MLX90816 Discrete Absolute Pressure Sensor 1. Features and Benefits 2. High sensitivity Outstanding linearity High stability and reliability 0 – 30..50Bar Absolute pressure sensor Fully automotive qualified beyond AEC-Q100 requirements Compact design 3. Automotive applications: • • Engine/Transmission oil pressure HVAC pressure Multi-Market: • • • • • • HVAC/Refrigeration Industrial process controls Appliance Consumer electronics Ships and marine systems Medical instruments Ordering Information Temperature Code Product Code MLX90816 Legend: Temperature Code: Package Code: Option Code: Packing Form: Ordering example: 4. Application Examples L Package Code UF Option Code ABA-000 Packing Form Code WB L(-40°C to 150°C) UF=Die on Foil ABA-000 WB = Wafer Box MLX90816LUF-ACA-000-WB Functional Diagram 5. Figure 4-1 Functional block diagram MLX90816 3901090816 Rev 1 Page 1 of 6 General Description The MLX90816 discrete micromachined absolute pressure sensors has been designed for an optimal performance when sensing pressures from 0 to 30..50 bar absolute. This device is fully automotive qualified. It can directly be used in non corrosive/non aggressive media applications. For harsh media, the MLX90816 can be used in a fluid filled module design. The sensor is a piezoresistive wheatstone bridge on a membrane made with a silicon micromachining process. As pressure is applied on the membrane a differential voltage change is seen across the Wheatstone bridge outputs while a bias voltage is applied to the bridge inputs. The MLX90816 can be used in combination with the Melexis sensor interfaces ICs that can perform the conditioning of the bridge signal (MLX90328, MLX90329). Data Sheet Dec 2014 MLX90816 Discrete Absolute Pressure Sensor 6. 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. Table of Contents Features and Benefits ...................................................................................................................................................................... 1 Application Examples....................................................................................................................................................................... 1 Ordering Information ........................................................................................................................................................................ 1 Functional Diagram .......................................................................................................................................................................... 1 General Description ......................................................................................................................................................................... 1 Table of Contents ............................................................................................................................................................................ 2 Absolute Maximum Ratings ............................................................................................................................................................. 3 Die Information ................................................................................................................................................................................ 3 General Electrical Specifications ...................................................................................................................................................... 4 Application Information ................................................................................................................................................................ 4 Standard information regarding manufacturability of Melexis products with different soldering processes .................................... 5 ESD Precautions ......................................................................................................................................................................... 5 Disclaimer ................................................................................................................................................................................... 6 Contact Information ..................................................................................................................................................................... 6 3901090816 Rev 1 Page 2 of 6 Data Sheet Dec 2014 MLX90816 Discrete Absolute Pressure Sensor 7. Absolute Maximum Ratings Sym bol Parameter Supply Voltage (overvoltage) Operating Temperature Range Storage Temperature Range Burst Pressure V T T Min Value Max Value -40 - 55 10 150 150 200 Table 1: Absolute maximum ratings Units V °C °C Bar Exceeding the absolute maximum ratings may cause permanent damage. Exposure to absolute maximum rated conditions for extended periods may affect device reliability. 