Product Folder Order Now Technical Documents Tools & Software Support & Community CC3120 SWAS034 – FEBRUARY 2017 CC3120 SimpleLink™ Wi-Fi® Wireless Network Processor, Internet-of-Things Solution for MCU Applications 1 Device Overview 1.1 Features 1 • CC3120R SimpleLink™ Wi-Fi® Consists of a Wireless Network Processor (NWP) and PowerManagement Subsystems • Featuring Wi-Fi Internet-on-a chip™ Dedicated ARM® Cortex®-M3 Microcontroller Unit (MCU) Completely Offloads Wi-Fi and Internet Protocols from the Application MCU • Wi-Fi Modes: – 802.11b/g/n Station – 802.11b/g Access Point (AP) Supports up to Four Stations – Wi-Fi Direct® Client/Group Owner • WPA2 Personal and Enterprise Security: WEP, WPA/WPA2 PSK, WPA2 Enterprise (802.1x) • IPv4 and IPv6 TCP/IP Stack – Industry-Standard BSD Socket Application Programming Interfaces (APIs) – 16 Simultaneous TCP or UDP Sockets – 6 Simultaneous TLS and SSL Sockets • IP Addressing: Static IP, LLA, DHCPv4, and DHCPv6 With Duplicate Address Detection (DAD) • SimpleLink Connection Manager for Autonomous and Fast Wi-Fi Connections • Flexible Wi-Fi Provisioning With SmartConfig™ Technology, AP Mode, and WPS2 Options • RESTful API Support Using Internal HTTP Server • Wide Set of Security Features – Hardware Features – Separate Execution Environments – Device Identity – Networking security – Personal and Enterprise Wi-Fi Security – Secure Sockets (SSLv3, TLS1.0/1.1/TLS1.2) – HTTPS Server – Trusted Root-Certificate Catalog – TI Root-of-Trust Public key – Software IP protection – Secure Key Storage – File System Security – Software Tamper Detection – Cloning Protection • Embedded Network Applications Running on the Dedicated NWP – HTTP/HTTPS Web Server With Dynamic User Callbacks – mDNS, DNS-SD, DHCP Server – Ping • Recovery Mechanism—Can Recover to Factory Defaults or to a Complete Factory Image • Wi-Fi TX Power – 18.0 dBm @ 1 DSSS – 14.5 dBm @ 54 OFDM • Wi-Fi RX Sensitivity – –96.0 dBm @ 1 DSSS – –74.5 dBm @ 54 OFDM • Application Throughput – UDP: 16 Mbps – TCP: 13 Mbps • Power-Management Subsystem – Integrated DC-DC Converters Support a Wide Range of Supply Voltage: – VBAT Wide-Voltage Mode: 2.1 V to 3.6 V – VIO is Always Tied With VBAT – Preregulated 1.85-V Mode – Advanced Low-Power Modes – Shutdown: 1 µA – Hibernate: 4.5 µA – Low-Power Deep Sleep (LPDS): 115 µA – RX Traffic: 59 mA @ 54 OFDM – TX Traffic: 229 mA @ 54 OFDM, Maximum Power – Idle Connected (MCU in LPDS): 690 µA @ DTIM = 1 • Clock Source – 40.0-MHz Crystal With Internal Oscillator – 32.768-kHz Crystal or External RTC • RGK Package – 64-Pin, 9-mm × 9-mm Very Thin Quad Flat Nonleaded (VQFN) Package, 0.5-mm Pitch • Operating Temperature – Ambient Temperature Range: –40°C to +85°C • Device Supports SimpleLink Developers Ecosystem 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. CC3120 SWAS034 – FEBRUARY 2017 1.2 • www.ti.com Applications For Internet-of-Things (IoT) applications, such as: – Cloud Connectivity – Internet Gateway – Home and Building Automation – Appliances – Access Control – Security Systems – Smart Energy 1.3 – – – – – – Industrial Control Smart Plug and Metering Wireless Audio IP Network Sensor Nodes Asset Tracking Medical Devices Description The CC3120R device is part of the SimpleLink™ microcontroller (MCU) platform which consists of Wi-Fi, Bluetooth® low energy, Sub-1 GHz and host MCUs, which all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit Overview for SimpleLink™ solutions. Connect any microcontroller (MCU) to the Internet of Things (IoT) cloud with the CC3120R device from Texas Instruments™. The Wi-Fi® Alliance CERTIFIED® CC3120R device is part of the second generation of the SimpleLink™ Wi-Fi family that dramatically simplifies the implementation of low-power Internet connectivity. The CC3120R has all of the Wi-Fi and Internet protocols implemented in the ROM, which runs from the dedicated on-chip ARM® network processor and significantly offloads the host MCU and simplifies the system integration. The CC3120R Wi-Fi Internet-on-a chip™ device contains a dedicated ARM MCU that offloads many of the networking activities from the host MCU. This subsystem includes an 802.11b/g/n radio, baseband, and MAC with a powerful crypto engine for fast, secure Internet connections with 256-bit encryption. The CC3120R device supports station, AP, and Wi-Fi direct modes. The device also supports WPA2 personal and enterprise security. The device includes embedded TCP/IP and TLS/SSL stacks, an HTTP server, and multiple Internet protocols. The CC3120R device supports a variety of Wi-Fi provisioning methods, including HTTP based on AP mode, SmartConfig™ technology, and WPS2.0. As part of TI’s SimpleLink Wi-Fi family second generation, the CC3120R device introduces the new features and enhanced capabilities, such as the following: IPv6 Enhanced Wi-Fi provisioning Enhanced power consumption Wi-Fi AP connection with up to four stations More concurrently opened BSD sockets; up to 16 BSD sockets, of which 6 are secure HTTPS support RESTful API support Asymmetric keys crypto library The CC3120R device is delivered with a slim and user-friendly host driver to simplify the integration and development of networking applications. The host driver can easily be ported to most platforms and operating systems (OS). The driver is written in strict ANSI-C (C89) and requires minimal platform adaptation layer (porting layer). The driver has a small memory footprint and can run on 8-, 16-, or 32-bit microcontrollers with any clock speed (no performance or real-time dependency). 2 Device Overview Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC3120 CC3120 www.ti.com SWAS034 – FEBRUARY 2017 The CC3120R device comes in an easy-to-layout VQFN package and is delivered as a complete platform solution, including various tools and software, sample applications, user and programming guides, reference designs, and the TI E2E™ support community. The CC3120R device is part of the SimpleLink MCU Ecosystem. Device Information (1) PART NUMBER CC3120RNMARGKT/R (1) PACKAGE BODY SIZE VQFN (64) 9.00 mm × 9.00 mm For all available packages, see the orderable addendum at the end of the data sheet. Device Overview Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC3120 3 CC3120 SWAS034 – FEBRUARY 2017 1.4 www.ti.com Functional Block Diagrams Figure 1-1 shows the CC3120R hardware overview. Network Processor ROM ‡ :L-Fi Driver ‡ TCP/IP Stack ‡ TLS/SSL Stack ‡ Net Apps RAM Crypto Engine ARM Cortex-M3 MAC Processor UART DC-DC Oscillators LNA System Synthesizer PA Host I/F SPI Baseband Radio Copyright © 2017, Texas Instruments Incorporated Figure 1-1. CC3120R Hardware Overview Figure 1-2 shows an overview of the CC3120R embedded software. User Application SimpleLink Driver SPI or UART Driver External Microcontroller Internet Protocols TLS/SSL Embedded Internet TCP/IP Supplicant Wi-Fi Driver Wi-Fi MAC Embedded Wi-Fi Wi-Fi Baseband Wi-Fi Radio ARM Processor (Wi-Fi Network Processor) Copyright © 2017, Texas Instruments Incorporated Figure 1-2. CC3120R Software Overview 4 Device Overview Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC3120 CC3120 www.ti.com SWAS034 – FEBRUARY 2017 Table of Contents 1 2 3 Device Overview ......................................... 1 4.13 Timing and Switching Characteristics ............... 18 1.1 Features .............................................. 1 4.14 External Interfaces 1.2 Applications ........................................... 2 4.15 Host UART .......................................... 28 1.3 Description ............................................ 2 1.4 Functional Block Diagrams ........................... 4 5.1 Overview Revision History ......................................... 5 Terminal Configuration and Functions .............. 6 5.2 Functional Block Diagram ........................... 30 5.3 Device Features ..................................... 31 .......................................... 6 3.2 Pin Attributes ......................................... 7 3.3 Connections for Unused Pins ........................ 9 Specifications ........................................... 10 4.1 Absolute Maximum Ratings ......................... 10 4.2 ESD Ratings ........................................ 10 4.3 Power-On Hours .................................... 10 4.4 Recommended Operating Conditions ............... 10 4.5 Current Consumption Summary .................... 11 5.4 Power-Management Subsystem .................... 36 5.5 Low-Power Operating Modes ....................... 37 5.6 Memory .............................................. 38 5.7 Restoring Factory Default Configuration ............ 39 3.1 4 Pin Diagram 4.6 TX Power and IBAT versus TX Power Level Settings .............................................. 12 4.7 ................. Electrical Characteristics (3.3 V, 25°C) ............. WLAN Receiver Characteristics .................... WLAN Transmitter Characteristics .................. WLAN Filter Requirements.......................... 4.8 4.9 4.10 4.11 4.12 5 Brownout and Blackout Conditions 6 7 .................................. 26 Detailed Description ................................... 30 ............................................ 30 Applications, Implementation, and Layout........ 40 6.1 Application Information .............................. 40 6.2 PCB Layout Guidelines ............................. 45 Device and Documentation Support ............... 48 ................................. 7.1 Tools and Software 7.2 Device Nomenclature ............................... 49 48 7.3 Documentation Support ............................. 49 14 7.4 Community Resources .............................. 50 15 7.5 Trademarks.......................................... 51 16 7.6 Electrostatic Discharge Caution ..................... 51 16 7.7 Export Control Notice 17 7.8 Glossary ............................................. 51 Thermal Resistance Characteristics for RGK Package ............................................. 17 8 ............................... 51 Mechanical, Packaging, and Orderable Information .............................................. 52 2 Revision History DATE REVISION NOTES February 2017 SWAS034* Initial Release Revision History Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC3120 5 CC3120 SWAS034 – FEBRUARY 2017 www.ti.com 3 Terminal Configuration and Functions 3.1 Pin Diagram VDD_ANA1 VDD_ANA2 DCDC_ANA2_SW_N DCDC_ANA2_SW_P VIN_DCDC_DIG DCDC_DIG_SW DCDC_PA_OUT DCDC_PA_SW_N DCDC_PA_SW_P VIN_DCDC_PA DCDC_ANA_SW VIN_DCDC_ANA LDO_IN1 SOP0 SOP1 VDD_PA_IN Figure 3-1 shows pin assignments for the 64-pin VQFN package. 