Datasheet Input Voltage 3.5 V to 36 V Output SW Current 4 A / 2.5A / 1.25A 1ch Step-Down Switching Regulator BD906xx-C series Key Specifications General Description Input Voltage Range : 3.5 V to 36 V (Initial startup is over 3.9 V) Output Voltage Range : 0.8 V to VIN Output Switch Current : 4 A / 2.5 A / 1.25 A (Max) Switching Frequency : 50 kHz to 600 kHz Reference Voltage Accuracy :±2% (-40 °C to +125 °C) Shutdown Circuit Current : 0 µA (Typ) Operating Temperature Range(Ta) : -40 °C to +125 °C BD906xx-C series is a step-down switching regulator with integrated POWER MOS FET and have the capability to withstand high input voltage, providing a free setting function of operating switching frequency with external resistor. This switching regulator features a wide input voltage range (3.5 V to 36 V, Absolute maximum 42 V) and operating temperature range (-40 °C to +125 °C). Furthermore, an external synchronization input pin enables synchronous operation with external clock. Package Features W(Typ) x D(Typ) x H(Max) 9.395mm x 10.540mm x 2.005mm 4.90mm x 6.00mm x 1.00mm HRP7 HTSOP-J8 (Note 1) AEC-Q100 Qualified Integrated Pch POWER MOS FET Low Dropout: 100 % ON Duty Cycle External Synchronization Function Soft Start Function: 1.38 ms (fSW = 500 kHz) Current Mode Control Over Current Protection Low Supply Voltage Error Prevention Thermal Shut Down Protection Short Circuit Protection High power HRP7 package mounted Compact and High power HTSOP-J8 package mounted Load dump up to 42 V. (Note 1 : Grade 1) HRP7 HTSOP-J8 Applications Automotive Battery Powered Supplies (Cluster Panels, Car Multimedia) Industrial / Consumer Supplies Other electronic equipment Typical Application Circuit L1 PVIN SW VO D1 VIN CO R1 C2 VIN Cbulk CIN FB RT VEN / SYNC CRT RRT EN / SYNC GND ○Product structure：Silicon monolithic integrated circuit www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. CVTSZ22111・14・001 R2 VC R3 C1 ○This product has no designed protection against radioactive rays 1/40 TSZ02201-0T1T0AL00130-1-2 15.Sep.2015 Rev.005 BD906xx-C series Lineup Product Name HRP7 BD90640HFP-C BD90620HFP-C - HTSOP-J8 BD90640EFJ-C BD90620EFJ-C BD90610EFJ-C 4A 2.5 A 1.25 A Output Switch Current Input Maximum Ratings Input Voltage Range 42 V (Note 1) 3.5 V to 36 V 0.16 Ω (Typ) POWER MOSFET ON Resistance Power Dissipation HRP7 (Note 2) HTSOP-J8 6.98 W (Note 3) 3.10 W (Note 1) Initial startup is over 3.9 V (Note 2) Reduce by 55.8 mW / °C (Above 25°C), (JESD51 -5 / -7 standard FR4 114.3 mm × 76.2 mm × 1.60 mmt 4-layer Top copper foil: ROHM recommended footprint + wiring to measure / 2,3 inner layers and Copper foil area on the reverse side of PCB 74.2 mm × 74.2 mm, copper (top & reverse side / inner layers) 70 μm / 35 μm. Thermal via : pitch 1.2 mm, diameter Φ0.30 mm ) (Note 3) Reduce by 24.8 mW / °C (Above 25°C), (JESD51 -5 / -7 standard FR4 114.3 mm × 76.2 mm × 1.60 mmt 4-layer Top copper foil: ROHM recommended footprint + wiring to measure / 2,3 inner layers and Copper foil area on the reverse side of PCB 74.2 mm × 74.2 mm, copper (top & reverse side / inner layers) 70 μm / 35 μm. Thermal via : pitch 1.2 mm, diameter Φ0.30 mm) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/40 TSZ02201-0T1T0AL00130-1-2 15.Sep.2015 Rev.005 BD906xx-C series Pin Configuration (TOP VIEW) (TOP VIEW) 1. VC 2. VIN 3. FB 4. GND 1. RT 8. FB 2. SW 7. PVIN 3. EN / SYNC 6. VIN 4. GND 5. VC FIN 5. RT 6. SW 7. EN / SYNC HRP7 HTSOP-J8 Pin Description Pin No. Symbol Function Pin No Symbol Function 1 VC Error Amp Output 1 RT Switching Frequency Setting Resistor Connection 2 VIN Power Supply Input 2 SW Switching Output 3 FB Output Voltage Feedback 3 EN / SYNC Enable / External Clock Input 4 GND GND 4 GND GND RT Switching Frequency Setting Resistor Connection 5 VC Error Amp Output 5 6 SW Switching Output 7 EN / SYNC Enable / External Clock Input FIN - GND 6 (Note 1) VIN 7 PVIN 8 Power Supply Input (Note 1) Power Supply Input FB Output Voltage Feedback (Note 1) VIN and PVIN must be shorted. HRP7 HTSOP-J8 Block Diagram PVIN 7 UVLO VIN VREF VREG OCP 6 VREF 3 EN / SYNC SCP_ LATCH Current Sense ∑ SLOPE OCP OCP TSD ERROR_AMP + - + + SOFT_ START VC Q R DRV Pch POWER MOSFET FB 8 SW EN UVLO TSD OCP SCP_LATCH OFF RT OSC 0.8V GND 4 TSD CUR _COMP + - + + SOFT_ START 5 HRP7 VC PWM_LATCH S Q R DRV Pch POWER MOSFET SW EN UVLO TSD OCP SCP_LATCH OFF GND HTSOP-J8 3/40 1 TSD ERROR_AMP 6 1 www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 SLOPE + - PWM_LATCH S ∑ SCP 0.55V CUR _COMP Current Sense OCP TSD + 0.55V SCP_LATCH SCP_ LATCH 5 OCP 0.8V EN / SYNC RT OSC SCP FB VREG EN / SYNC SCP_LATCH 3 UVLO OCP EN / SYNC 7 UVLO VIN UVLO 2 TSZ02201-0T1T0AL00130-1-2 15.Sep.2015 Rev.005 2 4 BD906xx-C series Description of Blocks 1. ERROR_AMP The ERROR_AMP block is an error amplifier and its inputs are the reference voltage 0.8 V (Typ) and the “FB” pin voltage. (Refer to recommended examples on p.16 to 17). The output “VC” pin controls the switching duty, the output voltage is set by “FB” pin with external resistors. Moreover, the external resistor and capacitor are required to COMP pin as phase compensation circuit (Refer to phase compensation selection method on p.17 to 18). 2. SOFT_START The function of the SOFT_START block is to prevent the overshoot of the output voltage VO through gradually increasing the input of the error amplifier when the power supply turns ON, which also results to the gradual increase of the witching duty. The soft start time is set to 1.38 ms (Typ , fSW = 500 kHz). The soft start time is changed by setting of the switching frequency. (Refer to p.18) 3. EN / SYNC The IC is in normal operation when the voltage on the “EN / SYNC” pin is more than 2.6 V. The IC is shut down when the voltage on the “EN / SYNC” pin is less than 0.8 V. Furthermore, external synchronization is possible when external clock are applied to the “EN / SYNC” pin. The switching frequency range of the external synchronization is within ±20 % of the switching frequency and is limited by the external resistance connected to the RT pin. ex) When RRT is 27 kΩ (f = 500 kHz), the switching frequency range of the external synchronization is 400 kHz to 600 kHz. 4. OSC (Oscillator) This circuit generates the clock pulses that are input to SLOPE block. The switching frequency is determined by the current going through the external resistor RT at constant voltage of ca. 0.8V. The switching frequency can be set in the range between 50 kHz to 600 kHz (Refer to p.16 Figure 13). The output of the OSC block send clock signals to PWM_LATCH. Moreover the generated pulses of the OSC block are also used as clock of the counter of SS and SCP_LATCH blocks. 5. SLOPE This block generates saw tooth waves using the clock generated by the OSC block. The generated saw tooth waves are combined with the current sense and sent to the CUR_COMP. 6. CUR_COMP (Current Comparator) The CUR_COMP block compares the signals between the ERROR_AMP and the combined signals from the SLOPE block and current sense. The output signals are sent to the PWM_LATCH block. 7. PWM_LATCH The PWM_LATCH block is a LATCH circuit. The OSC block output (set) and CUR_COMP block output (reset) are the inputs of this block. The PWM_LATCH block outputs PWM signals. 