LITEON LTL-42DGNMHCP Through hole lamp Datasheet

Through Hole Lamp
Product Data Sheet
LTL-42DGNMHCP
Spec No.: DS-20-98-0166
Effective Date: 10/04/2013
Revision: C
LITE-ON DCC
RELEASE
BNS-OD-FC001/A4
LITE-ON Technology Corp. / Optoelectronics
No.90,Chien 1 Road, Chung Ho, New Taipei City 23585, Taiwan, R.O.C.
Tel: 886-2-2222-6181 Fax: 886-2-2221-1948 / 886-2-2221-0660
http://www.liteon.com/opto
LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
Features
* Lead (Pb) free product – RoHS compliant.
* Designed for ease in circuit board assembly.
* Black case enhance contrast ratio.
* Solid state light source.
* Reliable and rugged.
Package Dimensions
Lamp Part No.
Lens
Source Color
LTL-42DGNMHCP
Green Diffused
Green
NOTES:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25mm(.010") unless otherwise noted.
3. The Holder (Housing) is 46L025 and Material is PC.
4. The LED lamp original is LTL-4231N.
5. Specifications are subject to change without notice.
Part No. : LTL-42DGNMHCP
BNS-OD-C131/A4
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Absolute Maximum Ratings at Ta=25℃
Parameter
Power Dissipation
Maximum Rating
Unit
120
mW
90
mA
30
mA
Peak Forward Current
(1/10 Duty Cycle, 0.1ms Pulse Width)
DC Forward Current
Operating Temperature Range
-55℃ to + 100℃
Storage Temperature Range
-55℃ to + 100℃
Lead Soldering Temperature
[2.0mm(.08") From Body]
Part No. : LTL-42DGNMHCP
BNS-OD-C131/A4
260℃ for 5 Seconds Max.
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Electrical / Optical Characteristics at TA=25℃
Parameter
Luminous Intensity
Viewing Angle
Dominant Wavelength
Symbol
Min.
Typ.
Max.
Unit
IV
5.6
12.6
85
mcd
60
2θ1/2
λd
564
569
Δλ
30
Forward Voltage
VF
2.1
Reverse Current
IR
Spectral Line Half-Width
deg
574
nm
Test Condition
IF = 10mA
Note 1,4
Note 2 (Fig.6)
IF = 10mA
Note 3
nm
2.6
V
100
μA
IF = 20mA
VR = 5V,Note 5
Note: 1. Luminous intensity is measured with a light sensor and filter combination that approximates the CIE
(Commission International De L'Eclairage) eye-response curve.
2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
3. The dominant wavelength, λd is derived from the CIE chromaticity diagram and represents the single
wavelength which defines the color of the device.
4. The Iv guarantee should be added ±15% .
5. Reverse voltage (VR) condition is applied for IR test only. The device is not designed for reverse
operation.
Part No. : LTL-42DGNMHCP
BNS-OD-C131/A4
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Typical Electrical / Optical Characteristics Curves
(25℃ Ambient Temperature Unless Otherwise Noted)
Part No. : LTL-42DGNMHCP
BNS-OD-C131/A4
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Packing Spec
Part No. : LTL-42DGNMHCP
BNS-OD-C131/A4
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Optical/Electrical Bin Table.
Luminous Intensity
Unit : mcd @10mA
Bin Code
Min.
Max.
N1
50
85
M1
29
50
L1
19
29
L2
12.6
19
L3
8.7
12.6
L4
5.6
8.7
Note: Tolerance of each bin limit is ±15%
Dominant Wavelength
Unit : nm @10mA
Bin Code
Min.
Max.
YG
571.0
574.0
PG
569.5
571.0
GG
568.0
569.5
GG1
566.0
568.0
GG2
564.0
566.0
Note: Tolerance of each bin limit is ±1nm
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BNS-OD-C131/A4
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CAUTIONS
1. Application
The LEDs described here are intended to be used for ordinary electronic equipment (such as office equipment,
communication equipment and household applications).Consult Liteon’s Sales in advance for information on
applications in which exceptional reliability is required, particularly when the failure or malfunction of the
LEDs may directly jeopardize life or health (such as in aviation, transportation, traffic control equipment,
medical and life support systems and safety devices).
2. Storage
The storage ambient for the LEDs should not exceed 30°C temperature or 70% relative humidity.
It is recommended that LEDs out of their original packaging are used within three months.
For extended storage out of their original packaging, it is recommended that the LEDs be stored in
a sealed container with appropriate desiccant or in desiccators with nitrogen ambient.
3. Cleaning
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LEDs if necessary.
4. Lead Forming & Assembly
During lead forming, the leads should be bent at a point at least 3mm from the base of LED lens.
Do not use the base of the lead frame as a fulcrum during forming.
Lead forming must be done before soldering, at normal temperature.
During assembly on PCB, use minimum clinch force possible to avoid excessive mechanical stress.
5. Soldering
When soldering, leave a minimum of 2mm clearance from the base of the lens/Holder to the soldering point.
Dipping the lens/Holder into the solder must be avoided.
