STMicroelectronics L9953LXP Door actuator driver Datasheet

L9953LXP
Door actuator driver
Features
■
Three half bridges for 0.75A loads
(RDSon=1600mΩ)
■
Two configurable high side driver for up to 1.5A
load (RDSon=500mΩ) or 0.35A load
(Ron=1800mΩ)
■
One full bridge for 6A load (Ron=150mΩ)
■
One highside driver for 6A load (Ron=100mΩ)
■
Programmable soft start function to drive loads
with higher inrush currents (i.e. current >6A,
>1.5A)
■
Very low current consumption in standby mode
(IS < 6µA typ; Tj ≤ 85 °C)
■
All outputs short circuit protected
■
Current monitor output for highside OUT1,
OUT4, OUT5 and OUT8
■
All outputs over temperature protected
■
Open-load diagnostic for all outputs
■
Overload diagnostic for all outputs
■
Separated half bridges for door lock motor
■
PWM control of all outputs
■
Charge pump output for reverse polarity
protection
Table 1.
PowerSSO-36
Applications
■
Door actuator driver with bridges for door lock,
mirror axis control, mirror fold and highside
driver for mirror defroster and two 10W-light
bulbs and/or LEDs.
Description
The L9953LXP is a microcontroller driven
multifunctional door actuator driver for automotive
applications. Up to three DC motors and three
grounded resistive loads can be driven with five
half bridges and three highside drivers. The
integrated standard serial peripheral interface
(SPI) controls all operation modes (forward,
reverse, brake and high impedance). All
diagnostic informations are available via SPI.
Device summary
Order codes
Package
PowerSSO-36
September 2013
Tube
Tape and reel
L9953LXP
L9953LXPTR
Doc ID 16185 Rev 3
1/35
www.st.com
1
Contents
L9953LXP
Contents
1
Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2
Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3
4
2/35
2.1
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.2
ESD protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.3
Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.4
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.5
SPI - electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.1
Dual power supply: VS and VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.2
Standby mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.3
Inductive loads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.4
Diagnostic functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.5
Overvoltage and under voltage detection . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.6
Charge pump . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.7
Temperature warning and thermal shutdown . . . . . . . . . . . . . . . . . . . . . . 21
3.8
Open-load detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.9
Over load detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.10
Current monitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3.11
PWM inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3.12
Cross-current protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3.13
Programmable soft start function to drive loads with higher inrush current
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Functional description of the SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
4.1
Serial Peripheral Interface (SPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
4.2
Chip Select Not (CSN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
4.3
Serial Data In (DI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
4.4
Serial Data Out (DO) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
4.5
Serial clock (CLK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
4.6
Input data register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Doc ID 16185 Rev 3
L9953LXP
Contents
4.7
Status register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
4.8
SPI - input data and status registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
5
Packages thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
6
Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
7
6.1
ECOPACK® packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
6.2
PowerSSO-36 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
6.3
PowerSSO-36 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Doc ID 16185 Rev 3
3/35
List of tables
L9953LXP
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
Table 19.
Table 20.
Table 21.
4/35
Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pin definitions and functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
ESD protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Operating junction temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Temperature warning and thermal shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Overvoltage and under voltage detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Current monitor output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Charge pump output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
OUT1 - OUT8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Delay time from standby to active mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Inputs: CSN, CLK, PWM1/2 and DI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
DI timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
DO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
DO timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
CSN timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
SPI - input data and status registers 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
SPI - input data and status registers 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
PowerSSO-36 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Doc ID 16185 Rev 3
L9953LXP
List of figures
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
SPI - transfer timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
SPI - input timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
SPI - DO valid data delay time and valid time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
SPI - DO enable and disable time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
SPI - driver turn on / off timing, minimum CSN hi time . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
SPI - timing of status bit 0 (fault condition) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Programmable soft start function for inductive loads and incandescent bulbs . . . . . . . . . . 23
Packages thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
PowerSSO-36 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
PowerSSO-36 tube shipment (no suffix). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
PowerSSO-36 tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Doc ID 16185 Rev 3
5/35
Block diagram and pin description
1
L9953LXP
Block diagram and pin description
Figure 1.
Block diagram
VBAT
Reverse Polarity
Protection
* Note: Value of capacitor has to be choosen carefully to limit the VS voltage below absolute
maximum ratings in case of an unexpected freewheeling condition (e.g. TSD, POR)
100k
*
VS
10k
100µF
OUT1
Charge
Pump
VCC
** 1k
** 1k
** 1k
** 1k
DI
DO
CLK
CSN
**1k
PWM1
SPI
Interface
VCC
Driver Interface & Diagnostic
OUT2
OUT3
OUT4
OUT5
OUT7
OUT8
PWM2 / CM
MUX
M
Mirror Vertical
M
Mirror Horizontal
M
Lock / Folder
OUT6
µC
**1k
Mirror Common
Programmable
Bulb (10W) or
LED Mode
Defroster
4
GND
** Note: Resistors between µC and L9953LXP are recommended to limit currents
for negative voltage transients at VBAT (e.g. ISO type 1 pulse)
Table 2.
Pin definitions and functions
Pin
1, 18, 19, 36
2, 35
6/35
Symbol
Function
GND
Ground:
reference potential.
Important: for the capability of driving the full current at the outputs all
pins of GND must be externally connected.
OUT8
Highside-driver-output 8
The output is built by a highside switch and is intended for resistive
loads, hence the internal reverse diode from GND to the output is
missing. For ESD reason a diode to GND is present but the energy
which can be dissipated is limited. The highside driver is a power
DMOS transistor with an internal parasitic reverse diode from the
output to VS (bulk-drain-diode). The output is over-current and openload protected.
Important: for the capability of driving the full current at the outputs both
pins of OUT8 must be externally connected.
Doc ID 16185 Rev 3
L9953LXP
Block diagram and pin description
Table 2.
Pin definitions and functions (continued)
Pin
3
4
5
6, 7, 14, 15,
23, 25, 28, 32
8
9
Symbol
Function
OUT1
OUT2
OUT3
Half-bridge-output 1,2,3
The output is built by a highside and a lowside switch, which are
internally connected. The output stage of both switches is a power
DMOS transistor. Each driver has an internal parasitic reverse diode
(bulk-drain-diode: highside driver from output to VS, lowside driver
from GND to output). This output is over-current and open-load
protected.
