TI1 LM3302NE4 Single supply or dual supplies low supply-current drain independent of supply voltage Datasheet

SLCS014A −OCTOBER 1977 −REVISED AUGUST 2003
D Single Supply or Dual Supplies
D Wide Range of Supply Voltage
D OR N PACKAGE
(TOP VIEW)
. . . 2 V to 28 V
1OUT
2OUT
VCC
2IN−
2IN+
1IN−
1IN+
D Low Supply-Current Drain Independent of
D
D
D
D
D
D
D
Supply Voltage . . . 0.8 mA Typ
Low Input Bias Current . . . 25 nA Typ
Low Input Offset Current . . . 3 nA Typ
Low Input Offset Voltage . . . 3 mV Typ
Common-Mode Input Voltage Range
Includes Ground
Differential Input Voltage Range Equal to
Maximum-Rated Supply Voltage . . . ±28 V
Low Output Saturation Voltage
Output Compatible With TTL, MOS, and
CMOS
1
14
2
13
3
12
4
11
5
10
6
9
7
8
3OUT
4OUT
GND
4IN+
4IN−
3IN+
3IN−
description/ordering information
This device consists of four independent voltage comparators that are designed to operate from a single power
supply over a wide range of voltages. Operation from dual supplies also is possible as long as the difference
between the two supplies is 2 V to 28 V and VCC is a least 1.5 V more positive than the input common-mode
voltage. Current drain is independent of the supply voltage. The outputs can be connected to other
open-collector outputs to achieve wired-AND relationships.
ORDERING INFORMATION
TA
VIOmax
AT 25°C
PDIP (N)
−40°C
−40
C to 85
85°C
C
20 mV
ORDERABLE
PART NUMBER
PACKAGE†
SOIC (D)
Tube of 25
LM3302N
Tube of 50
LM3302D
Reel of 2500
LM3302DR
TOP-SIDE
MARKING
LM3302N
LM3302
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
symbol (each comparator)
IN+
OUT
IN−
Copyright  2003, Texas Instruments Incorporated
!" #$
# % & ## '($ # ) # "( "#
) "" $
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SLCS014A −OCTOBER 1977 −REVISED AUGUST 2003
schematic
VCC
80-µA Current
Regulator
60 µA
80 µA
10 µA
10 µA
IN+
OUT
IN−
GND
Current values shown are nominal.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 V
Differential input voltage, VID (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±28 V
Input voltage range, VI (either input) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 28 V
Output voltage, VO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 V
Output current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
Duration of output short-circuit to ground (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Unlimited
Package thermal impedance, θJA (see Notes 4 and 5): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80°C/W
Operating virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds: D or N package . . . . . . . . . . . . . . . . 260°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. There are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated in the recommended operating conditions section of this
specification is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, except differential voltages, are with respect to the network ground.
2. Differential voltages are at IN+ with respect to IN−.
3. Short circuits from the output to VCC can cause excessive heating and eventual destruction.
4. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
5. The package thermal impedance is calculated in accordance with JESD 51-7.
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SLCS014A −OCTOBER 1977 −REVISED AUGUST 2003
electrical characteristics at specified free-air temperature, VCC = 5 V (unless otherwise noted)
TEST CONDITIONS†
PARAMETER
VIO
Input offset voltage
VCC = 5 V to 28 V,
VO = 1.4 V
IIO
Input offset voltage
VO = 1.4 V
IIB
Input bias current
VICR
Common-mode input
voltage range
TA
MIN
25°C
VIC = VICRmin,
TYP
MAX
3
20
−40°C to 85°C
40
25°C
3
−40°C to 85°C
−25
−40°C to 85°C
25°C
−40°C to 85°C
AVD
Large-signal differential
voltage amplification
VCC = 15 V,
RL = 15 Ω to VCC
VO = 1.4 V to 11.4 V,
IOH
High-level output current
VID = 1 V,
VOH = 5 V
VOL
Low-level output voltage
VID = −1 V,
IOL = 4 mA
−40°C to 85°C
IOL
Low-level output current
VID = 1 V,
VOL = 1.5 V
25°C
ICC
Supply current
(four comparators)
VO = 2.5 V,
No load
25°C
25°C
0 to
VCC−1.5
30
V/mV
0.1
nA
−40°C to 85°C
1
25°C
150
µA
500
700
6
nA
V
0 to
VCC−2
25°C
nA
−500
−1000
2
mV
100
300
25°C
UNIT
mV
16
mA
0.8
mA
† All characteristics are measured with zero common-mode input voltage unless otherwise specified.
switching characteristics, VCC = 5 V, TA = 25°C
PARAMETER
Response time
TEST CONDITIONS
RL = 5.1 kΩ to 5 V,
CL = 15 pF‡,
See Note 6
TYP
100-mV input step with 5-mV overdrive
1.3
TTL-level input step
0.3
UNIT
µs
‡ CL includes probe and jig capacitance.
NOTE 6: The response time specified is the interval between the input step function and the instant when the output crosses 1.4 V.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
PACKAGE OPTION ADDENDUM
www.ti.com
24-Jan-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package Qty
Drawing
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
LM3302D
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
LM3302
LM3302DE4
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
LM3302
LM3302DG4
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
LM3302
LM3302DR
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
LM3302
LM3302DRE4
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
LM3302
LM3302DRG4
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
LM3302
LM3302N
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-40 to 85
LM3302N
LM3302NE4
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-40 to 85
LM3302N
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
(4)
24-Jan-2013
Only one of markings shown within the brackets will appear on the physical device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jan-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LM3302DR
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
LM3302DR
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jan-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM3302DR
SOIC
D
14
2500
333.2
345.9
28.6
LM3302DR
SOIC
D
14
2500
367.0
367.0
38.0
Pack Materials-Page 2
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