Diodes DMTH4005SK3Q N-channel enhancement mode mosfet Datasheet

DMTH4005SK3Q
Green
40V +175°C N-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
Features
BVDSS
RDS(ON) Max
ID
TC = +25°C
40V
4.5mΩ @ VGS = 10V
95A








Rated to +175°C – Ideal for High Ambient Temperature
Environments
100% Unclamped Inductive Switching – Ensures More Reliable
and Robust End Application
Low RDS(ON) – Minimizes Power Losses
Low Qg – Minimizes Switching Losses
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
PPAP Capable (Note 4)
Description and Applications
Mechanical Data
This MOSFET has been designed to meet the stringent requirements
of Automotive applications. It is qualified to AEC-Q101, supported by
a PPAP and is ideal for use in:








Engine Management Systems
Body Control Electronics
DC-DC Converters

Case: TO252 (DPAK)
Case Material: Molded Plastic, “Green” Molding Compound. UL
Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections: See Diagram
Terminals: Finish – Matte Tin Annealed over Copper Leadframe.
Solderable per MIL-STD-202, Method 208
Weight: 0.33 grams (Approximate)
D
D
TO252 (DPAK)
G
D
G
S
Top View
Pin Out
Top View
S
Internal Schematic
Ordering Information (Note 5)
Part Number
DMTH4005SK3Q-13
Notes:
Case
TO252 (DPAK)
Packaging
2,500/Tape & Reel
1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. Automotive products are AEC-Q101 qualified and are PPAP capable. Refer to http://www.diodes.com/product_compliance_definitions.html.
5. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
H4005S
YYWW
DMTH4005SK3Q
Document number: DS38661 Rev. 2 - 2
= Manufacturer’s Marking
H4005S = Product Type Marking Code
YYWW = Date Code Marking
YY = Last Two Digits of Year (ex: 16 = 2016)
WW = Week Code (01 to 53)
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DMTH4005SK3Q
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
VDSS
VGSS
Drain-Source Voltage
Gate-Source Voltage
TC = +25°C
(Note 10)
TC = +100°C
Continuous Drain Current (Note 7)
Maximum Body Diode Forward Current (Note 7)
Pulsed Drain Current (10µs Pulse, Duty Cycle = 1%)
Avalanche Current, L=0.1mH
Avalanche Energy, L=0.1mH
Value
40
±20
Units
V
V
95
ID
A
IS
IDM
IAS
EAS
73
83
150
32.5
52.8
A
A
A
mJ
Symbol
PD
RθJA
PD
RθJC
TJ, TSTG
Value
2.1
38
100
1.5
-55 to +175
Units
W
°C/W
W
°C/W
°C
TC = +25C
Thermal Characteristics
Characteristic
Total Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient (Note 6)
Total Power Dissipation (Note 7)
Thermal Resistance, Junction to Case (Note 7)
Operating and Storage Temperature Range
Electrical Characteristics
TC = +25°C
(@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 8)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
ON CHARACTERISTICS (Note 8)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 9)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Notes:
TA = +25°C
Symbol
Min
Typ
Max
Unit
BVDSS
IDSS
IGSS
40






1
±100
V
µA
nA
VGS = 0V, ID = 1mA
VDS = 32V, VGS = 0V
VGS = ±20V, VDS = 0V
VGS(TH)
RDS(ON)
VSD
2



3.6
0.9
4
4.5

V
mΩ
V
VDS = VGS, ID = 250µA
VGS = 10V, ID = 50A
VGS = 0V, IS = 50A
Ciss
Coss
Crss
RG
Qg
Qgs
Qgd
tD(ON)
tR
tD(OFF)
tF
tRR
QRR