VS
Power supply voltage (external reverse protection required)
For this input a ceramic capacitor as close as possible to GND is
recommended.
Important: for the capability of driving the full current at the outputs all
pins of VS must be externally connected.
DI
Serial data input
The input requires CMOS logic levels and receives serial data from the
microcontroller. The data is an 24bit control word and the least
significant bit (LSB, bit 0) is transferred first.
Current monitor output/PWM2 input
Depending on the selected multiplexer bits of input data register this
output sources an image of the instant current through the
CM/PWM2
corresponding highside driver with a ratio of 1/10.000. This pin is
bidirectional. The microcontroller can overdrive the current monitor
signal to provide a second PWM input for the output OUT7.
CSN
Chip select not input / test mode
This input is low active and requires CMOS logic levels. The serial data
transfer between L9953LXP and micro controller is enabled by pulling
the input CSN to low level. If an input voltage of more than 7.5V is
applied to CSN pin the L9953LXP will be switched into a test mode.
11
DO
Serial data output
The diagnosis data is available via the SPI and this 3-state output. The
output will remain in 3-state, if the chip is not selected by the input CSN
(CSN = high)
12
VCC
Logic supply voltage
For this input a ceramic capacitor as close as possible to GND is
recommended.
13
CLK
Serial clock input
This input controls the internal shift register of the SPI and requires
CMOS logic levels.
16, 17, 20, 21
OUT4
OUT5
26
CP
27
PWM1
10
Half-bridge-output 4,5: → see OUT1 (pin 3).
Important: for the capability of driving the full current at the outputs both
pins of OUT4 (OUT5, respectively) must be externally connected.
Charge pump output
This output is provided to drive the gate of an external n-channel
PowerMOS used for reverse polarity protection
PWM1 input:
This input signal can be used to control the drivers OUT1-OUT6 and
OUT8 by an external PWM signal.
Doc ID 16185 Rev 3
7/35
Block diagram and pin description
Table 2.
L9953LXP
Pin definitions and functions (continued)
Pin
Symbol
Function
31
33
OUT6,
OUT7
Highside-driver-output 6,7:
Each output is built by a highside switch and is intended for resistive
loads, hence the internal reverse diode from GND to the output is
missing. For ESD reason a diode to GND is present but the energy
which can be dissipated is limited. Each highside driver is a power
DMOS transistor with an internal parasitic reverse diode from each
output to VS (bulk-drain-diode). Each output is over-current and openload protected.
22, 24, 29,
30, 34
NC
Figure 2.
Not connected pins.
Configuration diagram (top view)
GND 1
36 GND
OUT8 2
35 OUT8
OUT1 3
34 NC
OUT2 4
OUT3 5
33 OUT7
32 Vs
Vs 6
31 OUT6
Vs 7
DI 8
30 NC
CM / PWM2 9
29 NC
PowerSSO-36
DO 11
26 CP
Vcc 12
CLK 13
25 Vs
Vs 14
23 Vs
Vs 15
22 NC
24 NC
21 OUT5
OUT4 16
OUT4 17
GND 18
8/35
28 Vs
27 PWM1
CSN 10
20 OUT5
19 GND
Doc ID 16185 Rev 3
L9953LXP
Electrical specifications
2
Electrical specifications
2.1
Absolute maximum ratings
Stressing the device above the rating listed in the “Absolute maximum ratings” table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the Operating sections of
this specification is not implied. Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics SURE
Program and other relevant quality document
Table 3.
Absolute maximum ratings
Symbol
Parameter
Value
Unit
-0.3 to28
V
40
V
-0.3 to 5.5
V
Digital input / output voltage
-0.3 to VCC + 0.3
V
VCM
Current monitor output
-0.3 to VCC + 0.3
V
VCP
Charge pump output
-25 to VS + 11
V
DC supply voltage
VS
VCC
VDI, VDO, VCLK,
VCSN, Vpwm1
2.2
Single pulse tmax < 400ms
Stabilized supply voltage, logic supply
IOUT1,2,3,6,7
Output current
±5
A
IOUT4,5,8
Output current
±10
A
ESD protection
Table 4.
ESD protection
Parameter
All pins
Value
Unit
± 2(1)
kV
8(2)
kV
±
Output pins: OUT1 - OUT8
1. HBM according to MIL 883C, Method 3015.7 or EIA/JESD22-A114-A.
2. HBM with all unzapped pins grounded.
2.3
Thermal data
Table 5.
Symbol
Tj
Operating junction temperature
Parameter
Operating junction temperature
Doc ID 16185 Rev 3
Value
Unit
-40 to 150
°C
9/35
Electrical specifications
Table 6.
L9953LXP
Temperature warning and thermal shutdown
Symbol
2.4
Parameter
Min.
TjTW On
Temperature warning threshold junction
temperature
TjSD On
Thermal shutdown threshold junction
temperature
Tj
increasing
TjSD Off
Thermal shutdown threshold junction
temperature
Tj
decreasing
TjSD Hys
Thermal shutdown hysteresis
Tj
Typ.
130
Max.
Unit
150
°C
170
°C
150
°C
5
°K
Electrical characteristics
VS = 8 to 16V, VCC = 4.5 to 5.3V, Tj = - 40 to 150°C, unless otherwise specified.
The voltages are referred to GND and currents are assumed positive, when the current
flows into the pin.
Table 7.
Symbol
VS
Supply
Parameter
Test condition
Operating supply voltage
range
7
Unit
28
V
20
mA
VS = 16V, VCC = 0V
standby mode
OUT1 - OUT8 floating
Ttest = -40°C, 25°C
4
12
µA
Ttest = 85°C(1)
6
25
µA
VCC DC supply current
VS = 16V, VCC = 5.3V
CSN = VCC , active mode
1
3
mA
VCC quiescent supply
current
VS = 16V, VCC = 5.3V
CSN = VCC standby mode
OUT1 - OUT8 floating
25
50
µA
Sum quiescent supply
current
VS = 16V, VCC = 5.3V
CSN = VCC
standby mode
OUT1 - OUT8 floating
Ttest = 130°C
50
200
µA
VS quiescent supply current
1. Guaranteed by design.
10/35
Max.
7
IS
IS + ICC
Typ.
VS = 16V, VCC = 5.3V
active mode
OUT1 - OUT8 floating
VS DC supply current
ICC
Min.
Doc ID 16185 Rev 3
L9953LXP
Electrical specifications
Table 8.
