TI1 CD4066B-Q1 Cmos quad bilateral switch Datasheet

CD4066B-Q1
SCHS383 – APRIL 2011
www.ti.com
CMOS QUAD BILATERAL SWITCH
Check for Samples: CD4066B-Q1
FEATURES
1
•
•
•
•
•
•
•
•
•
•
•
•
•
Qualified for Automotive Applications
15-V Digital or ±7.5-V Peak-to-Peak Switching
125-Ω Typical On-State Resistance for 15-V
Operation
Switch On-State Resistance Matched to Within
5 Ω Over 15-V Signal-Input Range
On-State Resistance Flat Over Full
Peak-to-Peak Signal Range
High On/Off Output-Voltage Ratio: 80 dB
Typical at fis = 10 kHz, RL = 1 kΩ
High Degree of Linearity: <0.5% Distortion
Typical at fis = 1 kHz, Vis = 5 V p-p,
VDD – VSS ≥ 10 V, RL = 10 kΩ
Extremely Low Off-State Switch Leakage,
Resulting in Very Low Offset Current and High
Effective Off-State Resistance: 10 pA Typical
at VDD – VSS = 10 V, TA = 25°C
Extremely High Control Input Impedance
(Control Circuit Isolated From Signal Circuit):
1012 Ω Typical
Low Crosstalk Between Switches: –50 dB
Typical at fis = 8 MHz, RL = 1 kΩ
Matched Control-Input to Signal-Output
Capacitance: Reduces Output Signal
Transients
Frequency Response, Switch On = 40 MHz
Typical
100% Tested for Quiescent Current at 20 V
•
•
•
5-V, 10-V, and 15-V Parametric Ratings
Latch-Up Exceeds 100mA per JESD78 - Class I
Meets All Requirements of JEDEC Tentative
Standard No. 13-B, Standard Specifications for
Description of "B" Series CMOS Devices
APPLICATIONS
•
•
•
•
•
Analog Signal Switching/Multiplexing: Signal
Gating, Modulator, Squelch Control,
Demodulator, Chopper, Commutating Switch
Digital Signal Switching/Multiplexing
Transmission-Gate Logic Implementation
Analog-to-Digital and Digital-to-Analog
Conversion
Digital Control of Frequency, Impedance,
Phase, and Analog-Signal Gain
E, F, M, NS, OR PW PACKAGE
(TOP VIEW)
SIG A IN/OUT
SIG A OUT/IN
SIG B OUT/IN
SIG B IN/OUT
CONTROL B
CONTROL C
VSS
1
14
2
13
3
12
4
11
5
10
6
9
7
8
VDD
CONTROL A
CONTROL D
SIG D IN/OUT
SIG D OUT/IN
SIG C OUT/IN
SIG C IN/OUT
DESCRIPTION/ORDERING INFORMATION
The CD4066B-Q1 is a quad bilateral switch intended for the transmission or multiplexing of analog or digital
signals. It is pin-for-pin compatible with the CD4016B, but exhibits a much lower on-state resistance. In addition,
the on-state resistance is relatively constant over the full signal-input range.
The CD4066B-Q1 consists of four bilateral switches, each with independent controls. Both the p and the n
devices in a given switch are biased on or off simultaneously by the control signal. As shown in Figure 1, the well
of the n-channel device on each switch is tied to either the input (when the switch is on) or to VSS (when the
switch is off). This configuration eliminates the variation of the switch-transistor threshold voltage with input signal
and, thus, keeps the on-state resistance low over the full operating-signal range.
The advantages over single-channel switches include peak input-signal voltage swings equal to the full supply
voltage and more constant on-state impedance over the input-signal range. However, for sample-and-hold
applications, the CD4016B is recommended.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2011, Texas Instruments Incorporated
CD4066B-Q1
SCHS383 – APRIL 2011
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
TA
PACKAGE
–40°C to 125°C
SOIC – D
Reel of 2500
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
CD4066BQDRQ1
CD4066BQ
Switch
Control
In
Vis
p
n
p
n
Control
VC †
Out
Vos
n
VSS
VDD
VSS
† All control inputs are protected by the CMOS protection network.
NOTES: A.All p substrates are connected to V DD.
