AVAGO AFBR-83CDZ Cxp pluggable, parallel fiber-optics module Datasheet

AFBR-83CDZ
12 Channel × 12.5 Gbps Transceiver
CXP Pluggable, Parallel Fiber-Optics Module
Data Sheet
Description
Features
The Avago Technologies AFBR-83CDZ is a Twelve-Channel, Pluggable, Parallel, Fiber-Optic CXP Transceiver for
12 × 12.5G proprietary application. This transceiver is a
high performance module for short-range multi-lane
data communication and interconnect applications. It
integrates twelve data lanes in each direction with 150
Gbps aggregate bandwidth. Each lane can operate at
12.5 Gbps up to 50 m using OM3 fiber and 65 m using
OM4 fiber. These modules are designed to operate over
multimode fiber systems using a nominal wavelength of
850 nm. The electrical interface uses an 84-contact edge
type connector. The optical interface uses a 24-fiber MTP
(MPO) connector. This module incorporates Avago Technologies proven integrated circuit and VCSEL technology
to provide reliable long life, high performance, and consistent service.
• Compliant to SFF-8642: Mini Multilane Series: Shielded
Integrated Connector, and InfiniBand Architecture
Specification V2 R1.3 for CXP Interface
• Multi-rate capable up to 12.5 Gbps
• High Channel Capacity: 150 Gbps per module, bidirectional, with twelve independent Transmitters and
Receivers each
• Operates at 12.5 Gbps per channel with 64b/66b
encoded data for proprietary application
• Hot Pluggable
• Links up to 50 m using OM3 fiber and 65 m using OM4
fiber
• 0 to 70 °C case temperature operating range
• 3.3 V power supply only
• Low power dissipation of < 3.5 W
• Proven High Reliability 850 nm technology: Avago
VCSEL array transmitter and Avago PIN array receiver
• Two Wire Serial (TWS) interface with maskable interrupt
for expanded functionality including:
– Individual channel functions: channel/output disable, squelch disable, and lane polarity inversion
– Diagnostic Monitoring functions: module temperature and supply voltages, per channel laser current
and laser power, and input receiver power
– Status per channel: Tx fault, electrical (transmitter)
and optical (receiver) LOS, and alarm flags
• Utilizes a standard 24 lane optical fiber with MTP
(MPO) optical connector for high density and thin,
light-weight cable management
Applications
• 12 × 12.5G proprietary interconnects
• Data Aggregation, Backplane and Proprietary Protocol
and Density Applications
• Datacom/Telecom switch & router connections
Part Number Ordering Options
AFBR-83CDZ
12x 12.5 Gbps with Full Diagnostic Monitoring
AFBR-83EVB
CXP Evaluation Board
AFBR-83EVK*
CXP Evaluation Kit
*
Includes GUI, User Guide, i-Port and Power Supply
Patent - www.avagotech.com/patents
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WARNING
CLASS 1 LASER PRODUCT
CAUTION! Safe to view laser output with the naked eye or with the aid of typical
magifying optics (e.g. telescope or microscope.)
CAUTION! Use of controls or adjustments or performance of procedures other
than those specified herein may result in hazardous radiation exposure
Note: Standard used for classification: EN 60825-1:2007
CLASS 1 LASER PRODUCT: INVISIBLE LASER RADIATION, DO NOT VIEW DIRECTLY WITH OPTICAL INSTRUMENTS
Transmitter
Receiver
The optical transmitter incorporates a 12-channel VCSEL
(Vertical Cavity Surface Emitting Laser) array, a 12-channel
input buffer and laser driver, diagnostic monitors, and
control and bias blocks. The transmitter is designed for
EN 60825 and CDRH eye safety compliance. The Tx Input
Buffer provides differential inputs presenting a nominal
differential input impedance of 100 Ohms. AC coupling
capacitors are located inside the CXP module and are not
required on the host board. For module control and interrogation, the control interface incorporates a Two Wire
Serial (TWS) interface of clock and data signals.
The optical receiver incorporates a 12-channel PIN photodiode array, a 12-channel pre-amplifier and output buffer,
diagnostic monitors, and control and bias blocks. The Rx
Output Buffer provides differential outputs for the high
speed electrical interface presenting nominal single-ended output impedances of 50 W to AC ground and 100 W
differentially that should be differentially terminated with
100 W. AC coupling capacitors are located inside the CXP
module and are not required on the host board.
Modules have monitors for VCSEL bias, light output power
(LOP), temperature, and power supply voltage implemented; real-time results are available through the TWS interface.
Alarm thresholds are established for the monitored
attributes. Flags are set and interrupts generated when the
attributes are outside the thresholds.
Over the TWS interface, the user can, for individual
channels, control (flip) polarity of the differential inputs,
de-activate channels, disable the squelch function and
program input equalization levels to reduce the effect of
long PCB traces.
Flags are also set and interrupts generated for loss of input
signal (LOS) and transmitter fault conditions. All flags are
latched and will remain set even if the condition initiating
the latch clears and operation resumes. All interrupts can
be masked and flags are reset by reading the appropriate
flag register.
The optical output will AC squelch for loss of input signal
unless squelch is disabled. The input thresholds for the Tx
squelch are tied to Tx LOS thresholds which are informative only. See Tx LOS thresholds specification on page 6.
Fault detection or channel deactivation through the TWS
interface will disable the channel. Status, alarm and fault
information are available via the TWS interface. To reduce
the need for polling, the hardware interrupt signal is
provided to inform hosts of an assertion of an alarm, LOS
and/or Tx fault.
2
Modules have a monitor for optical input power; results
are available through the TWS interface. Alarm thresholds
are established for the monitored attributes. Flags are set
and interrupts generated when the attributes are outside
the thresholds.
Over the TWS interface, the user can, for individual
channels, control (flip) polarity of the differential outputs,
de-activate channels, disable the squelch function,
program output signal amplitude and deemphasis.
Flags are also set and interrupts generated for loss of
optical input signal (LOS). All flags are latched and will
remain set even if the condition initiating the latch clears
and operation resumes. All interrupts can be masked and
flags are reset upon reading the appropriate flag register.
The electrical output will squelch for loss of input signal
(unless squelch is disabled) and channel de-activation
through TWS interface. Status and alarm information are
available via the TWS interface. To reduce the need for
polling, the hardware interrupt signal is provided to inform
hosts of an assertion of an alarm and/or LOS.
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High Speed Electrical Signal Interface
Regulatory & Compliance
TX
Various standard and regulations apply to the modules.
These include eye-safety, EMC, ESD and RoHS. See the
Regulatory Section for details regarding these and
component recognition.
TX[0-11]p/n are the CXP module transmitter electrical
data inputs and are internally AC coupled (0.1 mF) differential lines with 100 W differential terminations. AC
coupling capacitors exist inside the CXP module and are
not required on the host board. All transmitter electrical
input channels are compliant to module CPPI specifications per IEEE 802.3ba other than jitter tolerance performance as per specified in the Transmitter Electrical Characteristics section of this data sheet.