3,062
902.2
179.2
0.67
49.1
10.3
13
8.7
6.8
18.6
7.3
31.8
26.5













pF
VDS = 20V, VGS = 0V,
f = 1MHz
Ω
VDS = 0V, VGS = 0V, f = 1MHz
nC
Test Condition
VDD = 20V, ID = 50A,
ns
VDD = 20V, VGS = 10V,
ID = 50A, RG = 3Ω
ns
nC
IF = 50A, di/dt = 100A/μs
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper pad layout.
7. Thermal resistance from junction to soldering point (on the exposed drain pad).
8. Short duration pulse test used to minimize self-heating effect.
9. Guaranteed by design. Not subject to production testing.
10. Package limited.
DMTH4005SK3Q
Document number: DS38661 Rev. 2 - 2
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DMTH4005SK3Q
50.0
20
VGS = 10.0V
40.0
VGS = 5.0V
VGS=4.5V
35.0
30.0
25.0
20.0
15.0
VGS = 4.0V
16
14
12
10
8
5.0
85℃
6
175℃
25℃
2
VGS = 3.5V
-55℃
0
0.0
0.5
1
1.5 2 2.5 3 3.5 4 4.5
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 1. Typical Output Characteristic
6.00
5.00
4.00
VGS = 10.0V
3.00
2.00
1.00
0.00
0
5
10
15
20
25
30
35
40
45
0
5
50
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (mΩ)
0
1
2
3
4
VGS, GATE-SOURCE VOLTAGE (V)
Figure 2. Typical Transfer Characteristic
5
20
18
16
14
12
10
8
6
ID = 50A
4
2
0
2
ID, DRAIN-SOURCE CURRENT (A)
Figure 3. Typical On-Resistance vs. Drain Current and
Gate Voltage
4
6
8
10
12
14
16
18
20
VGS, GATE-SOURCE VOLTAGE (V)
Figure 4. Typical Transfer Characteristic
0.008
2.2
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(NORMALIZED)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
125℃
150℃
4
10.0
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (mΩ)
VDS = 5.0V
18
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
45.0
VGS = 10V
0.007
150℃
175℃
0.006
0.005
125℃
0.004
85℃
0.003
25℃
-55℃
0.002
0.001
0
10
20
30
40
50 60
70
80 90 100
ID, DRAIN CURRENT (A)
Figure 5. Typical On-Resistance vs. Drain Current and
Temperature
DMTH4005SK3Q
Document number: DS38661 Rev. 2 - 2
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2
1.8
1.6
1.4
1.2
1
0.8
VGS = 10V, ID = 50A
0.6
0.4
-50
-25
0
25
50
75 100 125 150 175
TJ, JUNCTION TEMPERATURE (℃)
Figure 6. On-Resistance Variation with Temperature
August 2016
© Diodes Incorporated
0.008
VGS(TH), GATE THRESHOLD VOLTAGE (V)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
DMTH4005SK3Q
0.006
0.004
VGS = 10V, ID = 50A
0.002
0
-50
-25
3.5
3
ID = 1mA
2.5
2
ID = 250μA
1.5
1
0.5
0
0
25
50
75 100 125 150 175
TJ, JUNCTION TEMPERATURE (℃)
-50
0
25
50
75 100 125 150 175
TJ, JUNCTION TEMPERATURE (℃)
Figure 8. Gate Threshold Variation vs. Temperature
Figure 7. On-Resistance Variation with Temperature
100
10000
90
f = 1MHz
VGS = 0V
CT, JUNCTION CAPACITANCE (pF)
IS, SOURCE CURRENT (A)
-25
80
70
60
50
TA = 85oC
40
TA = 125oC
30
TA = 150oC
20
TA = 150oC
10
TA = 25oC
Ciss
1000
Coss
Crss
100
TA = -55oC
10
0
0
0.3
0.6
0.9
VSD, SOURCE-DRAIN VOLTAGE (V)
0
1.2
5
10
15
20
25
30
35
VDS, DRAIN-SOURCE VOLTAGE (V)
40
Figure 10. Typical Junction Capacitance
Figure 9. Diode Forward Voltage vs. Current
10
1000
RDS(ON) Limited
PW =10µs
PW =1µs
ID, DRAIN CURRENT (A)
VGS (V)
8
6
4
VDS = 20V, ID = 50A
2
100
PW =100µs
10
PW =1ms
PW =10ms
PW =100ms
1
TJ(Max) = 175℃ TC = 25℃
Single Pulse
DUT on Infinite Heatsink
VGS= 10V
PW =1s
0.1
0
0
10
20
30
Qg (nC)
40
50
Document number: DS38661 Rev. 2 - 2
1
10
100
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 12. SOA, Safe Operation Area
Figure 11. Gate Charge
DMTH4005SK3Q
0.1
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DMTH4005SK3Q
r(t), TRANSIENT THERMAL RESISTANCE
1
D=0.7
D=0.5
D=0.3
0.1
D=0.9
D=0.1
D=0.05
D=0.02
0.01
D=0.01
RθJC(t) = r(t) * RθJC
RθJC = 1.5℃/W
Duty Cycle, D = t1 / t2
D=0.005
D=Single Pulse
0.001
1E-06
1E-05
0.0001
0.001
0.01
0.1
1
10
t1, PULSE DURATION TIME (sec)
Figure 13. Transient Thermal Resistance
DMTH4005SK3Q
Document number: DS38661 Rev. 2 - 2
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DMTH4005SK3Q
Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
TO252 (DPAK)
E
A
b3
7° ± 1°
c
L3
D
A2
L4
e
H
b(3x)
b2(2x)
Gauge Plane
0.508
D1
E1
Seating Plane
a
L
A1
2.74REF
TO252 (DPAK)
Dim Min Max Typ
A 2.19 2.39 2.29
A1 0.00 0.13 0.08
A2 0.97 1.17 1.07
b 0.64 0.88 0.783
b2 0.76 1.14 0.95
b3 5.21 5.46 5.33
c
0.45 0.58 0.531
D 6.00 6.20 6.10
D1 5.21
e
2.286
E 6.45 6.70 6.58
E1 4.32
H 9.40 10.41 9.91
L 1.40 1.78 1.59
L3 0.88 1.27 1.08
L4 0.64 1.02 0.83
a
0°
10°
All Dimensions in mm
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
TO252 (DPAK)
X1
Dimensions
C
X
X1
Y
Y1
Y2
Y1
Y2
Value (in mm)
4.572
1.060
5.632
2.600
5.700
10.700
C
Y
X
DMTH4005SK3Q
Document number: DS38661 Rev. 2 - 2
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DMTH4005SK3Q
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INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
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Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
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failure of the life support device or to affect its safety or effectiveness.
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representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2016, Diodes Incorporated
www.diodes.com
DMTH4005SK3Q
Document number: DS38661 Rev. 2 - 2
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