ETC2 AP-CF512ME3NR-NDNRQ Compact flash series â ¢ industrial cf specification Datasheet

Compact Flash Ⅲ series
AP-CFxxxxE3NR-XXXXXXQ
RoHS Compliant
Compact Flash Series Ⅲ
Industrial CF Specifications
August 11th, 2013
Version 1.1
Apacer Technology Inc.
1F, No.32, Zhongcheng Rd., Tucheng Dist., New Taipei City, Taiwan, R.O.C
Tel: +886-2-2267-8000
Fax: +886-2-2267-2261
www.apacer.com
0
© 2013 Apacer Technology Inc.
Rev. 1.1
Compact Flash Ⅲ series
AP-CFxxxxE3NR-XXXXXXQ
Features:
Compact Flash Association
Specification Revision 3.0 Standard
Interface
– ATA command set compatible
– ATA mode support for up to:
PIO Mode-6
Multiword DMA Mode-4
Ultra DMA Mode-4
–
Connector Type
50 pins female
–
–
–
Power consumption (typical)*
Supply voltage: 3.3V & 5V
Active mode: 80 mA/95 mA (3.3V/5.0V)
Sleep mode: 700 µA/900 µA (3.3V/5.0V)
Temperature ranges
– Operating:
Standard: 0°C to 70°C
Extended: -40°C to 85°C
– Storage: -40°C to 100°C
Flash management
– Advanced wear-leveling algorithms
– S.M.A.R.T. technology
– Built-in hardware ECC
– Flash block management
– Power failure management
*
Performance
– Sustained read: up to 29 MB/sec
– Sustained write: up to 15 MB/sec
–
Capacity
128, 256, 512 MB
1, 2, 4, 8, 16 GB
NAND Flash Type: SLC
Shock & Vibration**
– Shock: 1,500 G
– Vibration: 15 G
–
–
–
–
–
–
–
–
Endurance (TBW: Terabytes Written)
128 MB: 3.3 TBW
256 MB: 6.7 TBW
512 MB: 12.9 TBW
1 GB: 25.6 TBW
2 GB: 38.4 TBW
4 GB: 51.9 TBW
8 GB: 69.8 TBW
16 GB: 115.0 TBW
–
Physical Dimensions
36.4mm x 42.8mm x 3.3mm
RoHS compliant
*Varies from capacities. The values addressed for Performance and Power consumptions are typical and may vary depending on
settings and platforms.
**Non-operating
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© 2013 Apacer Technology Inc.
Rev. 1.1
Compact Flash Ⅲ series
AP-CFxxxxE3NR-XXXXXXQ
Table of Contents
1. GENERAL DESCRIPTION .................................................................................................... 3
2. FUNCTIONAL BLOCK .......................................................................................................... 3
3. PIN ASSIGNMENTS ............................................................................................................... 4
4. PRODUCT SPECIFICATIONS.............................................................................................. 6
4.1 CAPACITY .............................................................................................................................................................6
4.2 PERFORMANCE SPECIFICATION .............................................................................................................................6
4.3 ENVIRONMENTAL SPECIFICATIONS .......................................................................................................................7
4.5 ENDURANCE ........................................................................................................................................................7
5. FLASH MANAGEMENT ........................................................................................................ 8
5.1. ADVANCED WEAR-LEVELING ALGORITHMS .........................................................................................................8
5.2 S.M.A.R.T. TECHNOLOGY ....................................................................................................................................8
5.3 BUILT-IN HARDWARE ECC ...................................................................................................................................8
5.4 FLASH BLOCK MANAGEMENT ...............................................................................................................................8
5.5 POWER FAILURE MANAGEMENT...........................................................................................................................8
6. SOFTWARE INTERFACE .................................................................................................... 9
6.1 COMMAND SET .....................................................................................................................................................9
7. ELECTRICAL SPECIFICATION ...................................................................................... 11
8. PHYSICAL CHARACTERISTICS ..................................................................................... 12
8.1 DIMENSION .........................................................................................................................................................12
9. PRODUCT ORDERING INFORMATION ........................................................................ 13
9.1 PRODUCT CODE DESIGNATIONS .........................................................................................................................13
9.2 VALID COMBINATIONS .......................................................................................................................................14
2
© 2013 Apacer Technology Inc.
