TI1 LOG100JP-2 Logarithmic and log ratio amplifier Datasheet

optical networking, optical power monitor(ing), laser diode control, optical amplifier control, EDFA control, Erbium Doped Fiber Amplifie
®
LOG100
Precision
LOGARITHMIC AND LOG RATIO AMPLIFIER
FEATURES
APPLICATIONS
● ACCURACY
0.37% FSO max Total Error
Over 5 Decades
● LINEARITY
0.1% max Log Conformity
Over 5 Decades
● EASY TO USE
Pin-selectable Gains
Internal Laser-trimmed Resistors
● WIDE INPUT DYNAMIC RANGE
6 Decades, 1nA to 1mA
● HERMETIC CERAMIC DIP
● LOG, LOG RATIO AND ANTILOG
COMPUTATIONS
● ABSORBANCE MEASUREMENTS
● DATA COMPRESSION
● OPTICAL DENSITY MEASUREMENTS
● DATA LINEARIZATION
DESCRIPTION
resistors. The resistors are laser-trimmed for maximum precision. FET input transistors are used for the
amplifiers whose low bias currents (1pA typical) permit signal currents as low as 1nA while maintaining
guaranteed total errors of 0.37% FSO maximum.
● CURRENT AND VOLTAGE INPUTS
The LOG100 uses advanced integrated circuit technologies to achieve high accuracy, ease of use, low
cost, and small size. It is the logical choice for your
logarithmic-type computations. The amplifier has guaranteed maximum error specifications over the full sixdecade input range (1nA to 1mA) and for all possible
combinations of I1 and I2. Total error is guaranteed so
that involved error computations are not necessary.
The circuit uses a specially designed compatible thinfilm monolithic integrated circuit which contains amplifiers, logging transistors, and low drift thin-film
Q1
9
Because scaling resistors are self-contained, scale
factors of 1V, 3V or 5V per decade are obtained
simply by pin selections. No other resistors are required for log ratio applications. The LOG100 will
meet its guaranteed accuracy with no user trimming.
Provisions are made for simple adjustments of scale
factor, offset voltage, and bias current if enhanced
performance is desired.
Q2
–VCC
7
A2
1
I1
VOUT
3
A1
K=1
4
K=3
I2
14
7.5kΩ
270Ω
10
VOUT = K LOG
I1
I2
220Ω
International Airport Industrial Park • Mailing Address: PO Box 11400
Tel: (520) 746-1111 • Twx: 910-952-1111 • Cable: BBRCORP •
© 1981 Burr-Brown Corporation
SBFS014
K=5
24kΩ
6
+VCC
Com
5
39kΩ
Scale
Factor
2 Trim
Resistor values nominal only;
laser-trimmed for precision gain.
• Tucson, AZ 85734 • Street Address: 6730 S. Tucson Blvd. • Tucson, AZ 85706
Telex: 066-6491 • FAX: (520) 889-1510 • Immediate Product Info: (800) 548-6132
PDS-437E
Printed in U.S.A. January, 1995
SPECIFICATIONS
ELECTRICAL
TA = +25°C and ±VCC = ±15V, after 15 minute warm-up, unless otherwise specified.
LOG100JP
PARAMETER
CONDITIONS
TRANSFER FUNCTION
Log Conformity Error(1)
Initial
Over Temperature
MIN
Either I1 or I2
1nA to 100µA (5 decades)
1nA to 1mA (6 decades)
1nA to 100µA (5 decades)
1nA to 1mA (6 decades)
0.04
0.15
0.002
0.001
1, 3, 5
0.3
0.03
K Range(2)
Accuracy
Temperature Coefficient
ACCURACY
Total Error(3)
Initial
TYP
MAX
UNITS
0.1
0.25
%
%
%/°C
%/°C
V/decade
%
%/°C
±55
±30
±25
±20
±25
±30
±37
mV
mV
mV
mV
mV
mV
mV
VOUT = K Log (I1/I2)
K = 1,(4) Current Input Operation
I1, I2 = 1mA
I1, I2 = 100µA
I1, I2 = 10µA
I1, I2 = 1µA
I1, I2 = 100nA
I1, I2 = 10nA
I1, I2 = 1nA
vs Temperature
I1, I2 = 1mA
I1, I2 = 100µA
I1, I2 = 10µA
I1, I2 = 1µA
I1, I2 = 100nA
I1, I2 = 10nA
I1, I2 = 1nA
±0.20
±0.37
±0.28
±0.033
±0.28
±0.51
±1.26
mV/°C
mV/°C
mV/°C
mV/°C
mV/°C
mV/°C