Symbol
Overvoltage and under voltage detection
Parameter
Test condition
Min.
Typ.
Max
Unit
VSUV On VS UV-threshold voltage
VS increasing
5.7
7.2
V
VSUV Off VS UV-threshold voltage
VS decreasing
5.5
6.9
V
VSUV Hyst VS UV-hysteresis
VSUV On - VSUV Off
VSOV Off VS OV-threshold voltage
VS increasing
18
24.5
V
VSOV On VS OV-threshold voltage
VS decreasing
17.5
23.5
V
VSOV Hyst VS OV-hysteresis
VSOV Off - VSOV On
VPOR Off Power-on reset threshold
VCC increasing
VPOR On Power-on reset threshold
VCC decreasing
VPOR Hyst Power-on reset hysteresis
VPOR Off - VPOR On
Table 9.
Symbol
VCM
ICM,r
Symbol
VCP
ICP
V
1
V
4.4
3.1
V
V
0.3
V
Current monitor output
Parameter
Test condition
Functional voltage range
Current monitor output
ratio:
ICM / IOUT 4,5,8
Current monitor output
ratio:
ICM / IOUT1
VCC = 5V
Min.
Typ.
0
Max.
Unit
4
V
1
---------------10000
-
1
------------4000
-
0V ≤ VCM ≤ 4V, VCC=5V
Current monitor accuracy
Acc ICM / IOUT 4,5,8
0 V ≤ VCM ≤ 3.8V,
VCC = 5V,
IOut,min 4,5,8= 0.5A,
IOut max 4,5,8= 5.9A
Current monitor accuracy
Acc ICM / IOUT 1
0 V ≤ VCM ≤ 3.8V,
VCC = 5V,
IOut,min 1= 60mA,
IOut max 1= 0.6A
ICM acc
Table 10.
0.5
4% +
1%FS
8% +
2%FS
-
Typ.
Max.
Unit
Charge pump output
Parameter
Charge pump output
voltage
Charge pump output
current
Test condition
Min.
VS = 8V, ICP = -60µA
VS+6
VS+13
V
VS = 10V, ICP = -80µA
VS+8
VS+13
V
VS ≥ 12V, ICP = -100µA
VS+10
VS+13
V
VCP = VS+10V, VS =13.5V
95
300
µA
Doc ID 16185 Rev 3
150
11/35
Electrical specifications
Table 11.
Symbol
L9953LXP
OUT1 - OUT8
Parameter
Test condition
Min.
Typ.
Max.
Unit
1600
2200
mΩ
2500
3400
mΩ
150
200
mΩ
225
300
mΩ
500
700
mΩ
700
950
mΩ
Tj = 25 °C, IOUT6,7= - 0.2 A
1800
2500
mΩ
Tj = 125 °C,IOUT6,7 = - 0.2 A
2700
3700
mΩ
VS = 13.5 V, Tj = 25 °C,
IOUT8 = -3 A
100
150
mΩ
VS = 13.5 V, Tj = 125 °C,
IOUT8 = -3 A
150
200
mΩ
VS = 13.5 V, Tj = 25 °C,
IOUT1,2,3 = ± 0.4A
RDSon OUT1,
On resistance to supply or
RDSon OUT2
GND
VS = 13.5 V, Tj = 125 °C,
RDSon OUT3
IOUT1,2,3 = ± 0.4 A
VS = 13.5 V, Tj = 25 °C,
IOUT4,5 = ± 3 A
RDSon OUT4, On resistance to supply or
RDSon OUT5 GND
VS = 13.5 V, Tj = 125 °C,
IOUT4,5 = ± 3 A
VS = 13.5 V, Tj = 25 °C,
IOUT6,7 = − 0.8A
On resistance to supply in
low RDSon mode
VS = 13.5 V, Tj = 125 °C,
RDSon OUT6,
IOUT6,7 = −0.8 A
RDSon OUT7
On resistance in high
RDSon mode
RDSon OUT8 On resistance to supply
IOUT1
IOUT2
IOUT3
Output current limitation
to GND
Source, VS=13.5 V
-1.25
-0.75
A
IOUT1
IOUT2
IOUT3
Output current limitation
to supply
Sink, VS=13.5 V
0.75
1.25
A
IOUT4
IOUT5
Output current limitation
to GND
Source, VS=13.5 V
-10.5
-6
A
IOUT4
IOUT5
Output current limitation
to supply
Sink, VS=13.5 V
6
10.5
A
-3.0
-1.4
A
-0.65
-0.35
A
IOUT6
IOUT7
12/35
Output current limitation
to GND
Output current limitation
to GND in high RDSon
mode
Source, VS=13.5 V
Doc ID 16185 Rev 3
L9953LXP
Electrical specifications
Table 11.
Symbol
OUT1 - OUT8 (continued)
Parameter
Test condition
Min.
Typ.
Max.
Unit
-6
A
IOUT8
Output current limitation
to GND
Source, VS=13.5 V
td On H
Output delay time,
highside driver on
VS=13.5 V, Rload=(1)
corresponding lowside driver
is not active
10
40
80
µs
td Off H
Output delay time,
highside driver off
VS=13.5 V, Rload=(1)
15
150
300
µs
td On L
Output delay time,
lowside driver on
VS=13.5 V, Rload=(1)
corresponding highside
driver is not active
15
30
70
µs
td Off L
Output delay time,
lowside driver off
VS=13.5 V, Rload=(1)
20
100
200
µs
td HL
Cross current protection
time, source to sink
tCC ONLS_OFFHS - td Off H(2)
200
400
µs
td LH
Cross current protection
time, sink to source
tCC ONHS_OFFLS - td Off L(2)
200
400
µs
-3
0
3
µA
Switched off output
VOUT1-2-3-4-5-8=0V, active
current highside drivers of
mode
OUT1-8
-40
-15
0
µA
VOUT6-7=0V, active mode
-10
-8
0
µA
0
80
120
µA
VOUT1-5= VS, active mode
-40
-15
0
µA
VOUT1-8=0V, standby mode
IQLH
IQLL
Switched off output
current lowside drivers of
OUT1-5
VOUT1-5= VS, standby mode
-10.5
IOLD123
Open-load detection
current of OUT1, OUT2
and OUT3
Source and sink
10
20
30
mA
IOLD45
Open-load detection
current of OUT4 and
OUT5
Source and sink
60
150
300
mA
15
40
60
mA
5
10
15
mA
30
150
300
mA
Open-load detection
current of OUT6 and
OUT7
IOLD67
Open-load detection
current of OUT6 and
OUT7 in high RDSon
mode
Source
IOLD8
Open-load detection
current of OUT8
td OL
Minimum duration of
open-load condition to set
the status bit
500
3000
µs
tISC
Minimum duration of overcurrent condition to switch
off the driver
10
100
µs
Source
Doc ID 16185 Rev 3
13/35
Electrical specifications
Table 11.
