PARA LIGHT L-T690WDT-NWA Surface mount device led Datasheet

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PARA LIGHT DCC
PARA LIGHT ELECTRONICS CO., LTD.
4F, No.1, Lane 93, Chien Yi Road, Chung Ho City, Taipei, Taiwan
Tel: 886-2-2225-3733
Fax: 886-2-2225-4800
http://www.para.com.tw
E-mail: [email protected]
DATA
SHEET
PART NO.: L-T690WDT-NWA
REV: A / 2
CUSTOMER’S APPROVAL : _______________
DRAWING NO. : DS-31P-12-0002
DATE : 2012-5-8
PARA-FOR-065
DCC : ____________
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Part No. : L-T690WDT-NWA
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l Features
Û
Û
Û
Û
Û
Û
l
Top view, Wide view angle, Netural White color PLCC6 package SMD LED .
EIA STD package, packing in 12mm tape on 7" diameter reels (ANSI/EIA-481-B-2001).
Compatible with automatic Pick & Place equipment.
Compatible with IR Reflow soldering and TTW soldering.
Pb free product and acceptable lead-free process!
Meet RoHS Green Product.
Application
*General lighting
*Decorative and Entertainment Lighting.
*Indicators.
l Package Outline Dimensions
3
6
2
1
5
4
C athode M ark
3
B
6
2
1
B
5
4
B
Notes:
1. All dimensions are in millimeters.
2. Tolerance is ± 0.10mm (.004") unless otherwise noted.
DRAWING NO. : DS-31P-12-0002
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DATE : 2012-5-8
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Part No. : L-T690WDT-NWA
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l Chip Materials
Û
Û
Û
Dice Material : InGaN
Light Color : Netural White
Lens Color : Light Yellow Diffused.
l Absolute Maximum Ratings(Ta=25℃)
Symbol
Parameter
Rating
Unit
PD
Power Dissipation
270
mW
IPF
Peak Forward Current
(1/10 Duty Cycle, 0.1ms Pulse Width)
100
mA
IF
Continuous Forward Current
90
mA
VR
Reverse Voltage
5
V
1000
V
Note A
ESD
Electrostatic Discharge Threshold (HBM)
Topr
Operating Temperature Range
-40 ~ + 85
℃
Tstg
Storage Temperature Range
-40 ~ + 100
℃
Note A :
HBM : Human Body Model. Seller gives no other assurances regarding the ability of to
withstand ESD.
l Electro-Optical Characteristics (Ta=25℃)
Symbol
Min.
Luminous Flux
φv
18
Viewing Angle
2θ1/2
120
CIE Chromaticity
x
0.3700
CIE Chromaticity
y
0.3700
Color temperature
CCT
4000
Forward Voltage
VF
2.90
Color Rending Index
CRI
70
Parameter
Reverse Voltage
Ir
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PARA-FOR-068
Typ.
3.20
Max.
Unit
Test Condition
22
lm
IF=60mA
Deg
Note 2
IF=60mA
4500
K
3.40
V
IF = 60mA
Ra
IF=60mA
uA
Vf=5V
10
DATE : 2012-5-8
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Notes:
1. Luminous intensity is measured with a light sensor and filter combination that
proximities the CIE eye-response curve.
2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous
intensity.
3. Caution in ESD :
Static Electricity and surge damages the LED. It is recommended use a wrist band or
anti-electrostatic glove when handling the LED. All devices, equipment and machinery
must be properly grounded.
4. Major standard testing equipment by “Instrument System” Model : CAS140B Compact
Array Spectrometer and “KEITHLEY” Source Meter Model : 2400.