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 NC 53 28 NC VIN_IO2 54 27 NC UART1_TX 55 26 NC VDD_DIG2 56 25 LDO_IN2 UART1_RX 57 24 VDD_PLL TEST_58 58 23 WLAN_XTAL_P TEST_59 59 22 WLAN_XTAL_N TEST_60 60 21 SOP2/TCXO_EN UART1_nCTS 61 20 NC TEST_62 62 19 RESERVED NC 63 18 NC NC 64 17 NC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 NC RESERVED HOSTINTR 29 FLASH_SPI_CS 52 FLASH_SPI_MISO RTC_XTAL_N FLASH_SPI_MOSI RESERVED FLASH_SPI_CLK 30 VIN_IO1 51 VDD_DIG1 RTC_XTAL_P HOST_SPI_nCS RF_BG HOST_SPI_MISO 31 HOST_SPI_MOSI 50 HOST_SPI_CLK UART1_nRTS NC nRESET RESERVED 32 nHIB 49 NC VDD_RAM Figure 3-1. VQFN 64-Pin Assignments Top View 6 Terminal Configuration and Functions Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC3120 CC3120 www.ti.com 3.2 SWAS034 – FEBRUARY 2017 Pin Attributes Table 3-1 describes the CC3120R pins. NOTE If an external device drives a positive voltage to signal pads when the CC3120R device is not powered, DC current is drawn from the other device. If the drive strength of the external device is adequate, an unintentional wakeup and boot of the CC3120R device can occur. To prevent current draw, TI recommends one of the following: • All devices interfaced to the CC3120R device must be powered from the same power rail as the CC3120R device. • Use level shifters between the CC3120R device and any external devices fed from other independent rails. • The nRESET pin of the CC3120R device must be held low until the VBAT supply to the device is driven and stable. Table 3-1. Pin Attributes PIN STATE AT RESET AND HIBERNATE I/O TYPE (1) DESCRIPTION nHIB Hi-Z I Hibernate signal input to the NWP subsystem (active low). This is connected to the MCU GPIO. If the GPIO from the MCU can float while the MCU enters low power, consider adding a pullup resistor on the board to avoid floating. 3 Reserved Hi-Z – Reserved for future use 5 HOST_SPI_CLK Hi-Z I Host interface SPI clock 6 HOST_SPI_MOSI Hi-Z I Host interface SPI data input 7 HOST_SPI_MISO Hi-Z O Host interface SPI data output 8 HOST_SPI_nCS Hi-Z I Host interface SPI chip select (active low) 9 VDD_DIG1 Hi-Z Power Digital core supply (1.2 V) 10 VIN_IO1 Hi-Z Power I/O supply 11 FLASH_SPI_CLK Hi-Z O Serial flash interface: SPI clock 12 FLASH_SPI_MOSI Hi-Z O Serial flash interface: SPI data out 13 FLASH _SPI_MISO Hi-Z I Serial flash interface: SPI data in (active high) 14 FLASH _SPI_CS Hi-Z O Serial flash interface: SPI chip select (active low) 15 HOST_INTR Hi-Z O Interrupt output (active high) 19 Reserved Hi-Z – Connect a 100-kΩ pulldown resistor to ground. 21 SOP2/TCXO_EN Hi-Z O Controls restore to default mode. Enable signal for external TCXO. Add a 10-kΩ pulldown resistor to ground. 22 WLAN_XTAL_N Hi-Z Analog Connect the WLAN 40-MHz XTAL here. 23 WLAN_XTAL_P Hi-Z Analog Connect the WLAN 40-MHz XTAL here. 24 VDD_PLL Hi-Z Power Internal PLL power supply (1.4 V nominal) 25 LDO_IN2 Hi-Z Power Input to internal LDO Reserved Hi-Z O Reserved for future use 31 RF_BG Hi-Z RF 2.4-GHz RF TX, RX 32 nRESET Hi-Z I 2 29 30 (1) DEFAULT FUNCTION RESET input for the device. Active low input. Use RC circuit (100 k || 0.1 µF) for power on reset (POR). I = Input O = Output RF = radio frequency I/O = bidirectional Terminal Configuration and Functions Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC3120 7 CC3120 SWAS034 – FEBRUARY 2017 www.ti.com Table 3-1. Pin Attributes (continued) 8 PIN DEFAULT FUNCTION STATE AT RESET AND HIBERNATE I/O TYPE (1) 33 VDD_PA_IN Hi-Z Power Power supply for the RF power amplifier (PA) 34 SOP1 Hi-Z – Controls restore to default mode. Add 100-kΩ pulldown to ground. Factory default function. 35 SOP0 Hi-Z – Controls restore to default mode. Add 100-kΩ pulldown to ground. Factory default function. 36 LDO_IN1 Hi-Z Power Input to internal LDO 37 VIN_DCDC_ANA Hi-Z Power Power supply for the DC-DC converter for analog section 38 DCDC_ANA_SW Hi-Z Power Analog DC-DC converter switch output 39 VIN_DCDC_PA Hi-Z Power PA DC-DC converter input supply 40 DCDC_PA_SW_P Hi-Z Power PA DC-DC converter switch output +ve 41 DCDC_PA_SW_N Hi-Z Power PA DC-DC converter switch output –ve 42 DCDC_PA_OUT Hi-Z Power PA DC-DC converter output. Connect the output capacitor for DC-DC here. 43 DCDC_DIG_SW Hi-Z Power Digital DC-DC converter switch output 44 VIN_DCDC_DIG Hi-Z Power Power supply input for the digital DC-DC converter 45 DCDC_ANA2_SW_P Hi-Z Power Analog2 DC-DC converter switch output +ve 46 DCDC_ANA2_SW_N Hi-Z Power Analog2 DC-DC converter switch output –ve 47 VDD_ANA2 Hi-Z Power Analog2 power supply input 48 VDD_ANA1 Hi-Z Power Analog1 power supply input 49 VDD_RAM Hi-Z Power Power supply for the internal RAM 50 UART1_nRTS Hi-Z O 51 RTC_XTAL_P Hi-Z Analog 32.768-kHz XTAL_P or external CMOS level clock input 52 RTC_XTAL_N Hi-Z Analog 32.768-kHz XTAL_N or 100-kΩ external pullup for external clock 54 VIN_IO2 Hi-Z Power I/O power supply. Same as battery voltage. 55 UART1_TX Hi-Z O 56 VDD_DIG2 Hi-Z Power 57 UART1_RX Hi-Z I UART host interface; connect to test point on prototype for flash programming. 58 TEST_58 – Test signal; connect to an external test point. 59 TEST_59 – Test signal; connect to an external test point. DESCRIPTION UART host interface (active low) UART host interface. Connect to test point on prototype for flash programming. Digital power supply (1.2 V) 60 TEST_60 Hi-Z O Test signal; connect to an external test point. 61 UART1_nCTS Hi-Z I UART host interface (active low) 62 TEST_62 Hi-Z O Test signal; connect to an external test point. 65 GND Power Terminal Configuration and Functions Ground tab used as thermal and electrical ground Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC3120 CC3120 www.ti.com 3.3 SWAS034 – FEBRUARY 2017 Connections for Unused Pins All unused pins must be left as no connect (NC) pins. Table 3-2 provides a list of NC pins. Table 3-2. Connections for Unused Pins (1) PIN DEFAULT FUNCTION STATE AT RESET AND HIBERNATE I/O TYPE (1) 1 NC WLAN analog – Unused; leave unconnected. DESCRIPTION 4 NC WLAN analog – Unused; leave unconnected. 16 NC WLAN analog – Unused; leave unconnected. 17 NC WLAN analog – Unused; leave unconnected. 18 NC WLAN analog – Unused; leave unconnected. 20 NC WLAN analog – Unused; leave unconnected. 26 NC WLAN analog – Unused; leave unconnected. 27 NC WLAN analog – Unused; leave unconnected. 28 NC WLAN analog – Unused; leave unconnected. 26 NC WLAN analog – Unused; leave unconnected. 27 NC WLAN analog – Unused; leave unconnected. 28 NC WLAN analog – Unused; leave unconnected. 53 NC WLAN analog – Unused; leave unconnected. 63 NC WLAN analog – Unused; leave unconnected. 64 NC WLAN analog – Unused; leave unconnected. I = Input O = Output RF = radio frequency I/O = bidirectional Terminal Configuration and Functions Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC3120 9 CC3120 SWAS034 – FEBRUARY 2017 www.ti.com 4 Specifications All measurements are referenced at the device pins, unless otherwise indicated. All specifications are over process and voltage, unless otherwise indicated. 4.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) MIN MAX –0.5 3.8 V 0.0 V –0.5 VIO + 0.5 V –0.5 2.1 V –0.5 2.1 V Operating temperature, TA –40 85 °C Storage temperature, Tstg –55 125 °C VBAT and VIO Pins: 37, 39, 44 VIO – VBAT (differential) Pins: 10, 54 Digital inputs RF pins Analog pins, XTAL 4.2 Pins: 22, 23, 51, 52 UNIT ESD Ratings VALUE VESD (1) (2) 4.3 Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) ±2000 Charged device model (CDM), per JEDEC specification JESD22-C101 (2) ±500 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Power-On Hours NOTE This information is provided solely for your convenience and does not extend or modify the warranty provided under TI's standard terms and conditions for TI semiconductor products. CONDITIONS POH TA up to 85°C (1) (1) 4.4 87,600 The TX duty cycle (power amplifier ON time) is assumed to be 10% of the device POH. Of the remaining 90% of the time, the device can be in any other state. Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) (1) (2) VBAT, VIO (shorted to VBAT) Pins: 10, 37, 39, 44, 54 Direct battery connection (3) (3) (4) (5) (6) 10 TYP MAX 3.3 3.6 Preregulated 1.85 V (5) (6) Ambient thermal slew (1) (2) MIN 2.1 (4) –20 20 UNIT V °C/minute Operating temperature is limited by crystal frequency variation. When operating at an ambient temperature of over 75°C, the transmit duty cycle must remain below 50% to avoid the auto-protect feature of the power amplifier. If the auto-protect feature triggers, the device takes a maximum of 60 seconds to restart the transmission. To ensure WLAN performance, ripple on the 2.1- to 3.3-V supply must be less than ±300 mV. The minimum voltage specified includes the ripple on the supply voltage and all other transient dips. The brownout condition is also 2.1 V, and care must be taken when operating at the minimum specified voltage. To ensure WLAN performance, ripple on the 1.85-V supply must be less than 2% (±40 mV). TI recommends keeping VBAT above 1.85 V. For lower voltages, use a boost converter. Specifications Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC3120 CC3120 www.ti.com 4.5 SWAS034 – FEBRUARY 2017 Current Consumption Summary TA = 25°C, VBAT = 3.6 V TEST CONDITIONS (1) PARAMETER 1 DSSS TX 6 OFDM 54 OFDM RX (3) (2) MIN TYP TX power level = 0 272 TX power level = 4 188 TX power level = 0 248 TX power level = 4 179 TX power level = 0 223 TX power level = 4 160 1 DSSS 53 54 OFDM 53 Idle connected (4) 690 LPDS 115 Hibernate (5) Peak calibration current (6) (3) (1) (2) (3) (4) (5) (6) MAX UNIT mA mA µA 4 VBAT = 3.3 V 450 VBAT = 2.1 V 670 VBAT = 1.85 V 700 mA TX power level = 0 implies maximum power (see Figure 4-1, Figure 4-2, and Figure 4-3). TX power level = 4 implies output power backed off approximately 4 dB. The CC3120R system is a constant power-source system. The active current numbers scale based on the VBAT voltage supplied. The RX current is measured with a 1-Mbps throughput rate. DTIM = 1 For the 1.85-V mode, the hibernate current is higher by 50 µA across all operating modes because of leakage into the PA and analog power inputs. The complete calibration can take up to 17 mJ of energy from the battery over a time of 24 ms. In default mode, calibration is performed sparingly, and typically occurs when re-enabling the NWP and when the temperature has changed by more than 20°C. There are two additional calibration modes that may be used to reduced or completely eliminate the calibration event. For further details, see CC3120, CC3220 SimpleLink™ Wi-Fi® and IoT Network Processor Programmer's Guide. Specifications Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC3120 11 CC3120 SWAS034 – FEBRUARY 2017 4.6 www.ti.com TX Power and IBAT versus TX Power Level Settings Figure 4-1, Figure 4-2, and Figure 4-3 show TX Power and IBAT versus TX power level settings for modulations of 1 DSSS, 6 OFDM, and 54 OFDM, respectively. In Figure 4-1, the area enclosed in the circle represents a significant reduction in current during transition from TX power level 3 to level 4. In the case of lower range requirements (14-dBm output power), TI recommends using TX power level 4 to reduce the current. 