Symbol
1.
L9953LXP
OUT1 - OUT8 (continued)
Parameter
Test condition
Min.
Max.
Unit
frec0
Recovery frequency for
OC recovery duty cycle
bit=0
2
8
kHz
frec1
Recovery frequency for
OC recovery duty cycle
bit=1
3
16
kHz
dVOUT123/dt
dVOUT67/dt
Slew rate of OUT123 and
OUT67
VS =13.5 V, Rload=(1)
0.1
0.4
0.9
V/µs
dVOUT45/dt
Slew rate of OUT4 and
OUT5
VS =13.5 V, Rload=(1)
0.08
0.2
0.4
V/µs
dVOUT8/dt
Slew rate of OUT8
VS =13.5 V, Rload=(1)
0.08
0.2
0.4
V/µs
OUT1,2,3 32Ohm OUT4,5 4Ohm OUT6,7 16Ohm OUT6,7 high RDSon mode 63Ohm OUT8 4Ohm
2. tCC ON is the switch On delay time td ON if complement in half bridge has to switch off.
14/35
Typ.
Doc ID 16185 Rev 3
L9953LXP
2.5
Electrical specifications
SPI - electrical characteristics
VS = 8 to 16V, VCC = 4.5 to 5.3V, Tj = - 40 to 150°C, unless otherwise specified. The
voltages are referred to GND and currents are assumed positive, when the current flows
into the pin).
Table 12.
Delay time from standby to active mode
Symbol
Parameter
tset
Delay time
Table 13.
Test condition
Min.
Switching from standby to active mode.
Time until output drivers are enabled
Parameter
160
300
µs
Max.
Unit
Min.
Typ.
1.5
2.0
VinL
Input low level
VCC = 5V
Input high level
VCC = 5V
VinHyst
Input hysteresis
VCC = 5V
0.5
ICSN in
Pull up current at input CSN
VCSN = 3.5V VCC = 5V
-40
ICLK in
Pull down current at input CLK
Cin(1)
Unit
Test condition
VinH
IPWM1 in
Max.
Inputs: CSN, CLK, PWM1/2 and DI
Symbol
IDI in
Typ.
Pull down current at input DI
Pull down current at input
PWM1
Input capacitance at input
CSN, CLK, DI and PWM1/2
3.0
V
3.5
V
V
-20
-5
µA
VCLK = 1.5V
10
25
50
µA
VDI = 1.5V
10
25
50
µA
VPWM = 1.5V
10
25
50
µA
10
15
pF
Max.
Unit
0 V < VCC < 5.3V
1. Value of input capacity is not measured in production test. Parameter guaranteed by design.
Table 14.
DI timing (1)
Symbol
Parameter
Test condition
Min.
Typ.
tCLK
Clock period
VCC = 5V
1000
ns
tCLKH
Clock high time
VCC = 5V
400
ns
tCLKL
Clock low time
VCC = 5V
400
ns
tset CSN
CSN setup time, CSN low
before rising edge of CLK
VCC = 5V
400
ns
tset CLK
CLK setup time, CLK high
before rising edge of CSN
VCC = 5V
400
ns
tset DI
DI setup time
VCC = 5V
200
ns
thold time
DI hold time
VCC = 5V
200
ns
tr in
Rise time of input signal DI,
CLK, CSN
VCC = 5V
100
ns
tf in
Fall time of input signal DI,
CLK, CSN
VCC = 5V
100
ns
1. DI timing parameters tested in production by a passed / failed test:
Tj= -40°C / +25°C:
SPI communication @ 2MHz.
Tj= +125°C
SPI communication @ 1.25 MHz.
Doc ID 16185 Rev 3
15/35
Electrical specifications
Table 15.
Symbol
L9953LXP
DO
Parameter
Test condition
VDOL
Output low level
VCC = 5 V, ID = -2mA
VDOH
Output high level
VCC = 5 V, ID = 2 mA
IDOLK
3-state leakage current
VCSN = VCC,
0V < VDO < VCC
3-state input
capacitance
VCSN = VCC,
0V < VCC < 5.3V
CDO (1)
Min.
Typ.
Max.
Unit
0.2
0.4
V
VCC -0.4 VCC-0.2
-10
V
10
µA
15
pF
Typ.
Max.
Unit
10
1. Value of input capacity is not measured in production test. Parameter guaranteed by design.
Table 16.
Symbol
DO timing
Parameter
Test condition
tr DO
DO rise time
CL = 100 pF, Iload = -1mA
80
140
ns
tf DO
DO fall time
CL = 100 pF, Iload = 1mA
50
100
ns
ten DO tri L
DO enable time
CL = 100 pF, Iload = 1mA
from 3-state to low level pull-up load to VCC
100
250
ns
tdis DO L tri
DO disable time
CL = 100 pF, Iload = 4 mA
from low level to 3-state pull-up load to VCC
380
450
ns
ten DO tri H
DO enable time
CL =100 pF, Iload = -1mA
from 3-state to high level pull-down load to GND
100
250
ns
tdis DO H tri
DO disable time
CL = 100 pF, Iload = -4mA
from high level to 3-state pull-down load to GND
380
450
ns
50
250
ns
Typ.
Max.
Unit
td DO
Table 17.
VDO < 0.3 VCC, VDO > 0.7VCC,
CL = 100pF
DO delay time
CSN timing
Symbol
Parameter
Test condition
Min.
tCSN_HI,stb
CSN HI time, switching from
standby mode
Transfer of SPI command
to input register
20
µs
Transfer of SPI command
to input register
4
µs
tCSN_HI,min CSN HI time, active mode
16/35
Min.
Doc ID 16185 Rev 3
L9953LXP
Electrical specifications
Figure 3.