B. Normal operation control-line biasing: switch on (logic 1), VC = VDD; switch off (logic 0), VC = VSS
C. Signal-level range: VSS ≤V is ≤ VDD
Figure 1. Schematic Diagram of One-of-Four Identical Switches and Associated Control Circuitry
2
Submit Documentation Feedback
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s) :CD4066B-Q1
CD4066B-Q1
SCHS383 – APRIL 2011
www.ti.com
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1)
DC supply-voltage range, VDD (voltages referenced to VSS terminal)
VALUE
UNIT
–0.5 to 20
V
–0.5 to VDD + 0.5
V
±10
mA
D package
86
°C/W
Human-Body Model (HBM)
500
Input voltage range, Vis (all inputs)
DC input current, IIN (any one input)
Package thermal impedance, θJA
(2)
ESD Electrostatic discharge (3)
Machine Model (MM)
150
Field_Induced_Charged Device Model (CDM)
1000
Lead temperature (during soldering): At distance 1/16 ± 1/32 inch (1,59 ± 0,79 mm) from case for 10 s max
Storage temperature range, Tstg
(1)
(2)
(3)
V
265
°C
–65 to 150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The package thermal impedance is calculated in accordance with JESD 51-7.
Tested in accordance with AEC-Q100.
THERMAL INFORMATION
CD4066B-Q1
THERMAL METRIC (1)
D PACKAGE
UNITS
14 PINS
θJA
Junction-to-ambient thermal resistance
92.4
θJCtop
Junction-to-case (top) thermal resistance
52.5
θJB
Junction-to-board thermal resistance
46.7
ψJT
Junction-to-top characterization parameter
46.4
ψJB
Junction-to-board characterization parameter
46.4
θJCbot
Junction-to-case (bottom) thermal resistance
N/A
(1)
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
RECOMMENDED OPERATING CONDITIONS
VDD
Supply voltage
TA
Operating free-air temperature
MIN
MAX
3
18
V
–40
125
°C
Submit Documentation Feedback
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s) :CD4066B-Q1
UNIT
3
CD4066B-Q1
SCHS383 – APRIL 2011
www.ti.com
ELECTRICAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
LIMITS AT INDICATED TEMPERATURES
PARAMETER
IDD
TEST CONDITIONS
Quiescent device current
VIN
(V)
VDD
(V)
–40°C
125°C
25°C
UNIT
TYP
MAX
0.5
5
0.25
7.5
0.01
0.25
0.10
10
0.5
15
0.01
0.5
0.15
15
1
30
0.01
1
0.20
20
5
150
0.02
5
µA
SIGNAL INPUTS (Vis) AND OUTPUTS (Vos)
VC = VDD, RL = 10 kΩ returned
ron
Δron
THD
Iis
tpd
5
850
1300
470
1050
10
330
550
180
400
to
,
Vis = VSS 2
to VDD
15
210
320
125
240
On-state resistance
difference between any two
switches
5
15
RL = 10 kΩ, VC = VDD
10
10
15
5
Total harmonic distortion
VC = VDD = 5 V, VSS = –5 V,
Vis(p-p) = 5 V (sine wave centered on 0 V),
RL = 10 kΩ, fis = 1-kHz sine wave
3-dB cutoff frequency
(switch on)
VC = VDD = 5 V, VSS = –5 V, Vis(p-p) = 5 V
(sine wave centered on 0 V), RL = 1 kΩ
–50-dB feedthrough
frequency (switch off)
VC = VSS = –5 V, Vis(p-p) = 5 V
(sine wave centered on 0 V), RL = 1 kΩ
Input/output leakage current
(switch off) (max)
VC = 0 V, Vis = 18 V, Vos = 0 V; and VC = 0 V,
Vis = 0 V, Vos = 18 V