1 DSSS 19.00 280.00 Color by 17.00 264.40 TX Power (dBm) IBAT (VBAT @ 3.6 V) 249.00 13.00 233.30 11.00 218.00 9.00 202.00 7.00 186.70 5.00 171.00 3.00 155.60 1.00 140.00 0 1 2 3 4 5 6 7 8 9 10 TX power level setting 11 12 13 14 IBAT (VBAT @ 3.6 V)(mAmp) TX Power (dBm) 15.00 15 Figure 4-1. TX Power and IBAT vs TX Power Level Settings (1 DSSS) 6 OFDM 19.00 280.00 Color by 17.00 IBAT (VBAT @ 3.6 V) 249.00 13.00 233.30 11.00 218.00 9.00 202.00 7.00 186.70 5.00 171.00 3.00 155.60 1.00 IBAT (VBAT @ 3.6 V)(mAmp) 15.00 TX Power (dBm) 264.40 TX Power (dBm) 140.00 0 1 2 3 4 5 6 7 8 9 10 TX power level setting 11 12 13 14 15 Figure 4-2. TX Power and IBAT vs TX Power Level Settings (6 OFDM) 12 Specifications Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC3120 CC3120 www.ti.com SWAS034 – FEBRUARY 2017 54 OFDM 19.00 280.00 Color by 17.00 IBAT (VBAT @ 3.6 V) 249.00 13.00 233.30 11.00 218.00 9.00 202.00 7.00 186.70 5.00 171.00 3.00 155.60 1.00 IBAT (VBAT @ 3.6 V)(mAmp) 15.00 TX Power (dBm) 264.40 TX Power (dBm) 140.00 0 1 2 3 4 5 6 7 8 9 10 TX power level setting 11 12 13 14 15 Figure 4-3. TX Power and IBAT vs TX Power Level Settings (54 OFDM) Specifications Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC3120 13 CC3120 SWAS034 – FEBRUARY 2017 4.7 www.ti.com Brownout and Blackout Conditions The device enters a brownout condition when the input voltage drops below Vbrownout (see Figure 4-4 and Figure 4-5). This condition must be considered during design of the power supply routing, especially when operating from a battery. High-current operations, such as a TX packet or any external activity (not necessarily related directly to networking) can cause a drop in the supply voltage, potentially triggering a brownout condition. The resistance includes the internal resistance of the battery, the contact resistance of the battery holder (four contacts for 2× AA batteries), and the wiring and PCB routing resistance. NOTE When the device is in HIBERNATE state, brownout is not detected. Only blackout is in effect during HIBERNATE state. Figure 4-4. Brownout and Blackout Levels (1 of 2) Figure 4-5. Brownout and Blackout Levels (2 of 2) 14 Specifications Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC3120 CC3120 www.ti.com SWAS034 – FEBRUARY 2017 In the brownout condition, all sections of the device (including the 32-kHz RTC) shut down except for the Hibernate module, which remains on. The current in this state can reach approximately 400 µA. The blackout condition is equivalent to a hardware reset event in which all states within the device are lost. Table 4-1 lists the brownout and blackout voltage levels. Table 4-1. Brownout and Blackout Voltage Levels VOLTAGE LEVEL UNIT Vbrownout CONDITION 2.1 V Vblackout 1.67 V 4.8 Electrical Characteristics (3.3 V, 25°C) GPIO Pins Except 29, 30, 50, 52, and 53 (25°C) PARAMETER TEST CONDITIONS MIN NOM MAX Pin capacitance VIH High-level input voltage 0.65 × VDD VIL Low-level input voltage –0.5 IIH High-level input current 5 nA IIL Low-level input current 5 nA VOH VOL IOH IOL VIL (1) 4 UNIT CIN High-level output voltage Low-level output voltage High-level source current, Low-level sink current, pF VDD + 0.5 V 0.35 × VDD IL = 2 mA; configured I/O drive strength = 2 mA; 2.4 V ≤ VDD < 3.6 V VDD × 0.8 IL = 4 mA; configured I/O drive strength = 4 mA; 2.4 V ≤ VDD < 3.6 V VDD × 0.7 IL = 8 mA; configured I/O drive strength = 8 mA; 2.4 V ≤ VDD < 3.6 V VDD × 0.7 IL = 2 mA; configured I/O drive strength = 2 mA; 2.1 V ≤ VDD < 2.4 V VDD × 0.75 IL = 2 mA; configured I/O drive strength = 2 mA; VDD = 1.85 V VDD × 0.7 IL = 2 mA; configured I/O drive strength = 2 mA; 2.4 V ≤ VDD < 3.6 V VDD × 0.2 IL = 4 mA; configured I/O drive strength = 4 mA; 2.4 V ≤ VDD < 3.6 V VDD × 0.2 IL = 8 mA; configured I/O drive strength = 8 mA; 2.4 V ≤ VDD < 3.6 V VDD × 0.2 IL = 2 mA; configured I/O drive strength = 2 mA; 2.1 V ≤ VDD < 2.4 V VDD × 0.25 IL = 2 mA; configured I/O drive strength = 2 mA; VDD = 1.85 V VDD × 0.35 2-mA drive 2 4-mA drive 4 6-mA drive 6 2-mA drive 2 4-mA drive 4 6-mA drive 6 nRESET (1) 0.6 V V V V mA mA V The nRESET pin must be held below 0.6 V for the device to register a reset. Specifications Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC3120 15 CC3120 SWAS034 – FEBRUARY 2017 4.9 www.ti.com WLAN Receiver Characteristics TA = 25°C, VBAT = 2.1 V to 3.6 V. Parameters are measured at the SoC pin on channel 6 (2437 MHz). PARAMETER Sensitivity (8% PER for 11b rates, 10% PER for 11g/11n rates) (10% PER) (2) Maximum input level (10% PER) (1) (2) (3) TEST CONDITIONS (Mbps) MIN TYP (1) 1 DSSS –96.0 2 DSSS –94.0 11 CCK –88.0 6 OFDM –90.5 9 OFDM –90.0 18 OFDM –86.5 36 OFDM –80.5 54 OFDM –74.5 MCS7 (GF) (3) –71.5 MCS7 (MM) (3) –70.5 802.11b –4.0 802.11g –10.0 MAX UNIT dBm dBm In preregulated 1.85-V mode, RX sensitivity is 0.25- to 1-dB lower. Sensitivity is 1-dB worse on channel 13 (2472 MHz). Sensitivity for mixed mode is 1-dB worse. 4.10 WLAN Transmitter Characteristics TA = 25°C, VBAT = 2.1 V to 3.6 V. Parameters measured at SoC pin on channel 7 (2442 MHz). (1) PARAMETER Maximum RMS output power measured at 1 dB from IEEE spectral mask or EVM TEST CONDITIONS (2) MIN +18.0 2 DSSS +18.0 11 CCK +18.3 6 OFDM +17.3 9 OFDM +17.3 18 OFDM +17.0 36 OFDM +16.0 54 OFDM +14.5 MCS7 (MM) Transmit center frequency accuracy (1) (2) 16 TYP 1 DSSS MAX UNIT dBm +13.0 –25 25 ppm Channel-to-channel variation is up to 2 dB. The edge channels (2412 and 2472 MHz) have reduced TX power to meet FCC emission limits. In preregulated 1.85-V mode, maximum TX power is 0.25- to 0.75-dB lower for modulations higher than 18 OFDM. Specifications Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC3120 CC3120 www.ti.com SWAS034 – FEBRUARY 2017 4.11 WLAN Filter Requirements The device requires an external band-pass filter to meet the various emission standards, including FCC. Table 4-2 presents the attenuation requirements for the band-pass filter. TI recommends using the same filter used in the reference design to ease the process of certification. Table 4-2. WLAN Filter Requirements PARAMETER FREQUENCY (MHz) Return loss 2412 to 2484 Insertion loss (1) 2412 to 2484 Attenuation Reference impendence TYP MAX 1 1.5 UNIT 10 dB 800 to 830 30 45 1600 to 1670 20 25 3200 to 3300 30 48 4000 to 4150 45 50 4800 to 5000 20 25 5600 to 5800 20 25 6400 to 6600 20 35 7200 to 7500 35 45 7500 to 10000 20 25 2412 to 2484 Filter type (1) MIN dB dB 50 Ω Bandpass Insertion loss directly impacts output power and sensitivity. At customer discretion, insertion loss can be relaxed to meet attenuation requirements. 4.12 Thermal Resistance Characteristics for RGK Package AIR FLOW PARAMETER 0 lfm (C/W) 150 lfm (C/W) 250 lfm (C/W) 500 lfm (C/W) θja 23 14.6 12.4 10.8 Ψjt 0.2 0.2 0.3 0.1 Ψjb 2.3 2.3 2.2 2.4 θjc 6.3 θjb 2.4 Specifications Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC3120 17 CC3120 SWAS034 – FEBRUARY 2017 www.ti.com 4.13 Timing and Switching Characteristics 4.13.1 Power Supply Sequencing For proper operation of the CC3120R device, perform the recommended power-up sequencing as follows: 1. Tie VBAT (pins 37, 39, 44) and VIO (pins 54 and 10) together on the board. 2. Hold the RESET pin low while the supplies are ramping up. TI recommends using a simple RC circuit (100 K ||, 1 µF, RC = 100 ms). 3. For an external RTC, ensure that the clock is stable before RESET is deasserted (high). For timing diagrams, see Section 4.13.3. 4.13.2 Device Reset When a device restart is required, the user may either issue a negative pulse on the nHIB pin (pin 2) or on the nRESET pin (pin 32), keeping the other pulled high, depending on the configuration of the platform. In case the nRESET pin is used, the user must follow one of the two alternatives to ensure the reset is properly applied: • A high-to-low reset pulse (on pin 32) of at least 200-mS duration • If the above cannot be ensured, a pulldown resistor of 2M Ω should be connected to pin 32 (RTC_XTAL_N). If implemented, a shorter pulse of at least 100 uSec can be used. To ensure a proper reset sequence, the user has to call the sl_stop function prior to toggling the reset. 4.13.3 Reset Timing 4.13.3.1 nRESET (32k XTAL) Figure 4-6 shows the reset timing diagram for the 32k XTAL first-time power-up and reset removal. T2 T1 T3 VBAT VIO nRESET nHIB STATE POWER RESET OFF HW INIT Device Ready to serve API calls FW INIT 32-kHz XTAL Figure 4-6. First-Time Power-Up and Reset Removal Timing Diagram (32k XTAL) Table 4-3 describes the timing requirements for the XTAL first-time power-up and reset removal. Table 4-3. First-Time Power-Up and Reset Removal Timing Requirements (32k XTAL) ITEM NAME T1 Supply settling time T2 Hardware wake-up time T3 Initialization time 18 DESCRIPTION Depends on application board power supply, decoupling capacitor, and so on 32-kHz XTAL settling plus firmware initialization time plus radio calibration Specifications MIN TYP MAX UNIT 3 ms 25 ms 1.35 s Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC3120 CC3120 www.ti.com SWAS034 – FEBRUARY 2017 4.13.3.2 nRESET (External 32K) Figure 4-7 shows the reset timing diagram for the external 32K first-time power-up and reset removal. T1 T2 T3 RESET HW INIT FW INIT VBAT VIO nRESET nHIB STATE POWER OFF Device Ready to serve API calls 32-kHz RTC CLK Figure 4-7. First-Time Power-Up and Reset Removal Timing Diagram (External 32K) describes the timing requirements for the external first-time power-up and reset removal. Table 4-4. First-Time Power-Up and Reset Removal Timing Requirements (External 32K) ITEM NAME T1 Supply settling time T2 Hardware wake-up time T3 Initialization time DESCRIPTION Depends on application board power supply, decoupling capacitor, and so on Firmware initialization time plus radio calibration MIN TYP MAX UNIT 3 ms 25 ms 250 ms Specifications Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC3120 19 CC3120 SWAS034 – FEBRUARY 2017 www.ti.com 4.13.3.3 Wakeup From HIBERNATE Mode Figure 4-8 shows the timing diagram for wakeup from HIBERNATE mode. Thib_min Twake_from_hib HIBERNATE HW WAKEUP+FW INIT VBAT VIO nRESET nHIB ACTIVE ACTIVE HIBERNATE 32-kHz XTAL/CXO Figure 4-8. nHIB Timing Diagram NOTE The 32.768-kHz XTAL is kept enabled by default when the chip goes into HIBERNATE mode in response to nHIB being pulled low. Table 4-5 describes the timing requirements for nHIB. Table 4-5. nHIB Timing Requirements ITEM NAME DESCRIPTION Thib_min Minimum hibernate time Minimum pulse width of nHIB being low (1) Twake_from_hib Hardware wakeup time plus firmware initialization time See (2) (1) (2) MIN TYP 10 MAX UNIT ms 50 ms Ensure that the nHIB pulse width is kept above the minimum requirement under all conditions (such as power up, MCU reset, and so on). If temperature changes by more than 20°C, initialization time from HIB can increase by 200 ms due to radio calibration. 4.13.4 Clock Specifications The CC3120R device requires two separate clocks for its operation: • A slow clock running at 32.768 kHz is used for the RTC. • A fast clock running at 40 MHz is used by the device for the internal processor and the WLAN subsystem. The device features internal oscillators that enable the use of less-expensive crystals rather than dedicated TCXOs for these clocks. The RTC can also be fed externally to provide reuse of an existing clock on the system and to reduce overall cost. 20 Specifications Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC3120 CC3120 www.ti.com SWAS034 – FEBRUARY 2017 4.13.4.1 Slow Clock Using Internal Oscillator The RTC crystal connected on the device supplies the free-running slow clock. The accuracy of the slow clock frequency must be 32.768 kHz ±150 ppm. In this mode of operation, the crystal is tied between RTC_XTAL_P (pin 51) and RTC_XTAL_N (pin 52) with a suitable load capacitance to meet the ppm requirement. Figure 4-9 shows the crystal connections for the slow clock. 