mV/°C
vs Supply
I1, I2 = 1mA
I1, I2 = 100µA
I1, I2 = 10µA
I1, I2 = 1µA
I1, I2 = 100nA
I1, I2 = 10nA
I1, I2 = 1nA
±4.3
±1.5
±0.37
±0.11
±0.61
±0.91
±2.6
mV/V
mV/V
mV/V
mV/V
mV/V
mV/V
mV/V
INPUT CHARACTERISTICS (of Amplifiers A1 and A2)
Offset Voltage
Initial
vs Temperature
Bias Current
Initial
vs Temperature
Voltage Noise
10Hz to 10kHz, RTI
Current Noise
10Hz to 10kHz, RTI
AC PERFORMANCE
3dB Response(6), I2 = 10µA
1nA
1µA
10µA
1mA
Step Response(6)
Increasing
1µA to 1mA
100nA to 1µA
10nA to 100nA
Decreasing
1mA to 1µA
1µA to 100nA
100nA to 10nA
OUTPUT CHARACTERISTICS
Full Scale Output (FSO)
Rated Output
Voltage
Current
Current Limit
Positive
Negative
Impedance
CC = 4500pF
CC = 150pF
CC = 150pF
CC = 50pF
±5
mV
µV/°C
1
Doubles Every 10°C
3
0.5
5(5)
pA
kHz
kHz
kHz
kHz
11
7
110
µs
µs
µs
45
20
550
µs
µs
µs
CC = 150pF
IOUT = ±5mA
VOUT = ±10V
±10
V
±10
±5
V
mA
12.5
15
0.05
2
µVrms
pArms
0.11
38
27
45
CC = 150pF
®
LOG100
±0.7
±80
mA
mA
Ω
SPECIFICATIONS
(CONT)
ELECTRICAL
TA = +25°C and ±VCC = ±15V, after 15 minute warm-up, unless otherwise specified.
LOG100JP
PARAMETER
POWER SUPPLY REQUIREMENTS
Rated Voltage
Operating Range
Quiescent Current
AMBIENT TEMPERATURE RANGE
Specification
Operating Range
Storage
CONDITIONS
MIN
Derated Performance
±12
TYP
±15
±7
0
–25
–40
Derated Performance
MAX
UNITS
±18
±9
VDC
VDC
mA
+70
+85
+85
°C
°C
°C
NOTES: (1) Log Conformity Error is the peak deviation from the best-fit straight line of the VOUT vs Log IIN curve expressed as a percent of peak-to-peak full scale
output. (2) May be trimmed to other values. See Applications section. (3) The worst-case Total Error for any ratio of I1/I2 is the largest of the two errors when
I1 and I2 are considered separately. (4) Total Error at other values of K is K times Total Error for K = 1. (5) Guaranteed by design. Not directly measurable due to
amplifier’s committed configuration. (6) 3dB and transient response are a function of both the compensation capacitor and the level of input current. See Typical
Performance Curves.
PIN CONFIGURATION
ABSOLUTE MAXIMUM RATINGS
Supply ................................................................................................ ±18V
Internal Power Dissipation .............................................................. 600mV
Input Current ..................................................................................... 10mA
Input Voltage Range .......................................................................... ±18V
Storage Temperature Range ........................................... –40°C to +85°C
Lead Temperature (soldering, 10s) ............................................... +300°C
Output Short-circuit Duration .................................. Continuous to ground
Junction Temperature ...................................................................... 175°C
Bottom View
I2 Input 14
1
I1 Input
NC 13
2
Scale Factor Trim
NC 12
3
K=1
NC 11
4
K=3
Common 10
5
K=5
–VCC
9
6
+VCC
NC
8
7
Output
SCALE FACTOR PIN CONNECTIONS
K, V/DECADE
CONNECTIONS
5
3
1.9
1
0.85
0.77
0.68
5 to 7
4 to 7
4 and 5 to 7
3 to 7
3 and 5 to 7
3 and 4 to 7
3 and 4 and 5 to 7
NC = No Connection
ELECTROSTATIC
DISCHARGE SENSITIVITY
FREQUENCY COMPENSATION
Any integral circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
9
7
1
LOG100
14
10
6
5
4
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet
published specifications.