–50-dB crosstalk frequency
VC(A) = VDD = 5 V,
VC(B) = VSS = -5 V,
Vis(A) = 5 Vp-p, 50-Ω source, RL = 1 kΩ
Propagation delay (signal
input to signal output)
RL = 200 kΩ, VC = VDD, VSS = GND,
CL = 50 pF, Vis = 10 V
(square wave centered on 5 V), tr, tf = 20 ns
On-state resistance (max)
V DD
V SS
Ω
Ω
0.4%
18
±0.1
±1
40
MHz
1
MHz
±10-5
±0.1
8
µA
MHz
5
20
40
10
10
20
15
7
15
ns
Cis
Input capacitance
VDD = 5 V, VC = VSS = –5 V
8
pF
Cos
Output capacitance
VDD = 5 V, VC = VSS = –5 V
8
pF
Cios
Feedthrough
VDD = 5 V, VC = VSS = –5 V
0.5
pF
4
Submit Documentation Feedback
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s) :CD4066B-Q1
CD4066B-Q1
SCHS383 – APRIL 2011
www.ti.com
ELECTRICAL CHARACTERISTICS (continued)
over operating free-air temperature range (unless otherwise noted)
LIMITS AT INDICATED TEMPERATURES
PARAMETER
VIN
(V)
TEST CONDITIONS
VDD
(V)
–40°C
125°C
25°C
TYP
UNIT
MAX
CONTROL (VC)
VILC
Control input, low voltage
(max)
|Iis| < 10 mA, Vis = VSS, VOS = VDD, and
Vis = VDD, VOS = VSS
5
1
1
1
10
2
2
2
15
2
2
2
5
VIHC
IIN
Control input, low voltage
3.5 (MIN)
10
7 (MIN)
15
11 (MIN)
±10-5
Vis ≤ VDD, VDD – VSS = 18 V, VCC ≤ VDD – VSS
18
Crosstalk (control input to
signal output)
VC = 10 V (square wave),
tr, tf = 20 ns, RL = 10 kΩ
10
50
5
35
70
Turn-on and turn-off
propagation delay
VIN = VDD, tr, tf = 20 ns,
CL = 50 pF, RL = 1 kΩ
10
20
40
15
15
30
Vis = VDD, VSS = GND, RL = 1 kΩ to GND,
CL = 50 pF, VC = 10 V (square wave
centered on 5 V), tr, tf = 20 ns,
Vos = 1/2 Vos at 1 kHz
±0.1
V
Input current (max)
Maximum control input
repetition rate
Ci
See Figure 6
V
±1
5
6
10
9
15
9.5
Input capacitance
±0.1
µA
mW
ns
MHz
5
pF
SWITCHING CHARACTERISTICS
SWITCH INPUT
VDD
(V)
SWITCH OUTPUT,
Vos (V)
Vis
(V)
Iis (mA)
–40°C
25°C
125°C
5
0
0.61
0.51
0.36
5
5
–0.61
–0.51
–0.36
10
0
1.5
1.3
0.9
10
10
–1.6
–1.3
–0.9
15
0
4
3.4
2.4
15
15
–4
–3.4
–2.4
MIN
MAX
0.4
4.6
1.5
13.5
Submit Documentation Feedback
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s) :CD4066B-Q1
5
CD4066B-Q1
SCHS383 – APRIL 2011
www.ti.com
TYPICAL CHARACTERISTICS
TYPICAL ON-STATE RESISTANCE
vs
INPUT SIGNAL VOLTAGE (ALL TYPES)
Supply Voltage (VDD − VSS) = 5 V
TA = 125°C
500
400
300
+25°C
200
−55°C
100
0
−4
−3
−2
−1
0
1
2
Vis − Input Signal Voltage − V
3
4
ron − Channel On-State Resistance − Ω
r − Channel On-State Resistance − Ω
on
600
TYPICAL ON-STATE RESISTANCE
vs
INPUT SIGNAL VOLTAGE (ALL TYPES)
300
Supply Voltage (VDD − VSS) = 10 V
250
TA = 125°C
200
+25°C
150
−55°C
100
50
0
−10
−7.5
−5
−2.5
250
200
TA = 125°C
150
+25°C
100
−55°C
50
0
0
2.5
5
Vis − Input Signal Voltage − V
7.5
10
r − Channel On-State Resistance − Ω
on
r − Channel On-State Resistance − Ω
on
300
−2.5
Iis
10
TA = 125°C
600
Supply Voltage (VDD − VSS) = 5 V
500
400
300
200
10 V
−15 V
100
0
−10
−7.5
−5
−2.5
0
2.5
5
7.5
10
V is − Input Signal Voltage − V 92CS-27330RI
92CS-27329RI
Figure 4.