51 RTC_XTAL_P 10 pF GND 32.768 kHz 52 RTC_XTAL_N 10 pF GND Copyright © 2017, Texas Instruments Incorporated Figure 4-9. RTC Crystal Connections Table 4-6 lists the RTC crystal requirements. Table 4-6. RTC Crystal Requirements CHARACTERISTICS TEST CONDITIONS MIN Frequency TYP MAX UNIT ±150 ppm 32.768 Frequency accuracy Initial plus temperature plus aging Crystal ESR 32.768 kHz kHz 70 kΩ 4.13.4.2 Slow Clock Using an External Clock When an RTC oscillator is present in the system, the CC3120R device can accept this clock directly as an input. The clock is fed on the RTC_XTAL_P line, and the RTC_XTAL_N line is held to VIO. The clock must be a CMOS-level clock compatible with VIO fed to the device. Figure 4-10 shows the external RTC input connection. RTC_XTAL_P 32.768 kHz VIO Host system 100 KΩ RTC_XTAL_N Copyright © 2017, Texas Instruments Incorporated Figure 4-10. External RTC Input Specifications Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC3120 21 CC3120 SWAS034 – FEBRUARY 2017 www.ti.com Table 4-7 lists the external RTC digital clock requirements. Table 4-7. External RTC Digital Clock Requirements CHARACTERISTICS TEST CONDITIONS MIN Frequency Frequency accuracy (Initial plus temperature plus aging) tr, tf Vil Square wave, DC coupled ppm 50% ns 80% 0.65 × VIO VIO 0 0.35 × VIO 1 Input impedance UNIT ±150 100 20% Slow clock input voltage limits MAX Hz Input transition time tr, tf (10% to 90%) Frequency input duty cycle Vih TYP 32768 V Vpeak MΩ 5 pF 4.13.4.3 Fast Clock (Fref) Using an External Crystal The CC3120R device also incorporates an internal crystal oscillator to support a crystal-based fast clock. The XTAL is fed directly between WLAN_XTAL_P (pin 23) and WLAN_XTAL_N (pin 22) with suitable loading capacitors. Figure 4-11 shows the crystal connections for the fast clock. 23 WLAN_XTAL_P 6.2 pF GND 40 MHz WLAN_XTAL_N 22 6.2 pF GND SWAS031-030 NOTE: The XTAL capacitance must be tuned to ensure that the PPM requirement is met. See CC31xx & CC32xx Frequency Tuning for information on frequency tuning. Figure 4-11. Fast Clock Crystal Connections 22 Specifications Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC3120 CC3120 www.ti.com SWAS034 – FEBRUARY 2017 Table 4-8 lists the WLAN fast-clock crystal requirements. Table 4-8. WLAN Fast-Clock Crystal Requirements CHARACTERISTICS TEST CONDITIONS MIN TYP Frequency MAX UNIT 40 Frequency accuracy Initial plus temperature plus aging Crystal ESR 40 MHz MHz ±25 ppm 60 Ω 4.13.4.4 Fast Clock (Fref) Using an External Oscillator The CC3120R device can accept an external TCXO/XO for the 40-MHz clock. In this mode of operation, the clock is connected to WLAN_XTAL_P (pin 23). WLAN_XTAL_N (pin 22) is connected to GND. The external TCXO/XO can be enabled by TCXO_EN (pin 21) from the device to optimize the power consumption of the system. If the TCXO does not have an enable input, an external LDO with an enable function can be used. Using the LDO improves noise on the TCXO power supply. Figure 4-12 shows the connection. Vcc XO (40 MHz) C CC3120R EN TCXO_EN 82 pF WLAN_XTAL_P OUT WLAN_XTAL_N Copyright © 2017, Texas Instruments Incorporated Figure 4-12. External TCXO Input Table 4-9 lists the external Fref clock requirements. Table 4-9. External Fref Clock Requirements (–40°C to +85°C) CHARACTERISTICS TEST CONDITIONS MIN Frequency TYP Frequency accuracy (Initial plus temperature plus aging) 45% Sine or clipped sine wave, AC coupled Clock voltage limits 0.7 @ 1 kHz Phase noise @ 40 MHz 55% 1.2 –143 12 Capacitance kΩ 7 Specifications Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC3120 Vpp –138.5 dBc/Hz @ 100 kHz Input impedance ppm –125 @ 10 kHz Resistance 50% UNIT MHz ±25 Frequency input duty cycle Vpp MAX 40.00 pF 23 CC3120 SWAS034 – FEBRUARY 2017 www.ti.com 4.13.5 Interfaces This section describes the interfaces that are supported by the CC3120R device: • Host SPI • Flash SPI 4.13.5.1 Host SPI Interface Timing Figure 4-13 shows the Host SPI interface timing diagram. I2 CLK I6 I7 MISO I9 I8 MOSI SWAS032-017 Figure 4-13. Host SPI Interface Timing Table 4-10 lists the Host SPI interface timing parameters. Table 4-10. Host SPI Interface Timing Parameters PARAMETER NUMBER (1) (2) 24 MIN MAX Clock frequency @ VBAT = 3.3 V 20 Clock frequency @ VBAT ≤ 2.1 V 12 UNIT I1 F (1) I2 tclk (2) (1) Clock period I3 tLP (1) Clock low period I4 tHT (1) I5 D (1) Duty cycle I6 tIS (1) RX data setup time 4 ns I7 tIH (1) RX data hold time 4 ns (1) I8 tOD I9 tOH (1) 50 Clock high period 45% MHz ns 25 ns 25 ns 55% TX data output delay 20 ns TX data hold time 24 ns The timing parameter has a maximum load of 20 pF at 3.3 V. Ensure that nCS (active-low signal) is asserted 10 ns before the clock is toggled. nCS can be deasserted 10 ns after the clock edge. Specifications Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC3120 CC3120 www.ti.com SWAS034 – FEBRUARY 2017 4.13.5.2 Flash SPI Interface Timing Figure 4-14 shows the Flash SPI interface timing diagram. I2 CLK I6 I7 MISO I9 I8 MOSI SWAS032-017 Figure 4-14. Flash SPI Interface Timing Table 4-11 lists the Flash SPI interface timing parameters. Table 4-11. Flash SPI Interface Timing Parameters PARAMETER NUMBER MIN MAX UNIT 20 MHz I1 F Clock frequency I2 tclk Clock period I3 tLP Clock low period 25 ns I4 tHT Clock high period 25 ns I5 D Duty cycle I6 tIS RX data setup time 1 I7 tIH RX data hold time 2 I8 tOD TX data output delay I9 tOH TX data hold time 50 45% ns 55% ns ns 8.5 ns 8 ns Specifications Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC3120 25 CC3120 SWAS034 – FEBRUARY 2017 www.ti.com 4.14 External Interfaces 4.14.1 SPI Flash Interface The external serial flash stores the user profiles and firmware patch updates. The CC3120R device acts as a master in this case; the SPI serial flash acts as the slave device. This interface can work up to a speed of 20 MHz. Figure 4-15 shows the SPI flash interface. CC3120R (master) Serial flash FLASH_SPI_CLK SPI_CLK FLASH_SPI_CS SPI_CS FLASH_SPI_MISO SPI_MISO FLASH_SPI_MOSI SPI_MOSI Copyright © 2017, Texas Instruments Incorporated Figure 4-15. SPI Flash Interface Table 4-12 lists the SPI flash interface pins. Table 4-12. SPI Flash Interface PIN NAME DESCRIPTION FLASH_SPI_CLK Clock (up to 20 MHz) CC3120R device to serial flash FLASH_SPI_CS CS signal from CC3120R device to serial flash FLASH_SPI_MISO Data from serial flash to CC3120R device FLASH_SPI_MOSI Data from CC3120R device to serial flash 26 Specifications Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC3120 CC3120 www.ti.com SWAS034 – FEBRUARY 2017 4.14.2 SPI Host Interface The device interfaces to an external host using the SPI interface. The CC3120R device can interrupt the host using the HOST_INTR line to initiate the data transfer over the interface. The SPI host interface can work up to a speed of 20 MHz. Figure 4-16 shows the SPI host interface. MCU CC3120R (slave) HOST_SPI_CLK SPI_CLK HOST_SPI_nCS SPI_nCS HOST_SPI_MISO SPI_MISO HOST_SPI_MOSI SPI_MOSI HOST_INTR INTR nHIB GPIO Copyright © 2017, Texas Instruments Incorporated Figure 4-16. SPI Host Interface Table 4-13 lists the SPI host interface pins. Table 4-13. SPI Host Interface PIN NAME DESCRIPTION HOST_SPI_CLK Clock (up to 20 MHz) from MCU host to CC3120R device HOST_SPI_nCS CS (active low) signal from MCU host to CC3120R device HOST_SPI_MOSI Data from MCU host to CC3120R device HOST_INTR Interrupt from CC3120R device to MCU host HOST_SPI_MISO Data from CC3120R device to MCU host nHIB Active-low signal that commands the CC3120R device to enter hibernate mode (lowest power state) Specifications Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC3120 27 CC3120 SWAS034 – FEBRUARY 2017 www.ti.com 4.15 Host UART The SimpleLink device requires the UART configuration described in Table 4-14. Table 4-14. SimpleLink UART Configuration PROPERTY SUPPORTED CC3120R CONFIGURATION Baud rate 115200 bps, no auto-baud rate detection, can be changed by the host up to 3 Mbps using a special command Data bits 8 bits Flow control CTS/RTS Parity None Stop bits 1 Bit order LSBit first Host interrupt polarity Active high Host interrupt mode Rising edge or level 1 Endianness Little-endian only (1) (1) The SimpleLink device does not support automatic detection of the host length while using the UART interface. 4.15.1 5-Wire UART Topology Figure 4-17 shows the typical 5-wire UART topology comprised of four standard UART lines plus one IRQ line from the device to the host controller to allow efficient low-power mode. HOST MCU UART nRTS nRTS nCTS nCTS TX TX RX RX HOST_INTR(IRQ) CC3120R SL UART HOST_INTR(IRQ) Copyright © 2017, Texas Instruments Incorporated Figure 4-17. Typical 5-Wire UART Topology This topology is recommended because the configuration offers the maximum communication reliability and flexibility between the host and the SimpleLink device. 4.15.2 4-Wire UART Topology The 4-wire UART topology eliminates the host IRQ line (see Figure 4-18). Using this topology requires meeting one of the following conditions: • The host is always awake or active. • The host goes to sleep, but the UART module has receiver start-edge detection for auto wakeup and does not lose data. HOST MCU UART nRTS nRTS nCTS nCTS TX TX RX RX H_IRQ X CC3120R SL UART H_IRQ Copyright © 2017, Texas Instruments Incorporated Figure 4-18. 4-Wire UART Configuration 28 Specifications Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC3120 CC3120 www.ti.com SWAS034 – FEBRUARY 2017 4.15.3 3-Wire UART Topology The 3-wire UART topology requires only the following lines (see Figure 4-19): • RX • TX • CTS nRTS nRTS X nCTS HOST MCU UART nCTS TX TX RX RX H_IRQ X CC3120R SL UART H_IRQ Copyright © 2017, Texas Instruments Incorporated Figure 4-19. 3-Wire UART Topology Using this topology requires meeting one of the following conditions: • The host always stays awake or active. • The host goes to sleep but the UART module has receiver start-edge detection for auto-wake-up and does not lose data. • The host can always receive any amount of data transmitted by the SimpleLink device because there is no flow control in this direction. Because there is no full flow control, the host cannot stop the SimpleLink device to send its data; thus, the following parameters must be carefully considered: • Maximum baud rate • RX character interrupt latency and low-level driver jitter buffer • Time consumed by the user's application Specifications Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC3120 29 CC3120 SWAS034 – FEBRUARY 2017 www.ti.com 5 Detailed Description 5.1 Overview The CC3120R Wi-Fi Internet-on-a-chip contains a dedicated ARM MCU that offloads many of the networking activities from the host MCU. The device includes an 802.11b/g/n radio, baseband, and MAC with a powerful crypto engine for a fast, secure WLAN and Internet connections with 256-bit encryption. The CC3120R device supports station, AP, and Wi-Fi Direct modes. The device also supports WPA2 personal and enterprise security and WPS 2.0. The Wi-Fi network processor includes an embedded IPv6 and IPv4 TCP/IP stack. 