SPI - transfer timing diagram
CSN high to low: DO enabled
CSN
time
CLK
0
1
2
3
4
5
6
X
7
X
18 19
0
20 21 22 23
time
DI: data will be accepted on the rising edge of CLK signal
DI
0
1
2
3
4
5
6
7
X
X
18 19
0
20 21 22 23
DO: data will change on the falling edge of CLK signal
DO
0
1
2
3
4
5
6
7
X
18 19
20 21 22
23
Input
Data
Register
old data
1
time
0
1
time
CSN low to high: actual data is
transfered to output power switches
fault bit
Figure 4.
X
1
new data
time
SPI - input timing
0.8 VCC
CSN
0.2 VCC
t
t
set CSN
t
CLKH
se t CLK
0.8 VCC
CLK
0.2 VCC
t
set DI
t
hold DI
t
CLKL
0.8 VCC
DI
Valid
Valid
0.2 VCC
Doc ID 16185 Rev 3
17/35
Electrical specifications
Figure 5.
L9953LXP
SPI - DO valid data delay time and valid time
t f in
t r in
0.8 VCC
0.5 VCC
0.2 VCC
CLK
t r DO
DO
(low to high)
0.8 VCC
0.2 VCC
t d DO
t f DO
0.8 VCC
DO
(high to low)
0.2 VCC
Figure 6.
SPI - DO enable and disable time
tf in
tr in
0.8 VCC
50%
0.2 VCC
CSN
DO
pull-up load to VCC
C L = 100 pF
50%
ten DO tri L
t dis DO L tri
50%
DO
pull-down load to GND
C L = 100 pF
ten DO tri H
18/35
Doc ID 16185 Rev 3
t dis DO H tri
L9953LXP
Electrical specifications
Figure 7.
SPI - driver turn on / off timing, minimum CSN hi time
CSN low to high: data from shi ft register
is transferred to output power switches
t
t r in
tCSN_HI,min
f in
80%
50%
20%
CSN
tdOFF
output voltage
current
output
of aa driver
driver
of
ON state
OFF state
t
80%
50%
20%
OFF
t
dON
t
output voltage
current
output
ofaa driver
driver
of
Figure 8.
ON
OFF state
80%
ON state
50%
20%
SPI - timing of status bit 0 (fault condition)
CSN high to low and CLK stays low: status information of data bit 0 (fault condition) is transfered to DO
CSN
time
CLK
time
DI
time
DI: data is not accepted
DO
0time
DO: status information of data bit 0 (fault condition) will stay as long as CSN is low
Doc ID 16185 Rev 3
19/35
Application information
L9953LXP
3
Application information
3.1
Dual power supply: VS and VCC
The power supply voltage VS supplies the half bridges and the highside drivers. An internal
charge-pump is used to drive the highside switches. The logic supply voltage VCC
(stabilized 5 V) is used for the logic part and the SPI of the device.
Due to the independent logic supply voltage the control and status information will not be
lost, if there are temporary spikes or glitches on the power supply voltage. In case of poweron (VCC increases from under voltage to VPOR Off = 4.2 V) the circuit is initialized by an
internally generated power-on-reset (POR). If the voltage VCC decreases under the
minimum threshold (VPOR ON = 3.4 V), the outputs are switched to 3-state (high impedance)
and the status registers are cleared.
3.2
Standby mode
The standby mode of the L9953LXP is activated by clearing the bit 23 of the input data
register 0. All latched data will be cleared and the inputs and outputs are switched to high
impedance. In the standby mode the current at VS (VCC) is less than 6 µA (50µA) for
CSN = high (DO in 3-state). By switching the VCC voltage a very low quiescent current can
be achieved. If bit 23 is set, the device will be switched to active mode.
3.3
Inductive loads
Each half bridge is built by an internally connected highside and a lowside power DMOS
transistor. Due to the built-in reverse diodes of the output transistors, inductive loads can be
driven at the outputs OUT1 to OUT5 without external free-wheeling diodes. The highside
drivers OUT6 to OUT8 are intended to drive resistive loads. Hence only a limited energy
(E<1mJ) can be dissipated by the internal ESD diodes in freewheeling condition. For
inductive loads (L>100µH) an external free-wheeling diode connected to GND and the
corresponding output is needed.
3.4
Diagnostic functions
All diagnostic functions (over/open-load, power supply over-/under voltage, temperature
warning and thermal shutdown) are internally filtered and the condition has to be valid for at
least 32 µs (open-load: 1ms, respectively) before the corresponding status bit in the status
registers will be set. The filters are used to improve the noise immunity of the device. Openload and temperature warning function are intended for information purpose and will not
change the state of the output drivers. On contrary, the overload condition will disable the
corresponding driver (over-current) and overtemperature will switch off all drivers (thermal
shutdown). Without setting the over-current recovery bits in the input data register, the
microcontroller has to clear the over-current status bits to reactivate the corresponding
drivers.
20/35
Doc ID 16185 Rev 3
L9953LXP
3.5
Application information
Overvoltage and under voltage detection
If the power supply voltage VS rises above the overvoltage threshold VSOV Off (typical 21 V),
the outputs OUT1 to OUT8 are switched to high impedance state to protect the load. When
the voltage VS drops below the under voltage threshold VSUV Off (UV-switch-Off voltage), the
output stages are switched to the high impedance to avoid the operation of the power
devices without sufficient gate driving voltage (increased power dissipation). If the supply
voltage VS recovers to normal operating voltage the outputs stages return to the
programmed state (input register 0: bit 20=0).
If the under voltage/overvoltage recovery disable bit is set, the automatic turn-On of the
drivers is deactivated. The microcontroller needs to clear the status bits to reactivate the
drivers. It is recommended to set bit 20 to avoid a possible high current oscillation in case of
a shorted output to GND and low battery voltage.
3.6
Charge pump
The charge pump runs under all conditions in normal mode. In standby the charge pump is
disabled.
3.7
Temperature warning and thermal shutdown
If junction temperature rises above Tj TW a temperature warning flag is set and is detectable
via the SPI. If junction temperature increases above the second threshold Tj SD, the thermal
shutdown bit will be set and power DMOS transistors of all output stages are switched Off to
protect the device. Temperature warning flag and thermal shutdown bit are latched and
must be cleared by the microcontroller. The related bit is only cleared if the temperature
decreases below the trigger temperature. If the thermal shutdown bit has been cleared the
output stages are reactivated.