RX
Rx[0-11]p/n are the CXP module receiver electrical data
outputs and are internally AC coupled (0.1 mF) differential lines that should be terminated with 100 W differential at the host side. AC coupling capacitors exist inside
the CXP module and are not required on the host board.
All receiver electrical output channels are compliant to
module CPPI specifications per IEEE 802.3ba other than
jitter output performance and output differential voltage
swing as per specified in the Receiver Electrical Characteristics section of this data sheet.
Tx Equalization Control
Tx Input Equalization Control: Four bit code blocks (bits
7-4 or 3-0) are assigned to each channel.
• Codes 1xxxb are reserved.
Handling and Cleaning
The transceiver module can be damaged by exposure to
current surges and over voltage events. Care should be
taken to restrict exposure to the conditions defined in
the Absolute Maximum Ratings. Wave soldering, reflow
soldering and/or aqueous wash process with the modules
on board are not recommended. Normal handling precautions for electrostatic discharge sensitive devices should
be observed.
Each module is supplied with an inserted port plug for
protection of the optical ports. This plug should always be
in place whenever a fiber cable is not inserted.
The optical connector includes recessed elements that
are exposed whenever a cable or port plug is not inserted.
Prior to insertion of a fiber optic cable, it is recommended
that the cable end be cleaned to avoid contamination from
the cable plug. The port plug ensures the optics remains
clean and no additional cleaning should be needed. In the
event of contamination, dry nitrogen or clean dry air at
less than 20 psi can be used to dislodge the contamination. The optical port features (e.g. guide pins) preclude
use of a solid instrument. Liquids are also not advised.
• Writing 0111b calls for full-scale equalization.
• Writing 0000b calls for no equalization.
Intermediate code values call for intermediate levels of
equalization.
Rx De-emphasis Control
Rx Output de-Emphasis Control: Four bit code blocks (bits
7-4 or 3-0) are assigned to each channel.
• Codes 1xxxb are reserved.
• Writing 0111b calls for full-scale de-emphasis.
• Writing 0000b calls for minimum de-emphasis.
Writing intermediate code values calls for intermediate
levels of de-emphasis.
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Link Model and Reference Channel
TP0
TP1
TP1a
TP4a
CXP RX
TP2
TP3
TP5
ASIC
Electrical Connector
Electrical Connector
Optical Patch Cord
CXP TX
ASIC
TP4
Figure 1. Link Model test point definitions
Absolute Maximum Ratings
Stress in excess of any of the individual Absolute Maximum Ratings can cause immediate catastrophic damage to the
module even if all other parameters are within Recommended Operation Conditions. It should not be assumed that
limiting values of more than one parameter can be applied to the module concurrently. Exposure to any of the Absolute
Maximum Ratings for extended periods can adversely affect reliability.
Parameter
Storage Temperature
Symbol
Min
Max
Units
Ts
-40
85
°C
85
°C
-0.5
4.0
V
-0.5
Vcc33+0.5, 4.0
V
1.6
V
Note 2
V
Note 3
Absolute Maximum Operating Temperature
3.3 V Power Supply Voltage
Vcc33
Data Input Voltage – Single Ended
Data Input Voltage – Differential
|Vdip - Vdin|
Control Input Voltage
Vi
-0.5
Vcc33+0.5
4.0
Control Output Current
Io
-20
20
mA
Relative Humidity
RH
5
85
%
4
dBm
Receiver Damage Threshold
Notes
Note 1
Note 4
Notes:
1. Electro-optical specifications are not guaranteed outside the recommended operating temperature range. Operation at or above the maximum
Absolute Maximum Case Temperature for extended periods may adversely affect reliability.
2. This is the maximum voltage that can be applied across the differential inputs without damaging the input circuitry.
3. The maximum limit is the lesser of Vcc33 + 0.5 V or 4.0 V
4. The receiver shall be able to tolerate, without damage, continuous exposure to a modulated optical input signal having this power level on one
lane. The receiver does not have to operate correctly at this input power
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Recommended Operating Conditions
Recommended Operating Conditions specify parameters for which the electrical characteristics hold unless otherwise
noted. Electrical characteristics are not defined for operation outside the Recommended Operating Conditions, reliability is not implied and damage to the module may occur for such operation over an extended period of time.
Parameter
Case Temperature
3.3 V Power Supply Voltage
Symbol
Min
Tc
0
Vcc33
3.135
Signal Rate per Channel
Typ
3.3
Max
Units
70
°C
3.465
V
12.5
GBd
Control Input Voltage High
Vih
2.3
3.6
V
Control Input Voltage Low
Vil
-0.3
0.4
V
0.25
0.15
0.10
UI
UI
UI
UI
UI
UI
Fiber Length: 4700 MHz•km 50 µm MMF (OM4)
65
m
Fiber Length: 2000 MHz•km 50 µm MMF (OM3)
50
m
Host Electrical Compliance
TJ Jitter output (TP1a)
DJ Jitter output (TP1a)
RJ Jitter output (TP1a)
TJ Jitter tolerance (TP4)
DJ Jitter tolerance (TP4)
RJ Jitter tolerance (TP4)
0.75
0.45
0.30
Receiver Differential Data Output Load
Notes
Note 1
Note 2
Note 3
W
100
Note:
1. For applications other than 12.5 Gbps per channel, please contact Avago Sales.
2. Per IEEE 802.3ba-2010 TP1a and TP4 CPPI specifications for host except for jitter.
3. 1.5dB allocated for connection and splice loss.
Transceiver Electrical Characteristics
The following characteristics are defined over the Recommended Operating Conditions unless otherwise noted. Typical
values are for Tc = 40°C, Vcc33 = 3.3 V
Parameter
Max
Units
Notes
Transceiver Power Consumption
3.5
W
With module
default settings
Transceiver Power Supply Current – Vcc33
1.1
A
With module
default settings
Maximum inrush current
1.25
A
On any contact
Maximum current ramp rate
100
mA/ms
Power Supply Noise including ripple
50
mVpp
Power On Initialization Time
Symbol
Min
Typ
2000
ms
Two Wire Serial Interface Clock Rate
tpwr init
400
kHz
TWS Write Cycle Time (4 byte write)
40
ms
Note 1
Note:
1. 1 kHz to frequency of operation at the host supply side of the recommended power supply filter with the module and recommended filter in place.
See Figure 9 for recommended power supply filter.