l Typical Electro-Optical Characteristics Curves
Fig.1 Relative Intensity vs. Wavelength
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l Typical Electro-Optical Characteristics Curves
(25℃ Ambient Temperature Unless Otherwise Noted)
60
40
20
3.0 3.2 3.4 3.6
Forward Voltage(v)
90
60
30
Ta=25℃
2.0
1.5
1.0
0.5
20
40
60
80 100
20
40
60
80 100
Forward Current(mA)
Ambient Temperature Ta(℃)
Fig.3 Relative Luminous Intensity vs.Forward Current
Fig.2 Forward Current Derating Curve
3.8
IFP=120mA
1
0.5
0.2
0.1
-40 -20 0 20 40 60 80 100
Ambient Temperature Ta(℃)
Fig.4 Luminous Intensity vs.Ambient Temperature
Allowable Forward Current IFP(mA)
2
Relative luminous intensity
120
0
2.8
Fig.1 Forward Current vs.Forward Voltage
200
0.35
0.33
-30℃
0℃
25
℃
85℃ 50℃
0.32
30
20
0.31
0
1
5 10
20
50 100
0.30
0.29
Ambient Temperature Ta(℃)
Fig.5 Forward Current Derating Curve
10°
0.30 0.31 0.32
x
0.33
0.34
Fig.6 Ambient Temperature vs.Chromaticity Coordinate
°
20°
Y-Y
300mA
10°
20°
X-X
30°
30°
240mA
0.33
0.32
Y
120mA
0.31
60mA
0.30
1.0
40°
0.9
50°
0.8
10mA
0.29
0.315
0.34
50
0°
Ta=25℃
IFP=120mA
Ta=25℃
100
0.35
0.34
Relative Luminous lntensity
Normalized of 120mA
Forward Current IF(mA)
Forward Current(mA)
Ta=25℃
80
0
2.5
150
100
0.7
0.320
0.325 0.330 0.335
x
Fig.7 Forward Current vs.Chromaticity Coordinate
DRAWING NO. : DS-31P-12-0002
PARA-FOR-068
0.5 0.3 0.1
0.2 0.4 0.6
Fig 8 Spatial Distribution
60°
70°
80°
90°
1.0
40°
0.9
50°
0.8
60°
70°
80°
90°
0.7
0.5 0.3 0.1
0.2 0.4 0.6
Fig.9 Spatial Distribution
DATE : 2012-5-8 PAGE
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l IV Bin Code List
Luminous Flux(Lm)
Bin
Code
Min
Max
Lh
18
20
Li
20
Tolerance of each bin are±10%
22
l VF Bin Code List
Forward Voltage(VF),, Unit:V@60mA
BINCODE
MIN
MAX
V1
2.90
3.00
V2
3.00
3.10
V3
3.10
3.20
V4
3.20
3.30
V5
3.30
3.40
Tolerance of each bin are±0.1V.
●C.I.E Chromaticity Diagram
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●Bin Range of Chromaticity Coordinates @ 60mA
4000-4250-K1
4000-4250-K2
4000-4250-K3
4000-4250-K4
X
Y
X
Y
0.3736
0.3879
0.3635
0.3808
0.3779
0.4079
0.3668
0.3997
0.3900
0.4157
0.3779
0.4079
0.3843
0.3943
0.3736
0.3879
0.3693
0.3691
0.3602
0.3621
0.3736
0.3879
0.3635
0.3808
0.3843
0.3943
0.3736
0.3879
0.3792
0.3752
0.3693
0.3691
0.3655
0.3519
0.3574
0.3463
0.3693
0.3691
0.3602
0.3621
0.3792
0.3752
0.3693
0.3691
0.3744
0.3579
0.3655
0.3519
0.3616
0.3343
0.3546
0.3305
0.3655
0.3519
0.3574
0.3463
0.3744
0.3579
0.3655
0.3519
0.3696
0.3392
0.3616
0.3343
4000-4250-H1
4000-4250-H2
4000-4250-H3
4000-4250-H4
* easurement of Color coordinates : +/- 0.01
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l Label Explanation
l Reel Dimensions
Notes:
1. Taping Quantity : 1000 pcs/reel MAX
2. The tolerances unless noted is±0.1mm, Angle±0.5°, Unit: mm.
DRAWING NO. : DS-31P-12-0002
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DATE : 2012-5-8
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l Suggest Soldering Pad Dimensions
Moisture Resistant Packaging
Label
H:\S M D\SM D\S M D° ü × ° \± ê ? ? .jpg
H:\S MD\ SM D\S MD° ü × ° \± ê ? ? .jpg
H:\S
MD\
SM
D\SM
D°
ü×
ê
° \±
? ? .jpg
l
Reel
Label
Desiccant
Aluminum moistue-proof bag
240
H:\S
M D\S
M D\S
MD
° \± ê
°ü ×
pg
? ? .j
145
210
5
25
Label
Box
435
Carton
Notes : One reel in a bag, one bag in a inner box, ten inner boxes in a carton. Unit : mm.
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l Package Dimensions Of Tape And Reel
Notes: All dimensions are in millimeters.
Plarity
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Part No. : L-T690WDT-NWA
●
Suggest Sn/Pb IR Reflow Soldering Profile Condition:
●
Suggest Pb-Free IR Reflow Soldering Profile Condition:
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l CAUTIONS
1. Static Electricity:
* Static electricity or surge voltage damages the LEDs.
It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs.
* All devices, equipment and machinery must be properly grounded.
It is recommended that measures be taken against surge voltage to the equipment that mounts the LEDs.
* When inspecting the final products in which LEDs were assembled, it is recommended to check
whether the assembled LEDs are damaged by static electricity or not. It is easy to find static-damaged
LEDs by a light-on test or a VF test at a lower current (blew 1mA is recommended).
