Material Content Data Sheet Sales Product Name BAR 90-02ELS E6327 MA# MA001084230 Package PG-TSSLP-2-3 Issued Weight* Construction Element Material Group Substances CAS# if applicable chip non noble metal noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material noble metal noble metal noble metal < 10% tin gold silicon nickel copper carbon black epoxy resin silicondioxide gold palladium gold 7440-31-5 7440-57-5 7440-21-3 7440-02-0 7440-50-8 1333-86-4 60676-86-0 7440-57-5 7440-05-3 7440-57-5 leadframe wire encapsulation leadfinish plating *deviation 29. August 2013 Weight [mg] 0.21 mg Average Mass [%] Sum [%] Average Mass [ppm] 0.000 0.17 1662 0.001 0.64 6440 0.017 7.86 8.67 78618 86720 0.108 51.48 51.48 514824 514824 0.001 0.69 0.69 6887 6887 0.000 0.17 1743 0.011 5.05 0.062 29.61 34.83 296071 348321 0.004 1.76 1.76 17566 17566 0.001 0.61 0.004 1.96 50507 6092 2.57 19590 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com Sum [ppm] 25682 1000000