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Transmitter Electrical Characteristics
The following characteristics are defined over the Recommended Operating Conditions unless otherwise noted. Typical
values are for Tc = 40°C, Vcc33 = 3.3 V
Parameter
Symbol
Differential Input Impedance
Min
Typ
Max
Units
80
100
120
W
LOS Assert Threshold: Tx Data Input
Differential Peak-to-Peak Voltage Swing
ΔVdi pp losA
110
LOS De-Assert Threshold: Tx Data Input
Differential Peak-to-Peak Voltage Swing
ΔVdi pp losD
130
LOS Hysteresis
0.5
Parameter
Test Point
Min
Single ended input voltage tolerance
TP1a
-0.3
AC common mode input voltage tolerance
TP1a
15
Differential input return loss
TP1
Differential to common-mode
input return loss
TP1
TJ Jitter tolerance
210
4
Typ
Notes
mVpp
Note 1
Informative
mVpp
Note 1
Informative
dB
Max
Units
Notes/Conditions
4.0
V
Note 2
mV
RMS
dB
10 MHz to 11.1 GHz
Note 3
10
dB
10 MHz to 11.1 GHz
TP1a
0.25
UI
DJ Jitter tolerance
TP1a
0.15
UI
RJ Jitter tolerance
TP1a
0.10
UI
Data Dependent Pulse Width Shrinkage
(DDPWS) tolerance
TP1a
0.07
UI
Eye Mask Coordinates:
X1, X2, Y1, Y2
TP1a
footnote
SPECIFICATION VALUES
0.11, 0.31
95, 350
UI
mV
Hit Ratio = 5x10-5
Notes:
1. At default Tx EQ setting only. Informative only. Tx LOS thresholds also represent the Tx channel squelch thresholds when enabled. Behavior per
IBTA Annex A6 CXP Interface Specification (Tx squelch disabled).
2. Referred to TP1 signal common; The single-ended input voltage tolerance is the allowable range of the instantaneous input signals
3. From 10 MHz to 11.1 GHz, the magnitude in decibels of the module differential input return loss at TP1 and the host differential output return loss
at TP1a shall not exceed the limit given in Equation
Return_loss (ƒ)
≥ 12 – 2√ ƒ
ƒ
≥ 6.3 – 13log10  
 5.5 
0.01 ≤ ƒ < 4.1 GHz
4.11 ≤ ƒ < 11.1 GHz
Return_loss(ƒ) is the return loss at frequency ƒ
ƒ is the frequency in GHz.
Differential amplitude (mV)
Y2
Y1
0
-Y1
-Y2
0
X1
X2
Time (UI)
1-X2
1-X1
1
Figure 2. Tx Electrical Eye Mask Coordinates (TP1a) at Hit ratio 5 x 10-5 hits per sample
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Receiver Electrical Characteristics
The following characteristics are defined over the Recommended Operating Conditions, with module default settings,
unless otherwise noted. Typical values are for Tc = 40°C, Vcc33 = 3.3 V
Parameter
Test Point
Min
Data Output Differential Peak-to-Peak
Voltage Swing
TP4
220
AC common mode voltage (RMS)
Typ
Max
Units
850
mV
TP4
7.5
mV
Termination mismatch at 1MHz
TP4
5
Differential output return loss
TP4
footnote
10 MHz to 11.1 GHz
Note 1
Common-mode output return loss
TP4
footnote
10 MHz to 11.1 GHz
Note 2
Output transition time 20% to 80%
TP4
TJ Jitter output
TP4
0.75
UI
DJ Jitter output
TP4
0.45
UI
RJ Jitter output
TP4
0.30
UI
Data Dependent Pulse Width Shrinkage
(DDPWS)
TP4
0.34
UI
Eye Mask coordinates:
X1, X2, Y1, Y2
TP4
28
Notes/Conditions
RMS
%
ps
SPECIFICATION VALUES
0.29, 0.5
110, 425
UI
mV
Hit Ratio = 5x10-5
Notes:
1. From 10 MHz to 11.1 GHz, the magnitude in decibels of the module differential output return loss at TP4 and the host differential input return loss
at TP4a shall not exceed the limit given in Equation
Return_loss (ƒ)
≥ 12 – 2√ ƒ
0.01 ≤ ƒ < 4.1 GHz
≥ 6.3 – 13log10 
ƒ
 5.5 
4.11 ≤ ƒ < 11.1 GHz
2. From 10 MHz to 11.1 GHz, the magnitude in decibels of the module common-mode output return loss at TP4 shall not exceed the limit given in
Equation
Return_loss (ƒ)
≥ 7 – 1.6ƒ
0.01 ≤ ƒ < 2.5 GHz
≥3
2.5 ≤ ƒ < 11.1 GHz
Differential Amplitude [mV]
Y2
Y1
0
-Y1
-Y2
0
X1
X2
Normalized Time [UI]
1-X1
1.0
Figure 3. Rx Electrical Eye Mask Coordinates (TP4) at Hit ratio 5 x 10-5 hits per sample
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Transmitter Optical Characteristics
The following characteristics are defined over the Recommended Operating Conditions unless otherwise noted. Typical
values are for Tc = 40°C, Vcc33 = 3.3 V
Parameter
Test Point
Min
Typ
Max
Units
Center wavelength
TP2
840
850
860
nm
RMS spectral width
TP2
0.65
nm
Average launch power, each lane
TP2
-7.6
2.4
dBm
Optical Modulation Amplitude (OMA)
each lane
TP2
-5.6
3
dBm
Difference in launch power between
any two lanes (OMA)
TP2
4
dB
Peak power, each lane
TP2
4
dBm
Launch power in OMA minus TDP,
each lane
TP2
Transmitter and dispersion penalty (TDP),
each lane
TP2
Extinction ratio
TP2
Optical return loss tolerance
TP2
Encircled flux
TP2
≥ 86% at 19 μm,
≤ 30% at 4.5 μm
Eye Mask coordinates:
X1, X2, X3, Y1, Y2, Y3
TP2
SPECIFICATION VALUES
0.23, 0.34, 0.43, 0.27, 0.35, 0.4
Average launch power of OFF transmitter,
each lane
TP2
-6.5
3
Mask Coordinates
X1 = 0.23
X2 = 0.34
X3 = 0.43
Y1 = 0.27
Y2 = 0.35
Y3 = 0.40
Normalizd Amplitude
0.5
Y2
Y1
0
-Y3
0
X1
X2
X3 1-X3 1-X2
1-X1
Normalized Time (Unit Interval
1.0
Figure 4. Transmitter eye mask definitions (TP2) at Hit ratio 5 x 10-5 hits per sample
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dB
If measured into type A1a.2
50 μm fiber in accordance
with EN 61280-1-4
-30
1-Y1
1-Y2
Even if the TDP<0.9 dB,
the OMA minimum must
exceed this minimum value
dB
12
1
RMS Spectral Width is the
standard deviation of the
spectrum
dBm
3.5
1+Y3
Notes/Conditions
UI
dBm
Hit Ratio = 5x10-5
Receiver Optical Characteristics
The following characteristics are defined over the Recommended Operating Conditions unless otherwise noted. Typical
values are for Tc = 40°C, Vcc33 = 3.3 V
Parameter
Test Point
Min
Typ
Max
Units
Center wavelength, each lane
TP3
840
850
860
nm
Average power at receiver input, each lane
TP3
-9.5
2.4
dBm
Receiver Reflectance
TP3
-12
dB
Receiver Sensitivity (OMA)
TP3
-11.3
Notes/Conditions
3
dBm
Informative
Measured with conformance test signal at TP3
for BER = 10e-12
Stressed receiver sensitivity in OMA,
each lane
TP3
-5.4
dBm
Peak power, each lane
TP3
4
dBm
Conditions of stressed receiver sensitivity:
TP3
Vertical Eye Closure Penalty, each lane
TP3
1.9
dB
Stressed eye J2, Jitter, each lane
TP3
0.30
UI
Stressed eye J9, Jitter, each lane
TP3
0.47
UI
OMA of each aggressor lane
