Everlight EAST1616RGBA4 Compatible with automatic placement equipment. Datasheet

SMD ƒ B
EAST1616RGBA4
Features
․Package in 8mm tape on 7〞diameter reel.
․Compatible with automatic placement equipment.
․Compatible with infrared and vapor phase reflow solder process.
․Full-color type.
․Pb-free
․The product itself will remain within RoHS compliant version.
․Compliance with EU REACH.
․Compliance Halogen Free .(Br <900 ppm ,Cl <900 ppm , Br+Cl < 1500 ppm).
Description
․The SMD LED is much smaller than lead frame type components, thus enable smaller board size, higher packing density,
reduced storage space and finally smaller equipment to be obtained.
․Besides, lightweight makes them ideal for miniature applications. etc.
Applications
․Backlighting in dashboard and switch.
․Telecommunication: indicator and backlighting in telephone and fax.
․Flat backlight for LCD, switch and symbol.
․General use.
1
Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 23-Aug-2013. Issue No: 1
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DATASHEET
SMD ƒ B
EAST1616RGBA4
Device Selection Guide
Code
Chip
Materials
Emitted Color
R6
AlGaInP
Brilliant Red
GH
InGaN
Brilliant Green
BH
InGaN
Blue
2
Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 23-Aug-2013. Issue No: 1
Resin Color
Water Clear
Rev.1
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DATASHEET
SMD ƒ B
EAST1616RGBA4
Absolute Maximum Ratings (Ta=25℃)
Parameter
Symbol
Reverse Voltage
Forward Current
Peak Forward Current
(Duty 1/10 @1KHz)
Power Dissipation
Electrostatic
Discharge(HBM)
Rating
Unit
VR
5
V
IF
25
mA
IFP
Pd
ESD
Code
R6
60
GH
100
BH
100
R6
60
GH
95
BH
95
R6
2000
GH
150
BH
150
mA
mW
V
Operating Temperature
Topr
-40 ~ +85
℃
Storage Temperature
Tstg
-40 ~ +90
℃
Soldering Temperature
Tsol
3
Reflow Soldering : 260 ℃ for 10 sec.
Hand Soldering : 350 ℃ for 3 sec.
Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 23-Aug-2013. Issue No: 1
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DATASHEET
SMD ƒ B
EAST1616RGBA4
Electro-Optical Characteristics (Ta=25℃)
Parameter
Symbol
Luminous Intensity
Viewing Angle
Peak Wavelength
Min.
Typ.
Max.
R6
72.0
100
225
GH
140
180
285
BH
36.0
50.0
90.0
-----
120
-----
R6
-----
632
-----
GH
-----
518
-----
BH
-----
468
-----
R6
614
624
628
2θ1/2
λp
Unit
Condition
mcd
Deg
nm
IF=20mA
Dominant
λd
Wavelength
Spectrum
Iv
Code
Radiation
Bandwidth
Forward Voltage
Reverse Current
△λ
VF
IR
GH
518
525
528
BH
465
470
475
R6
-----
20
-----
GH
-----
35
-----
BH
-----
25
-----
R6
1.7
-----
2.4
GH
2.7
-----
3.8
BH
2.7
-----
3.8
R6
10
GH
50
BH
-----
-----
nm
nm
V
μA
VR=5V
50
Note:
1. Tolerance of Luminous Intensity: ±11%
2. Tolerance of Dominant Wavelength: ±1nm
3. Tolerance of Forward Voltage: ±0.1V
4
Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 23-Aug-2013. Issue No: 1
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DATASHEET
SMD ƒ B
EAST1616RGBA4
R6
Bin Range of Luminous Intensity
Bin Code
Min.
Max.
Unit
Condition
Q1
Q2
R1
R2
S1
72.0
90,0
112
140
180
90.0
112
140
180
225
mcd
IF=20mA
GH
Bin Range of Luminous Intensity
Bin Code
Min.
Max.