Rev. 1.1
Compact Flash Ⅲ series
AP-CFxxxxE3NR-XXXXXXQ
1. General Description
Apacer’s value-added Industrial CompactFlash Card offers high performance, high reliability and powerefficient storage. Regarding standard compliance, this CompactFlash Card complies with CompactFlash
specification revision 4.1, supporting transfer modes up to Programmed Input Output (PIO) Mode 6, Multiword Direct Memory Access (DMA) Mode 4, Ultra DMA Mode 5, and PCMCIA Ultra DMA Mode 5.
Apacer’s value-added CFC provides complete PCMCIA – ATA functionality and compatibility. Apacer ‘s
CompactFlash technology is designed for applications in Point of Sale (POS) terminals, telecom, IP-STB,
medical instruments, surveillance systems, industrial PCs and handheld applications such as the new
generation of Digital Single Lens Reflex (DSLR) cameras.
2. Functional Block
The Compact Flash Card (CFC) includes a controller and flash media, as well as the Compact Flash
standard interface. Figure 2-1 shows the functional block diagram.
Flash Array
Flash
Media
Compact Flash
Interface
Flash
Media
Compact Flash
Controller
Flash
Media
Flash
Media
Figure 2-1: Functional block diagram
3
© 2013 Apacer Technology Inc.
Rev. 1.1
Compact Flash Ⅲ series
AP-CFxxxxE3NR-XXXXXXQ
3. Pin Assignments
Table 3-1 lists the pin assignments with respective signal names for the 50-pin configuration. A “#” suffix
indicates the active low signal. The pin type can be input, output or input/output.
Table 3-1: Pin assignments (1 of 2)
Pin No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
Memory card mode
Signal name
GND
D3
D4
D5
D6
D7
#CE1
A10
#OE
A9
A8
A7
VCC
A6
A5
A4
A3
A2
A1
A0
D0
D1
D2
WP
#CD2
#CD1
D11
D12
D13
D14
D15
#CE2
#VS1
#IORD
#IOWR
#WE
RDY/-BSY
VCC
#CSEL
#VS2
RESET
Pin I/O type
I/O
I/O
I/O
I/O
I/O
I
I
I
I
I
I
I
I
I
I
I
I
I
I/O
I/O
I/O
O
O
O
I/O
I/O
I/O
I/O
I/O
I
O
I
I
I
O
I
O
I
I/O card mode
Signal name
GND
D3
D4
D5
D6
D7
#CE1
A10
#OE
A9
A8
A7
VCC
A6
A5
A4
A3
A2
A1
A0
D0
D1
D2
#IOCS16
#CD2
#CD1
D11
D12
D13
D14
D15
#CE2
#VS1
#IORD
#IOWR
#WE
-IREQ
VCC
#CSEL
#VS2
RESET
Pin I/O type
I/O
I/O
I/O
I/O
I/O
I
I
I
I
I
I
I
I
I
I
I
I
I
I/O
I/O
I/O
O
O
O
I/O
I/O
I/O
I/O
I/O
I
O
I
I
I
O
I
O
I
True IDE mode
Signal name
GND
D3
D4
D5
D6
D7
#CE1
1
A10
#OE
1
A9
1
A8
1
A7
VCC
1
A6
1
A5
1
A4
1
A3
A2
A1
A0
D0
D1
D2
#IOCS16
#CD2
#CD1
D11
D12
D13
D14
D15
#CE2
#VS1
#IORD
#IOWR
#WE
INTRQ
VCC
#CSEL
#VS2
RESET
Pin I/O type
I/O
I/O
I/O
I/O
I/O
I
I
I
I
I
I
I
I
I
I
I
I
I
I/O
I/O
I/O
O
O
O
I/O
I/O
I/O
I/O
I/O
I
O
I
I
I
O
I
O
I
4
© 2013 Apacer Technology Inc.
Rev. 1.1
Compact Flash Ⅲ series
AP-CFxxxxE3NR-XXXXXXQ
Table 3-1: Pin assignments (2 of 2)
Pin No.
1.
2.
Memory card mode
Signal name Pin I/O type
42
#WAIT
O
43
#INPACK
O
44
-REG
I
45
BVD2
O
46
BVD1
O
47
D8
I/O
48
D9
I/O
49
D10
I/O
50
GND
The signal should be tied to VCC by the host.