TP3
-0.4
dBm
Rx LOS Assert Threshold
TP3
Rx LOS De-assert Threshold
TP3
LOS Hysteresis
TP3
Note 1
-30
dBm OMA
-8
0.5
dBm OMA
dB
Notes:
1. Vertical eye closure penalty and stressed eye jitter are test conditions for measuring stressed receiver sensitivity. They are not characteristics of the
receiver. The apparent discrepancy between VECP and TDP is because VECP is defined at eye center while TDP is defined with ±0.15 UI offsets of
the sampling instant
100GBASE-SR10 Illustrative Link Power Budgets
Parameter
OM3
OM4
Units
Effective Modal Bandwidth at 850 nm
2000
4700
MHz•km
Launch Power in OMA minus TDP, each lane
Transmitter and Dispersion Penalty, each lane
Receiver Sensitivity (OMA)
dBm
3.5
dB
-11.3
Power Budget (for maximum TDP)
Operating Distance
-6.5
dBm
8.3
dB
0.5 to 100
0.5 to 150
m
Channel Insertion Loss
1.9
1.5
dB
Allocation for Penalties (for max. TDP)
6.4
6.5
dB
0
0.3
dB
Unallocated Margin
Additional Insertion Loss Allowed
9
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dB
Reference
Jitter histogram (at waveform
average, may not be at waist)
Vertical eye closure histograms
(at time-center of eye)
Approximate OMA (difference of
means of histograms)
P1
A0
OMA
P0
J
Figure 5. Required characteristics of the conformance test signal at TP3 – definitions of the conditions of stressed receiver sensitivity
Regulatory and Compliance
Feature
Test Method
Performance
Electrostatic Discharge
(ESD) to the Electrical
Contacts
JEDEC Human Body Model (HBM)
(JESD22-A114-B)
High speed signal contacts shall withstand 1000
V. All other con­tacts shall withstand 2000 V
Electrostatic Discharge
(ESD) to Optical Connector
Receptacle
EN 61000-4-2, crite­rion B
When installed in a properly grounded
housing and chassis the units are subjected
to 15 KV air discharges during operation and
8 KV direct contact discharges to the case
Electromagnetic
Interference (EMI)
FCC Part 15 CENELEC EN55022
(CISPR 22A) VCCI Class 1
Typically passes with 10 dB margin. Actual
performance dependent on enclosure design
Immunity
Variation of EN 61000-4-3
Typically minimum effect from a 10 V/m field
swept from 80 MHz to 1 GHz applied to the
module without a chassis enclosure
Laser Eye Safety and
Equipment Type Testing
EN 60950-1:2006+A11+A1+A12
EN 60825-1:2007
EN 60825-2:2004+A1+A2
Pout: EN AEL & US FDA CDRH Class 1
TUV File Number: R72122669
Component Recognition
Underwriters Laboratories and Canadian
Standards Association Joint Component
Recognition for Information Technology
Equipment including Electrical Business
Equipment
UL File Number: E173874
RoHS Compliance
BS EN 1122:2001 Mtd B by ICP for Cadmium,
EPA Method 3051A by ICP for Lead and
Mercury, EPA Method 3060A & 7196A by
UV/Vis Spectrophotometry for Hexavalent
Chromium. EPA Method 3540C/3550B by
GC/MS for PPB and PBDE
Less than 100 ppm of cadmium,
Less than 1000 ppm of lead, mercury,
hexavalent chromium, polybrominated
biphenyls, and polybrominated biphenyl esters.
BS EN method by ICP and EPA methods by
ICP, UV/Vis Spectrophotometry and GC/MS.
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Pin Assignment
D1
C1
D21
C21
B1
A1
B21
A21
D21
C21
D1
C1
B21
A21
B1
A1
Figure 6. CXP module and host board connector pin assignments
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Transceiver Contact Assignment and Signal Description
There are 21 pads per level, for a total of 84, with 48 pads allocated for (12+12) differential pairs, 28 for Signal Common
or Ground (GND), 4 for power connections, 4 for control/service.
Bottom side
I/O #
Top Side
Contact
Length
Name
Contact
Length
Name
I/O #
Receiver -- Top Card
GND
GND
Rx1p
Rx1n
Rx0p
Rx0n
Rx3p
Rx3n
Rx2p
Rx2n
Rx5p
Rx5n
Rx4p
Rx4n
GND
GND
GND
GND
GND
Rx7p
Rx7n
GND
Card Edge
C1
C2
C3
C4
C5
C6
C7
C8
C9
C10
C11
C12
C13
C14
C15
C16
C17
C18
C19
C20
C21
Rx9p
Rx9n
GND
Rx6p
Rx6n
GND
Rx8p
Rx8n
GND
GND
Rx11p
Rx11n
Rx10p
Rx10n
GND
GND
PRSNT_L
Int_L/Reset_L
Vcc3.3-Rx
Not used
D1
D2
D3
D4
D5
D6
D7
D8
D9
D10
D11
D12
D13
D14
D15
D16
D17
D18
D19
D20
D21
Transmitter -- Bottom Card
12
GND
GND
Tx1p
Tx1n
Tx0p
Tx0n
Tx3p
Tx3n
Tx2p
Tx2n
Tx5p
Tx5n
Tx4p
Tx4n
GND
GND
GND
GND
GND
Tx7p
Tx7n
GND
Tx9p
Tx9n
Card Edge
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
A18
A19
A20
A21
GND
Tx6p
Tx6n
GND
Tx8p
Tx8n
GND
GND
Tx11p
Tx11n
Tx10p
Tx10n
GND
GND
SCL
SDA
Vcc3.3-Tx
Not used
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B1
B2
B3
B4
B5
B6
B7
B8
B9
B10
B11
B12
B13
B14
B15
B16
B17
B18
B19
B20
B21
Pin
Signal Name
Signal Description
A1
GND
Ground
A2
TX1p
Transmitter Non-Inverted Data Input
CML-I
A3
TX1n
Transmitter Inverted Data Input
CML-I
A4
GND
Ground
A5
TX3p
Transmitter Non-Inverted Data Input
CML-I
A6
TX3n
Transmitter Inverted Data Input
CML-I
A7
GND
Ground
A8
TX5p
Transmitter Non-Inverted Data Input
CML-I
A9
TX5n
Transmitter Inverted Data Input
CML-I
A10
GND
Ground
A11
TX7p
Transmitter Non-Inverted Data Input
CML-I
A12
TX7n
Transmitter Inverted Data Input
CML-I
A13
GND
Ground
A14
TX9p
Transmitter Non-Inverted Data Input
CML-I
A15
TX9n
Transmitter Inverted Data Input
CML-I
A16
GND
Ground
A17
TX11p
Transmitter Non-Inverted Data Input
CML-I
A18
TX11n
Transmitter Inverted Data Input
CML-I
A19
GND
Ground
A20
SCL
Two-wire serial interface clock
LVCMOS-I/O
1
A21
SDA
Two-wire serial interface data
LVCMOS-I/O
1
B1
GND
Ground
B2
TX0p
Transmitter Non-Inverted Data Input
CML-I
B3
TX0n
Transmitter Inverted Data Input
CML-I
B4
GND
Ground
B5
TX2p
Transmitter Non-Inverted Data Input
CML-I
B6
TX2n
Transmitter Inverted Data Input
CML-I
B7
GND
Ground
B8
TX4p
Transmitter Non-Inverted Data Input
CML-I
B9
TX4n
Transmitter Inverted Data Input
CML-I
B10
GND
Ground
B11
TX6p
Transmitter Non-Inverted Data Input
CML-I
B12
TX6n
Transmitter Inverted Data Input
CML-I
B13
GND
Ground
B14
TX8p
Transmitter Non-Inverted Data Input
CML-I
B15
TX8n
Transmitter Inverted Data Input
CML-I
B16
GND
Ground
B17
TX10p
Transmitter Non-Inverted Data Input
CML-I
B18
TX10n
Transmitter Inverted Data Input
CML-I
B19
GND
Ground
B20
VCC3.3-TX
+3.3 V Power supply Transmitter
B21
Not used
Not used , 3.3 V only
Note:
1. Host shall use a pull up of 1.5 kohm – 10 kohm to Vcc3.3.
13
Avago Technologies Confidential
Logic
Notes
Pin
Signal Name
Signal Description
Logic
Notes
C1
GND
Ground
C2
RX1p
Receiver Non-Inverted Data Output
CML-O
C3
RX1n
Receiver Inverted Data Output
CML-O
C4
GND
Ground
C5
RX3p
Receiver Non-Inverted Data Output
CML-O
C6
RX3n
Receiver Inverted Data Output
CML-O
C7
GND
Ground
C8
RX5p
Receiver Non-Inverted Data Output
CML-O
C9
RX5n
Receiver Inverted Data Output
CML-O
C10
GND
Ground
C11
RX7p
Receiver Non-Inverted Data Output
CML-O
C12
RX7n
Receiver Inverted Data Output
CML-O
C13
GND
Ground
C14
RX9p
Receiver Non-Inverted Data Output
CML-O
C15
RX9n
Receiver Inverted Data Output
CML-O
C16
GND
Ground
C17
RX11p
Receiver Non-Inverted Data Output
CML-O
C18
RX11n
Receiver Inverted Data Output
CML-O
C19
GND
Ground
C20
PRSNT_L
Module Present
O
1
C21
Int_L/Reset_L
Interrupt / Reset
I/O
2
D1
GND
Ground
D2
RX0p
Receiver Non-Inverted Data Output
CML-O
D3
RX0n
Receiver Inverted Data Output
CML-O
D4
GND
Ground
D5
RX2p
Receiver Non-Inverted Data Output
CML-O
D6
RX2n
Receiver Inverted Data Output
CML-O
D7
GND
Ground
D8
RX4p
Receiver Non-Inverted Data Output
CML-O
D9
RX4n
Receiver Inverted Data Output
CML-O
D10
GND
Ground
D11
RX6p
Receiver Non-Inverted Data Output
CML-O
D12
RX6n
Receiver Inverted Data Output
CML-O
D13
GND
Ground
D14
RX8p
Receiver Non-Inverted Data Output
CML-O
D15
RX8n
Receiver Inverted Data Output
CML-O
D16
GND
Ground
D17
RX10p
Receiver Non-Inverted Data Output
CML-O
D18
RX10n
Receiver Inverted Data Output
CML-O
D19
GND
Ground
D20
VCC3.3-RX
+3.3 V Power supply receiver
D21
Not used
Not used , 3.3 V only
Notes:
1. Shorted directly to GND inside the module.
2. Int_L/Reset_L is a bidirectional contact. When driven from the host, it operates logically as a Reset signal (input). When driven from the module, it
operates logically as an Interrupt signal (output). Signal levels are per specified in Low Speed Logic section. Host shall use a pull up of 1.5 kohm – 10
kohm to Vcc3.3 for this pin.
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Avago Technologies Confidential
Control Interface
Int_L operation:
The control interface includes a bi-directional Int_L/
Reset_L interrupt/reset signal and two-wire serial – SCL
(clock) and SDA (data) signals to provide users rich functionality over an efficient and easily used interface. The
TWS interface is implemented as a slave device and compatible with industry standard two-wire serial protocol.
Signal and timing characteristics are further defined in
this section. In general, TWS bus timing and protocols
follow the implementation popularized in Atmel Two-wire
Serial EEPROMs.
When Int_L/Reset_L is pulled “Low” by the module for
longer than the minimum pulse width (tInt_L, PW-min) and
shorter than the maximum pulse width (tInt_L, PW-max) the
signal signifies an interrupt. When asserted “Low”, Int_L
indicates a possible module operational fault or a status
critical to the host system. The host identifies the cause
of the interrupt using the two-wire serial interface. Int_L
must operate in Pulse mode (as opposed to Static mode),
in order to distinguish a short Int_L signal from a longer
Reset_L signal, so the module must de-assert Int_L/
Reset_L after the interrupt has been signaled.
Low-Speed Electrical Contact Definitions
Reset_L operation:
SDA, SCL
SCL is the clock of the two-wire serial interface, and SDA is
the data for the two-wire interface. SCL and SDA must be
pulled up in the host through a pull-up resistor of value
appropriate to the overall bus capacitance and the rise
and fall time requirements as per “CXP two-wire Serial
Interface Timing Specifications” table.
The host supplied SCL input to the CXP transceiver is used
to positive-edge clock data into each CXP device and negative-edge clock data out of each device. CXP transceivers
operate only as slave devices. The host must provide a bus
master for SCL and initiate all read/write communication.
Since all CXP transceivers use the same two base
addresses, each CXP port requires its own SCL/SDA bus.
Support of multiple ports in a host requires multiple SCL/
SDA buses, or multiplexing circuitry such as a multiplexer
chip or a switch chip.
INT_L/RESET_L
Int_L/Reset_L is a bidirectional contact. When driven
from the host, it op­erates logically as a Reset signal.
When driven from the module, it oper­ates logically as an
Interrupt signal. In both cases, the signal is asserted low,
as indicated by the ’_L’ suffix. The Int_L/Reset_L signal
requires open collector outputs in both the host and
the module, and must be pulled up on the host board
with 1.5 kohm – 10 kohm resistor. The two uses are
distinguished by timing – a shorter assertion, driven by
the module indicates an interrupt and a longer assertion
of the signal driven by the host indicates a reset as per “I/O
Timing for Control and Status Functions” Table below.