5.2 Functional Block Diagram Figure 5-1 shows the functional block diagram of the CC3120R SimpleLink Wi-Fi solution. VCC SPI FLASH 32-kHz XTAL 40-MHz XTAL 32 kHz MCU MCU nHIB CC3120R Network Processor HOST_INTR SPI/UART Copyright © 2017, Texas Instruments Incorporated Figure 5-1. Functional Block Diagram 30 Detailed Description Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC3120 CC3120 www.ti.com 5.3 SWAS034 – FEBRUARY 2017 Device Features 5.3.1 WLAN The WLAN features are as follows: • 802.11b/g/n integrated radio, modem, and MAC supporting WLAN communication as a BSS station, AP, Wi-Fi Direct client and group owner with CCK and OFDM rates in the 2.4-GHz ISM band, channels 1 to 13. NOTE 802.11n is supported only in Wi-Fi station, Wi-Fi direct, and P2P client mode • • • • • 5.3.2 Autocalibrated radio with a single-ended 50-Ω interface enables easy connection to the antenna without requiring expertise in radio circuit design. Advanced connection manager with multiple user-configurable profiles stored in serial-flash allows automatic fast connection to an access point without user or host intervention. Supports all common Wi-Fi security modes for personal and enterprise networks with on-chip security accelerators, including: WEP, WPA/WPA2 PSK, WPA2 Enterprise (802.1x). Smart provisioning options deeply integrated within the device providing a comprehensive end-to-end solution. With elaborate events notification to the host, enabling the application to control the provisioning decision flow. The wide variety of Wi-Fi provisioning methods include: – Access Point using HTTPS – SmartConfig Technology: a 1-step, 1-time process to connect a CC3120R-enabled device to the home wireless network, removing dependency on the I/O capabilities of the host MCU; thus, it is usable by deeply embedded applications 802.11 transceiver mode allows transmitting and receiving of proprietary data through a socket without adding MAC or PHY headers. The 802.11 transceiver mode provides the option to select the working channel, rate, and transmitted power. The receiver mode works with the filtering options. Network Stack The Network Stack features are as follows: • Integrated IPv4, IPv6 TCP/IP stack with BSD (BSD adjacent) socket APIs for simple Internet connectivity with any MCU, microprocessor, or ASIC NOTE Not all APIs are 100% BSD compliant. Not all BSD APIs are supported. • • • Support of 16 simultaneous TCP, UDP, or RAW sockets Support of 6 simultaneous SSL\TLS sockets Built-in network protocols: – Static IP, LLA, DHCPv4, DHCPv6 with DAD and stateless autoconfiguration – ARP, ICMPv4, IGMP, ICMPv6, MLD, ND – DNS client for easy connection to the local network and the Internet Detailed Description Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC3120 31 CC3120 SWAS034 – FEBRUARY 2017 • www.ti.com Built-in network application and utilities: – HTTP/HTTPS • Web page content stored on serial flash • RESTful APIs for setting and configuring application content • Dynamic user callbacks – Service discovery: Multicast DNS service discovery lets a client advertise its service without a centralized server. After connecting to the access point, the CC3120R device provides critical information, such as device name, IP, vendor, and port number. – DHCP server – Ping Table 5-1 summarizes the NWP features. Table 5-1. NWP Features Feature Description 802.11b/g/n station Wi-Fi standards 802.11b/g AP supporting up to four stations Wi-Fi Direct client and group owner Wi-Fi Channels 1 to 13 Wi-Fi security WEP, WPA/WPA2 PSK, WPA2 enterprise (802.1x) Wi-Fi provisioning SmartConfig technology, Wi-Fi protected setup (WPS2), AP mode with internal HTTP/HTTPS web server IP protocols IPv4/IPv6 IP addressing Static IP, LLA, DHCPv4, DHCPv6 (Stateful) with DAD and stateless auto configuration Cross layer ARP, ICMPv4, IGMP, ICMPv6, MLD, NDP UDP, TCP Transport SSLv3.0/TLSv1.0/TLSv1.1/TLSv1.2 RAW IP Ping HTTP/HTTPS web server Network applications and utilities mDNS DNS-SD DHCP server Host interface UART/SPI Device identity Security Trusted root-certificate catalog TI root-of-trust public key Power management Enhanced power policy management uses 802.11 power save and deep sleep power modes RF Transceiver Other Programmable RX Filters with Events trigger mechanism including WoWLAN Recovery mechanism – Restore to factory default 32 Detailed Description Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC3120 CC3120 www.ti.com 5.3.3 SWAS034 – FEBRUARY 2017 Security The SimpleLink Wi-Fi CC3120R Internet-on-a-chip device enhances the security capabilities available for development of IoT devices, while completely offloading these activities from the MCU to the networking subsystem. The security capabilities include the following key features: Wi-Fi and Internet Security: • Personal and enterprise Wi-Fi security – Personal standards • AES (WPA2-PSK) • TKIP (WPA-PSK • WEP – Enterprise standards • EAP Fast • EAP PEAPv0 MSCHAPv2 • EAP PEAPv0 TLS • EAP PEAPv1 TLS EAP LS • EAP TTLS TLS • EAP TTLS MSCHAPv2 Detailed Description Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC3120 33 CC3120 SWAS034 – FEBRUARY 2017 • • • • • www.ti.com Secure sockets – Protocol versions: SSL v3/TLS 1.0/TLS 1.1/TLS 1.2 – On-chip powerful crypto engine for fast, secure Wi-Fi and internet connections with 256-bit AES encryption for TLS and SSL connections – Ciphers suites • SL_SEC_MASK_SSL_RSA_WITH_RC4_128_SHA • SL_SEC_MASK_SSL_RSA_WITH_RC4_128_MD5 • SL_SEC_MASK_TLS_RSA_WITH_AES_256_CBC_SHA • SL_SEC_MASK_TLS_DHE_RSA_WITH_AES_256_CBC_SHA • SL_SEC_MASK_TLS_ECDHE_RSA_WITH_AES_256_CBC_SHA • SL_SEC_MASK_TLS_ECDHE_RSA_WITH_RC4_128_SHA • SL_SEC_MASK_TLS_RSA_WITH_AES_128_CBC_SHA256 • SL_SEC_MASK_TLS_RSA_WITH_AES_256_CBC_SHA256 • SL_SEC_MASK_TLS_ECDHE_RSA_WITH_AES_128_CBC_SHA256 • SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_AES_128_CBC_SHA256 • SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_AES_128_CBC_SHA • SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_AES_256_CBC_SHA • SL_SEC_MASK_TLS_RSA_WITH_AES_128_GCM_SHA256 • SL_SEC_MASK_TLS_RSA_WITH_AES_256_GCM_SHA384 • SL_SEC_MASK_TLS_DHE_RSA_WITH_AES_128_GCM_SHA256 • SL_SEC_MASK_TLS_DHE_RSA_WITH_AES_256_GCM_SHA384 • SL_SEC_MASK_TLS_ECDHE_RSA_WITH_AES_128_GCM_SHA256 • SL_SEC_MASK_TLS_ECDHE_RSA_WITH_AES_256_GCM_SHA384 • SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_AES_128_GCM_SHA256 • SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_AES_256_GCM_SHA384 • SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_CHACHA20_POLY1305_SHA256 • SL_SEC_MASK_TLS_ECDHE_RSA_WITH_CHACHA20_POLY1305_SHA256 • SL_SEC_MASK_TLS_DHE_RSA_WITH_CHACHA20_POLY1305_SHA256 – Server authentication – Client authentication – Domain name verification – Socket upgrade to secure socket – STARTTLS Secure HTTP server (HTTPS) The Trusted root-certificate catalog verifies that the CA used by the application is trusted and known secure content delivery The TI root-of-trust public key is a hardware-based mechanism that allows authenticating TI as the genuine origin of a given content using asymmetric keys Secure content delivery allows file transfer to the system in a secure way on any unsecured tunnel Code and Data Security: • Secured network information: Network passwords and certificates are encrypted • Secured and authenticated service pack: SP is signed based on TI certificate 34 Detailed Description Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC3120 CC3120 www.ti.com 5.3.4 SWAS034 – FEBRUARY 2017 Host Interface and Driver • • • 5.3.5 Interfaces over a 4-wire serial peripheral interface (SPI) with any MCU or a processor at a clock speed of 20 MHz. Interfaces over UART with any MCU with a baud rate up to 3 Mbps. A low footprint driver is provided for TI MCUs and is easily ported to any processor or ASIC. Simple APIs enable easy integration with any single-threaded or multithreaded application. System • • • Works from a single preregulated power supply or connects directly to a battery Ultra-low leakage when disabled (hibernate mode) with a current of less than 4 µA with the RTC running Integrated clock sources Detailed Description Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC3120 35 CC3120 SWAS034 – FEBRUARY 2017 5.4 www.ti.com Power-Management Subsystem The CC3120R power-management subsystem contains DC-DC converters to accommodate the different voltage or current requirements of the system. • Digital DC-DC (Pin 44) – Input: VBAT wide voltage (2.1 to 3.6 V) or preregulated 1.85 V • ANA1 DC-DC (Pin 38) – Input: VBAT wide voltage (2.1 to 3.6 V) – In preregulated 1.85-V mode, the ANA1 DC-DC converter is bypassed. • PA DC-DC (Pin 39) – Input: VBAT wide voltage (2.1 to 3.6 V) – In preregulated 1.85-V mode, the PA DC-DC converter is bypassed. The CC3120R device is a single-chip WLAN radio solution used on an embedded system with a widevoltage supply range. The internal power management, including DC-DC converters and LDOs, generates all of the voltages required for the device to operate from a wide variety of input sources. For maximum flexibility, the device can operate in the modes described in Section 5.4.1 and Section 5.4.2. 5.4.1 VBAT Wide-Voltage Connection In the wide-voltage battery connection, the device is powered directly by the battery or preregulated 3.3-V supply. All other voltages required to operate the device are generated internally by the DC-DC converters. This scheme supports wide-voltage operation from 2.1 to 3.6 V and is thus the most common mode for the device. 