8. Die Information Figure 2 Chip Dimensions and bond pad positions (all dim. in μm) Bond Pads opening size (x, y) in um (330,155) Bond Pad Die thickness (μm) 700 Function / Description Vexc + Supply voltage Vout + Positive output voltage Vout - Negative output voltage Vexc - Ground connection Table 2: Bond pads description 3901090816 Rev 1 Page 3 of 6 Data Sheet Dec 2014 MLX90816 Discrete Absolute Pressure Sensor 9. General Electrical Specifications o DC Operating Parameters TA = 25 C, VDD = 5V, Pressure = 50 bar Full Scale unless otherwise specified. Symbol Min Max Units Sensitivity Parameter S 0.42 .58 mV/V/bar Bridge Resistance Rb 3 5.5 kΩ Offset O -30 30 mV Non linearity (best fit) NL -0.2 0.2 %FS Thermal Hysteresis Hyst -0.2 0.2 %FS Thermal coefficient of Span TCS -0.23 -0.15 %FS/˚C Thermal coefficient of Offset TCO -0.06 0.06 %FS/˚C Thermal coefficient of bridge resistance TCR 0.30 0.40 %FS/˚C Table 3: Electrical specifications The MLX90816 can also be used with full scale pressures other than 50bar (30 to 50bar). Contact Melexis for detailed information on the IC performance at different full scale pressures. 10. Application Information The MLX90816 is a very reliable discrete absolute pressure sensor fully automotive qualified. Like all Melexis pressure sensors it has been qualified beyond typical semiconductors qualification standards. For harsh media applications the MLX90816 can be used in a fluid filled housing. If the application requires an amplified conditioned output the MLX90816 can be used in combination with Melexis sensor interfaces IC like the MLX90328 and the MLX90329. By programming some calibration settings in the sensor interface IC the sensitivity and offset variations from part to part as well as their variations over temperature can be compensated for. 3901090816 Rev 1 Page 4 of 6 Data Sheet Dec 2014 MLX90816 Discrete Absolute Pressure Sensor 11. Standard information regarding manufacturability of Melexis products with different soldering processes Our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity level according to following test methods: Reflow Soldering SMD’s (Surface Mount Devices) • IPC/JEDEC J-STD-020 Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices (classification reflow profiles according to table 5-2) • EIA/JEDEC JESD22-A113 Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing (reflow profiles according to table 2) Wave Soldering SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices) • EN60749-20 Resistance of plastic- encapsulated SMD’s to combined effect of moisture and soldering heat • EIA/JEDEC JESD22-B106 and EN60749-15 Resistance to soldering temperature for through-hole mounted devices Iron Soldering THD’s (Through Hole Devices) • EN60749-15 Resistance to soldering temperature for through-hole mounted devices Solderability SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices) • EIA/JEDEC JESD22-B102 and EN60749-21 Solderability For all soldering technologies deviating from above mentioned standard conditions (regarding peak temperature, temperature gradient, temperature profile etc) additional classification and qualification tests have to be agreed upon with Melexis. The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance of adhesive strength between device and board. Melexis recommends reviewing on our web site the General Guidelines soldering recommendation (http://www.melexis.com/Quality_soldering.aspx) as well as trim&form recommendations (http://www.melexis.com/Assets/Trim-and-form-recommendations-5565.aspx). Melexis is contributing to global environmental conservation by promoting lead free solutions. For more information on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of the use of certain Hazardous Substances) please visit the quality page on our website: http://www.melexis.com/quality.aspx 12. ESD Precautions Electronic semiconductor products are sensitive to Electro Static Discharge (ESD). Always observe Electro Static Discharge control procedures whenever handling semiconductor products. 3901090816 Rev 1 Page 5 of 6 Data Sheet Dec 2014 MLX90816 Discrete Absolute Pressure Sensor 13. Disclaimer Devices sold by Melexis are covered by the warranty and patent indemnification provisions appearing in its Term of Sale. Melexis makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. Melexis reserves the right to change specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with Melexis for current information. This product is intended for use in normal commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical lifesupport or life-sustaining equipment are specifically not recommended without additional processing by Melexis for each application. The information furnished by Melexis is believed to be correct and accurate. However, Melexis shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interrupt of business or indirect, special incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of Melexis’ rendering of technical or other services. © 2014 Melexis NV. All rights reserved. 14. Contact Information For the latest version of this document, go to our website at www.melexis.com Or for additional information contact Melexis Direct: Europe, Africa, Asia: America: Phone: +32 1367 0495 E-mail: [email protected] Phone: +1 248 306 5400 E-mail: [email protected] ISO/TS 16949 and ISO14001 Certified 3901090816 Rev 1 Page 6 of 6 Data Sheet Dec 2014