* Damaged LEDs will show some unusual characteristics such as the leak current remarkably increases,
the forward voltage becomes lower, or the LEDs do not light at the low current.
Criteria: (VF>2.0V,at IF=0.5m A )
2. Storage :
* Before opening the package :
The LEDs should be kept at 30°C or less and 85%RH or less. When storing the LEDs, moisture
proof packaging with absorbent material (silica gel) is recommended.
* After opening the package :
The LEDs should be kept at 30°C or less and 70%RH or less. The LEDs should be soldered within
168 hours (7 days) after opening the package. If unused LEDs remain, they should be stored in
moisture proof packages, such as sealed containers with packages of moisture absorbent material
(silica gel). It is also recommended to return the LEDs to the original moisture poof bag and to
reseal the moisture proof bag again.
If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the
storage time, baking treatment should e performed using the following conditions.
Baking treatment: more than 24hours at 65±5℃.
* Please avoid rapid transitions in ambient temperature in high humidity environments where
condensation may occur.
3. Soldering:
Do not apply any stress to the LED lens during soldering while the LED is at high temperature.
Recommended soldering condition.
* Reflow Soldering :
Pre-heat 120~150°C, 120sec. MAX., Peak temperature : 240°C Max. Soldering time : 10 sec Max.
* Soldering Iron : (Not recommended)
Temperature350°C Max., Soldering time : 3 sec. Max.(one time only), power dissipation of iron :
20W Max. use SN60 solder of solder with silver content and don’t to touch LED lens when soldering.
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DATE : 2012-5-8
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4. Lead-Free Soldering
For Reflow Soldering :
1、Pre-Heat Temp: 150-180℃,120sec.Max.
2、Soldering Temp: Temperature Of Soldering Pot Over 240℃,40sec.Max.
3、Peak Temperature: 260℃,10sec.
4、Reflow Repetition: 2 Times Max.
5、Suggest Solder Paste Formula : 93.3 Sn/3.1 Ag/3.1 Bi/0.5 Cu
For Soldering Iron (Not Recommended) :
1、Iron Tip Temp: 350℃ Max.
2、Soldering Iron: 30w Max.
3、Soldering Time: 3 Sec. Max. One Time.
5. Drive Method
Circuit model A
Circuit model B
(A)Recommended circuit.
(B)The difference of brightness between LED`s could be found due to the Vf-If characteristics of LED.
6. Reliability
1、Criteria For Judging The Damage
Item
Symbol
Test Conditions
Forward Voltage
VF
Reverse Current
Luminous Intensity
Criteria for Judgement
MIN.
Max.
IF=60mA
-
U.S.L.*)×1.1
IR
VR=5V
-
U.S.L.*)×2.0
IV
IF=60mA
L.S.L**)×0.7
-
*) U.S.L.: Upper Standard Level
**) L.S.L: Lower Standard Level
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2、Test Items And Results
Test Item
Reference
Standard
Resistance to Soldering Heat
JEITA
(Reflow Soldering)
ED-4701300 301
Solder ability (Reflow Soldering)
Thermal Shock
Temperature Cycle
High Temperature Storage
Temperature Humidity Storage
Low Temperature Storage
JEITA
ED-4701300 303
JEITA
ED-4701300 307
JEITA
ED-4701100 105
JEITA
ED-4701200201
JEITA
ED-4701100 103
JEITA
ED-4701200 202
Steady State Operating Life
Condition
Steady State Operating Life
of High Humidity Heat
Test Condition
Note
Tsld=260℃,10sec.
(Pre treatment
2times
30℃,70%,168hrs)
Tsld=215℃,3sec.
1time
(Lead Solder)
over 95%
-40℃ ~ 100℃
100cycles
30min. 30min.
-40℃ ~ 25℃~100℃~25℃
100cycles
30min. 5min. 30min. 5min
Number
of
Damaged
0/50
0/50
0/50
0/50
Ta=100℃
1000hrs.
0/50
Ta=60℃,RH=90%
1000hrs.
0/50
Ta=-40℃
1000hrs.
0/50
Ta=25℃,IF=60mA
1000hrs.
0/50
Ta=60℃,RH=90%,IF=60mA
500hrs.
0/50
7. Cleaning
Û If cleaning is required , use the following solutions for less than 1 minute and less than 40℃.
Û Appropriate chemicals: isopropyl alcohol. (When using other solvents, it should be confirmed
beforehand whether the solvents will dissolve the package and the resin or not.)
Û Effect of ultrasonic cleaning on the LED resin body differs depending on such factors as
ultrasonic power and the assembled condition. Before cleaning, a pre-test should be
confirm whether any damage to the LEDS will occur.
8.Others:
The appearance and specifications of the product may be modified for improvement without notice.
DRAWING NO. : DS-31P-12-0002
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DATE : 2012-5-8
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