8. TSD (Thermal Shut down) The TSD block prevents thermal destruction / thermal runaway of the IC by turning OFF the Pch POWER MOSFET output when the temperature of the chip reaches more than about 175 °C (Typ). When the chip temperature falls to a specified level, the switching will resume. However, since the TSD is designed to protect the IC, the chip temperature should be provided with the thermal shutdown detection temperature of less than approximately Tjmax = 150 °C. 9. OCP (Over Current Protection) OCP is activated when the voltage between the drain and source (on-resistance × load current) of the Pch POWER MOSFET when it is ON, exceeds the reference voltage which is internally set within the IC. This OCP is a self-return type. When OCP is activated, the ON duty will be small, and the output voltage will decrease. However, this protection circuit is only effective in preventing destruction from sudden accident. It does not support the continuous operation of the protection circuit (e.g. if a load, which significantly exceeds the output current capacitance, is connected). 10. SCP (Short Circuit Protection) and SCP-LATCH While OCP is activated, and if the output voltage falls below 70 %, SCP will be activated. When SCP is active, the output will be turned OFF after a period of 1024 pulse. It extends the time that the output is OFF to reduce the average output current. In addition, during startup of the IC, this feature is masked until it reaches a certain output voltage to prevent the startup failure. 11. UVLO (Under Voltage Lock-Out) UVLO is a protection circuit that prevents low voltage malfunction. It prevents malfunction of the internal circuit from sudden rise and fall of power supply voltage. It monitors the VIN power supply voltage and the internal regulator voltage. If VIN is less than the threshold voltage 3.24 V (Typ), the Pch POWER MOSFET output is OFF and the soft-start circuit will be restarted. This threshold voltage and release voltage have a hysteresis of 280 mV (Typ). 12. DRV (Driver) This circuit drives the gate electrode of the Pch POWER MOSFET output. It reduces the increase of the Pch POWER MOSFET’s on-resistance by switching the driving voltage when the power supply voltage drop. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/40 TSZ02201-0T1T0AL00130-1-2 15.Sep.2015 Rev.005 BD906xx-C series Absolute Maximum Ratings (Ta = 25 °C) Parameter Symbol Rating Unit Input Power Supply Voltage VIN, PVIN -0.3 to +42 V EN / SYNC Pin Voltage VEN / SYNC -0.3 to VIN V RT, VC, FB Pin Voltage VRT, VVC, VFB -0.3 to +7 V HRP7 Power Dissipation (Note2) 6.98 (Note1) Pd HTSOP-J8 W (Note3) 3.10 Storage Temperature Range Maximum Junction Temperature Tstg -55 to +150 °C Tjmax 150 °C (Note 1) Do not however exceed Pd. (Note 2) Reduce by 55.8 mW / °C, (Above 25°C), (JESD51 -5 / -7 standard FR4 114.3 mm × 76.2 mm × 1.60 mmt 4-layer Top copper foil: ROHM recommended footprint + wiring to measure / 2,3 inner layers and Copper foil area on the reverse side of PCB 74.2 mm × 74.2 mm, copper (top & reverse side / inner layers) 70 µm / 35 µm. Thermal via : pitch 1.2 mm, diameter Φ0.30 mm ) (Note 3) Reduce by 24.8 mW / °C, (Above 25°C), (JESD51 -5 / -7 standard FR4 114.3 mm × 76.2 mm × 1.60 mmt 4-layer Top copper foil: ROHM recommended footprint + wiring to measure / 2,3 inner layers and Copper foil area on the reverse side of PCB 74.2 mm × 74.2 mm, copper (top & reverse side / inner layers) 70 µm / 35 µm. Thermal via : pitch 1.2 mm, diameter Φ0.30 mm ) Caution: Exceeding the absolute maximum rating for supply voltage, operating temperature or other parameters can result in damages to or destruction of the chip. In this event it also becomes impossible to determine the cause of the damage (e.g. short circuit, open circuit, etc). Therefore, if any special mode is being considered with values expected to exceed the absolute maximum ratings, implementing physical safety measures, such as adding fuses, should be considered. Recommended Operating Conditions Parameter Symbol Limit Unit Min Max VIN, PVIN 3.5 36 V Topr -40 +125 °C BD90640HFP/EFJ-C ISW40 - 4 A BD90620HFP/EFJ-C ISW20 - 2.5 A BD90610EFJ-C ISW10 - 1.25 A VO 0.8 VIN V Min ON Pulse Width TON_MIN 250 - ns Switching Frequency fSW 50 600 kHz Switching Frequency Set Resistance RRT 22 330 kΩ Synchronous Operation Frequency Range fSYNC 50 600 kHz fSYNC_RT -20 +20 % DSYNC 10 90 % - µF Operating Power Supply Voltage (Note 1) Operating Temperature Range Output Switch Current (Note2) Output Voltage Synchronous Operation Frequency External Clock ON Duty Capacitance of Input Capacitor CIN 2.4 (Note 3) (Note 1) Initial startup is over 3.9 V. (Note 2) The Limits include output DC current and output ripple current. (Note 3) Ceramic capacitor is recommended. The capacitor value including temperature change, DC bias change, and aging change must be larger than minimum value (Refer to p.15). Also, the IC might not function properly when the PCB layout or the position of the capacitor is not good. Please check “Notes on the PCB Layout” on page 30. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 5/40 TSZ02201-0T1T0AL00130-1-2 15.Sep.2015 Rev.005 BD906xx-C series Electrical Characteristics (Unless otherwise specified, Ta = - 40 °C to +125 °C, VIN = 13.2 V, VEN / SYNC = 5 V) Limit Parameter Symbol Unit Conditions Min Typ Max ISDN - 0 5 μA VEN / SYNC = 0 V, Ta < 105 °C IIN - 2.2 3.3 mA Io = 0 A, VFB = 2 V RON - 0.16 0.32 Ω BD90640HFP / EFJ-C ISWLIMIT40 4.0 6.4 - A BD90620HFP / EFJ-C ISWLIMIT20 2.5 4.3 - A BD90610EFJ-C ISWLIMIT10 1.25 2.20 - A IOLK - 0 5 μA VIN = 36 V, VEN / SYNC = 0 V, Ta < 105 °C Reference Voltage 1 VREF1 0.792 0.800 0.808 V VVC = VFB, Ta = 25 °C Reference Voltage 2 VREF2 0.784 0.800 0.816 V VVC = VFB Reference Voltage Input Regulation ΔVREF - 0.5 - % 3.5 V ≤ VIN ≤ 36 V IB -1.0 - +1.0 μA IVCSINK -76.5 -54.0 -31.5 μA VC Source Current IVCSOURCE 31.5 54.0 76.5 μA Trans Conductance GEA 135 270 540 μA / V Soft Start Time TSS 1.13 1.38 1.63 ms GCS - 5.2 - A/V fSW 450 500 550 kHz ΔfSW - 1 - % Threshold Voltage VEN / SYNC 0.8 1.9 2.6 V SYNC Current IEN / SYNC - 23 50 μA UVLO ON Mode Voltage VUVLO_ON - 3.24 3.50 V UVLO OFF Mode Voltage VUVLO_OFF - 3.52 3.90 V UVLO Hysteresis VUVLO_HYS - 280 - mV Whole chip Shutdown Circuit Current Circuit Current SW Block POWER MOSFET ON Resistance Operating Output Switch Current Of Overcurrent (Note 1) Protection Output Leak Current ISW = 30 mA Error Amp Block Input Bias Current VC Sink Current VVC = 1.25 V, VFB = 1.3 V VVC = 1.25 V, VFB = 0.3 V IVC = ±10 μA, VVC = 1.25 V RRT = 27 kΩ Current Sense Part Trans Conductance OSC Block Switching Frequency Frequency Input Regulation RRT = 27 kΩ 3.5 V ≤ VIN ≤ 36 V Enable / Sync Input Block VEN / SYNC = 5 V UVLO (Note 1) The Limit include output DC current and output ripple current. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 6/40 TSZ02201-0T1T0AL00130-1-2 15.Sep.2015 Rev.005 BD906xx-C series 4.0 4.0 3.5 3.5 3.0 From Top Ta = 125 °C Ta = 25 °C Ta = -40 °C 2.5 Circuit Current :IIN [mA] Shutdown Circuit Current : ISDN[µA] Typical Performance Curves 2.0 1.5 1.0 0.5 3.0 2.5 2.0 1.5 From Top Ta = 125 °C Ta = 25 °C Ta = -40 °C 1.0 0.5 0.0 0.0 0 5 10 15 20 25 30 Input Voltage : VIN [V] 35 40 0 Figure 1. Shutdown Circuit Current vs Input Voltage 10 15 20 25 30 Input Voltage : VIN [V] 35 40 Figure 2. Circuit Current vs Input Voltage 0.30 10 From Top BD90640HFP / EFJ-C BD90620HFP / EFJ-C BD90610EFJ-C 9 0.25 Switch Current Limit : ISW [A] POWER MOSFET ON Resistance : RON[Ω] 5 0.20 0.15 From Top VIN = 3.5 V VIN = 13.2 V 0.10 0.05 8 7 6 5 4 3 2 1 0.00 Ta = 25 °C 0 -40 -20 0 20 40 60 80 100 120 Ambient Temperature : Ta [˚C] Figure 3. POWER MOSFET ON Resistance vs Ambient Temperature www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 0 5 10 15 20 25 30 Input Voltage : VIN [V] 35 40 Figure 4. Switch Current Limit vs Input Voltage 7/40 TSZ02201-0T1T0AL00130-1-2 15.Sep.2015 Rev.005 BD906xx-C series Typical Performance Curves – continued 5.0 816 812 Reference Voltage : VREF[V] Leak Current : IOLK [μA] 4.0 3.0 2.0 1.0 808 804 800 796 792 788 VIN = 13.2 V 0.0 VIN = 13.2 V 784 -40 -20 0 20 40 60 80 100 120 Ambient Temperature : Ta [˚C] -40 -20 0 20 40 60 80 100 120 Ambient Temperature : Ta[˚C] Figure 6. Reference Voltage vs Ambient Temperature Figure 5. Leak Current vs Ambient Temperature 1.63 1.0 1.58 1.53 Soft Start Time : TSS[μS] Input Bias Current :IB [μA] 0.8 0.6 0.4 1.48 1.43 1.38 1.33 1.28 1.23 0.2 VIN = 13.2 V VFB = 0.8 V 1.18 RRT = 27 kΩ 1.13 0.0 -40 -20 0 20 40 60 80 100 120 Ambient Temperature : Ta [˚C] -20 0 20 40 60 80 100 120 Ambient Temperature : Ta[˚C] Figure 8. Soft Start Time vs Ambient Temperature Figure 7. Input Bias Current vs Ambient Temperature www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 -40 8/40 TSZ02201-0T1T0AL00130-1-2 15.Sep.2015 Rev.005 BD906xx-C series Typical Performance Curves – continued 550 EN / SYNC Threshold Voltage : VEN/SYNC [V] 2.6 540 Switching Frequency : fSW [kHz] 530 520 510 500 490 480 470 VIN = 13.2 V RRT = 27 kΩ 460 -20 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 450 -40 2.4 -40 0 20 40 60 80 100 120 Ambient Temperature : Ta[˚C] 0 20 40 60 80 100 120 Ambient Temperature : Ta [˚C] Figure 10. EN / SYNC Threshold Voltage vs Ambient Temperature Figure 9. Switching Frequency vs Ambient Temperature 450 100 400 90 From Top Ta = 125 °C Ta = 25 °C Ta = -40 °C 350 300 80 From Top VO = 8.8 V VO = 5 V VO = 3.3 V 70 Efficiency [%] EN / SYNC Current : IEN / SYNC [μA] -20 250 200 150 60 50 BD90640HFP / EFJ-C IO<3.79 A BD90620HFP / EFJ-C IO<2.29 A BD90610EFJ-C IO<1.04 A 40 30 100 20 50 10 VIN = 13.2 V fSW = 500 kHz Ta = 25 °C 0 0 0 5 10 15 20 25 30 35 EN / SYNC Voltage : VEN / SYNC [V] 40 0 Figure 11. EN / SYNC Current vs EN / SYNC Voltage www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 9/40 1 2 Output Current : IO[A] 3 Figure 12. Efficiency vs Output Current TSZ02201-0T1T0AL00130-1-2 15.Sep.2015 Rev.005 BD906xx-C series Timing Chart 1. Start Up Operation VIN EN / SYNC Threshold Voltage EN / SYNC SS SW VO Internal slope VC 2. Over Current Protection Operation Normal pulse repetition at SW the following Over Current Detect Level IL VO FB Short Current Detect Level VC Internal SOFT START ＊T OFF TOFF* TOFF* TOFF* TSS* , ＊TSS terminal TOFF = 1024 / fSW [s] ex) fSW = 500 [kHz] , TOFF = 2.048 [ms] tSS = 1.38 [ms] (Typ) Output Voltage Short Release Output Voltage Short to GND Auto reset (Soft Start Operation) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 10/40 TSZ02201-0T1T0AL00130-1-2 15.Sep.2015 Rev.005 BD906xx-C series External Synchronization Function In order to activate the external synchronization function, connect the frequency-setting resistor to the RT pin and then input a synchronizing signal to the EN / SYNC pin. The external synchronization operation frequency is limited by the external resistance of RRT pin. The allowable setting limit is within ±20 % of the switching frequency. ex) When RRT is 27 kΩ (f = 500 kHz), the frequency range of the external synchronization is 400 kHz to 600 kHz. Furthermore, the pulse wave’s LOW voltage should be under 0.8 V and the HIGH voltage over 2.6 V (when the HIGH voltage is over 11 V the EN / SYNC input current increases), and the slew rate (rise and fall) under 20 V / µS. The ON Duty of External clock should be configured between 10 % and 90 %. The frequency will synchronize with the external clock operation frequency after three external sync pulses is sensed. L1 PVIN SW VO D1 VIN CO R1 C2 VIN Cbulk CIN FB RT VEN / SYNC CRT RRT EN / SYNC GND R2 VC R3 C1 Eternal SYNC Sample Circuit www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 11/40 TSZ02201-0T1T0AL00130-1-2 15.Sep.2015 Rev.005 BD906xx-C series Selection of Components Externally Connected Necessary parameters in designing the power supply are as follows: Parameter Symbol Specification Case Input Voltage VIN 6 V to 18 V Output Voltage VO 5V Output Ripple Voltage ΔVPP 20 mVp-p IO Min 1.0 A / Typ 1.5 A / Max 2.0 A Input Range Switching Frequency Operating Temperature Range fSW 500 kHz Topr -40 °C to +105 °C L1 PVIN SW VO D1 VIN CO R1 C2 VIN Cbulk CIN FB RT VEN / SYNC CRT RRT EN / SYNC GND R2 VC R3 C1 Application Sample Circuit 1. Selection of the inductor L1 value When the switching regulator supplies current continuously to the load, the LC filter is necessary for the smoothness of the output voltage. The Inductor ripple current ΔIL that flows to the inductor becomes small when an inductor with a large inductance value is selected. Consequently, the voltage of the output ripple also becomes small. It is the trade-off between the size and the cost of the inductor. The inductance value of the inductor is shown in the following equation: (𝑉𝐼𝑁(𝑀𝑎𝑥) −𝑉𝑜)×𝑉𝑜 𝐿=𝑉 𝐼𝑁(𝑀𝑎𝑥) ×𝑓𝑆𝑊 ×∆𝐼𝐿 [H] Where: 𝑉𝐼𝑁 (𝑀𝑎𝑥) is the maximum input voltage ΔIL is set to approximately 30 % of IO. To avoid discontinuous operation, ΔIL shall be set to make SW continuously pulsing (IL keeps continuously flowing). The condition of the continuous operation is shown in the following equation: (𝑉𝐼𝑁(𝑀𝑎𝑥) −𝑉𝑂 )×𝑉𝑂 𝐼𝑂 > 2×𝑉 𝐼𝑁(𝑀𝑎𝑥) ×𝑓𝑆𝑊 ×𝐿 [A] Where: 𝐼𝑂 is the Load Current V V SW SW t A t A IO IL ΔIL IL IO t Continuous Operation www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 t Discontinuous Operation 12/40 TSZ02201-0T1T0AL00130-1-2 15.Sep.2015 Rev.005 BD906xx-C series Selection of Components Externally Connected – continued The smaller the ΔIL, each the Inductor core loss (iron loss), the loss due to ESR of the output capacitor, and the ΔVPP will be reduced. ΔVPP is shown in the following equation. ∆𝐼𝐿 ∆𝑉𝑃𝑃 = ∆𝐼𝐿 × 𝐸𝑆𝑅 + 8×𝐶 [V] 𝑂 ×𝑓𝑆𝑊 ・・・・・(a) Where: 𝐸𝑆𝑅 is the equivalent series resistance of output capacitor 𝐶𝑂 is the output condenser capacity Generally, even if ΔIL is somewhat large, ΔVPP of the target is satisfied because the ceramic capacitor has super-low ESR. In that case, it is also possible to use it by the discontinuous operation. The inductance value can be set small as an advantage. It contributes to the miniaturization of the application because of the lower rated current, smaller inductor is possible if the inductance value is small. The disadvantages are the increase in core losses in the inductor, the decrease in maximum output current, and the deterioration of the response. When other capacitors (electrolytic capacitor, tantalum capacitor, and electro conductive polymer etc.) are used for output capacitor CO, check the ESR from the manufacturer's data sheet and determine the ΔIL to fit within the acceptable range of ΔVPP. Especially in the case of electrolytic capacitor, because the capacity decrease at the low temperature is remarkable, ΔVPP increases. When using capacitor at the low temperature, it is necessary to note this. The maximum output electric current is limited to the overcurrent protection working current as shown in the following equation. 