I/O card mode
Signal name
#WAIT
#INPACK
#REG
#SPKR
#STSCHG
D8
D9
D10
GND
Pin I/O type
O
O
I
O
O
I/O
I/O
I/O
-
True IDE mode
Signal name
IORDY
2
DMARQ
2
DMACK
#DASP
#PDIAG
D8
D9
D10
GND
Pin I/O type
O
O
I
I/O
I/O
I/O
I/O
I/O
-
Connection required when UDMA is in use.
5
© 2013 Apacer Technology Inc.
Rev. 1.1
Compact Flash Ⅲ series
AP-CFxxxxE3NR-XXXXXXQ
4. Product Specifications
4.1 Capacity
Capacity specification of the Compact Flash Card series (CFC) is available as shown in Table 4-1. It lists
the specific capacity and the default numbers of heads, sectors and cylinders for each product line.
Table 4-1: Capacity specifications
Capacity
Total bytes
1,2
Cylinders
Heads
Sectors
Max LBA
128 MB
128,450,560
980
8
32
250,880
256 MB
256,901,120
980
16
32
501,760
512 MB
512,483,328
993
16
63
1,000,944
1GB
1,024,966,656
1,986
16
63
2,001,888
2GB
2,048,901,120
3,970
16
63
4,001,760
4GB
4,110,188,544
7,964
16
63
8,027,712
8GB
8,195,604,480
15,880
16
63
16,007,040
16GB
16,391,208,960
16,3833
16
63
32,014,080
Notes:
Display of total bytes varies from operating systems.
Cylinders, heads or sectors are not applicable for these capacities. Only LBA addressing applies
Notes: 1 GB = 1,000,000,000 bytes; 1 sector = 512 bytes.
LBA count addressed in the table above indicates total user storage capacity and will remain the same throughout the lifespan of the
device. However, the total usable capacity of the SSD is most likely to be less than the total physical capacity because a small portion
of the capacity is reserved for device maintenance usages.
4.2 Performance Specification
Performances of the CF cards are listed in Table 4-2
Table 4-2: Performance specifications
Capacity
128 MB
256 MB
512 MB
1 GB
2 GB
4 GB
8 GB
16 GB
Sustained
read (MB/s)
17
29
19
21
20
21
21
20
Sustained
write (MB/s)
4
8
7
12
11
11
13
15
Performance
Notes: performance may vary depending on flash configurations or host system settings.
6
© 2013 Apacer Technology Inc.
Rev. 1.1
Compact Flash Ⅲ series
AP-CFxxxxE3NR-XXXXXXQ
4.3 Environmental Specifications
Environmental specification of the Compact Flash Card series (CFC) follows the MIL-STD-810F
standards as shown in Table 4-3.
Table 4-3: Environmental specifications
Environment
Temperature
Specification
Operation
0°C to 70°C; -40°C to 85°C (Extended Temperature)
Storage
-40°C to 100°C
Vibration (Non-Operation)
Shock (Non-Operation)
Sine wave : 10~2000Hz, 15G (X, Y, Z axes)
Half sine wave 1,500G (X, Y, Z ; All 6 axes)
4.5 Endurance
The endurance of a storage device is predicted by TeraBytes Written based on several factors related to
usage, such as the amount of data written into the drive, block management conditions, and daily
workload for the drive. Thus, key factors, such as Write Amplifications and the number of P/E cycles, can
influence the lifespan of the drive.
Capacity
TeraBytes Written
128 MB
3.3
256 MB
6.7
512 MB
12.9
1 GB
25.6
2 GB
38.4
4 GB
51.9
8 GB
69.8
16 GB
115.0
Notes:
The measurement assumes the data written to the SSD for test is under a typical and constant rate.
The measurement follows the standard metric: 1 TB (Terabyte) = 1000 GB.
7
© 2013 Apacer Technology Inc.