Vis
7.5
TYPICAL ON-STATE RESISTANCE
vs
INPUT SIGNAL VOLTAGE (ALL TYPES)
Supply Voltage (VDD − VSS) = 15 V
−5
5
Figure 3.
TYPICAL ON-STATE RESISTANCE
vs
INPUT SIGNAL VOLTAGE (ALL TYPES)
−7.5
2.5
Vis − Input Signal Voltage − V 92CS-27327RI
92CS-27326RI
Figure 2.
−10
0
Figure 5.
CD4066B
1 of 4 Switches
ron =
Vos
|Vis − Vos|
|Iis|
92CS-30966
Figure 6. Determination of ron as a Test Condition for Control-Input High-Voltage (VIHC) Specification
6
Submit Documentation Feedback
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s) :CD4066B-Q1
CD4066B-Q1
SCHS383 – APRIL 2011
www.ti.com
TYPICAL CHARACTERISTICS (continued)
Keithley
160 Digital
Multimeter
VDD
TG
On
10 kΩ
1-kΩ
Range
Y
X-Y
Plotter
VSS
H. P.
Moseley
7030A
X
92CS-22716
Figure 7. Channel On-State Resistance Measurement Circuit
TYPICAL ON CHARACTERISTICS
FOR 1 OF 4 CHANNELS
POWER DISSIPATION PER PACKAGE
vs
SWITCHING FREQUENCY
6
4
TA = 25°C
2
103
1
0
VC = VDD
−1
Vis
Vos
RL
VSS
−2
All unused terminals are
connected to VSS
−3
−3
−2
−1
0
1
2
VI − Input Voltage − V
3
2
10 V
102
VDD
CD4066B
1 of 4
Switches
Supply Voltage
(VDD) = 15 V
6
4
4
5V
6
4
14
VO − Output Voltage − V
2
PD − Power Dissipation Per Package − μ W
104
3
5
2
6
101
12
6
4
13
CD4066B
7
2
10
10
2
4
6
102
2
VDD
4
VSS
6
103
92CS-30919
f − Switching Frequency − kHz
Figure 8.
92C-30920
Figure 9.
Submit Documentation Feedback
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s) :CD4066B-Q1
7
CD4066B-Q1
SCHS383 – APRIL 2011
www.ti.com
TYPICAL CHARACTERISTICS (continued)
Cios
Vis = VDD
VDD = 5 V
VC = −5 V
VDD
VC = VSS
Vos
CD4066B
1 of 4
Switches
CD4066B
1 of 4
Switches
I
VSS
92CS-30922
All unused terminals are connected to VSS.
Cis
VSS = −5 V
Cos
92CS-30921
Measured on Boonton capacitance bridge, model 75a (1 MHz);
test-fixture capacitance nulled out.
Figure 10. Typical On Characteristics for One of Four
Channels
+10 V
VDD
VC = VDD
Vis
Figure 11. Off-Switch Input or Output Leakage
CD4066B
1 of 4
Switches
VSS
Vos
50 pF
VDD
VC
Vis
tr = tf = 20 ns
1 kΩ
200 kΩ
CD4066B
1 of 4
Switches
Vos
10 kΩ
VSS
VDD
92CS-30924
tr = tf = 20 ns
92CS-30923
All unused terminals are connected to VSS.
All unused terminals are connected to VSS.
Figure 12. Propagation Delay Time Signal Input (Vis) to
Signal Output (Vos)
Figure 13. Crosstalk-Control Input to Signal Output
VDD
VDD
tr = tf = 20 ns
VC = VDD
VDD
CD4066B
1 of 4
Switches
VSS
50 pF
Vos
1 kΩ
NOTES: A.All unused terminals are connected to V SS.
B. Delay is measured at Vos level of +10% from ground (turn-on) or on-state output level (turn-off).
92CS-30925
Figure 14. Propagation Delay, tPLH, tPHL Control-Signal Output
8
Submit Documentation Feedback
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s) :CD4066B-Q1
CD4066B-Q1
SCHS383 – APRIL 2011
www.ti.com
TYPICAL CHARACTERISTICS (continued)
tr
tf
VC
10 V
90%
50%
10%
0V
Repetition
Rate
tr = tf = 20 ns
Vos
V OS
V OS at 1kHz
2
VDD = 10 V
VC
Vis = 10 V
CD4066B
1 of 4
Switches
V OS
50 pF
V OS at 1kHz
2
1 kΩ
VSS
All unused terminals are connected to VSS.