𝐼𝑂(𝑀𝑎𝑥) = 𝐼𝑆𝑊𝐿𝐼𝑀𝐼𝑇(𝑀𝑖𝑛) − ∆𝐼𝐿 2 [A] Where: 𝐼𝑂(𝑀𝑎𝑥) is the maximum output current 𝐼𝑆𝑊𝐿𝐼𝑀𝐼𝑇(𝑀𝑖𝑛) is the OCP operation current (Min) A ISWLIMIT (Min) IO IL IL peak t In current mode control, when the IC is operating in ON Duty ≥ 50 % and in the condition of continuous operation,The sub-harmonic oscillation may happen. The slope compensation circuit is integrated into the IC in order to prevent sub-harmonic oscillation. The sub-harmonic oscillation depends on the rate of increase of output switch current. If the inductor value is too small, the sub-harmonic oscillation may happen. And if the inductor value is too large, the feedback loop may not achieve stability. The inductor value which prevents sub-harmonic oscillation is shown in the following equation. 2D−1 𝐿 ≥ 2(1−𝐷) × 𝑅𝑠 × D= 𝑉𝐼𝑁 (𝑀𝑖𝑛) −𝑉𝑂 𝑚 [H] 𝑉𝑂 𝑉𝐼𝑁(𝑀𝑖𝑛) 𝑚 = 6 × 𝑓𝑆𝑊 × 10−6 Where: 𝐷 is the switching pulse ON Duty. 𝑅𝑆 is the coefficient of current sense(4.0 µA / A) 𝑚 is the slope of slope compensation current The shielded type (closed magnetic circuit type) is the recommended type of inductor. Open magnetic circuit type can be used for low cost applications if noise issues are not concerned. But in this case, an influence other parts by magnetic field radiation is considered. An enough space layout between each parts should be noted. For ferrite core inductor type, please note that magnetic saturation may occur. It is necessary not to saturate the core in all cases. Precautions must be taken into account on the given provisions of the current rating because it differs according to each manufacturer. Please confirm the rated current at the maximum ambient temperature of the application to the manufacturer. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 13/40 TSZ02201-0T1T0AL00130-1-2 15.Sep.2015 Rev.005 BD906xx-C series Selection of Components Externally Connected – continued 2. Selection of output Capacitor CO The output capacitor is selected on the basis of ESR that is required from the equation (a). ΔVPP can be reduced by using a capacitor with a small ESR. The ceramic capacitor is the best option that meets this requirement. The ceramic capacitor contributes to the size reduction of the application because it has small ESR. Please confirm frequency characteristic of ESR from the datasheet of the manufacturer, and consider ESR value is low in the switching frequency being used. It is necessary to consider the ceramic capacitor because the DC biasing characteristic is remarkable. For the voltage rating of the ceramic capacitor, twice or more than the maximum output voltage is usually required. By selecting these high voltages rating, it is possible to reduce the influence of DC bias characteristics. Moreover, in order to maintain good temperature characteristics, the one with the characteristic of X7R or more is recommended. Because the voltage rating of a mass ceramic capacitor is low, the selection becomes difficult in the application with high output voltage. In that case, please select electrolytic capacitor. Please consider having a voltage rating of 1.2 times or more of the output voltage when using electrolytic capacitor. Electrolytic capacitors have a high voltage rating, large capacity, small amount of DC biasing characteristic, and are generally cheap. Because main failure mode is OPEN, it is effective to use electrolytic capacitor for applications when reliability is required such as in-vehicle. But there are disadvantages such as, ESR is relatively high, and decreases capacitance value at low temperatures. In this case, please take note that ΔVPP may increase at low temperature conditions. Moreover, consider the lifetime characteristic of this capacitor because there is a possibility for it to dry up. A tantalum capacitor and a conductive polymer hybrid capacitor have excellent temperature characteristic unlike an electrolytic capacitor. Moreover, as these ESR is smaller than an electrolytic capacitor, a ripple voltage is relatively-small over wide temperature range. The design is facilitated because there is little DC bias characteristic like an electrolytic capacitor. Normally, for voltage rating, a tantalum capacitor is selected twice the output voltage, and for conductive polymer hybrid capacitor is selected 1.2 times more than the output voltage. The disadvantage of a tantalum capacitor is that the failure mode is SHORT, and the breakdown voltage is low. It is not generally selected in the application that reliability such as in automotive is demanded. The failure mode of an electro conductive polymer hybrid capacitor is OPEN. Though it is effective for reliability, the disadvantage is generally expensive. In case of Pch step-down switching regulator, when the input voltage decreases and the voltage between input and output becomes small, switching pulse begin to skip before the Pch MOSFET completely turns on. Because of this the output ripple voltage may increase. To improve performance in this condition, following is recommended: 1. To use low ESR capacitor like ceramic or conductive polymer hybrid capacitor. 2. Higher value of capacitance. These capacitors are rated in ripple current. The RMS values of the ripple current that can be obtained in the following equation must not exceed the ratings ripple current. 𝐼𝐶𝑂(𝑅𝑀𝑆) = ∆𝐼𝐿 √12 [A] Where: 𝐼𝐶𝑂(𝑅𝑀𝑆) is the value of the ripple electric current In addition, total value of capacitance with output line Co(Max), respect to CO, choose capacitance value less than the value obtained by the following equation. 𝐶𝑂(𝑀𝑎𝑥) = 𝑇𝑆𝑆(𝑀𝑖𝑛) ×(𝐼𝑂𝐿𝐼𝑀𝐼𝑇(𝑀𝑖𝑛) −𝐼𝑂𝑆𝑇𝐴𝑅𝑇(𝑀𝑎𝑥) ) 𝑉𝑂 [F] Where: 𝐼𝑆𝑊𝐿𝐼𝑀𝐼𝑇(𝑀𝑖𝑛) is the OCP operation switch current (Min) 𝑇𝑆𝑆(𝑀𝑖𝑛) is the Soft Start Time (Min) 𝐼𝑆𝑊𝑆𝑇𝐴𝑅𝑇(𝑀𝑎𝑥) is the maximum output current during startup The startup failure may happen when the limits from the above-mentioned are exceeded. Especially if the capacitance value is extremely large, over-current protection may be activated by the inrush current at startup, and the output does not start. Please confirm this on the actual application. For stable transient response, the loop is dependent on the C O. Please select after confirming the setting of the phase compensation circuit. Also, in case of large changing input voltage and load current, select the capacitance in accordance with verifying that the actual application meets with the required specification. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 14/40 TSZ02201-0T1T0AL00130-1-2 15.Sep.2015 Rev.005 BD906xx-C series Selection of Components Externally Connected – continued 3. Selection of capacitor CIN / Cbulk input The input capacitor is usually required for two types of decoupling: capacitors CIN and bulk capacitors Cbulk. Ceramic capacitors with values more than 2.4 µF are necessary for the decoupling capacitor. Ceramic capacitors are effective by being placed as close as possible to the VIN pin. Voltage rating is recommended to more than 1.2 times the maximum input voltage, or twice the normal input voltage. The capacitor value including temperature change, DC bias change, and aging change must be larger than minimum value. Also, the IC might not function properly when the PCB layout or the position of the capacitor is not good. Please check “Notes on the PCB Layout” on page 24. The bulk capacitor is option. The bulk capacitor prevents the decrease in the line voltage and serves a backup power supply to keep the input potential constant. The low ESR electrolytic capacitor with large capacity is suitable for the bulk capacitor. It is necessary to select the best capacitance value as per set of application. n that case, please consider not to exceed the rated ripple current of the capacitor. The RMS value of the input ripple electric current is obtained in the following equation. 