5.4.2 Preregulated 1.85V The preregulated 1.85-V mode of operation applies an external regulated 1.85 V directly at pins 10, 25, 33, 36, 37, 39, 44, 48, and 54 of the device. The VBAT and the VIO are also connected to the 1.85-V supply. This mode provides the lowest BOM count version in which inductors used for PA DC-DC and ANA1 DC-DC (2.2 and 1 µH) and a capacitor (22 µF) can be avoided. In the preregulated 1.85-V mode, the regulator providing the 1.85 V must have the following characteristics: • Load current capacity ≥900 mA • Line and load regulation with <2% ripple with 500-mA step current and settling time of < 4 µs with the load step NOTE The regulator must be placed as close as possible to the device so that the IR drop to the device is very low. 36 Detailed Description Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC3120 CC3120 www.ti.com 5.5 SWAS034 – FEBRUARY 2017 Low-Power Operating Modes This section describes the low-power modes supported by the device to optimize battery life. 5.5.1 Low-Power Deep Sleep The low-power deep-sleep (LPDS) mode is an energy-efficient and transparent sleep mode that is entered automatically during periods of inactivity based on internal power optimization algorithms. The device can wake up in less than 3 ms from the internal timer or from any incoming host command. Typical battery drain in this mode is 115 µA. During LPDS mode, the device retains the software state and certain configuration information. The operation is transparent to the external host; thus, no additional handshake is required to enter or exit LPDS mode. 5.5.2 Hibernate The hibernate mode is the lowest power mode in which all of the digital logic is power-gated. Only a small section of the logic powered directly by the main input supply is retained. The RTC is kept running and the device wakes up once the nHIB line is asserted by the host driver. The wake-up time is longer than LPDS mode at approximately 50 ms. NOTE Wake-up time can be extended depending on the service-pack size. 5.5.3 Shutdown The shutdown mode is the lowest power-mode system-wise. All device logics are off, including the realtime clock (RTC). The wake-up time in this mode is longer than hibernate at approximately 1.1 s. Detailed Description Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC3120 37 CC3120 SWAS034 – FEBRUARY 2017 5.6 5.6.1 www.ti.com Memory External Memory Requirements The CC3120R device maintains a proprietary file system on the sFLASH. The CC3120R file system stores the service pack file, system files, configuration files, certificate files, web page files, and user files. By using a format command through the API, users can provide the total size allocated for the file system. The starting address of the file system cannot be set and is always at the beginning of the sFLASH. The applications microcontroller must access the sFLASH memory area allocated to the file system directly through the CC3120R file system. The applications microcontroller must not access the sFLASH memory area directly. The file system manages the allocation of sFLASH blocks for stored files according to download order, which means that the location of a specific file is not fixed in all systems. Files are stored on sFLASH using human-readable filenames rather than file IDs. The file system API works using plain text, and file encryption and decryption is invisible to the user. Encrypted files can be accessed only through the file system. All file types can have a maximum of 100 supported files in the file system. All files are stored in 4-KB blocks and thus use a minimum of 4KB of flash space. Fail-safe files require twice the original size and use a minimum of 8KB. Encrypted files are counted as fail-safe in terms of space. The maximum file size is 1MB. Table 5-2 lists the minimum required memory consumption under the following assumptions: • System files in use consume 64 blocks (256KB). • Vendor files are not taken into account. • Gang image: – Storage for the gang image is rounded up to 32 blocks (meaning 128-KB resolution). – Gang image size depends on the actual content size of all components. Additionally, the image should be 128-KB aligned so unaligned memory is considered lost. Service pack, system files, and the 128-KB aligned memory are assumed to occupy 256KB. • All calculations consider that the restore-to-default is enabled. Table 5-2. Title ITEM CC3120 [KB] File system allocation table 20 System and configuration files 256 Service Pack 264 Gang image size 256 Total 796 Minimal flash size 8MBit Recommended flash size 16MBit space NOTE The maximum supported sFLASH size is 32MB (256Mb). Please refer to Using Serial Flash on CC3120/CC3220 SimpleLink™ Wi-Fi® and Internet-of-Things Devices. 38 Detailed Description Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC3120 CC3120 www.ti.com 5.7 SWAS034 – FEBRUARY 2017 Restoring Factory Default Configuration The device has an internal recovery mechanism that allows rolling back the file system to its predefined factory image or restoring the factory default parameters of the device. The factory image is kept in a separate sector on the sFLASH in a secure manner and cannot be accessed from the host processor. The following restore modes are supported: • None—no factory restore settings • Enable restore of factory default parameters • Enable restore of factory image and factory default parameters The restore process is performed by pulling or forcing SOP[2:0] = 110 pins and toggling the nRESET pin from low to high. The process is fail-safe and resumes operation if a power failure occurs before the restore is finished. The restore process typically takes about 8 seconds, depending on the attributes of the serial flash vendor. Detailed Description Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC3120 39 CC3120 SWAS034 – FEBRUARY 2017 www.ti.com 6 Applications, Implementation, and Layout NOTE Information in the following Applications section is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI's customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 6.1 6.1.1 40 Application Information Typical Application—CC3120R Wide-Voltage Mode Applications, Implementation, and Layout Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC3120 CC3120 www.ti.com SWAS034 – FEBRUARY 2017 Figure 6-1 shows the typical application schematic using the CC3120R device in the wide-voltage mode of operation. For a full operation reference design, refer to the BoosterPack that uses the CC3120R device (see CC3120 SimpleLink™ and Internet of Things Hardware Design Files). Antenna match. Pi network might be required depending on type of antenna. 1 IN OUT 3 50 Ohm VBAT_CC GND GND 2 L1 FL1 VBAT_CC E1 1 Optional: Consider adding extra decoupling capacitors if the battery cannot source the peak currents. 3.3nH 2 4 C1 0.5pF GNDGND VBAT_CC #37 #39 #44 #54 #10 GND GND U1 VBAT_CC C3 100µF GND C4 4.7µF GND C5 4.7µF GND C6 4.7µF GND GND GND 8 C8 0.1µF C7 0.1µF R1 10k 1 6 5 2 3 7 C9 0.1µF GND R2 100k GND VDD_ANA C12 1µF VBAT_CC GND C13 C14 GND GND VDD_ANA1 VDD_ANA2 VDD_PA_IN VDD_DIG1 VDD_DIG2 VDD_PLL VDD_RAM RF_BG FLASH_SPI_CLK FLASH _SPI_CS FLASH _SPI_MISO FLASH_SPI_MOSI C16 0.1µF 0.1µF 0.1µF GND C15 0.1µF 37 39 44 10 54 GND UART1_CTS UART1_RTS UART1_TX UART1_RX VIN_DCDC_ANA VIN_DCDC_PA VIN_DCDC_DIG VIN_IO1 VIN_IO2 L2 38 2.2uH 36 25 C17 10µF L3 C19 0.1µF C18 0.1µF PA_SWP PA_SWN VDD_PA 40 41 42 TEST_58 TEST_59 TEST_60 TEST_62 DCDC_ANA_SW GND GND C20 22µF GND C23 43 C21 22µF GND C22 10µF 2.2uH 11 14 13 12 RTC_XTAL_P TP1 TP2 TP3 TP4 NC DCDC_DIG_SW HOST_SPI_CLK HOST_SPI_CS HOST_SPI_MISO HOST_SPI_MOSI HOST_INTR HIB R62 is needed only if UART is used as host interface. R5 100k 4 CC_SPI_CLK CC_SPI_CS CC_SPI_DOUT CC_SPI_DIN CC_IRQ CC_nHIB 5 8 7 6 15 2 52 RTC_XTAL_N WLAN_XTAL_P 23 RTC_XTAL_P WLAN_XTAL_N 22 NC NC NC NC NC NC NC NC NC NC NC 1 16 17 18 20 26 27 28 53 63 64 1 10pF SOP0 SOP1 SOP2/TCXO_EN J1 1 3 5 32 3 19 29 30 VBAT_CC R9 100k Flash Programming / Host Control GND DCDC_PA_SW_P DCDC_PA_SW_N DCDC_PA_OUT DCDC_ANA2_SW_P DCDC_ANA2_SW_N 51 VBAT_CC R12 100k CC_UART1_CTS CC_UART1_RTS CC_UART1_TX CC_UART1_RX CC_WLRS232_TX CC_WLRS232_RX CC_WL_UART_TX CC_NWP_UART_TX 58 59 60 62 45 46 35 34 21 2 4 6 R4 100k CC_SPI_CLK CC_SPI_CS CC_SPI_DOUT CC_SPI_DIN CC_IRQ CC_nHIB HOST INTERFACE (Ensure the nHIB line does not float at any time.) R6 Y1 32.768kHz C24 R3 100k GND CC_UART1_CTS CC_UART1_RTS CC_UART1_TX CC_UART1_RX 61 50 55 57 R10 100k RESET RESERVED RESERVED RESERVED RESERVED PAD 100k WLAN_XTAL_N GND GND C25 6.2pF Y2 40 MHz C26 6.2pF 65 GND CC3120RNMARGKR R11 2.7K R7 100k WLAN_XTAL_P 2 GND SFL_CLK SFL_CS SFL_MISO SFL_MOSI GND RTC_XTAL_N 10pF VBAT_CC 31 LDO_IN1 LDO_IN2 L4 GND 4 1 3 GND GND 2 4 GND 48 47 33 9 56 24 VDD_PLL VDD_RAM 49 VDD_PA VDD_DIG_CC C11 0.1µF CS SCLK SI/SIO0 SO/SIO1 WP/SIO2 RESET/SIO3 U2 VDD_FL C10 10µF VCC G G C2 100µF GND GND GND GND R13 100k C27 0.1µF GND GND Copyright © 2017, Texas Instruments Incorporated Figure 6-1. CC3120R Wide-Voltage Mode Application Applications, Implementation, and Layout Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC3120 41 CC3120 SWAS034 – FEBRUARY 2017 www.ti.com Table 6-1 lists the bill of materials for an application using the CC3120R device in wide-voltage mode. Table 6-1. Bill of Materials for CC3120R in Wide-Voltage Mode QUANTITY PART REFERENCE VALUE MANUFACTURER PART NUMBER DESCRIPTION 1 C1 0.5 pF Murata GRM1555C1HR50BA01D CAP, CERM, 0.5 pF, 50 V, ±20%, C0G/NP0, 0402 2 C2, C3 100 µF Taiyo Yuden LMK325ABJ107MMHT CAP, CERM, 100 µF, 10 V, ±20%, X5R, AEC-Q200 Grade 3, 1210 3 C4, C5, C6 4.7 µF TDK C1005X5R0J475M050BC CAP, CERM, 4.7 µF, 6.3 V, ±20%, X5R, 0402 11 C7, C8, C9, C11, C13, C14, C15, C16, C18, C19, 0.1 µF C27 TDK C1005X5R1A104K050BA CAP, CERM, 0.1 µF, 10 V, ±10%, X5R, 0402 3 C10, C17, C22 10 µF Murata GRM188R60J106ME47D CAP, CERM, 10 µF, 6.3 V, ±20%, X5R, 0603 1 C12 1 µF TDK C1005X5R1A105K050BB CAP, CERM, 1 µF, 10 V, ±10%, X5R, 0402 2 C20, C21 22 µF TDK C1608X5R0G226M080AA CAP, CERM, 22 µF, 4 V, ±20%, X5R, 0603 2 C23, C24 10 pF Johanson Technology 500R07S100JV4T CAP, CERM, 10 pF, 50 V, ±5%, C0G/NP0, 0402 2 C25, C26 6.2 pF Murata GRM1555C1H6R2CA01D CAP, CERM, 6.2 pF, 50 V, ±5%, C0G/NP0, 0402 1 E1 2.45-GHz Ant Taiyo Yuden AH316M245001-T ANT Bluetooth W-LAN ZIGBEE WIMAX, SMD 1 FL1 1.02 dB TDK DEA202450BT-1294C1-H Multilayer Chip Band Pass Filter For 2.4GHz WLAN/Bluetooth, SMD 1 L1 3.3 nH Murata LQG15HS3N3S02D Inductor, Multilayer, Air Core, 3.3 nH, 0.3 A, 0.17 ohm, SMD 2 L2, L4 2.2 uH Murata LQM2HPN2R2MG0L Inductor, Multilayer, Ferrite, 2.2 µH, 1.3 A, 0.08 ohm, SMD 1 L3 1 uH Murata LQM2HPN1R0MG0L Inductor, Multilayer, Ferrite, 1 µH, 1.6 A, 0.055 ohm, SMD 1 R1 10 k Vishay-Dale CRCW040210K0JNED RES, 10 k, 5%, 0.063 W, 0402 1 R11 2.7 k Vishay-Dale CRCW04022K70JNED RES, 2.7 k, 5%, 0.063 W, 0402 10 R2, R3, R4, R5, R6, R7, R9, R10, R12, R13 100 k Vishay-Dale CRCW0402100KJNED RES, 100 k, 5%, 0.063 W, 0402 1 U1 MX25R Macronix International MX25R1635FM1IL0 ULTRA LOW POWER, 16M-BIT [x 1/x 2/x 4] CMOS MXSMIO(SERIAL MULTI I/O) FLASH MEMORY, SOP-8 1 U2 CC3120 Texas Instruments CC3120RNMRGK SimpleLink Wi-Fi Network Processor, Internet-of-Things Solution for MCU Applications, RGK0064B 1 Y1 Crystal Abracon Corporation ABS07-32.768KHZ-9-T CRYSTAL, 32.768KHZ, 9PF, SMD 1 Y2 Crystal Epson Q24FA20H0039600 Crystal, 40MHz, 8pF, SMD 42 Applications, Implementation, and Layout Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC3120 CC3120 www.ti.com 6.1.2 SWAS034 – FEBRUARY 2017 Typical Application Schematic—CC3120R Preregulated, 1.85-V Mode Figure 6-2 shows the typical application schematic using the CC3120R in preregulated, 1.85-V mode of operation. For addition information on this mode of operation please contact your TI representative. Antenna match. Pi network might be required depending on type of antenna. 1.85V 1 IN OUT 3 GND GND 2 4 50 Ohm 1.85V 2 E1 L1 FL1 1 Optional: Consider adding extra decoupling capacitors if the battery cannot source the peak currents. 