92CS-30925
Figure 15. Maximum Allowable Control-Input Repetition Rate
VDD
Inputs
VDD
I
VSS
92CS-27555
VSS
Measure inputs sequentially to both VDD and VSS. Connect all unused inputs to either VDD or VSS. Measure control inputs only.
Figure 16. Input Leakage-Current Test Circuit
Submit Documentation Feedback
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s) :CD4066B-Q1
9
CD4066B-Q1
SCHS383 – APRIL 2011
www.ti.com
TYPICAL CHARACTERISTICS (continued)
10
Clock
Reset
14
2
PE
J1
J2
7
9
J3
J4
12
Clock
J5
CD4018B
15
1
3
External
Reset
13
14
1/4 CD4066B
1
PE
J1
3
7
9
12
J2
J3
J4
J5
CD4018B
Q1 Q2
1
4
2
15
Q1 Q2
5
10
5
2
4
13
1
3
7
2
2
1/3 CD4049B
5
6
4
9
8
5
6
1
2
6
1/3 CD4049B
5
4
CD4001B
3
12
8
9
CD4001B
10
10
11
4
3
10
9
5
6
12
12
13
6
5
Signal
Outputs
11
11
13
Signal
Inputs
11
12
Channel 1
Channel 2
CD4066B
4
Channel 3
1
5
3
8
9
11
10
3
4
4
Channel 4
1/4 CD4066B
3
8
LPF
9
10 kΩ
Channel 2
Channel 3
10 kΩ
VDD
Clock
Maximum
Allowable
Signal Level
LPF
10 kΩ
CD4066B
11
Package Count
2 - CD4001B
1 - CD4049B
3 - CD4066B
2 - CD4018B
Channel 1
10 k Ω
1/6 CD4049B
2
1
LPF
2
12
LPF Channel 4
10
10 kΩ
30% (VDD − VSS)
VSS
Chan 1 Chan 2 Chan 3 Chan 4
92CM-30928
Figure 17. Four-Channel PAM Multiplex System Diagram
5V
0
−5 V
Analog Inputs (±5 V)
VDD = 5 V
VDD = 5 V
5V
SWA
0
IN
CD4054B
CD4066B
SWB
SWC
SWD
Digital
Control
Inputs
VSS = 0 V
VEE = −5 V
Analog Outputs (±5 V)
VSS = −5 V
92CS-30927
Figure 18. Bidirectional Signal Transmission Via Digital Control Logic
10
Submit Documentation Feedback
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s) :CD4066B-Q1
CD4066B-Q1
SCHS383 – APRIL 2011
www.ti.com
APPLICATION INFORMATION
In applications that employ separate power sources to drive VDD and the signal inputs, the VDD current capability
should exceed VDD/RL (RL = effective external load of the four CD4066B-Q1 bilateral switches). This provision
avoids any permanent current flow or clamp action on the VDD supply when power is applied or removed from the
CD4066B-Q1.
In certain applications, the external load-resistor current can include both VDD and signal-line components. To
avoid drawing VDD current when switch current flows into terminals 1, 4, 8, or 11, the voltage drop across the
bidirectional switch must not exceed 0.8 V (calculated from ron values shown).
No VDD current will flow through RL if the switch current flows into terminals 2, 3, 9, or 10.
Submit Documentation Feedback
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s) :CD4066B-Q1
11
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
CD4066BQDRQ1
ACTIVE
Package Type Package Pins Package
Drawing
Qty
SOIC
D
14
2500
Eco Plan
Lead/Ball Finish
(2)
Green (RoHS
& no Sb/Br)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
CU NIPDAU
Level-1-260C-UNLIM
(4)
-40 to 125
CD4066BQ
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF CD4066B-Q1 :
• Catalog: CD4066B
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
• Military: CD4066B-MIL
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Military - QML certified for Military and Defense Applications
Addendum-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2014, Texas Instruments Incorporated
Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
Texas Instruments:
CD4066BQDRQ1
Similar pages