𝐼𝐶𝐼𝑁(𝑅𝑀𝑆) = 𝐼𝑂(𝑀𝐴𝑋) ∙ √𝑉𝑂 ×(𝑉𝐼𝑁 −𝑉𝑂 ) 𝑉𝐼𝑁 [A] Where: 𝐼𝐶𝐼𝑁(𝑅𝑀𝑆) is the RMS value of the input ripple electric current In addition, in automotive and other applications requiring high reliability, it is recommended that capacitors are connected in parallel to accommodate a multiple of electrolytic capacitors to minimize the chances of drying up. It is recommended by making it into two series + two parallel structures to decrease the risk of ceramic capacitor destruction due to short circuit conditions. The line has been improved to the summary respectively by 1pack in each capacitor manufacturer and confirms two series and two parallel structures to each manufacturer. When impedance on the input side is high because of wiring from the power supply to VIN is long, etc., and then high capacitance is needed. In actual conditions, it is necessary to verify that there is no problem when IC operation turns off or overshoot the output due to the change in VIN at transient response. 4. Selection of output voltage setting registance R1, R2 Output voltage is governed by the following equation. 𝑉𝑂 = 0.8 × 𝑅1+𝑅2 𝑅2 [V] Please set feedback resistor R2 below 30 kΩ to reduce the error margin by the bias current. In addition, since power efficiency is reduced with a small R1 + R2, please set the current flowing through the feedback resistor to be small as possible than the output current IO. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 15/40 TSZ02201-0T1T0AL00130-1-2 15.Sep.2015 Rev.005 BD906xx-C series Selection of Components Externally Connected – continued 5. Selection of the schottky barrier diode D1 The schottky barrier diode that has small forward voltage and short reverse recovery time is used for D1. The important parameters for the selection of the schottky barrier diode are the average rectified current and direct current inverse-direction voltage. Average rectified current IF (AVG) is obtained in the following equation: 𝐼𝐹(𝐴𝑉𝐺) = 𝐼𝑂(𝑀𝐴𝑋) × 𝑉𝐼𝑁(𝑀𝐴𝑋) −𝑉𝑂 𝑉𝐼𝑁(𝑀𝐴𝑋) [A] Where: 𝐼𝐹(𝐴𝑉𝐸) is the average rectified current The absolute maximum rating of the schottky barrier diode rectified current average is more than 1.2 times IF(AVG) and the absolute maximum rating of the DC reverse voltage is greater than or equal to 1.2 times the maximum input voltage. The loss of D1 is obtained in the following equation: 𝑃𝐷𝑖 = 𝐼𝑂(𝑀𝐴𝑋) × 𝑉𝐼𝑁(𝑀𝐴𝑋)− 𝑉𝑂 𝑉𝐼𝑁(𝑀𝐴𝑋) × 𝑉𝐹 [W] Where: 𝑉𝐹 is the forward voltage in 𝐼𝑂(𝑀𝐴𝑋) condition Selecting a diode that has small forward voltage, and short reverse recovery time is highly effective. Please select a diode with 0.65 V Max of forward voltage. Please note that there is possibility of internal element destruction when a diode with a larger VF than this is used. Because the reverse recovery time of the schottky barrier diode is so short, that it is possible to disregard, the switching loss can be disregarded. When it is necessary for the diode to endure the state of output short-circuit, power dissipation ratings and the heat radiation ability are needed to be considered. The rated current that is required is about 1.5 times the overcurrent detection value. 6. Selection of the switching frequency setting resistance RRT, CRT The internal switching frequency can be set by connecting a resistor between RT and GND. The range that can be set is 50 kHz to 600 kHz, and the relation between resistance and the switching frequency is decided as shown in the figure below. When setting beyond this range, there is a possibility that there is no oscillation and IC operation cannot be guaranteed. CRT is required to stabilize switching frequency. Typical capacitance value is 100pF. Actually, the changes in the frequency characteristic are greatly affected by the type and the condition (temperature, etc.) of parts that are used, the wire routing and layout of the PCB. Switching Frequency : fSW [kHz] 700 600 RRT [kΩ] 22 fSW [kHz] 599 RRT [kΩ] 100 fSW [kHz] 151 500 24 27 555 500 110 120 139 128 400 30 33 455 418 130 150 119 104 300 36 39 386 359 160 180 98. 88 200 43 47 329 303 200 220 80 73 100 51 56 281 258 240 270 68 61 62 68 235 216 300 330 55 51 75 82 197 182 91 165 0 0 100 200 300 400 500 Switching Frequency Setting Resistance : RRT [kΩ] Figure 13. Switching Frequency vs Switching Frequency Setting Resistance www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 16/40 TSZ02201-0T1T0AL00130-1-2 15.Sep.2015 Rev.005 BD906xx-C series Selection of Components Externally Connected – continued 7. Selection of the phase compensation circuit R3, C1, C2 A good high frequency response performance is achieved by setting the 0 dB crossing frequency, fc, (frequency at 0 dB gain) high. However, you need to be aware of the trade-off correlation between speed and stability. Moreover, DC / DC converter application is sampled by switching frequency, so the gain of this switching frequency must be suppressed. It is necessary to set the 0 dB crossing frequency to 1 / 10 or less of the switching frequency. In summary, target these characteristics as follows: ・When the 0 dB crossing frequency, fc, phase lag is less than or equal to 135 ˚(More than 45 ˚ phase margin). ・0 dB crossing frequency, fc, is 1 / 10 times or less of the switching frequency. To improve the responsiveness, higher the phase compensation is set by the capacitor and resistor which are connected in series to the VC pin. Achieving stability by using the phase compensation is done by cancelling the f P1 and fP2 (error amp pole and power stage pole) of the regulation loop by use of fZ1. fP1, fP2 and fZ1 are determined in the following equations. 1 𝑓𝑍1 = 2𝜋×𝑅3×𝐶1 1 𝑓𝑃1 = 2𝜋×𝐶 𝑂 ×𝑅𝑂 𝐺 𝐸𝐴 𝑓𝑃2 = 2𝜋×𝐶1×𝐴 𝑉 [Hz] [Hz] [Hz] Also, by inserting a capacitor in C2, phase lead fZ2 can be added. 1 𝑓𝑍2 = 2𝜋×𝑅1×𝐶2 [Hz] Where: 𝑅𝑂 is the resistance assumed actual load[Ω] = Output Voltage[V] / Output Current[A]、 𝐺𝐸𝐴 is the Error Amp trans conductance (270 µA / V) 𝐴𝑉 is the Error Amp Voltage Gain (78 dB) SW Vo C2 L1 Vo R1 FB D1 ERROR_AMP CO RO R2 VREF VC R3 C1 Setting Phase Compensation Circuit www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 17/40 TSZ02201-0T1T0AL00130-1-2 15.Sep.2015 Rev.005 BD906xx-C series Selection of Components Externally Connected – continued By setting zero and pole settings to suitable position, stable frequency characteristic can be achieved. The typical setting of fZ1, fZ2 is as below. 1. fZ1 setting is to cancel fP1. For instance, application which load current is 500 mA ~ 3.5 A, typical setting of FZ1, FP1 setting in Examples1 (P.19) is as below. Application 0.5 × 𝑓𝑝1 ≤ 𝑓𝑍1 ≤ 5 × 𝑓𝑝1 (fP1＝362 Hz [IO=500 mA], 2.53 kHz [IO =3.5 A] fZ1=1.69 kHz) 2. fZ2 setting is to shift the 0 dB crossing frequency to higher frequency or to improvephase margin near the 0 dB crossing frequency. Typical setting of FZ2, FP1 inApplication Examples3 (P.23) is as below. 0.5 × 𝑓𝑧𝑒𝑟𝑜 ≤ 𝑓𝑍2 ≤ 2 × 𝑓𝑧𝑒𝑟𝑜 (fZERO＝31.6 kHz [IO=400 mA] fZ2=20.6 kHz) Actually, the changes in the frequency characteristic are greatly affected by the type and the condition (temperature, etc.) of parts that are used, the wire routing and layout of the PCB. Please confirm stability and responsiveness in actual equipment. To check the actual frequency characteristics, use a FRA or a gain-phase analyzer. Moreover, the method of observing the degree of change by the loading response can be performed when these measuring instruments are not available. The phase margin degree is said to be low when there are lots of variation quantities after the output is made to change under no load to maximum load. It can also be observed that the phase margin degree is low when there is a lot of ringing frequencies after the transition of no load to maximum load, usually two times or more ringing than the standard. However, a quantitative phase margin degree cannot be confirmed. Load Maximum load IO Inadequate phase margin Output voltage VO Adequate phase margin. t 0 Measurement of Load Response 8. Setting of soft start time (TSS) The soft start function is necessary to prevent inrush of coil current and output voltage overshoot at startup. TSS will be changed by setting the switching frequency. The production tolerance of TSS is ±18.1%.TSS can be calculated by using the equation. 