Unit
Condition
R2
S1
S2
140
180
225
180
225
285
mcd
IF=20mA
BH
Bin Range of Luminous Intensity
Bin Code
Min.
Max.
Unit
Condition
N2
P1
P2
Q1
36.0
45.0
57.0
72.0
45.0
57.0
72.0
90.0
mcd
IF=20mA
Note:
Tolerance of Luminous Intensity: ±11%
5
Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 23-Aug-2013. Issue No: 1
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DATASHEET
SMD ƒ B
EAST1616RGBA4
Typical Electro-Optical Characteristics Curves
R6
Forward Current vs.
Forward Voltage
Ta=25°C
100
Forward Current IF (mA)
Relative luminous intensity (%)
Spectrum Distribution
75
50
25
0
500
550
600
650
Wavelength λ (nm)
40
30
25
20
10
0
1.2
700
Relative luminous intensity (%)
Relative luminous intensity (%)
Forward Current
Ambient Temperature
100
10
1
-60 -40 -20
1.6 2.0
2.4 2.8 3.0
Forward Voltage VF (V)
Luminous Intensity vs.
Luminous Intensity vs.
1000
0 20 40 60 80 100
Ta=25°C
1000
100
10
1 0
10
10
1
10
2
Forward Current IF (mA)
Ambient Temperature Ta (°C)
Radiation Diagram
Forward Current Derating Curve
Forward Current IF (mA)
Ta=25°C
50
0°
50
10°
Ta=25°C
20°
30°
40
40°
30
25
1.0
0.9
20
50°
0.8
60°
10
0.7
0
0
20
40
60
85
100
0.5 0.3
0.1 0.2 0.4 0.6
70°
80°
90°
Ambient Temperature Ta (°C)
6
Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 23-Aug-2013. Issue No: 1
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DATASHEET
SMD ƒ B
EAST1616RGBA4
Typical Electro-Optical Characteristics Curves
GH
Spectrum Distribution
50
I (mA)
100
40
F
75
Forward Current
Relative luminous intensity (%)
Ta=25°
Forward Current vs.
Forward Voltage
Ta=25°C
50
25
0
400
450
500
550
30
25
20
10
0
2.6
600
Relative luminous intensity (%)
Relative luminous intensity (%)
Ambient Temperature
100
10
0
1000
4.5
10
1
10
20 40 60 80 100
10
10
Forward Current IF(mA)
Radiation Diagram
Forward Current Derating Curve
0°
50
IF(mA)
4.2
100
Ambient Temperature Ta (°C)
Forward Current
3.8
Luminous Intensity vs
Forward Current
Ta=25°C
Luminous Intensity vs.
1
-60 -40 -20
3.4
Forward Voltage V F (V)
Wavelength λ (nm)
1000
3.0
10°
Ta=25°C
20°
30°
40
30
25
20
10
0
40°
1.0
0.9
50°
0.8
60°
0.7
0
20
40
60
85
100
0.5 0.3
0.1
0.2 0.4 0.6
70°
80°
90°
Ambient Temperature Ta (°C)
7
Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 23-Aug-2013. Issue No: 1
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DATASHEET
SMD ƒ B
EAST1616RGBA4
Typical Electro-Optical Characteristics Curves
BH
Forward Current vs.
Forward Voltage
Ta=25°C
100
Forward Current IF (mA)
Relative luminous intensity (%)
Spectrum Distribution
75
50
25
0
400
450
500
550
40
30
25
20
10
0
2.6
600
Wavelength λ (nm)
100
10
1
-60 -40 -20 0 20 40 60 80 100
Relative luminous intensity (%)
Relative luminous intensity (%)
3.8
Forward Current
Ambient Temperature
4.2 4.5
Ta=25°C
1000
100
10
1
10
2
1
10
10
Forward Current IF (mA)
Radiation Diagram
0° 10°
Forward Current Derating Curve
Forward Current IF (mA)
3.4
Luminous Intensity vs.