15
When the Int_L/Reset_L signal is pulled “Low” by the
host for longer than the minimum reset pulse length
(tReset_L,PW-min), it ini­tiates a complete module reset,
returning all user module settings to their default state.
There is no maximum reset pulse length. Module Reset
Assert Time (t_init) starts on the rising edge after the
low level on the Reset_L signal is released. During the
execution of a reset (t_init) the host shall disregard all
status bits until the module indicates a completion of the
reset interrupt. The module indicates this by posting an
Int_L signal with the Data_Not_Ready bit (Memory Map,
Byte 2, bit 0) negated. Note that on power up (including
hot insertion) the module will post this completion of
reset interrupt without requiring a reset from the host.
PRSNT_L
PRSNT_L is used to indicate when the module it plugged
into the host re­ceptacle. PRSNT_L is pulled up to Vcc3.3
on the host board through > 50 kW and pulled down
directly to signal common (no re­sistor) in the module. The
PRSNT_L is asserted “Low” when inserted and deas­serted
“High” when the module is physically absent from the host
con­nector.
Avago Technologies Confidential
I/O Timing for Control and Status Functions
Parameter
Symbol
Initialization Time
tinit
Reset Pulse Width - Min.
treset_L,PW-min
Monitor Data Ready Time
tdata
Reset Assert Time
Int_L Assert Time
Interrupt Pulse Width - Min
tInt_L,PW-min
Interrupt Pulse Width - Max
tInt_L,PW-max
Int_L Deassert Time
Rx LOS Assert Time
Min
Max
Unit
Condition, and Notes
2000
ms
Note 1 2, 3
ms
Note 4
2000
ms
Note 5
tRSTL,OFF
2000
ms
Note 6
tInt_L,ON
200
ms
Note 7
μs
Note 8
50
μs
Note 9
tInt_L,OFF
100
ms
Note 10
tLOS,ON
100
ms
Note 11
Tx Fault Assert Time
tTxfault,ON
200
ms
Note 12
Flag Assert Time
tflag,ON
200
ms
Note 13
Mask Assert Time
tmask,OFF
100
ms
Note 14
Mask Deassert Time
tmask,ON
100
ms
Note 15
Select Change Time
tratesel
100
ms
Note 16
25
5
Notes:
1. Time from power on, hot plug or rising edge of reset until the module is fully functional.
2. Power on is defined as the instant when supply voltages reach and remain at or above the minimum level as specified in the power supply
specifications.
3. Fully functional is defined as Int_L asserted due to Data Not Ready (Byte 2, bit 0) deasserted. The module should meet the optical and electrical
specifications.
4. This is the minimum Reset_L pulse width required to reset a module. Assertion of Reset_L activates a complete module reset, i.e. module returns
to the factory default control settings. While Reset_L is low, the Tx and Rx outputs are disabled and the module does not response to the 2WS
serial interface.
5. Time from power on to Data Not Ready (Byte 2, bit 0) deasserted and Int_L asserted.
6. Time from rising edge on the Reset_L contact until the module is fully functional. During the Reset Time module will not respond to a “low” on the
Int_L/Reset_L signal.
7. Time from occurrence of condition triggering Int_L until Vout:Int_L = Vol.
8. Int_L operates in pulse mode. Static mode (Int_L stays low until reset by host) is not supported for Int_L.
9. Int_L pulse width must not exceed tInt_L,PW-max to distinguish Int_L from a Reset for other devices on bus.
10. Time from clear on read operation of associated flag until Int_L Status (Lower page, byte 2, bit 1) is cleared. This includes deassert times for Rx LOS,
Tx Fault and other flag bit. Measured from falling clock edge after stop bit of read transaction.
11. Time from Rx LOS state to Rx LOS bit set (value = 1b) and Int_L asserted.
12. Time from Tx Fault state to Tx Fault bit set (value = 1b) and Int_L asserted.
13. Time from occurrence of condition triggering flag to associated flag bit set (value = 1b) and Int_L asserted.
14. Time from mask bit set (value = 1b) until associated Int_L assertion is inhibited.
15. Time from mask bit cleared (value = 0b) until associated Int_L operation resumes.
16. Time from change of state of Application or Rate Select bit until transmitter or receiver bandwidth is in conformance with appropriate specification.
16
Avago Technologies Confidential
Low Speed Logic
Management signaling logic levels are based on Low Voltage CMOS operating at 3.3 V Vcc. Host shall use a pull-up
(1.5 kohm – 10 kohm) to Vcc3.3 for the Two-wire interface SCL (clock), SDA (address & data), and Int_L/Reset_L signals.
Low Speed Control and Sense Signal Specifications
Parameter
Symbol
Min
Max
Units
Condition
Module Input Voltage Low
Vil
-0.3
0.4
V
Module Input Voltage High
Vih
2.3
3.6
V
Pull-up to 3.3V.
Min Vih = 0.7*3.3V.
Module Output Voltage Low
Vol
-0.3
0.3
V
Condition IOL=3.0 mA. Pull-up to 3.3V.
Module Output Voltage High
Voh
2.8
3.6
V
Min Voh = 3.3V - 0.5V.
Module Output Current High
Ioh
-10
10
μA
-0.3 V < Voutput < 3.6 V
Capacitance of module on SCL, SDA
and Int_L/Reset_L I/O contacts
Ci,SCLSDA
36
pF
Allocate 28 pF for IC, 8 pF for module PCB
Capacitance of module on
Int_L/Reset_L I/O contact
Ci,INT_L
36
pF
Allocate 28 pF for IC, 8 pF for module PCB
Total bus capacitive load, SCL, SDA
and Int_L/Reset_L I/O pin
Cb
100
pF
3.0 kW Pullup resistor, max
200
pF
1.6 kW Pullup resistor, max
Management Interface Timing Specification
tR
tHIGH
tF
SCL
tLOW
tHD,STA
tHD,DAT
tSU,STA
tSU,DAT
t
tSU,STO
tR
tF
SDA
START
ReSTART
Figure 7. Two-wire Serial Interface Timing Diagram
17
Avago Technologies Confidential
STOP
CXP Two-Wire Serial Interface Timing Specifications
Parameter
Symbol
Min
Max
Unit
Clock Frequency
Clock Pulse Width Low
Condition
fSCL
0
400
kHz
tLOW
1.3
μs
Clock Pulse Width High
tHIGH
0.6
μs
Time bus free before new transmission can start
tBUF
20
μs
START Set-up Time
tSU,STA
0.6
μs
START Hold Time
tHD,STA
0.6
μs
Data Set-up Time
tSU,DAT
0.1
μs
Note 2
Data Hold Time
tHD,DAT
0
μs
Note 3
SDA and SCL rise time
tR,400
0.3
μs
Note 4
SDA and SCL fall time
tF,400
0.3
μs
Note 5
STOP Set-up Time
tSU,STO
Note 1
μs
0.6
Notes:
1. Between STOP & START and between ACK & ReSTART.
2. Data In Set Up Time is measured from Vil(max)SDA or Vih(min)SDA to Vil(max)SCL.
3. Data In Hold Time is measured from Vil(max)SCL to Vil(max)SDA or Vih(min)SDA.
4. Rise Time is measured from Vol(max)SDA to Voh(min)SDA.
5. Fall Time is measured from Voh(min)SDA to Vol(max)SDA.
Memory Specifications
Memory may be accessed in single-byte or multi-byte (up to 4 bytes) memory blocks. The largest multiple-byte contiguous write operation that a module shall handle is 4 bytes. The minimum size write block is 1 byte.