𝑇𝑆𝑆 = 690.8 𝑓𝑠𝑤 [s] www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 18/40 TSZ02201-0T1T0AL00130-1-2 15.Sep.2015 Rev.005 BD906xx-C series Application Examples1 Parameter Symbol Specification case Product Name IC BD90640HFP / EFJ-C Input Voltage VIN 6 V to 18 V VO 5V ΔVPP 20 mVp-p Output Current IO Min 1.0 A / Typ 1.5 A / Max 2.0 A Switching Frequency fSW 500 kHz Operating Temperature Topr -40 °C ~ +105 °C Output Voltage Output Ripple Voltage Specification Example 1 L1 PVIN SW VO CO R100 D1 VIN R1 VIN Cbulk CIN C2 FB RT VEN / SYNC CRT RRT EN / SYNC GND R2 VC R3 C1 Reference Circuit 1 No Package Parameters Part name (series) Type Manufacturer R1 R2 1608 43 kΩ, 1 %, 1 / 10 W MCR03 series Chip resistor ROHM 1608 8.2 kΩ, 1 %, 1 / 10 W MCR03 series Chip resistor ROHM R3 1608 20 kΩ, 1 %, 1 / 10 W MCR03 series Chip resistor ROHM R100 - SHORT - - - RRT 1608 27 kΩ, 1 %, 1 / 10 W MCR03 series Chip resistor ROHM C1 1608 4700 pF, R, 50 V GCM series Ceramic capacitor Murata C2 - OPEN - - - CRT 1608 100 pF, CH, 50 V GCM series Ceramic capacitor Murata CIN 3225 4.7 μF, X7R, 50 V GCM series Ceramic capacitor Murata CO 3225 44 μF (22 μF, X7R, 16 V × 2) GCM series Ceramic capacitor Murata Cbulk - 220 μF, 50 V CD series Electrolytic capacitor NICHICON L1 W 9.7 x H 3.8 x L 10 mm 15 μH CLF10040T-150M-H Inductor TDK D1 CPD Average I = 6 A Max RB095BM-40FH Schottky Diode ROHM 3 Parts List 1 www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 19/40 TSZ02201-0T1T0AL00130-1-2 15.Sep.2015 Rev.005 BD906xx-C series Characteristic Data (Application Examples 1) 100 90 Tektronix DPO5054 80 Efficiency [%] 70 60 VO 10 mV / div＠AC 50 40 30 20 10 0 0.0 0.5 1.0 1.5 Output Current : IO[A] 2.0 Figure 15. Output Ripple Voltage 1 (VIN = 13.2 V, IO = 1.5 A, 1 μs / div) Figure 14. Efficiency vs Output Current (Conversion Efficiency 1 VIN = 13.2 V) Tektronix DPO5054 FRA5087 VO 50 mV / div＠AC Phase IO 200 mA / div＠DC offset 1.5A Gain Figure 16. Frequency Characteristic 1 (VIN = 13. 2 V, IO = 1.5 A) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Figure 17. Load Response 1 (VIN = 13.2 V, IO = 1.5 A → 2.0 A, 200 μs / div) 20/40 TSZ02201-0T1T0AL00130-1-2 15.Sep.2015 Rev.005 BD906xx-C series Application Examples 2 Parameter Product Name Input Voltage Output Voltage Output Ripple Voltage Output Current Switching Frequency Operating Temperature Symbol IC VIN VO ΔVPP IO fSW Specification case BD90620HFP / EFJ-C 6 V to 18 V 5V 20 mVp-p Min 0.4 A / Typ 0.8 A / Max 1.5 A 500 kHz -40 °C ~ +105°C Topr Specification Example 2 L1 PVIN SW VO CO R100 D1 VIN R1 VIN Cbulk CIN C2 FB RT VEN / SYNC CRT RRT EN / SYNC GND R2 VC R3 C1 Reference Circuit 2 No Package Parameters Part name (series) Type Manufacturer R1 1608 43 kΩ, 1 %, 1 / 10 W MCR03 series Chip resistor ROHM R2 1608 8.2 kΩ, 1 %, 1 / 10 W MCR03 series Chip resistor ROHM R3 1608 20 kΩ, 1 %, 1 / 10 W MCR03 series Chip resistor ROHM R100 - SHORT - - - RRT 1608 27 kΩ, 1 %, 1 / 10 W MCR03 series Chip resistor ROHM C1 1608 4700 pF, R, 50 V GCM series Ceramic capacitor Murata C2 - OPEN - - - CRT 1608 100 pF, CH, 50 V GCM series Ceramic capacitor Murata CIN 3225 4.7 μF, X7R, 50 V GCM series Ceramic capacitor Murata CO 3225 44 μF (22 μF, X7R, 16 V × 2) GCM series Ceramic capacitor Murata Cbulk - 220 μF, 50 V CD series Electrolytic capacitor NICHICON L1 W 9.7 x H 3.8 x L 10 mm 22 μH CLF10040T-220M-H Inductor TDK D1 CPD Average I = 6 A Max RB095BM-40FH Schottky Diode ROHM 3 Parts List 2 www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 21/40 TSZ02201-0T1T0AL00130-1-2 15.Sep.2015 Rev.005 BD906xx-C series Characteristic Data (Application Examples 2) 100 90 Tektronix DPO5054 80 Efficiency [%] 70 60 VO 10 mV / div＠AC 50 40 30 20 10 0 0.0 0.5 1.0 Output Current : IO[A] 1.5 Figure 18. Efficiency vs Output Current (Conversion Efficiency 2 VIN = 13.2 V) Figure 19. Output Ripple Voltage 2 (VIN = 13.2 V, IO = 0.8 A, 1 μs / div) Tektronix DPO5054 FRA5087 VO 50 mV / div＠AC Phase Gain IO 200 mA / div＠DC offset 0.8A Figure 20. Frequency Characteristic 2 (VIN = 13.2 V, IO = 0.8 A) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Figure 21. Load ResponseResponse 2 (VIN = 13.2 V, IO = 0.8 A → 1.5 A, 200 μs / div) 22/40 TSZ02201-0T1T0AL00130-1-2 15.Sep.2015 Rev.005 BD906xx-C series Application Examples 3 Parameter Product Name Input Voltage Output Voltage Output Ripple Voltage Output Current Switching Frequency Operating Temperature Symbol IC VIN VO ΔVPP IO fSW Specification case BD90610EFJ-C 6 V to 18 V 5V 20 mVp-p Min 0.1 A / Typ 0.4 A / Max 0.8 A 500 kHz -40 °C ~ +105°C Topr Specification Example 3 L1 PVIN SW VO CO R100 D1 VIN R1 VIN Cbulk CIN C2 FB RT VEN / SYNC CRT RRT EN / SYNC GND R2 VC R3 C1 Reference Circuit 3 No Package Parameters Part name (series) Type Manufacturer R1 1608 43 kΩ, 1 %, 1 / 10 W MCR03 series Chip resistor ROHM R2 1608 8.2 kΩ, 1 %, 1 / 10 W MCR03 series Chip resistor ROHM R3 1608 33 kΩ, 1 %, 1 / 10 W MCR03 series Chip resistor ROHM R100 - SHORT - - - RRT 1608 27 kΩ, 1 %, 1 / 10 W MCR03 series Chip resistor ROHM C1 1608 10000 pF, R, 50 V GCM series Ceramic capacitor Murata C2 1608 180pF,CH,50V GCM series Ceramic capacitor Murata CRT 1608 100 pF, CH, 50 V GCM series Ceramic capacitor Murata CIN 3225 4.7 μF, X7R, 50 V GCM series Ceramic capacitor Murata CO 3225 44 μF (22 μF, X7R, 16 V × 2) GCM series Ceramic capacitor Murata Cbulk - 220 μF, 50 V CD series Electrolytic capacitor NICHICON L1 W 9.7 x H 3.8 x L 10 mm 100 μH CLF10040T-101M-H Inductor TDK D1 PMDS Average I = 3 A Max RB055L-40TF Schottky Diode ROHM 3 Parts List 3 www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 23/40 TSZ02201-0T1T0AL00130-1-2 15.Sep.2015 Rev.005 BD906xx-C series Characteristic Data (Application Examples 3) 100 Tektronix DPO5054 90 80 Efficiency [%] 70 60 VO 10 mV / div＠AC 50 40 30 20 10 0 0.0 0.2 0.4 0.6 Output Current : IO[A] 0.8 Figure 23. Output Ripple Voltage 3 (VIN = 13.2 V, IO = 0.4 A, 1 μs / div) Figure 22. Efficiency vs Output Current (Conversion Efficiency 3 VIN = 13.2 V) Tektronix DPO5054 FRA5087 VO 50 mV / div＠ AC Phase Gain IO 200 mA / div＠DC Figure 24. Frequency Characteristic 3 (VIN = 13.2 V, IO = 0.4 A) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Figure 25. Load Response 3 (VIN = 13.2 V, IO = 0.4 A → 0.8 A, 200 μs / div) 24/40 TSZ02201-0T1T0AL00130-1-2 15.Sep.2015 Rev.005 BD906xx-C series Application Examples 4 Parameter Product Name Input Voltage Output Voltage Output Ripple Voltage Output Current Switching Frequency Operating Temperature Symbol IC VIN VO ΔVPP IO fSW Specification case BD90640HFP / EFJ-C 3.5 V to 18 V 3.3 V 20 mVp-p Min 1.0 A / Typ 1.5 A / Max 2.0A 500 kHz -40 °C ~ +125°C Topr Specification Example 4 L1 PVIN SW VO CO R100 D1 VIN R1 VIN Cbulk CIN C2 FB RT VEN / SYNC CRT RRT EN / SYNC GND R2 VC R3 C1 Reference Circuit 4 No Package