3.8
Open-load detection
The open-load detection monitors the load current in each activated output stage. If the load
current is below the open-load detection threshold for at least 1 ms (tdOL) the corresponding
open-load bit is set in the status register. Due to mechanical/electrical inertia of typical loads
a short activation of the outputs (e.g. 3ms) can be used to test the open-load status without
changing the mechanical/electrical state of the loads.
3.9
Over load detection
In case of an over-current condition a flag is set in the status register in the same way as
open-load detection. If the over-current signal is valid for at least tISC = 32 µs, the overcurrent flag is set and the corresponding driver is switched off to reduce the power
dissipation and to protect the integrated circuit. If the over-current recovery bit of the output
is zero the microcontroller has to clear the status bits to reactivate the corresponding driver.
Doc ID 16185 Rev 3
21/35
Application information
3.10
L9953LXP
Current monitor
The current monitor output sources a current image at the current monitor output which has
a fixed ratio (1/10000) of the instantaneous current of the selected highside driver. The bits
18 and 19 of the input data register 0 control which of the outputs OUT1, OUT4, OUT5, and
OUT8 will be multiplexed to the current monitor output. The current monitor output allows a
more precise analysis of the actual state of the load rather than the detection of an open- or
overload condition. For example this can be used to detect the motor state (starting, freerunning, stalled). Moreover, it is possible to regulate the power of the defroster more precise
by measuring the load current. The current monitor output is bidirectional (c.f. PWM inputs).
3.11
PWM inputs
Each driver has a corresponding PWM enable bit which can be programmed by the SPI
interface. If the PWM enable bit in input data register 1 is set, the output is controlled by the
logically AND-combination of the PWM signal and the output control bit in input data
register 0. The outputs OUT1-OUT6 and OUT8 are controlled by the PWM1 input and the
output OUT7 is controlled by the bidirectional input CM/PMW2. For example, the two PWM
inputs can be used to dim two lamps independently by external PWM signals.
3.12
Cross-current protection
The six half-bridges of the device are cross-current protected by an internal delay time. If
one driver (LS or HS) is turned-off the activation of the other driver of the same half bridge
will be automatically delayed by the cross-current protection time. After the cross-current
protection time is expired the slew-rate limited switch-off phase of the driver will be changed
to a fast turn-off phase and the opposite driver is turned-on with slew-rate limitation. Due to
this behavior it is always guaranteed that the previously activated driver is totally turned-off
before the opposite driver will start to conduct.
22/35
Doc ID 16185 Rev 3
L9953LXP
3.13
Application information
Programmable soft start function to drive loads with higher
inrush current
Loads with start-up currents higher than the over-current limits (e.g. inrush current of lamps,
start current of motors and cold resistance of heaters) can be driven by using the
programmable soft start function (i.e. overcurrent recovery mode). Each driver has a
corresponding over-current recovery bit. If this bit is set, the device will automatically switchon the outputs again after a programmable recovery time. The duty cycle in over-current
condition can be programmed by the SPI interface to be about 12% or 25%. The PWM
modulated current will provide sufficient average current to power up the load (e.g. heat up
the bulb) until the load reaches operating condition. The PWM frequency settles at 3kHz or
6kHz. The device itself cannot distinguish between a real overload and a non linear load like
a light bulb. A real overload condition can only be qualified by time. As an example the
microcontroller can switch on light bulbs by setting the over-current recovery bit for the first
50ms. After clearing the recovery bit the output will be automatically disabled if the overload
condition still exits.
Figure 9.
Programmable soft start function for inductive loads and incandescent
bulbs
Load Current
Load Current
Unlimited Inrush Current
Unlimited Inrush Current
Limited Inrush Current in
overcurrent recovery mode with
incandescent bulb
Limited Inrush Current in
overcurrent recovery mode
with inductive load
Overcurrent
detection
Overcurrent
detection
t
Doc ID 16185 Rev 3
t
23/35
Functional description of the SPI
L9953LXP
4
Functional description of the SPI
4.1
Serial Peripheral Interface (SPI)
This device uses a standard SPI to communicate with a microcontroller. The SPI can be
driven by a microcontroller with its SPI peripheral running in following mode: CPOL = 0 and
CPHA = 0.
For this mode, input data is sampled by the low to high transition of the clock CLK, and
output data is changed from the high to low transition of CLK.
This device is not limited to microcontroller with a build-in SPI. Only three CMOS-compatible
output pins and one input pin will be needed to communicate with the device. A fault
condition can be detected by setting CSN to low. If CSN = 0, the DO-pin will reflect the
status bit 0 (fault condition) of the device which is a logical-or of all bits in the status registers
0 and 1. The microcontroller can poll the status of the device without the need of a full SPIcommunication cycle.
Note:
In contrast to the SPI-standard the least significant bit (LSB) will be transferred first (see
Figure 3).
4.2
Chip Select Not (CSN)
The input pin is used to select the serial interface of this device. When CSN is high, the
output pin (DO) will be in high impedance state. A low signal will activate the output driver
and a serial communication can be started. The state when CSN is going low until the rising
edge of CSN will be called a communication frame. If the CSN-input pin is driven above
7.5V, the L9953LXP will go into a test mode. In the test mode the DO will go from 3-state to
active mode.
4.3
Serial Data In (DI)
The input pin is used to transfer data serial into the device. The data applied to the DI will be
sampled at the rising edge of the CLK signal and shifted into an internal 24 bit shift register.
At the rising edge of the CSN signal the contents of the shift register will be transferred to
data input register. The writing to the selected data input register is only enabled if exactly
24 bits are transmitted within one communication frame (i.e. CSN low). If more or less clock
pulses are counted within one frame the complete frame will be ignored. This safety function
is implemented to avoid an activation of the output stages by a wrong communication frame.
Note:
Due to this safety functionality a daisy chaining of SPI is not possible. Instead, a parallel
operation of the SPI bus by controlling the CSN signal of the connected ICs is
recommended.
4.4
Serial Data Out (DO)
The data output driver is activated by a logical low level at the CSN input and will go from
high impedance to a low or high level depending on the status bit 0 (fault condition). The first
rising edge of the CLK input after a high to low transition of the CSN pin will transfer the
24/35
Doc ID 16185 Rev 3
L9953LXP
Functional description of the SPI
content of the selected status register into the data out shift register. Each subsequent
falling edge of the CLK will shift the next bit out.