Rev. 1.1
Compact Flash Ⅲ series
AP-CFxxxxE3NR-XXXXXXQ
5. Flash Management
5.1. Advanced wear-leveling algorithms
Flash memory devices differ from Hard Disk Drives (HDDs) in terms of how blocks are utilized. For HDDs,
when a change is made to stored data, like erase or update, the controller mechanism on HDDs will
perform overwrites on blocks. Unlike HDDs, flash blocks cannot be overwritten and each P/E cycle wears
down the lifespan of blocks gradually. Repeatedly program/erase cycles performed on the same memory
cells will eventually cause some blocks to age faster than others. This would bring flash storages to their
end of service term sooner. Wear leveling is an important mechanism that level out the wearing of blocks
so that the wearing-down of blocks can be almost evenly distributed. This will increase the lifespan of
SSDs. Commonly used wear leveling types are Static and Dynamic.
5.2 S.M.A.R.T. technology
S.M.A.R.T. is an acronym for Self-Monitoring, Analysis and Reporting Technology, an open standard
allowing disk drives to automatically monitor their own health and report potential problems. It protects the
user from unscheduled downtime by monitoring and storing critical drive performance and calibration
parameters. Ideally, this should allow taking proactive actions to prevent impending drive failure. Apacer
SMART feature adopts the standard SMART command B0h to read data from the drive. When the Apacer
SMART Utility running on the host, it analyzes and reports the disk status to the host before the device is
in critical condition.
5.3 Built-in hardware ECC
The ATA-Disk Module uses BCH Error Detection Code (EDC) and Error Correction Code (ECC)
algorithms which correct up to eight random single-bit errors for each 512-byte block of data. High
performance is fulfilled through hardware-based error detection and correction.
5.4 Flash block management
Current production technology is unable to guarantee total reliability of NAND flash memory array. When
a flash memory device leaves factory, it comes with a minimal number of initial bad blocks during
production or out-of-factory as there is no currently known technology that produce flash chips free of bad
blocks. In addition, bad blocks may develop during program/erase cycles. When host performs
program/erase command on a block, bad block may appear in Status Register. Since bad blocks are
inevitable, the solution is to keep them in control. Apacer flash devices are programmed with ECC, block
mapping technique and S.M.A.R.T to reduce invalidity or error. Once bad blocks are detected, data in
those blocks will be transferred to free blocks and error will be corrected by designated algorithms.
5.5 Power Failure Management
Power Failure Management plays a crucial role when experiencing unstable power supply. Power
disruption may occur when users are storing data into the SSD. In this urgent situation, the controller
would run multiple write-to-flash cycles to store the metadata for later block rebuilding. This urgent
operation requires about several milliseconds to get it done. At the next power up, the firmware will
perform a status tracking to retrieve the mapping table and resume previously programmed NAND blocks
to check if there is any incompleteness of transmission.
8
© 2013 Apacer Technology Inc.
Rev. 1.1
Compact Flash Ⅲ series
AP-CFxxxxE3NR-XXXXXXQ
6. Software Interface
6.1 Command Set
Table 6-1 summarizes the command set with the paragraphs that follow describing the individual
commands and the task file for each.
Table 6-1: Command set (1 of 2)
Command
Code
Check-Power-Mode
E5H or 98H
Execute-Drive-Diagnostic
90H
Erase Sector(s)
C0H
Flush-Cache
E7H
Format Track
50H
Identify-Drive
ECH
Idle
E3H or 97H
Idle-Immediate
E1H or 95H
Initialize-Drive-Parameters
91H
NOP
00H
Read-Buffer
E4H
Read-DMA
C8H or C9H
Read-Multiple
C4H
Read-Sector(s)
20H or 21H
Read-Verify-Sector(s)
40H or 41H
Recalibrate
1XH
Request-Sense
03H
Seek
7XH
Set-Features
EFH
SMART
B0H
Set-Multiple-Mode
C6H
Set-Sleep-Mode
E6H or 99H
Standby
E2H or 96H
Standby-lmmediate
E0H or 94H
Translate-Sector
87H
Write-Buffer
E8H
Write-DMA
CAH or CBH
Write-Multiple
C5H
Write-Multiple-Without-Erase
CDH
9
© 2013 Apacer Technology Inc.
Rev. 1.1
Compact Flash Ⅲ series
AP-CFxxxxE3NR-XXXXXXQ
Write-Sector(s)
30H or 31H
Write-Sector-Without-Erase
38H
Write-Verify
3CH
10
© 2013 Apacer Technology Inc.