Parameters Part name (series) Type Manufacturer R1 1608 47 kΩ, 1 %, 1 / 10 W MCR03 series Chip resistor ROHM R2 1608 15 kΩ, 1 %, 1 / 10 W MCR03 series Chip resistor ROHM R3 1608 10 kΩ, 1 %, 1 / 10 W MCR03 series Chip resistor ROHM R100 - SHORT - - - RRT 1608 27 kΩ, 1 %, 1 / 10 W MCR03 series Chip resistor ROHM C1 1608 6800 pF, R, 50 V GCM series Ceramic capacitor Murata C2 - OPEN - - - CRT 1608 100 pF, CH, 50 V GCM series Ceramic capacitor Murata CIN 3225 4.7 μF, X7R, 50 V GCM series Ceramic capacitor Murata CO 3225 44 μF (22 μF, X7R, 16 V × 2) GCM series Ceramic capacitor Murata Cbulk - 220 μF,35 V × 2 CZ series Electrolytic capacitor NICHICON L1 W 9.7 x H 3.8 x L 10 mm 15 μH CLF10040T-150M-D Inductor TDK D1 CPD Average I = 6 A Max RB095BM-40FH Schottky Diode ROHM 3 Parts List 4 www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 25/40 TSZ02201-0T1T0AL00130-1-2 15.Sep.2015 Rev.005 BD906xx-C series Characteristic Data (Application Examples 4) 100 Tektronix DPO5054 90 80 Efficiency [%] 70 60 VO 10 mV / div＠AC 50 40 30 20 10 0 0.0 0.5 1.0 1.5 Output Current : IO[A] 2.0 Figure 26. Efficiency vs Output Current (Conversion Efficiency 4 VIN = 13.2 V) Figure 27. Output Ripple Voltage 4 (VIN = 13.2 V, IO = 1.5 A, 1 μs / div) FRA5087 Tektronix DPO5054 VO 50 mV / div＠AC Phase Gain IO 200 mA / div＠DC offset 1.5A Figure 28. Frequency Characteristic 4 (VIN = 13.2 V, IO = 1.5 A) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Figure 29. Load Response 4 (VIN = 13.2 V, IO = 1.5 A → 2.0 A, 200 μs / div) 26/40 TSZ02201-0T1T0AL00130-1-2 15.Sep.2015 Rev.005 BD906xx-C series Application Examples 5 Parameter Product Name Input Voltage Output Voltage Output Ripple Voltage Output Current Switching Frequency Operating Temperature Symbol IC VIN VO ΔVPP IO fSW Specification case BD90640HFP / EFJ-C 9 V to 18 V 8.8 V 100 mVp-p Min 1.0 A / Typ 1.5 A / Max 2.0 A 500 kHz -40 °C ~ +125°C Topr Specification Example 5 L1 PVIN SW VO CO R100 D1 VIN R1 VIN Cbulk CIN C2 FB RT VEN / SYNC CRT RRT EN / SYNC GND R2 VC R3 C1 Reference Circuit 5 No Package Parameters Part name (series) Type Manufacturer R1 1608 51 kΩ, 1 %, 1 / 10 W MCR03 series Chip resistor ROHM R2 1608 5.1 kΩ, 1 %, 1 / 10 W MCR03 series Chip resistor ROHM R3 1608 91 kΩ, 1 %, 1 / 10 W MCR03 series Chip resistor ROHM R100 - SHORT - - - RRT 1608 27 kΩ, 1 %, 1 / 10 W MCR03 series Chip resistor ROHM C1 1608 10000 pF, R, 50 V GCM series Ceramic capacitor Murata C2 - OPEN - - - CRT 1608 100 pF, CH, 50 V GCM series Ceramic capacitor Murata CIN 3225 4.7 μF, X7R, 50 V GCM series Ceramic capacitor Murata CO - 270 μF, 25 V HVP series Cbulk - 220 μF, 35 V × 2 CZ series Electrolytic capacitor NICHICON L1 W 9.7 x H 3.8 x L 10 mm 22 μH CLF10040T-220M-D Inductor TDK D1 CPD Average I = 6 A Max RB095BM-40FH Schottky Diode ROHM 3 Hybrid capacitor SUNCON Parts List 5 www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 27/40 TSZ02201-0T1T0AL00130-1-2 15.Sep.2015 Rev.005 BD906xx-C series Characteristic Data (Application Examples 5) 100 Tektronix DPO5054 90 80 Efficiency [%] 70 60 VO 10 mV / div＠AC 50 40 30 20 10 0 0.0 0.5 1.0 1.5 Output Current : IO[A] 2.0 Figure 31. Output Ripple Voltage 5 (VIN = 13.2 V, IO = 1.5 A, 1 μs / div) Figure 30. Efficiency vs Output Current (Conversion5 Efficiency VIN = 13.2 V) FRA5087 Tektronix DPO5054 VO 50 mV / div＠AC Phase Gain IO 200 mA / div＠DC offset 1.5A Figure 32. Frequency Characteristic 5 (VIN = 13.2 V, IO = 1.5 A) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Figure 33. Load Response 5 (VIN = 13.2 V, IO = 1.5 A → 2.0 A, 500 μs / div) 28/40 TSZ02201-0T1T0AL00130-1-2 15.Sep.2015 Rev.005 BD906xx-C series Automotive Power Supply Line Circuit BATTERY LINE Reverse-touching protection Diode VIN L BD906xx-C series D TVS C C π type filter Figure 34. Filter Circuit The input filter circuit for EMC measures is depicted in the above Figure 34. The π type filters are the third order LC filters. When the decoupling capacitor for high frequency is insufficient, it uses π type filters. An excellent characteristic can be performed as EMI filter by a large attenuation characteristic. Components for π type filter shall be closely-placed. TVS (Transient Voltage Suppressors) are used for the first protection of the in automotive power supply line. Because it is necessary to endure high energy when the load is connected, a general zener diode is insufficient. The following are recommended. To protect it when the power supply such as BATTERY is accidentally connected in reverse, reverse polarity protection diode is needed. Device Part name (series) Manufacturer Device Part name (series) Manufacturer L CLF series TDK TVS SM8 series Vishay D S3A thru S3M series Vishay L XAL series Coilcraft C CJ series / CZ series NICHICON Parts of Automotive Power Supply Line Circuit Recommended Parts Manufacturer List Shown below is the list of the recommended parts manufacturers for reference. Type Manufacturer Electrolytic capacitor NICHICON www.nichicon.com Ceramic capacitor Murata www.murata.com Inductor TDK Inductor Coilcraft www.coilcraft.com Inductor SUMIDA www.sumida.com Diode Vishay www.vishay.com Diode / Resistor ROHM www.rohm.com www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 29/40 URL www.global.tdk.com TSZ02201-0T1T0AL00130-1-2 15.Sep.2015 Rev.005 BD906xx-C series Directions for Pattern Layout of PCB 6.SW 5.RT 4.GND 3.FB R1 2.VIN C2 1.VC R100 7.EN / SYNC GND L1 VIN VO R3 Cbulk CIN2 D1 CIN1 R2 RRT C1 CO1 CO2 CRT Exposed die pad is needed to be connected to GND. Application Circuit (HRP7) C2 R100 R1 RRT L1 VO CO1 CO2 1.RT 8.FB 2.SW 7.PVIN R2 CRT VIN CIN1 D1 3.EN / SYNC 6.VIN 4.GND 5.VC CIN2 Cbulk R3 C1 Exposed die pad is needed to be connected to GND. Application Circuit (HTSOP-J8) 1. 2. 3. 4. 5. 6. 7. Arrange the wirings of the wide lines, shown above, as short as possible in a broad pattern. Locate the input ceramic capacitor CIN as close to the VIN - GND pin as possible. Locate RRT as close to the RT pin as possible. Locate R1 and R2 as close to the FB pin as possible, and provide the shortest wiring from the R1 and R2 to the FB pin. Locate R1 and R2 as far away from the L1 as possible. Separate Power GND (schottky diode, I/O capacitor`s GND) and Signal GND (RT, VC), so that switching noise does not have an effect on SIGNAL GND at all. The feedback frequency characteristics (phase margin) can be measured using FRA by inserting a resistor at the location of R100. However, this should be shorted during normal operation. R100 is option pattern for measuring the feedback frequency characteristics. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 30/40 TSZ02201-0T1T0AL00130-1-2 15.Sep.2015 Rev.005 BD906xx-C series Reference layout pattern HRP7 EN / SYNC EN/ SYNC PGND PGND GND R100 R2 R1 RRT CO2 EN SW FB RT GND VC C1 R3 VIN CO1 CRT GND C2 L1 VIN CIN2 VIN CIN1 VO D1 Cbulk VO PGND PGND Top Layer Bottom Layer HTSOP-J8 VIN PGND PGND PGND VIN PGND Cbulk R100 CO1 CO2 D1 RRT CRT R1 C2 R2 VO FB SW PVIN EN VIN GND VC CIN1 CIN2 R3 L1 RT GND VO C1 EN / SYNC EN/ SYNC Top Layer www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 GND Bottom Layer 31/40 TSZ02201-0T1T0AL00130-1-2 15.Sep.2015 Rev.005 BD906xx-C series Power Dissipation For thermal design, be sure to operate the IC within the following conditions. (Since the temperatures described hereunder are all guaranteed temperatures, take margin into account.) 