Memory Transaction Timing Specification
Parameter
Symbol
Serial Interface Clock Holdoff - “Clock Stretching”
T_clock_hold
Complete Single or Sequential Write
tWR
Endurance (Write cycles)
Min
50,000
Max
Unit
Condition
500
μs
Note 1
40
ms
Note 2
cycles
Note 3
75,000
Notes:
1. Maximum time the CXP module may hold the SCL line low before continuing with a read or write operation.
2. Complete up to 4 Byte write. Timing should start from Stop bit at the end of the sequential write operation and continue until the module responds
to another operation.
3. 50 K write cycles at 70°C.
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Avago Technologies Confidential
I/O Timing for Squelch and Disable
Parameter
Symbol
Rx Squelch Assert Time
Rx Squelch Deassert Time
Min
Max
Unit
Condition and Notes
tRxsq,ON
0.080
ms
Note 1
tRxsq,OFF
0.080
ms
Note 2
Tx Squelch Assert Time
tTxsq,ON
400
ms
Note 3
Tx Squelch Deassert Time
tTxsq,OFF
400
ms
Note 4
Tx Disable Assert Time
tTxdis,ON
100
ms
Note 5
Tx Disable Deassert Time
tTxdis,OFF
400
ms
Note 6
Rx Output Disable Assert Time
tRxdis,ON
100
ms
Note 7
Rx Output Disable Deassert Time
tRxdis,OFF
100
ms
Note 8
Squelch Disable Assert Time
tSqdis,ON
100
ms
Note 9
Squelch Disable Deassert Time
tSqdis,OFF
100
ms
Note 10
Notes:
1. Time from loss of Rx input signal until the squelched output condition is reached.
2. Time from resumption of Rx input signals until normal Rx output condition is reached.
3. Time from loss of Tx input signal until the squelched output condition is reached.
4. Time from resumption of Tx input signals until normal Tx output condition is reached.
5. Time from Tx Disable bit set (value = 1b) until optical output falls below 10% of nominal.
6. Time from Tx Disable bit cleared (value = 0b) until optical output rises above 90% of nominal. Measured from Stop bit low-to-high SDA transition.
7. Time from Rx Output Disable bit set (value = 1b) until Rx output falls below 10% of nominal.
8. Time from Rx Output Disable bit cleared (value = 0b) until Rx output rises above 90% of nominal.
9. This applies to Rx and Tx Squelch and is the time from bit set (value = 1b) until squelch functionality is disabled.
10. This applies to Rx and Tx Squelch and is the time from bit cleared (value = 0b) until squelch functionality is enabled.
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Avago Technologies Confidential
Memory Map
Tx Lower Page (1010 000x) – Required
Tx Upper Page 01h (Optional)
Byte
Type
Functions
Byte
Type
Functions
0-6
RO
Tx Status: 0xA8 Presence, Flat/ Paging Memory
Presence, Interrupt, Data Not Ready, Loss of
Signal, Fault, Summary of Alarms
128-167
RO
Module Alarm Threshold Settings
168-179
RO
Channel Alarm Threshold Settings
180-181
RO
Checksum
182-229
RO
Per-Channel Monitors: Tx Bias
Current and Light Output
7-18
RO
Latched Tx Alarms: Loss of Signal, Fault, Perchannel Alarms (Power or Current High/Low),
Device Alarms (Temp, Vcc3.3 or Vcc12)
22-27
RO
Module Monitors: Temp, Voltage
38-39
RO
Module Monitors: Elapsed Operating Time
40-41
RW
Module Control: Rate/Application Select
51
RW
Module Control: Tx Reset
Byte
Type
Functions
52-67
RW
Tx Channel Control: Disables, Squelch, Polarity
Flip, Margin, Equalization Control
128-129
RO
Identifiers
130-146
RO
Device Description: Cable & Connector, Power Supplies, Max Case
Temp, Min-Max Signal Rate, Laser
Wavelength or Copper Attenuation, and Supported Functions
230-255
Reserved – Vendor-Specific Tx
Functions
Upper Page 00h (identical for Tx & Rx) Required
95-106
RW
Masks for Alarms: Channel (LOS, Fault),
Channel Internal (Power or Current High/Low)
and Module (Temp, Voltage)
110-118
RW
Vendor Specific Area – Read/Write
119-126
RW
Password
147
RO
Description: Device Technology
127
RW
Upper Page Select Byte (00h or 01h or 02h)
152-222
RO
Vendor Information: Name &
OUI, PN & PN rev, Serial Number,
Data Code, & Customer-specific
Information
223
RO
Checksum on 128-222
224-255
RO
Vendor Specific Area – Read-only
Rx Lower Page (1010 100x) – Optional
Byte
Type
Functions
0-6
RO
Rx Status: Flat/ Paging Memory, Interrupt, Data
Not Ready, Loss of Signal, Fault, Summary of
Alarms
7-18
RO
Latched Rx Alarms: Loss of Signal, Fault, Perchannel Alarms (Power or Current High/Low),
Device Alarms (Temp, Vcc3.3 or Vcc12)
22-27
RO
Module Monitors: Temp, Voltage
38-39
RO
Module Monitors: Elapsed Operating Time
40-41
RW
Module Control: Rate/Application Select
51
RW
Module Control: Rx Reset
52-73
RW
95-106
RW
Type
Functions
128-247
RW
User Writable EEPROM (120 B)
248-255
Reserved - Vendor Specific (8 B)
Rx Upper Page 01h (Optional)
Rx Channel Control: Disables, Squelch, Polarity
Flip, Margin, Amplitude, Pre-emphasis Control
Byte
Type
Functions
128-167
RO
Module Alarm Threshold Settings
Masks for Alarms: Channel (LOS, Fault),
Channel Internal (Power High/Low) and
Module (Temp, Voltage)
168-179
RO
Channel Alarm Threshold Settings
180-181
RO
Checksum
206-229
RO
Per-Channel Monitors: Rx Input
Power
110-118
RW
Vendor Specific Area – Read/Write
119-126
RW
Password
127
RW
Upper Page Select Byte (00h or 01h or 02h)
20
Tx and/or Rx Upper Page 02h (Optional)
Byte
230-255
Avago Technologies Confidential
Reserved – Vendor-Specific Rx
Functions
Digital Monitoring Interface
Through TWS interface, the host can fetch the monitoring data as summarized in the previous section.
The following table summarizes the function and the specifications.