Rev. 1.1
Compact Flash Ⅲ series
AP-CFxxxxE3NR-XXXXXXQ
7. Electrical Specification
Caution: Absolute Maximum Stress Ratings – Applied conditions greater than those listed under
“Absolute Maximum Stress Ratings” may cause permanent damage to the device. This is a stress rating
only and functional operation of the device at these conditions or conditions greater than those defined in
the operational sections of this data sheet is not implied. Exposure to absolute maximum stress rating
conditions may affect device reliability.
Table 7-1: Operating range
Standard Operating Temperature
0°C to +70°C
Extended Operating Temperature
Supply voltage
-40°C to +85°C
5V± 5% (4.75-5.25V)
3.3V ± 5% (3.135-3.465V)
Table 7-2: Absolute maximum power pin stress ratings
Parameter
Symbol
Input Power
Voltage on any pin except VDD with respect to GND
VDD
V
Conditions
-0.3V min. to 6.5V max.
-0.5V min. to VDD + 0.5V max.
Table 7-3: Recommended system power-up timing
Symbol
Parameter
1
TPU-READY
1
TPU-WRITE
Power-up to Ready Operation
Power-up to Write Operation
Typical
Maximum
Units
200
200
1000
1000
ms
ms
1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter.
11
© 2013 Apacer Technology Inc.
Rev. 1.1
Compact Flash Ⅲ series
AP-CFxxxxE3NR-XXXXXXQ
8. Physical Characteristics
8.1 Dimension
TABLE 8-1: Type I CFC physical specification
Length:
Width:
Thickness (Including Label Area):
36.40 +/- 0.15mm (1.433+/- 0.06 in.)
42.80 +/- 0.10mm (1.685+/- 0.04 in.)
3.3mm+/-0.10mm (0.130+/-0.04in.)
Unit: mm
FIGURE 8-1: Physical dimension
12
© 2013 Apacer Technology Inc.
Rev. 1.1
Compact Flash Ⅲ series
AP-CFxxxxE3NR-XXXXXXQ
9. Product Ordering Information
9.1 Product Code Designations
A P – C F x x x x E 3 N R – XXXXXX Q
Firmware
version
Specification
NR: Non-Removable Setting
NDNR: Non-DMA + Non-Removable
ETNR: Ext. Temp. + Non-Removable
ETNDNR: Ext. Temp + Non-DMA + Non-Removable
RoHS Compliant
Configuration
N: Standard
Controller Type
CFC Type
Capacity:
128M:
256M:
512M:
001G:
002G:
004G:
008G:
016G:
128MB
256MB
512MB
1GB
2GB
4GB
8GB
16GB
Model Name
Apacer Product Code
13
© 2013 Apacer Technology Inc.
Rev. 1.1
Compact Flash Ⅲ series
AP-CFxxxxE3NR-XXXXXXQ
9.2 Valid Combinations
Standard Temperature
Non-Removable
Capacity
Model Number
128MB
AP-CF128ME3NR-NRQ
256MB
AP-CF256ME3NR-NRQ
512MB
AP-CF512ME3NR-NRQ
1GB
AP-CF001GE3NR-NRQ
2GB
AP-CF002GE3NR-NRQ
4GB
AP-CF004GE3NR-NRQ
8GB
AP-CF008GE3NR-NRQ
16GB
AP-CF016GE3NR-NRQ
Non-DMA & Non-Removable
Capacity
Model Number
128MB
AP-CF128ME3NR-NDNRQ
256MB
AP-CF256ME3NR-NDNRQ
512MB
AP-CF512ME3NR-NDNRQ
1GB
AP-CF001GE3NR-NDNRQ
2GB
AP-CF002GE3NR-NDNRQ
4GB
AP-CF004GE3NR-NDNRQ
8GB
AP-CF008GE3NR-NDNRQ
16GB
AP-CF016GE3NR-NDNRQ
14
© 2013 Apacer Technology Inc.