1. The ambient temperature Ta is to be 125 °C or less. 2. The chip junction temperature Tj is to be 150 °C or less. The chip junction temperature Tj can be considered in the following two patterns: ① To obtain Tj from the package surface center temperature Tt in actual use 𝑇𝑗 = 𝑇𝑡 + 𝜓𝐽𝑇 × 𝑊 ② To obtain Tj from the ambient temperature Ta 𝑇𝑗 = 𝑇𝑎 + 𝜃𝑗𝑎 × 𝑊 ＜Reference Value＞ HRP7 ＜Reference Value＞ θjc Top : 22 °C / W Bottom : 2 °C / W θja 95.3 °C / W 1-layer PCB 17.9 °C / W 4-layer PCB ψJT 5 °C / W 1-layer PCB 1 °C / W 4-layer PCB PCB Size 114.3 mm x 76.2 mm x 1.60 mmt HTSOP-J8 θjc Top : 44 °C / W Bottom : 14 °C / W θja 189.4 °C / W 1-layer PCB 40.3 °C / W 4-layer PCB ψJT 21°C / W 1-layer PCB 5°C / W 4-layer PCB PCB Size 114.3 mmx76.2 mm x 1.60 mmt The heat loss W of the IC can be obtained by the formula shown below: 𝑊 = 𝑅ON × 𝐼𝑂 2 × 𝑉𝑂 1 + 𝑉𝐼𝑁 × 𝐼𝐼𝑁 + × (𝑇𝑟 + 𝑇𝑓) × 𝑉𝐼𝑁 × 𝐼𝑂 × 𝑓𝑠𝑤 𝑉𝐼𝑁 2 Where: RON is the ON Resistance of IC (Refer to page 7) [Ω] IO is the Load Current [A] VO is the Output Voltage [V] VIN is the Input Voltage [V] IIN is the Circuit Current (Refer to page 7) [A] Tr is the Switching Rise Time [s] (Typ:17ns) Tf is the Switching Fall Time [s] (Typ:17ns) fsw is the Switching Frequency [Hz] Tr Tf (17 ns) (17 ns) ① VIN ①𝑅𝑂𝑁 × 𝐼𝑂 2 SW wave form 1 1 ② × (𝑇𝑟 + 𝑇𝑓) × 𝑉𝐼𝑁 × 𝐼𝑂 × 2 𝑇 GND T= = 𝑇𝑟 × 𝑉𝐼𝑁 × 𝐼𝑂 × 𝑓𝑠𝑤 1 fsw ② SW Wave Form www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 32/40 TSZ02201-0T1T0AL00130-1-2 15.Sep.2015 Rev.005 BD906xx-C series Thermal reduction characteristics HRP7 7.0 ①IC mounted on ROHM standard board based on JEDEC51-3 1 - layer PCB Board materials : FR-4 Board size : 114.3 mm × 76.2 mm × 1.57 mmt Top copper foil : footprint + wiring to measure, 70 μm copper. Power Dissipation : Pd[W] 6.0 ②6.98 W 5.0 4.0 ②IC mounted on ROHM standard board based on JEDEC51-5,7 4 - layer PCB Board materials : FR-4 Board size : 114.3 mm × 76.2 mm × 1.60 mmt Thermal via : pitch 1.20 mm, diameter Φ0.30 mm Top copper foil : footprint + wiring to measure, 70 μm copper. 2 inner layers copper foil : 74.2 mm × 74.2 mm, 35um copper. Reverse copper foil : 74.2 mm × 74.2 mm, 70um copper. 3.0 2.0 1.0 ①1.31 W 0.0 0 25 50 75 100 125 150 Ambient Temperature : [˚C] Condition① : θja = 95.3 °C / W Condition② : θja = 17.9 °C / W Figure 35. Power Dissipation vs Ambient Temperature (Thermal Reduction Characteristics (HRP7) ) HTSOP-J8 ①IC mounted on ROHM standard board based on JEDEC51-3 1 - layer PCB Board materials : FR-4 Board size : 114.3 mm × 76.2 mm × 1.57 mmt Top copper foil : footprint + wiring to measure, 70 μm copper. Power Dissipation : Pd[W] 7.0 6.0 5.0 4.0 ②3.10 W 3.0 2.0 ①0.66 W 1.0 ②IC mounted on ROHM standard board based on JEDEC51-5,7 4 - layer PCB Board materials : FR-4 Board size : 114.3 mm × 76.2 mm × 1.60 mmt Thermal via : pitch 1.20 mm, diameter Φ0.30 mm Top copper foil : footprint + wiring to measure, 70 μm copper. 2 inner layers copper foil : 74.2 mm × 74.2 mm, 35um copper. Reverse copper foil : 74.2 mm × 74.2 mm, 70um copper. 0.0 0 25 50 75 100 125 150 Ambient Temperature : [˚C] Condition① : θja = 189.4 °C / W Condition② : θja = 40.3 °C / W Figure 36. Power Dissipation vs Ambient Temperature (Thermal Reduction Characteristics (HTSOP-J8) ) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 33/40 TSZ02201-0T1T0AL00130-1-2 15.Sep.2015 Rev.005 BD906xx-C series I/O Equivalent Circuit VC RT Internal Supply VIN Internal Supply Internal Supply 30kΩ VIN 1kΩ 1kΩ VC 1kΩ RT 30kΩ 1kΩ SW 4MΩ FB Internal Supply VIN PVIN Internal Supply VIN 200kΩ SW 30kΩ 10kΩ 30kΩ FB EN / SYNC VIN 1333kΩ 400kΩ EN / SYNC 200kΩ 100kΩ 185kΩ 250kΩ www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 34/40 TSZ02201-0T1T0AL00130-1-2 15.Sep.2015 Rev.005 BD906xx-C series Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a potential below the ground pin at any time, even during transient condition. However, pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground due to back EMF or electromotive force. In such cases, the user should make sure that such voltages going below ground will not cause the IC and the system to malfunction by examining carefully all relevant factors and conditions such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 35/40 TSZ02201-0T1T0AL00130-1-2 15.Sep.2015 Rev.005 BD906xx-C series Operational Notes – continued 12. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements GND Parasitic Elements GND N Region close-by Figure 37. Example of monolithic IC structure 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe Operation (ASO). 15. Thermal Shutdown Circuit(TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 16. Over Current Protection Circuit (OCP) This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection circuit. 17. Disturbance light In a device where a portion of silicon is exposed to light such as in a WL-CSP, IC characteristics may be affected due to photoelectric effect. For this reason, it is recommended to come up with countermeasures that will prevent the chip from being exposed to light. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 36/40 TSZ02201-0T1T0AL00130-1-2 15.Sep.2015 Rev.005 BD906xx-C series Ordering Information B D Product Name 9 0 6 Output Switch Current 90640 : 4 A 90620 : 2.5 A 90610 : 1.25 A 4 0 H F P Package HFP : HRP7 EFJ : HTSOP-J8 - C T R Product Rank C : for Automotive Tape and Reel Information TR : Reel type embossed taping E2 : Reel type embossed taping Marking Diagram HRP7 (TOP VIEW) Part Number Marking LOT Number Output Switch Current Part Number Marking 4A BD90640HFP 2.5 A BD90620HFP Output Switch Current Part Number Marking 4A D90640 2.5 A D90620 1.25 A D90610 1PIN MARK HTSOP-J8 (TOP VIEW) Part Number Marking LOT Number 1PIN MARK www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 37/40 TSZ02201-0T1T0AL00130-1-2 15.Sep.2015 Rev.005 BD906xx-C series Physical Dimension, Tape and Reel Information Package Name www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 HRP7 38/40 TSZ02201-0T1T0AL00130-1-2 15.Sep.2015 Rev.005 BD906xx-C series Physical Dimension, Tape and Reel Information Package Name www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 HTSOP-J8 39/40 TSZ02201-0T1T0AL00130-1-2 15.Sep.2015 Rev.005 BD906xx-C series Revision History Date Revision 6.Jan.2014 001 7.Apr.2014 002 17.Oct.2014 003 21.Nov.2014 004 15.Sep.2015 005 Changes New Release P.4 Description of OCP remove sentence “Furthermore ~” P.6 Operating Output Switch Current Of Overcurrent Protection symbol change ISWLIMIT. P.18 Parts List D1 Package change “PMDS” P.19 Parts List C2 change “open” P.21 About Directions for Pattern Layout of PCB ⑥ change “～and Signal GND (RT, VC,),～” HRP Package version addition P.5 Recommended Operating Conditions：Capacitance of Input Capacitor addition P.17 Setting Phase Compensation Circuit：Change SBD symbol P.28 I/O Equivalent Circuit：Change MOS symbol The whole : Changing format Power Dissipation Note : additional detail of board condition Selection of the switching frequency setting : additional setting CRT Selection of the phase compensation circuit : additional settings to suitable position of the phase compensation Marking diagram [HRP7] : delete “BD90610HFP” . www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 40/40 TSZ02201-0T1T0AL00130-1-2 15.Sep.2015 Rev.005 Datasheet Notice Precaution on using ROHM Products 1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet BD90610EFJ-C - Web Page Buy Distribution Inventory Part Number Package Unit Quantity Minimum Package Quantity Packing Type Constitution Materials List RoHS BD90610EFJ-C HTSOP-J8 2500 2500 Taping inquiry Yes