TDK HHM2915A2 Multilayer chip directional coupler Datasheet

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Multilayer Chip Directional Couplers
For GSM850/GSM900 Tx
Conformity to RoHS Directive
HHM Series HHM2915A2
0.1+0.10
–0.05
SHAPES AND DIMENSIONS
0.3±0.15
3
1
2
0.5±0.15
0.4max.
0.5±0.05
1.0±0.05
4
0.25 +0.15
–0.10
Terminal functions
1 Coupling
2 50Ω term
3 Output
4 Input
Dimensions in mm
RECOMMENDED PC BOARD PATTERNS
0.4
0.1
0.35
0.15
Dimensions in mm
ELECTRICAL CHARACTERISTICS
Frequency range
Coupling factor
Insertion loss
Isolation
VSWR
Temperature range
1
2
Operating
Storage
824 to 925MHz
23.2±1.2dB
0.2dB max.1
0.23dB max.2
35dB min.
1.4 max.
–40 to +85°C
–40 to +85°C
25°C
Operating temperature
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and
specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• All specifications are subject to change without notice.
001-02 / 20130901 / rf_coupler_hhm2915a2_en.fm
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1
2
3
45
800
900
Frequency (MHz)
ISOLATION & DIRECTIVITY
1: 824MHz
23.7dB
2: 849MHz
23.4dB
3: 880MHz
23.1dB
4: 915MHz
22.8dB
5: 925MHz
22.7dB
1000
INSERTION LOSS
Insertion loss (dB)
0.2
2
3
45
0.4
0.6
0.8
1.0
700
0
10
20
30
1
2
40
1
50
700
2
3
45
3
45
800
900
Frequency (MHz)
Isolation
:
1: 824MHz
47.7dB
2: 849MHz
47.2dB
3: 880MHz
47.0dB
4: 915MHz
46.5dB
5: 925MHz
46.4dB
1000
Directivity
:
1: 824MHz
24.1dB
2: 849 MHz
23.8dB
3: 880MHz
23.9dB
4: 915MHz
23.7dB
5: 925MHz
23.7dB
VSWR
0
1
Isolation & Directivity(dB)
0
5
10
15
20
25
30
35
40
700
800
900
Frequency (MHz)
1: 824MHz
0.07dB
2: 849MHz
0.07dB
3: 880MHz
0.08dB
4: 915MHz
0.08dB
5: 925MHz
0.08dB
1000
2.0
1: 824MHz
1.11
2: 849MHz
1.12
3: 880MHz
1.12
4: 915MHz
1.12
5: 925MHz
1.12
1.8
VSWR
Coupling factor(dB)
FREQUENCY CHARACTERISTICS
COUPLING
1.6
1.4
1.2
1.0
700
45
3
1 2
800
900
Frequency (MHz)
1000
• All specifications are subject to change without notice.
001-02 / 20130901 / rf_coupler_hhm2915a2_en.fm
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