Ambient Temperature Ta (°C)
50
Ta=25°C
20°
30°
40
40°
30
25
1.0
0.9
50°
20
0.8
60°
10
0
70°
0.7
0
20
40
60
85 100
Ambient Temperature Ta (°C)
8
3.0
Forward Voltage VF (V)
Luminous Intensity vs.
1000
Ta=25°C
50
80°
90°
0.5 0.3
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0.1 0.2 0.4 0.6
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DATASHEET
SMD ƒ B
EAST1616RGBA4
Package Dimension
1.6
1.6
2
1
3
4
5
6
Cathode Mark
0.35
0.2
1.1
1.0
0.6±0.1
1.9±0.3
1.6
0.8
1.35±0.2
1
0.4
0.4
Solder Mask
3
4
5
6
0.1
0.725±0.1
2
1
2
0.275±0.1
3
0.5±0.1 0.4±0.2
4
0.25±0.05
5
0.25±0.05
0.25
6
0.6
0.55±0.15 0.8
0.25
1.6
1.6
0.55±0.15
0.7±0.2
1.5±0.2
2.2±0.2
Suggested pad dimension is just for reference only.
Please modify the pad dimension based on individual need
Note: Tolerances unless mentioned ±0.1mm. Unit = mm
9
Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 23-Aug-2013. Issue No: 1
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DATASHEET
SMD ƒ B
EAST1616RGBA4
Moisture Resistant Packing Materials
Label Explanation
‧CPN: Customer’s Product Number
‧P/N: Product Number
‧QTY: Packing Quantity
‧CAT: Luminous Intensity Rank
‧HUE: Chromaticity Coordinates & Dom. Wavelength Rank
‧REF: Forward Voltage Rank
‧LOT No: Lot Number
Reel Dimensions
Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm
10
Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 23-Aug-2013. Issue No: 1
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DATASHEET
SMD ƒ B
EAST1616RGBA4
Carrier Tape Dimensions: Loaded quantity 2000 PCS per reel
6
4
2
5
3
1
Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm
Moisture Resistant Packaging
Label
11
Aluminum moisture-proof bag
Desiccant
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Label
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DATASHEET
SMD ƒ B
EAST1616RGBA4
Precautions For Use
1. Over-current-proof
Customer must apply resistors for protection, otherwise slight voltage shift will cause big
current change ( Burn out will happen ).
2. Storage
2.1 Do not open moisture proof bag before the products are ready to use.
2.2 Before opening the package: The LEDs should be kept at 30℃ or less and 90%RH or less.
2.3 After opening the package: The LED's floor life is 1 year under 30℃ or less and 60% RH or less.
If unused LEDs remain, it should be stored in moisture proof packages.
2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the
storage time, baking treatment should be performed using the following conditions.
Baking treatment : 60±5℃ for 24 hours.
3. Soldering Condition
3.1 Pb-free solder temperature profile
26 0 °C M ax.
10 sec. M ax.
A b ov e2 5 5°C
3 0 sec.M ax .
3 °C /sec.M ax .
6 °C /sec.M ax .
P re-h eatin g
A b o ve 2 1 7 °C
6 0 ~ 1 5 0sec.
15 0 ~ 2 00 °C
6 0 ~ 12 0 sec.
3.2 Reflow soldering should not be done more than two times.
3.3 When soldering, do not put stress on the LEDs during heating.
3.4 After soldering, do not warp the circuit board.
4.Soldering Iron
Each terminal is to go to the tip of soldering iron temperature less than 350℃ for 3 seconds within once in less than the
soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful because
the damage of the product is often started at the time of the hand solder.
5.Repairing
Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering
iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs will or will
not be damaged by repairing.
12
Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 23-Aug-2013. Issue No: 1
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DATASHEET
SMD ƒ B
EAST1616RGBA4
Application Restrictions
High reliability applications such as military/aerospace, automotive safety/security systems,
and medical equipment may require different product. If you have any concerns, please contact
Everlight Americas before using this product in your application. This specification guarantees the quality
and performance of the product as an individual component. Do not use this product beyond the
specification described in this document.
13
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