CBS
FNE41060 Smart Power Module (Samsung Refrigerator only)
Detailed Package Outline Drawings
FNE41060 Rev. C
14
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The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not
intended to be an exhaustive list of all such trademarks.
FRFET®
Global Power ResourceSM
Green FPS™
Green FPS™ e-Series™
GTO™
IntelliMAX™
ISOPLANAR™
MegaBuck™
MICROCOUPLER™
MicroFET™
MicroPak™
MillerDrive™
MotionMax™
Motion-SPM™
OPTOLOGIC®
OPTOPLANAR®
Build it Now™
CorePLUS™
CorePOWER™
CROSSVOLT™
CTL™
Current Transfer Logic™
EcoSPARK®
EfficentMax™
EZSWITCH™ *
™
®
Fairchild ®
Fairchild Semiconductor®
FACT Quiet Series™
FACT®
FAST®
FastvCore™
FlashWriter® *
FPS™
F-PFS™
®
PDP SPM™
Power-SPM™
PowerTrench®
PowerXS™
Programmable Active Droop™
QFET®
QS™
Quiet Series™
RapidConfigure™
™
Saving our world, 1mW /W /kW at a time™
SmartMax™
SMART START™
SPM®
STEALTH™
SuperFET™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SupreMOS™
SyncFET™
®
TinyBoost™
TinyBuck™
TinyLogic®
TINYOPTO™
TinyPower™
TinyPWM™
TinyWire™
TriFault Detect™
mSerDes™
UHC®
Ultra FRFET™
UniFET™
VCX™
VisualMax™
XS™
The Power Franchise®
* EZSWITCH™ and FlashWriter® are trademarks of System General Corporation, used under license by Fairchild Semiconductor.
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PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
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THEREIN, WHICH COVERS THESE PRODUCTS.
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FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE
EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems which, (a) are
intended for surgical implant into the body or (b) support or sustain life,
and (c) whose failure to perform when properly used in accordance with
instructions for use provided in the labeling, can be reasonably
expected to result in a significant injury of the user.
2.
A critical component in any component of a life support, device, or
system whose failure to perform can be reasonably expected to cause
the failure of the life support device or system, or to affect its safety or
effectiveness.
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Fairchild Semiconductor Corporation’s Anti-Counterfeiting Policy. Fairchild’s Anti-Counterfeiting Policy is also stated on our external website,
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Counterfeiting of semiconductor parts is a growing problem in the industry. All manufactures of semiconductor products are experiencing counterfeiting of their
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proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild
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PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative / In Design
Datasheet contains the design specifications for product development. Specifications
may change in any manner without notice.
Preliminary
First Production
Datasheet contains preliminary data; supplementary data will be published at a later
date. Fairchild Semiconductor reserves the right to make changes at any time without
notice to improve design.
No Identification Needed
Full Production
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to
make changes at any time without notice to improve the design.
Obsolete
Not In Production
Datasheet contains specifications on a product that is discontinued by Fairchild
Semiconductor. The datasheet is for reference information only.
Rev. I38
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