4.5
Serial clock (CLK)
The CLK input is used to synchronize the input and output serial bit streams. The data input
(DI) is sampled at the rising edge of the CLK and the data output (DO) will change with the
falling edge of the CLK signal.
4.6
Input data register
The device has two input registers. The first bit (bit 0) at the DI-input is used to select one of
the two Input Registers. All bits are first shifted into an input shift register. After the rising
edge of CSN the contents of the input shift register will be written to the selected Input Data
Register only if a frame of exact 24 data bits are detected. Depending on bit 0 the contents
of the selected status register will be transferred to DO during the current communication
frame. Bit 1-17 controls the behavior of the corresponding driver.
If bit 23 is zero, the device will go into the standby-mode. The bits 18 and 19 are used to
control the current monitor multiplexer. Bit 22 is used to reset all status bits in both status
registers. The bits in the status registers will be cleared after the current communication
frame (rising edge of CSN).
4.7
Status register
This devices uses two status registers to store and to monitor the state of the device. Bit 0 is
used as a fault bit and is a logical-NOR combination of bits 1-22 in both status registers. The
state of this bit can be polled by the microcontroller without the need of a full SPI
communication cycle. If one of the over-current bits is set, the corresponding driver will be
disabled. If the over-current recovery bit of the output is not set the microcontroller has to
clear the over-current bit to enable the driver. If the thermal shutdown bit is set, all drivers
will go into a high impedance state. Again the microcontroller has to clear the bit to enable
the drivers.
Doc ID 16185 Rev 3
25/35
Functional description of the SPI
4.8
L9953LXP
SPI - input data and status registers
Table 18.
SPI - input data and status registers 0
Input register 0 (write)
Status register 0 (read)
Bit
23
22
21
20
Name
Comment
Name
Comment
If enable bit is set the
device will be switched in
active mode. If enable bit
is cleared the device go
into standby mode and all
bits are cleared. After
power-on reset device
starts in standby mode.
Always 1
A broken VCC-or SPIconnection of the L9953LXP
can be detected by the
microcontroller, because all 24
bits low or high is not a valid
frame.
Enable bit
Reset bit
If reset bit is set both
status registers will be
cleared after rising edge of
CSN input.
VS overvoltage
Overvoltage/
undervoltage
recovery
disable
If this bit is set the
microcontroller has to
clear the status register
after
undervoltage/overvoltage
event to enable the
outputs.
In case of an overvoltage or
undervoltage event the
corresponding bit is set and
the outputs are deactivated. If
OC recovery This bit defines in
VS voltage recovers to normal
duty cycle
combination with the overoperating conditions outputs
current recovery bit (Input
VS undervoltage are reactivated automatically
register 1) the duty cycle
(if Bit 20 of status register 0 is
0: 12% 1: 25% in over current condition of
not set).
an activated driver.
Depending on
combination of bit 18 and
19 the current image
(1/10.000) of the selected
HS-output will be multiplexed to the CM output:
19
Current monitor
select bits
18
26/35
Bit
19
Bit
18
Output
0
0
OUT8
1
0
OUT1
0
1
OUT5
1
1
OUT4
Doc ID 16185 Rev 3
Thermal
shutdown
In case of a thermal shutdown
all outputs are switched off.
The microcontroller has to
clear the TSD bit by setting the
reset bit to reactivate the
outputs.
Temperature
warning
This TW bit is for information
purpose only. It can be used
for a thermal management by
the microcontroller to avoid a
thermal shutdown.
Not ready bit
After switching the device from
standby mode to active mode
an internal timer is started to
allow charge pump to settle
before the outputs can be
activated. This bit is cleared
automatically after start up
time has finished. Since this bit
is controlled by internal clock it
can be used for synchronizing
testing events (e.g. measuring
filter times).
L9953LXP
Functional description of the SPI
Table 18.
SPI - input data and status registers 0 (continued)
Input register 0 (write)
Status register 0 (read)
Bit
Name
Comment
Name
17
OUT8 – HS
on/off
OUT8 – HS
over-current
16
x (don’t care)
0
15
OUT7 – HS
on/off
OUT7 – HS
over-current
14
OUT6 – HS
on/off
OUT6 – HS
over-current
13
x (don’t care)
0
If a bit is set the selected
output driver is switched
On. If the corresponding
PWM enable bit is set
(input register 1) the driver
is only activated if PWM1
(PWM2) input signal is
high. The outputs of
OUT1-OUT5 are half
bridges. If the bits of HSand LS-driver of the same
half bridge are set, the
internal logic prevents that
both drivers of this output
stage can be switched on
simultaneously in order to
avoid a high internal
current from VS to GND.
12
x (don’t care)
11
x (don’t care)
10
OUT5 – HS
on/off
9
OUT5 – LS
on/off
8
OUT4 – HS
on/off
7
OUT4 – LS
on/off
6
OUT3 – HS
on/off
5
OUT3 – LS
on/off
4
OUT2 – HS
on/off
OUT2 – HS
over-current
3
OUT2 – LS
on/off
OUT2 – LS
over-current
2
OUT1 – HS
on/off
OUT1 – HS
over-current
1
OUT1 – LS
on/off
OUT1 – LS
over-current
0
Comment
0
0
OUT5 – HS
over-current
OUT5 – LS
over-current
OUT4 – HS
over-current
OUT4 – LS
over-current
OUT3 – HS
over-current
OUT3 – LS
over-current
No error bit
Doc ID 16185 Rev 3
In case of an over-current
event the corresponding status
bit is set and the output driver
is disabled. If the over-current
recovery enable bit is set
(input register 1) the output will
be automatically reactivated
after a delay time resulting in a
PWM modulated current with a
programmable duty cycle (bit
21).
If the over-current recovery bit
is not set the microcontroller
has to clear the over-current
bit (reset bit) to reactivate the
output driver.
A logical NOR-combination of
all bits 1 to 22 in both status
registers.
27/35
Functional description of the SPI
Table 19.
L9953LXP
SPI - input data and status registers 1
Input register 1 (write)
Status register 1 (read)
Bit
Name
Comment
23
Enable bit
If enable bit is set the device
will be switched in active
mode. If enable bit is cleared
device goes into standby mode
and all bits are cleared. After
power-on reset device starts in
standby mode.