3.3nH C1 0.5pF GNDGND 1.85V 1.85V #37 #39 #44 #54 #10 GND GND U1 C2 100µF C10 10µF C3 100µF GND C4 4.7µF GND C5 4.7µF GND C6 4.7µF GND C8 0.1µF C7 0.1µF GND GND R1 10k C9 0.1µF GND R2 100k 8 VCC 1 6 5 2 3 7 CS SCLK SI/SIO0 SO/SIO1 WP/SIO2 RESET/SIO3 GND GND GND 4 U2 1.85V C11 0.1µF GND C13 C12 C14 C15 22µF 1µF 0.1µF 0.1µF GND GND C16 0.1µF GND 48 47 33 9 56 24 49 VDD_ANA1 VDD_ANA2 VDD_PA_IN VDD_DIG1 VDD_DIG2 VDD_PLL VDD_RAM 37 39 44 10 54 VIN_DCDC_ANA VIN_DCDC_PA VIN_DCDC_DIG VIN_IO1 VIN_IO2 38 DCDC_ANA_SW 36 25 LDO_IN1 LDO_IN2 40 41 42 DCDC_PA_SW_P DCDC_PA_SW_N DCDC_PA_OUT 43 DCDC_DIG_ SW 45 46 DCDC_ANA2_SW_P DCDC_ANA2_SW_N VBA T_CC GND C17 0.1µF L2 GND GND C18 0.1µF C21 C19 C20 10µF 0.1µF 2.2uH RF_BG 31 FLASH_SPI_CLK FLASH _SPI_CS FLASH _SPI_MISO FLASH_SPI_MOSI 11 14 13 12 UART1_CTS UART1_RTS UART1_TX UART1_RX 61 50 55 57 TEST_58 TEST_59 TEST_60 TEST_62 58 59 60 62 1.85V SFL_CLK SFL_CS SFL_MISO SFL_MOSI GND R3 100k R4 100k CC_UART1_CTS CC_UART1_RTS CC_UART1_TX CC_UART1_RX CC_UART1_CTS CC_UART1_RTS CC_UART1_TX CC_UART1_RX CC_WLRS232_TX CC_WLRS232_RX CC_WL_UART_TX CC_NWP_UART_TX TP1 TP2 TP3 TP4 R62 is needed only if UART is used as host interface. R5 100k GND NC HOST_SPI_CLK HOST_SPI_CS HOST_SPI_MISO HOST_SPI_MOSI HOST_INTR HIB 4 5 8 7 6 15 2 CC_SPI_CLK CC_SPI_CS CC_SPI_DOUT CC_SPI_DIN CC_IRQ CC_nHIB CC_SPI_CLK CC_SPI_CS CC_SPI_DOUT CC_SPI_DIN CC_IRQ CC_nHIB (Ensure the nHIB line does not float at any time.) GND 52 WLAN_XTAL_P RTC_XTAL_P WLAN_XTAL_N 22 35 34 21 SOP0 SOP1 SOP2/TCXO_EN NC NC NC NC NC NC NC NC NC NC NC 1 16 17 18 20 26 27 28 53 63 64 PAD 65 10pF VBAT_CC J1 2 4 6 32 1 3 5 1.85V R8 100k R9 100k 3 19 29 30 R10 2.7K RESET RESERVED RESERVED RESERVED RESERVED R7 100k 23 RTC_XTAL_N 51 100k GND GND 1 3 GND C23 6.2pF Y2 40 MHz G G GND C24 6.2pF 2 4 Y1 32.768kHz 1 C22 HOST INTERFACE R6 2 10pF GND Flash Programming / Host Control GND CC3120RNMARGKR GND GND R11 100k GND R12 100k GND C25 0.1µF GND GND Copyright © 2017, Texas Instruments Incorporated Figure 6-2. CC3120R Preregulated 1.85-V Mode Application Circuit Applications, Implementation, and Layout Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC3120 43 CC3120 SWAS034 – FEBRUARY 2017 www.ti.com Table 6-2 lists the bill of materials for an application using the CC3120R device in preregulated 1.85-V mode. Table 6-2. Bill of Materials for CC3120R in Preregulated, 1.85-V Mode QUANTITY DESIGNATOR VALUE MANUFACTURER PART NUMBER DESCRIPTION 1 U1 MX25R Macronix International Co., LTD MX25R1635FM1IL0 ULTRA LOW POWER, 16M-BIT [x 1/x 2/x 4] CMOS MXSMIO(SERIAL MULTI I/O) FLASH MEMORY, SOP-8 1 U2 CC3120 Texas Instruments CC3120RNMRGK SimpleLink Wi-Fi Network Processor, Internetof-Things Solution for MCU Applications, RGK0064B 1 R10 2.7 k Vishay-Dale CRCW04022K70JNED RES, 2.7 k, 5%, 0.063 W, 0402 10 R2, R3, R4, R5, R6, R7, R8, R9, R11, R12 100 k Vishay-Dale CRCW0402100KJNED 1 R1 10 k Vishay-Dale CRCW040210K0JNED RES, 10 k, 5%, 0.063 W, 0402 1 FL1 1.02 dB TDK DEA202450BT-1294C1-H Multilayer Chip Band Pass Filter For 2.4-GHz W-LAN/Bluetooth, SMD 1 L2 2.2 µH MuRata LQM2HPN2R2MG0L Inductor, Multilayer, Ferrite, 2.2 µH, 1.3 A, 0.08 ohm, SMD 1 L1 3.3 nH MuRata LQG15HS3N3S02D Inductor, Multilayer, Air Core, 3.3 nH, 0.3 A, 0.17 Ω, SMD 1 Y1 Crystal Abracon Corportation ABS07-32.768KHZ-9-T CRYSTAL, 32.768 kHz, 9 pF, SMD 1 Y2 Crystal Epson Q24FA20H0039600 Crystal, 40 MHz, 8 pF, SMD 2 C2, C3 100 µF Taiyo Yuden LMK325ABJ107MMHT CAP, CERM, 100 µF, 10 V, ±20%, X5R, AECQ200 Grade 3, 1210 1 C13 22 µF TDK C1608X5R0G226M080AA CAP, CERM, 22 µF, 4 V, ±20%, X5R, 0603 2 C10, C20 10 µF MuRata GRM188R60J106ME47D CAP, CERM, 10 µF, 6.3 V, ±20%, X5R, 0603 2 C21, C22 10 pF Johanson Technology 500R07S100JV4T CAP, CERM, 10 pF, 50 V, ±5%, C0G/NP0, 0402 2 C23, C24 6.2 pF MuRata GRM1555C1H6R2CA01D CAP, CERM, 6.2 pF, 50 V, ±5%, C0G/NP0, 0402 3 C4, C5, C6 4.7 µF TDK C1005X5R0J475M050BC CAP, CERM, 4.7 µF, 6.3 V, ±20%, X5R, 0402 1 C12 1 µF TDK C1005X5R1A105K050BB CAP, CERM, 1 µF, 10 V, ±10%, X5R, 0402 1 C1 0.5 pF MuRata GRM1555C1HR50BA01D CAP, CERM, 0.5 pF, 50 V, ±20%, C0G/NP0, 0402 11 C7, C8, C9, C11, C14, C15, C16, C17, C18, C19, C25 0.1 µF TDK C1005X5R1A104K050BA 1 E1 2.45-Ghz Ant Taiyo Yuden AH316M245001-T 44 Applications, Implementation, and Layout RES, 100 k, 5%, 0.063 W, 0402 CAP, CERM, 0.1 µF, 10 V, ±10%, X5R, 0402 ANT BLUETOOTH W-LAN ZIGBEE WIMAX, SMD Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC3120 CC3120 www.ti.com 6.2 SWAS034 – FEBRUARY 2017 PCB Layout Guidelines This section details the PCB guidelines to speed up the PCB design using the CC3120R VQFN device. Follow these guidelines ensures that the design will minimize the risk with regulatory certifications including FCC, ETSI, and CE. For more information, see CC3120 and CC3220 SimpleLink™ Wi-Fi® and IoT Solution Layout Guidelines. 6.2.1 General PCB Guidelines Use the following PCB guidelines: • Verify the recommended PCB stackup in the PCB design guidelines, as well as the recommended layers for signals and ground. • Ensure that the QFN PCB footprint follows the information in Section 8. • Ensure that the QFN PCB GND and solder paste follow the recommendations provided in CC3120 and CC3220 SimpleLink™ Wi-Fi® and IoT Solution Layout Guidelines. • Decoupling capacitors must be as close as possible to the QFN device. 6.2.2 Power Layout and Routing Three critical DC-DC converters must be considered for the CC3120R device. • Analog DC-DC converter • PA DC-DC converter • Digital DC-DC converter Each converter requires an external inductor and capacitor that must be laid out with care. DC current loops are formed when laying out the power components. 6.2.2.1 Design Considerations The following design guidelines must be followed when laying out the CC3120R device: • Route all of the input decoupling capacitors (C11, C13, and C18) on L2 using thick traces, to isolate the RF ground from the noisy supply ground. This step is also required to meet the IEEE spectral mask specifications. • Maintain the thickness of power traces to be greater than 12 mils. Take special consideration for power amplifier supply lines (pin 33, 40, 41, and 42), and all input supply pins (pin 37, 39, and 44). • Ensure the shortest grounding loop for the PLL supply decoupling capacitor (pin 24). • Place all decoupling capacitors as close to the respective pins as possible. • Power budget: The CC3120R device can consume up to 450 mA for 3.3 V, 670 mA for 2.1 V, and 700 mA for 1.85 V, for 24 ms during the calibration cycle. • Ensure the power supply is designed to source this current without any issues. The complete calibration (TX and RX) can take up to 17 mJ of energy from the battery over a time of 24 ms. • The CC3120R device contains many high-current input pins. Ensure the trace feeding these pins is capable of handling the following currents: – PA DCDC input (pin 39) maximum 1 A – ANA DCDC input (pin 37) maximum 600 mA – DIG DCDC input (pin 44) maximum 500 mA – PA DCDC switching nodes (pin 40 and pin 41) maximum 1 A – PA DCDC output node (pin 42) maximum 1 A – ANA DCDC switching node (pin 38) maximum 600 mA – DIG DCDC switching node (pin 43) maximum 500 mA – PA supply (pin 33) maximum 500 mA Applications, Implementation, and Layout Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC3120 45 CC3120 SWAS034 – FEBRUARY 2017 www.ti.com Figure 6-3 shows the ground routing for the input decoupling capacitors. Figure 6-3. Ground Routing for the Input Decoupling Capacitors The ground return for the input capacitors are routed on L2 to reduce the EMI and improve the spectral mask. This routing must be strictly followed because it is critical for the overall performance of the device. 6.2.3 Clock Interfaces The following guidelines are for the slow clock. • The 32.768-kHz crystal must be placed close to the QFN package. • Ensure that the load capacitance is tuned according to the board parasitics to the frequency tolerance is within ±150 ppm. • The ground plane on layer two is solid below the trace lanes and there is ground around these traces on the top layer. The following guidelines are for the fast clock. • The 40-MHz crystal must be placed close to the QFN package. • Ensure that he load capacitance is tuned according to the board parasitics to the frequency tolerance is within ±100 ppm at room temperature. The total frequency across parts, temperature, and with aging, must be ±25 ppm to meet the WLAN specification. • Ensure that no high-frequency lines are routed close to the XTAL routing to avoid noise degradation. • Ensure that crystal tuning capacitors are close to the crystal pads. • Make both traces (XTALM and XTALP) as close to parallel as possible and approximately the same length. • The ground plane on layer two is solid below the trace lines and that there is ground around these traces on the top layer. • See CC31xx & CC32xx Frequency Tuning for frequency tuning. 46 Applications, Implementation, and Layout Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC3120 CC3120 www.ti.com 6.2.4 SWAS034 – FEBRUARY 2017 Digital Input and Output The following guidelines are for the digital I/O. • Route SPI and UART lines away from any RF traces. • Keep the length of the high-speed lines as short as possible to avoid transmission line effects. • Keep the line lower than 1/10 of the rise time of the signal to ignore transmission line effects. This is required if the traces cannot be kept short. Place the resistor at the source end, closer to the device that is driving the signal. • Add series-terminating resistor for each high-speed line (such as SPI_CLK or SPI_DATA) to match the driver impedance to the line. Typical terminating-resistor values range from 27 to 36 Ω for a 50-Ω line impedance. • Route high-speed lines with a ground reference plane continuously below it to offer good impedance throughout. This routing also helps shield the trace against EMI. • Avoid stubs on high-speed lines to minimize the reflections. If the line must be routed to multiple locations, use a separate line driver for each line. • If the lines are longer compared to the rise time, add series-terminating resistors near the driver for each high-speed line to match the driver impedance to the line. Typical terminating-resistor values range from 27 to 36 Ω for a 50-Ω line impedance. 6.2.5 RF Interface The following guidelines are for the RF interface. Follow guidelines specified in the vendor-specific antenna design guides (including placement of the antenna). Also see CC3120 and CC3220 SimpleLink™ Wi-Fi® and IoT Solution Layout Guidelines for general antenna guidelines. • Ensure that the antenna is matched for 50-Ω. A Pi-matching network is recommended. • Ensure that the area underneath the BPF pads are grounded on layer one and layer two, and that the minimum fulter requirements are met. • Verify that the Wi-Fi RF trace is a 50-Ω, impedance-controlled trace with a reference to solid ground. • The RF trace bends must be made with gradual curves, and 90-degree bends must be avoided. • The RF traces must not have sharp corners. • There must be no traces or ground under the antenna section. • The RF traces must have via stitching on the ground plane beside the RF trace on both sides. Applications, Implementation, and Layout Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC3120 47 CC3120 SWAS034 – FEBRUARY 2017 www.ti.com 7 Device and Documentation Support TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device, generate code, and develop solutions are listed in this section. 