Digital Monitoring Specifications
Tolerance
DMI Range*
Alarm Setting
max
min
max
min
max
Comment
+0.1
3.135
3.465
2.94
3.63
Test point at module MEG-Array connector
-5
+5
0
70
-5
75
Case temperature
mA
-1
+1
0
11
0.5
10
Note 1
TX Light
Output Power
dB/dBm
-3
+3
-9
+2.4
-11.6
+5.4
at TP2
RX Light Input
Power
dB/dBm
-3
+3
-10
+2.4
-13.5
+3.4
at TP3
DMI on-time
%
-10
+10
Monitor
Parameter
Unit
min
Vcc33
volt
-0.1
Temperature
C
TX Bias
current
*
Within DMI range, the tolerance is guaranteed. The modules still reports data if the operating condition is out of the DMI range, but the tolerance
is not guaranteed.
Note
1. TX bias DMI report accuracy not guaranteed when TX squelch is disabled, and LOS is asserted, i.e. no valid electrical inputs into TX.
Connector Orientation for 24 fiber MTP/MPO connector
Fiber 12
Rx11
Recommended Power Supply Filter
Fiber 1
Rx0
CXP Module
1 µH
Vcc3.3-Rx
10 µF
Vcc_host = 3.3 V
0.1 µF
GND
1 µH
Fiber 24
Tx11
Vcc3.3-Tx
Fiber 13
Tx0
10 µF
0.1 µF
10 µF
Figure 8. 24-fiber MPO Receptacle
Optical cables with 24-fiber MPO-style connectors on each
end shall be built “Key up/Key down” so that the helix halftwist incurred when the cable is lugged into transceivers
will correctly connect transmitter lanes to receiver lanes:
lanes 0 to 0 and 11 to 11. MPO-style ‘male” alignment
pins are used in the receptacle and a “female” MPO-style
connector shall be used on the cable connector.
21
Figure 9. Recommended Power Supply Filter
Avago Technologies Confidential
0.1 µF
GND
Mechanical Dimensions, Package Outline
112
34.93
28.45
67.92
19.21
21.2
23.9
48.62
13.73
9.81
7.69
23.9
4.6
All dimensions in millimeters
Figure 10. Transceiver package dimensions
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Avago Technologies Confidential
Host Board Connector
Figure 11. CXP host board connector dimensions (part 1 of 2)
ID
Description
Dim.
Tol. (±)
ID
AD01 Latch Hole Length
2.00
0.10
AD02 Latch Hole from Face
0.97
0.05
AD03 Latch Hole Width
1.50
AD04 Datum to Latch Hole
5.40
AD05 Latch Hole to Hole
Dim.
Tol. (±)
AD09 Shell Height
11.88
0.13
AD10 Locating Post Centerline to Centerline of Receptacle Co
0.05
0.05
0.10
AD11 Locating Post to EMI Shell Base
18.06
0.13
0.10
AD12 Locating Post to Face
25.06
0.08
10.80 0.05
AD13 PCB to Lower Card Slot Centerline
3.75
0.10
AD06 Shell Width
25.05 0.25
AD14 Lower Card Slot to Upper Card Slot
Centerline
4.50
0.10
AD07 Shell Width at screw attach features
27.00 0.25
AD15 Card Slot Rib to Rib
17.18
0.10
AD08 EMI Shell Base to Back
46.22 0.25
AD16 Peg Centerline to Peg Centerline
24.00
0.08
23
Description
Avago Technologies Confidential
Host Board Connector (con't)
AE01
AE12
AE11
AE10
AE02
AK
AE03
AE04
AE09
0.10 AG AH AK
AE08
AE07
AG
AE06
0.10 AG AH AK
AE05
Figure 12. CXP host board connector dimensions (part 2 of 2)
ID
Description
Dim.
Tol. (±)
ID
Dim.
Tol. (±)
AE01
Orientation Key Location
1.63
0.13
AE07 Snout Height
11.70
0.08
AE02
Orientation Key Location, Depth
20.75
Basic
AE08 Snout Opening Height
10.20
0.05
AE03
Card Slot Height
1.18
0.05
AE09 Receptacle Body Height
8.00
0.08
AE04
Datum to Bottom of Receptacle
Housing
2.09
0.10
AE10 Receptacle Body Width
19.94
0.08
AE05
Snout Opening Width
21.60
0.05
AE11 Card Slot Width
18.20
0.05
AE06
Snout Width
23.10
0.08
AE12 Orientation Key Width
1.25
0.13
24
Description
Avago Technologies Confidential
Host PCB Footprint
Figure 13. CXP host board connector footprint
ID
Description
Dim.
Tol. (±)
ID
Description
Dim.
AK01
Locating Hole to Locating Hole
24.00
0.05
AK07
First to Last Column
16.00 Basic
AK02
Locating Hole to First Row of Signal
Holes
0.20
Basic
AK08
Contact Hole Diameter (Finished
PTH)
0.37
0.05
AK03
First Row to Second Row of Signal
Holes
0.70
Basic
AK09
Row A to Row B
4.00
Basic
AK04
First Row to Third Row of Signal Holes 1.40
Basic
AK10
Row A to Row C
8.00
Basic
AK05
Column to Column Pitch
1.60
Basic
AK11
Row A to Row D
12.00 Basic
AK06
Column to Column Pitch
0.80
Basic
AK12
Locating Hole Diameter (Finished
PTH)
2.20
25
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Tol. (±)
0.05
CXP Cage and Bezel
AJ01
Figure 14. CXP cage-to-bezel dimensions
ID
Description
Dim.
Tol. (±)
ID
Description
Dim.
Tol. (±)
AJ01
Centerline of Receptacle Contacts to
Base of EMI Shell
19.66
Basic
AJ02
-
-
-
Bezel Opening
Figure 15. CXP bezel opening dimensions
ID
Description
Dim.
Tol. (±)
ID
Description
Dim.
Tol. (±)
AH01
Cutout Height
12.10
Basic
AH03
Bottom of Cutout to Peg
0.28
Basic
AH02
Cutout Length
23.50
Basic
AH04
-
-
-
Heat Sink interface and Case Temperature Measurement point on the Connector Plug
Case Temperature Measurement Point
Figure 16. Case Temperature Measurement point
26
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Insertion, Extraction and Retention Forces for the CXP Transceiver
Symbol
Parameter
Min
Max
Unit
Comments
Fi
Fw
CXP module insertion force
150
N
EIA 364-13
CXP module extraction
50
N
EIA 364-13
Fr
CXP module retention
90
170
N
Load pull, per EIA 364-38A
No damage to transceiver below 90N
Frcl
Cage retention (latch strength)
180
N
No damage to latch below 180N
Frhb
Cage retention in host board
114
N
Force to be applied in a vertical direction,
no damage to cage
Nhc
Insertion / removal cycles,
connector/receptacle
100
Cycles
Number of cycles for the connector and
receptacle with multiple transceivers
Nx
Insertion / removal cycles,
CXP module
50
Cycles
Number of cycles for an individual module
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2013 Avago Technologies. All rights reserved.
AV02-3753EN - October 14, 2013
Avago Technologies Confidential
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