22
OUT8 OC
recovery
enable
VS overvoltage
21
0/1
VS undervoltage
20
19
18
28/35
OUT7 OC
recovery
enable
OUT6 OC
recovery
enable
In case of an over-current
event the over-current status
bit (status register 0) is set and
the output is switched off. If the
over-current recovery enable
bit is set the output will be
automatically reactivated after
a delay time resulting in a
PWM modulated current with a
programmable duty cycle (bit
21 of input data register 0).
Depending on occurrence of
over-current event and internal
clock phase it is possible that
one recovery cycle is executed
even if this bit is set to zero.
0/1
Doc ID 16185 Rev 3
Name
Comment
Always 1
A broken VCC or SPI
connection of the
L9953LXP can be
detected by the
microcontroller, because
all 24 bits low or high is
not a valid frame.
In case of an overvoltage
or under voltage event
the corresponding bit is
set and the outputs are
deactivated. If Vs voltage
recovers to normal
operating conditions
outputs are reactivated
automatically.
In case of a thermal
shutdown all outputs are
switched off. The
Thermal shutdown microcontroller has to
clear the TSD bit by
setting the reset bit to
reactivate the outputs.
Temperature
warning
The TW bit can be used
for thermal management
by the microcontroller to
avoid a thermal
shutdown. The
microcontroller has to
clear the TW bit.
Not ready bit
After switching the
device from standby
mode to active mode an
internal timer is started to
allow charge pump to
settle before the outputs
can be activated. This bit
is only present during
start up time
Since this bit is
controlled by internal
clock it can be used for
synchronizing testing
events(e.g. measuring
filter times).
L9953LXP
Functional description of the SPI
Table 19.
SPI - input data and status registers 1 (continued)
Input register 1 (write)
Status register 1 (read)
Bit
Name
Comment
Name
17
Enable high
RDSon OUT7
OUT8 – HS
open-load
16
OUT5 OC
recovery
enable
0
15
OUT4 OC
recovery
enable
OUT7 – HS
open-load
14
OUT3 OC
recovery
enable
13
OUT2 OC
recovery
enable
0
12
OUT1 OC
recovery
enable
0
11
OUT8 PWM1
enable
0
10
0/1
OUT5 – HS
open-load
9
OUT7 PWM2
enable
OUT5 – LS
open-load
8
OUT6 PWM1
enable
OUT4 – HS
open-load
7
After 50ms the bit can be
cleared.
If over-current
condition still exists, a wrong
load can be assumed.
If the PWM1/2 enable bit is set
and the output is enabled
(input register 0) the output is
switched On if PWM1/2 input is
high and switched off if
PWM1/2 input is low. OUT7 is
controlled by PWM2 input. All
other outputs are controlled by
PWM1 input.
OUT6 – HS
open-load
OUT4 – LS
open-load
OUT3 – HS
open-load
6
Enable high
RDSon OUT6
5
OUT5 PWM1
enable
4
OUT4 PWM1
enable
3
OUT3 PWM1
enable
OUT2– LS
open-load
2
OUT2 PWM1
enable
OUT1 – HS
open-load
1
OUT1 PWM1
enable
OUT1 – LS
open-load
0
1
The open-load detection
monitors the load current
in each activated output
stage. If the load current
is below the open-load
detection threshold for at
least 1 ms (tdOL) the
corresponding open-load
bit is set. Due to
mechanical/electrical
inertia of typical loads a
short activation of the
outputs (e.g. 3ms) can
be used to test the openload status without
changing the
mechanical/electrical
state of the loads.
OUT3 – LS
open-load
OUT2 –HS
open-load
No error bit
Doc ID 16185 Rev 3
Comment
A logical NORcombination of all bits 1
to 22 in both status
registers.
29/35
Packages thermal data
5
L9953LXP
Packages thermal data
Figure 10. Packages thermal data
30/35
Doc ID 16185 Rev 3
L9953LXP
Package and packing information
6
Package and packing information
6.1
ECOPACK® packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
6.2
PowerSSO-36 package information
Figure 11.
PowerSSO-36 package dimensions
Doc ID 16185 Rev 3
31/35
Package and packing information
Table 20.
L9953LXP
PowerSSO-36 mechanical data
Millimeters
Symbol
32/35
Min.
Typ.
Max.
A
2.15
-
2.47
A2
2.15
-
2.40
a1
0
-
0.075
b
0.18
-
0.36
c
0.23
-
0.32
D
10.10
-
10.50
E
7.4
-
7.6
e
-
0.5
-
e3
-
8.5
-
G
-
-
0.1
G1
-
-
0.06
H
10.1
-
10.5
h
-
-
0.4
L
0.55
-
0.85
N
-
-
10 deg
X
4.3
-
5.2
Y
6.9
-
7.5
Doc ID 16185 Rev 3
L9953LXP
6.3
Package and packing information
PowerSSO-36 packing information
Figure 12. PowerSSO-36 tube shipment (no suffix)
Base Qty
Bulk Qty
Tube length (±0.5)
A
B
C (±0.1)
C
B
49
1225
532
3.5
13.8
0.6
All dimensions are in mm.
A
Figure 13. PowerSSO-36 tape and reel shipment (suffix “TR”)
Reel dimensions
Base Qty
Bulk Qty
A (max)
B (min)
C (±0.2)
F
G (+2 / -0)
N (min)
T (max)
1000
1000
330
1.5
13
20.2
24.4
100
30.4
Tape dimensions
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb. 1986
Tape width
Tape Hole Spacing
Component Spacing
Hole Diameter
Hole Diameter
Hole Position
Compartment Depth
Hole Spacing
W
P0 (±0.1)
P
D (±0.05)
D1 (min)
F (±0.1)
K (max)
P1 (±0.1)
24
4
12
1.55
1.5
11.5
2.85
2
End
All dimensions are in mm.
Start
Top
cover
tape
No components Components
500mm min
No components
500mm min
Empty components pockets
sealed with cover tape.
User direction of feed
Doc ID 16185 Rev 3
33/35
Revision history
7
L9953LXP
Revision history
Table 21.
34/35
Document revision history
Date
Revision
Description of changes
31-Aug-2009
1
Initial release.
14-May-2010
2
Table 20: PowerSSO-36 mechanical data:
– Changed X: minimum value from 4.1 to 4.3 and
maximum value from 4.7 to 5.2
– Changed Y: minimum value from 6.5 to 6.9 and
maximum value from 7.1 to 7.5
19-Sep-2013
3
Updated disclaimer.
Doc ID 16185 Rev 3
L9953LXP
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Doc ID 16185 Rev 3
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