Do not apply any external stress to the lead frame during soldering while the LED is at high temperature.
Recommended soldering conditions :
Soldering iron
Temperature
Soldering time
350°C Max.
3 sec. Max.
(one time only)
Wave soldering
Pre-heat
Pre-heat time
Solder wave
Soldering time
100°C Max.
60 sec. Max.
260°C Max.
5 sec. Max.
Note: Excessive soldering temperature and/or time might result in deformation of the LED/Holder or
catastrophic failure of the CBI. IR (Hot air) reflow is not suitable process for through hole type LED lamp
product. Max. temperature of waive soldering is not mean that Holder’s HDT/Melting temperature.
Part No. : LTL-42DGNMHCP
BNS-OD-C131/A4
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6. Drive Method
An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs
connected in parallel in an application, it is recommended that a current limiting resistor be
incorporated in the drive circuit, in series with each LED as shown in Circuit A below.
Circuit model A
LED
Circuit model B
LED
(A) Recommended circuit
(B) The brightness of each LED might appear different due to the differences in the I-V characteristics
of those LEDs
7. ESD (Electrostatic Discharge)
Static Electricity or power surge will damage the LED.
Suggestions to prevent ESD damage:
 Use a conductive wrist band or anti- electrostatic glove when handling these LEDs
 All devices, equipment, and machinery must be properly grounded
 Work tables, storage racks, etc. should be properly grounded
 Use ion blower to neutralize the static charge which might have built up on surface of the LEDs
plastic lens as a result of friction between LEDs during storage and handing
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Suggested checking list :
Training and Certification
1. Everyone working in a static-safe area is ESD-certified?
2. Training records kept and re-certification dates monitored?
Static-Safe Workstation & Work Areas
1. Static-safe workstation or work-areas have ESD signs?
2. All surfaces and objects at all static-safe workstation and within 1 ft measure less than 100V?
3. All ionizer activated, positioned towards the units?
4. Each work surface mats grounding is good?
Personnel Grounding
1. Every person (including visitors) handling ESD sensitive (ESDS) items wear wrist strap, heel strap or
conductive shoes with conductive flooring?
2. If conductive footwear used, conductive flooring also present where operator stand or walk?
3. Garments, hairs or anything closer than 1 ft to ESD items measure less than 100V*?
4. Every wrist strap or heel strap/conductive shoes checked daily and result recorded for all DSL?
5. All wrist strap or heel strap checkers calibration up to date?
Note: *50V for Blue LED.
Device Handling
1. Every ESDS items identified by EIA-471 labels on item or packaging?
2. All ESDS items completely inside properly closed static-shielding containers when not at static-safe
workstation?
3. No static charge generators (e.g. plastics) inside shielding containers with ESDS items?
4. All flexible conductive and dissipative package materials inspected before reuse or recycle?
Others
1. Audit result reported to entity ESD control coordinator?
2. Corrective action from previous audits completed?
3. Are audit records complete and on file?
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8. Reliability Test
Classification
Test Item
Reference Standard
Ta= Under Room Temperature As
Per Data Sheet Maximum Rating
*Test Time= 1000HRS (-24HRS,+72HRS)
*Test Current = 20mA Max.
MIL-STD-750D:1026 (1995)
MIL-STD-883D:1005 (1991)
JIS C 7021:B-1 (1982)
High Temperature
High Humidity
Storage
Ta= 65±5°C
RH= 90 ~ 95%
MIL-STD-202F: 103B(1980)
JIS C 7021 : B-11(1982)
High Temperature
Storage
Ta= 105±5°C
*Test Time= 1000HRS (-24HRS,+72HRS)
MIL-STD-883D:1008 (1991)
JIS C 7021:B-10 (1982)
Low Temperature
Storage
Ta= -55±5°C
*Test Time=1000HRS (-24HRS,+72HRS)
JIS C 7021:B-12 (1982)
Temperature
Cycling
105°C ~ 25°C ~ -55°C ~ 25°C
30mins 5mins
30mins 5mins
10 Cycles
MIL-STD-202F:107D (1980)
MIL-STD-750D:1051(1995)
MIL-STD-883D:1010 (1991)
JIS C 7021: A-4(1982)
Thermal
Shock
105 ± 5°C ~ -55°C ± 5°C
10mins
10mins
10 Cycles
MIL-STD-202F:107D(1980)
MIL-STD-750D:1051(1995)
MIL-STD-883D:1011 (1991)
Solder
Resistance
T.sol = 260 °C Max.
Dwell Time= 5 secs Max.
MIL-STD-202F:210A(1980)
MIL-STD-750D:2031(1995)
JIS C 7021: A-1(1982)
Solderability
T. sol = 230 ± 5°C
Dwell Time= 5 ± 1secs
MIL-STD-202F:208D(1980)
MIL-STD-750D:2026(1995)
MIL-STD-883D:2003(1991)
JIS C 7021: A-2(1982)
Operation Life
Endurance
Test
Test Condition
Environmental
Test
Test Time= 240HRS±2HRS
9. Others
The appearance and specifications of the product may be modified for improvement, without prior notice.
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