Rev. 1.1
Compact Flash Ⅲ series
AP-CFxxxxE3NR-XXXXXXQ
Extended Temperature
Non-Removable
Capacity
Model Number
128MB
AP-CF128ME3NR-ETNRQ
256MB
AP-CF256ME3NR-ETNRQ
512MB
AP-CF512ME3NR-ETNRQ
1GB
AP-CF001GE3NR-ETNRQ
2GB
AP-CF002GE3NR-ETNRQ
4GB
AP-CF004GE3NR-ETNRQ
8GB
AP-CF008GE3NR-ETNRQ
16GB
AP-CF016GE3NR-ETNRQ
Non-DMA & Non-Removable
Capacity
Model Number
128MB
AP-CF128ME3NR-ETNDNRQ
256MB
AP-CF256ME3NR-ETNDNRQ
512MB
AP-CF512ME3NR-ETNDNRQ
1GB
AP-CF001GE3NR-ETNDNRQ
2GB
AP-CF002GE3NR-ETNDNRQ
4GB
AP-CF004GE3NR-ETNDNRQ
8GB
AP-CF008GE3NR-ETNDNRQ
16GB
AP-CF016GE3NR-ETNDNRQ
15
© 2013 Apacer Technology Inc.
Rev. 1.1
Compact Flash Ⅲ series
AP-CFxxxxE3NR-XXXXXXQ
Revision History
Revision
1.0
Date
Description
05/19/2011
Official release
Remark
Updated performance and product ordering information due
to change in NAND flash use
1.1
08/11/2013
Updated the address of Taiwan headquarter
Added endurance TBW section to replace MTBF
16
© 2013 Apacer Technology Inc.
Rev. 1.1
Compact Flash Ⅲ series
AP-CFxxxxE3NR-XXXXXXQ
Global Presence
Taiwan (Headquarters)
Apacer Technology Inc.
Apacer Technology Inc.
1F., No.32, Zhongcheng Rd., Tucheng Dist.,
New Taipei City 236, Taiwan R.O.C.
Tel: 886-2-2267-8000
Fax: 886-2-2267-2261
[email protected]
U.S.A.
Apacer Memory America, Inc.
386 Fairview Way, Suite102,
Milpitas, CA 95035
Tel: 1-408-518-8699
Fax: 1-408-935-9611
[email protected]
Japan
Apacer Technology Corp.
5F, Matsura Bldg., Shiba, Minato-Ku
Tokyo, 105-0014, Japan
Tel: 81-3-5419-2668
Fax: 81-3-5419-0018
[email protected]
Europe
Apacer Technology B.V.
Science Park Eindhoven 5051 5692 EB Son,
The Netherlands
Tel: 31-40-267-0000
Fax: 31-40-267-0000#6199
[email protected]
China
Apacer Electronic (Shanghai) Co., Ltd
1301, No.251,Xiaomuqiao Road, Shanghai,
200032, China
Tel: 86-21-5529-0222
Fax: 86-21-5206-6939
[email protected]
India
Apacer Technologies Pvt. Ltd.
# 535, 1st Floor, 8th cross, JP Nagar 3rd Phase,
Bangalore – 560078, India
Tel: 91-80-4152-9061
[email protected]
17
© 2013 Apacer Technology Inc.
Rev. 1.1
Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
Apacer:
AP-CF004GE3NR-ETNDNRQ AP-CF016GE3NR-NDNRQ AP-CF001GE3NR-ETNDNRQ AP-CF001GE3NR-ETNRQ
AP-CF001GE3NR-NDNRQ AP-CF008GE3NR-NRQ AP-CF002GE3NR-ETNDNRQ AP-CF008GE3NR-ETNDNRQ
AP-CF256ME3NR-ETNRQ AP-CF002GE3NR-NRQ AP-CF004GE3NR-NDNRQ AP-CF256ME3NR-NDNRQ APCF128ME3NR-ETNRQ AP-CF512ME3NR-NRQ AP-CF016GE3NR-ETNRQ AP-CF001GE3NR-NRQ APCF256ME3NR-ETNDNRQ AP-CF002GE3NR-NDNRQ AP-CF008GE3NR-NDNRQ AP-CF016GE3NR-ETNDNRQ APCF004GE3NR-NRQ AP-CF128ME3NR-ETNDNRQ AP-CF128ME3NR-NDNRQ AP-CF016GE3NR-NRQ APCF004GE3NR-ETNRQ AP-CF512ME3NR-ETNRQ AP-CF256ME3NR-NRQ AP-CF512ME3NR-NDNRQ APCF512ME3NR-ETNDNRQ AP-CF128ME3NR-NRQ AP-CF008GE3NR-ETNRQ AP-CF002GE3NR-ETNRQ
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