7.1 Tools and Software Development Tools SimpleLink Studio for CC3120R The CC3120R device is supported. SimpleLink Studio for CC3120R is a Windows®-based software tool used to aid in the development of embedded networking applications and software for microcontrollers. Using SimpleLink Studio for CC3120R, embedded software developers can develop and test applications using any desktop IDE, such as Visual Studio or Eclipse, and connect their applications to the cloud using the CC3120R BoosterPack™ Plug-in Module. The application can then be easily ported to any microcontroller. With the SimpleLink Wi-Fi CC3120R solution, customers now have the flexibility to add Wi-Fi to any microcontroller (MCU). This Internet-on-a-chip solution contains all you need to easily create IoT solutions: security, quick connection, cloud support, and more. For more information on CC3120R, visit SimpleLink Wi-Fi Solutions. CC3120R Software Development Kit (SDK) The CC3120R device is supported. The SimpleLink Wi-Fi CC3220 SDK contains drivers for the CC3220 programmable MCU, 30+ sample applications, and documentation needed to use the solution. The SDK also contains the flash programmer, a command line tool for flashing software, configuring network and software parameters (SSID, access point channel, network profile, and so on), system files, and user files (certificates, web pages, and so on). This SDK can be used with TI’s SimpleLInk Wi-Fi CC3220 LaunchPad™ development kit. The SDK has a variety of support offerings. All sample applications in the SDK are supported on the integrated Cortex-M4 processor with CCS IDE and no RTOS. In addition, a few of the applications support IAR, Free RTOS, and TI-RTOS. TI Designs and Reference Designs The TI Designs Reference Design Library is a robust reference design library spanning analog, embedded processor, and connectivity. Created by TI experts to help you jumpstart your system design, all TI Designs include schematic or block diagrams, BOMs, and design files to speed your time to market. 48 Device and Documentation Support Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC3120 CC3120 www.ti.com 7.2 SWAS034 – FEBRUARY 2017 Device Nomenclature To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of the CC3120R device and support tools (see Figure 7-1). X CC 3 1 20 R N M x RGK R/T PACKAGING R = tape/reel T = small reel PREFIX X = perproduction device no prefix = production device PACKAGE RGK = 9-mm x 9-mm VQFN DEVICE FAMILY CC = wireless connectivity REVISION A = Revision A SERIES NUMBER 3 = Wi-Fi Centric No Memory Figure 7-1. CC3120R Device Nomenclature 7.3 Documentation Support To receive notification of documentation updates—including silicon errata—go to the product folder for your device on ti.com (CC3120). In the upper right corner, click the "Alert me" button. This registers you to receive a weekly digest of product information that has changed (if any). For change details, check the revision history of any revised document. The current documentation that describes the processor, related peripherals, and other technical collateral follows. The following documents provide support for the CC3120 device. Application Reports SimpleLink™ CC3120, CC3220 Wi-Fi® Internet-on-a chip™ Networking Sub-System Power Management This application report describes the best practices for power management and extended battery life for embedded low-power Wi-Fi devices such as the SimpleLink Wi-Fi Internet-ona chip™ solution from Texas Instruments™. SimpleLink™ CC3120, CC3220 Wi-Fi® Internet-on-a chip™ Solution Built-In Security Features The SimpleLink Wi-Fi CC3120 and CC3220 Internet-on-a chip™ family of devices from Texas Instruments™ offer a wide range of built-in security features to help developers address a variety of security needs, which is achieved without any processing burden on the main microcontroller (MCU). This document describes these security-related features and provides recommendations for leveraging each in the context of practical system implementation. SimpleLink™ CC3120, CC3220 Wi-Fi® and Internet of Things Over-the-Air Update This document describes the OTA library for the SimpleLink™ Wi-Fi® CC3x20 family of devices from Texas Instruments™ and explains how to prepare a new cloud-ready update to be downloaded by the OTA library. SimpleLink™ CC3120, CC3220 Wi-Fi® Internet-on-a chip™ Solution Device Provisioning This guide describes the provisioning process, which provides the SimpleLink Wi-Fi device with the information (network name, password, and so forth) needed to connect to a wireless network. Using Serial Flash on SimpleLink™ CC3120 and CC3220 Wi-Fi® and Internet-of-Things Devices This application note is divided into two parts. The first part provides important guidelines and best- practice design techniques to consider when choosing and embedding a serial flash paired with the CC3120 and CC3220 (CC3x20) devices. The second part describes the file system, along with guidelines and considerations for system designers working with the CC3x20 devices. Device and Documentation Support Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC3120 49 CC3120 SWAS034 – FEBRUARY 2017 www.ti.com User's Guides SimpleLink™ Wi-Fi® and Internet of Things CC3120 and CC3220 Network Processor This document provides software (SW) programmers with all of the required knowledge for working with the networking subsystem of the SimpleLink Wi-Fi devices. This guide provides basic guidelines for writing robust, optimized networking host applications, and describes the capabilities of the networking subsystem. The guide contains some example code snapshots, to give users an idea of how to work with the host driver. More comprehensive code examples can be found in the formal software development kit (SDK). This guide does not provide a detailed description of the host driver APIs. SimpleLink™ Wi-Fi® CC3120 BoosterPack™ Plug-In Module and IoT Solution The SimpleLink Wi-Fi CC3120 wireless network processor from Texas Instruments™ provides users the flexibility to add Wi-Fi to any MCU. This user's guide explains the various configurations of the CC3120 BoosterPack™ Plug-In Module. SimpleLink™ Wi-Fi® CC3120 and CC3220 and IoT Solution Layout Guidelines This document provides the design guidelines of the 4-layer PCB used for the CC3120 and CC3220 SimpleLink Wi-Fi family of devices from Texas Instruments™. The CC3120 and CC3220 devices are easy to lay out and are available in quad flat no-leads (QFNS) packages. When designing the board, follow the suggestions in this document to optimize performance of the board. SimpleLink™ Wi-Fi® CC3120 Internet-on-a-chip™ Solution SDK This guide is intended to help users in the initial setup and demonstration of the different demos in the CC3120 SDK. The guide lists the software and hardware components required to get started, and explains how to install the supported integrated development environment (IDE), SimpleLink CC3120 SDK, and the various other tools required. SimpleLink™ Wi-Fi® and Internet-on-a-chip™ CC3120 and CC3220 Solution Radio Tool The Radio Tool serves as a control panel for direct access to the radio, and can be used for both the radio frequency (RF) evaluation and for certification purposes. This guide describes how to have the tool work seamlessly on Texas Instruments ™ evaluation platforms such as the BoosterPack™ plus FTDI emulation board for CC3120 devices, and the LaunchPad™ for CC3220 devices. SimpleLink™ Wi-Fi® CC3120 and CC3220 Provisioning for Mobile Applications This guide describes TI’s SimpleLink™ Wi-Fi® provisioning solution for mobile applications, specifically on the usage of the Android™ and iOS® building blocks for UI requirements, networking, and provisioning APIs required for building the mobile application. More Literature RemoTI Manifest CC3120 SimpleLink™ WI-Fi® and Internet of Things CC3120 hardware design files. 7.4 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community The TI engineer-to-engineer (E2E) community was created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. TI Embedded Processors Wiki Established to help developers get started with Embedded Processors from Texas Instruments and to foster innovation and growth of general knowledge about the hardware and software surrounding these devices. 50 Device and Documentation Support Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC3120 CC3120 www.ti.com 7.5 SWAS034 – FEBRUARY 2017 Trademarks SimpleLink, Internet-on-a chip, SmartConfig, Texas Instruments, E2E, BoosterPack, LaunchPad are trademarks of Texas Instruments. Cortex is a registered trademark of ARM Limited. ARM is a registered trademark of ARM Physical IP, Inc. Bluetooth is a registered trademark of Bluetooth SIG, Inc. Windows is a registered trademark of Microsoft Inc. Wi-Fi, Wi-Fi Direct are registered trademarks of Wi-Fi Alliance. All other trademarks are the property of their respective owners. 7.6 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 7.7 Export Control Notice Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data (as defined by the U.S., EU, and other Export Administration Regulations) including software, or any controlled product restricted by other applicable national regulations, received from disclosing party under nondisclosure obligations (if any), or any direct product of such technology, to any destination to which such export or re-export is restricted or prohibited by U.S. or other applicable laws, without obtaining prior authorization from U.S. Department of Commerce and other competent Government authorities to the extent required by those laws. 7.8 Glossary TI Glossary This glossary lists and explains terms, acronyms, and definitions. Device and Documentation Support Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC3120 51 CC3120 SWAS034 – FEBRUARY 2017 www.ti.com 8 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 52 Mechanical, Packaging, and Orderable Information Submit Documentation Feedback Product Folder Links: CC3120 Copyright © 2017, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 17-Feb-2017 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) CC3120RNMARGKR ACTIVE VQFN RGK 64 2500 Green (RoHS & no Sb/Br) CU NIPDAU | CU NIPDAUAG Level-3-260C-168 HR -40 to 85 CC3120R NMA CC3120RNMARGKT ACTIVE VQFN RGK 64 250 Green (RoHS & no Sb/Br) CU NIPDAU | CU NIPDAUAG Level-3-260C-168 HR -40 to 85 CC3120R NMA (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 17-Feb-2017 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 17-Feb-2017 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant CC3120RNMARGKR VQFN RGK 64 2500 330.0 16.4 9.3 9.3 1.1 12.0 16.0 Q2 CC3120RNMARGKT VQFN RGK 64 250 180.0 16.4 9.3 9.3 1.1 12.0 16.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 17-Feb-2017 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CC3120RNMARGKR VQFN RGK 64 2500 367.0 367.0 38.0 CC3120RNMARGKT VQFN RGK 64 250 210.0 185.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE FOR TI DESIGN INFORMATION AND RESOURCES Texas Instruments Incorporated (‘TI”) technical, application or other design advice, services or information, including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to assist designers who are developing applications that incorporate TI products; by downloading, accessing or using any particular TI Resource in any way, you (individually or, if you are acting on behalf of a company, your company) agree to use it solely for this purpose and subject to the terms of this Notice. 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