3
CC
PACKAGE INFORMATION
ORDERING INFORMATION
MODEL
LOG100JP
PACKAGE
SPECIFIED
TEMPERATURE
RANGE
14-Pin Hermetic Ceramic DIP
0°C to +70°C
MODEL
LOG100JP
PACKAGE
PACKAGE DRAWING
NUMBER(1)
14-Pin Hermetic Ceramic DIP
148(2)
NOTES: (1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix D of Burr-Brown IC Data Book. (2) During 1994, the package
was changed from plastic to hermetic ceramic. Pinout, model number, and
specifications remained unchanged. The metal lid of the new package is
internally connected to common, pin 10.
®
3
LOG100
TYPICAL PERFORMANCE CURVES
TA = +25°C, VCC = ±15VDC, unless otherwise noted.
ONE CYCLE OF NORMALIZED TRANSFER FUNCTION
NORMALIZED TRANSFER FUNCTION
3 (K)
Normalized Output Voltage (V)
Normalized Output Voltage (V)
1 (K)
I1
VOUT = K Log
I2
2 (K)
1 (K)
0 (K)
–1 (K)
–2 (K)
–3 (K)
0.9 (K)
0.8 (K)
0.7 (K)
0.6 (K)
0.5 (K)
0.4 (K)
0.3 (K)
0.2 (K)
0.1 (K)
0
0.01
0.001
0.1
1
10
100
1
1000
2
8
6
TOTAL ERROR vs INPUT CURRENT
TRIMMED OUTPUT ERROR vs INPUT CURRENT
60
Trimmed Output Error (mV)
50
±25
40
–60
Gain Error and
Offset Error Trimmed
to Zero
–50
–40
30
I2
20
–30
I1
±50
10
0
0
10
–20
100nA
10µA
20
1mA
1nA
100nA
Input Current ( I1 or I2)
10µA
1mA
Input Current (I1 or I2)
3dB FREQUENCY RESPONSE
MINIMUM VALUE OF COMPENSATION CAPACITOR
1M
1M
10µA
I1 = 1nA
Select CC for
I1 min and I2 max
100k
3dB Frequency Response (Hz)
Compensation Capacitor, CC (pF)
–20
–10
–10
0
1nA
10
I
Current Ratio, 1
I2
±75
Maximum Total Error (mV)
4
3
I
Current Ratio, 1
I2
I1 = 10nA
10k
I1 = 100nA
Values below 2pF
may be ignored.
1k
I1 = 1µA
100
I1 = 10µA
10
I1 = 100µA to 1mA
10k
1k
10nA
100nA
1µA
10µA
100µA
CC
1nA
=1
I1 = 1nA
LOG100
4
100nA
10nA
F
0p
0
CC
0
=1
I1 = 1nA
CC
10nA
100nA
1µA
I2
®
1µA
1mA
to 10µA
10nA
10
1nA
1mA
Input Current, I2
A
1µ
to
µA
10
10nA
F
0p 100µA
100µA
100
1
100µA
100µA
1mA
I1 = 1mA
1µA
0.1
1
1nA
100k
=
F
1µ
10µA
100µA
1mA
THEORY OF OPERATION
The base-emitter voltage of a bipolar transistor is
IC
KT
VBE = VT l n
where: VT =
q
IS
It should be noted that the temperature dependance associated with VT = KT/q is compensated by making R1 a
temperature sensitive resistor with the required positive
temperature coefficient.
(1)
K = Boltzman’s constant = 1.381 x 10–23
DEFINITION OF TERMS
T = Absolute temperature in degrees Kelvin
q = Electron charge = 1.602 x 10–19 Coulombs
TRANSFER FUNCTION
IC = Collector current
The ideal transfer function is VOUT = K log
IS = Reverse saturation current
where:
From the circuit in Figure 1, we see that
(2)
Substituting (1) into (2) yields
I1
I1
– VT2 l n
VOUT' = VT1 l n
IS1
IS2
I1 = numerator input current
I2 = denominator input current.
(3)
ACCURACY
If the transistors are matched and isothermal and VT1 = VT2,
then (3) becomes:
I1
I2
VOUT' = VT [ l n
– ln
]
(4)
IS
IS
I1
VOUT' = VT l n
and since
(5)
I2
ln x = 2.3 log10 x
Accuracy considerations for a log ratio amplifier are somewhat more complicated than for other amplifiers. The reason
is that the transfer function is nonlinear and has two inputs,
each of which can vary over a wide dynamic range. The
accuracy for any combination of inputs is determined from
the total error specification.
(6)
I1
(7)
I2
VOUT (V)
R1 + R2
R1
or
VOUT = K log
(9)
R1
K=1
4
(8)
R1 + R2
2
1nA
10nA
100nA
I1
0
1µA
–2
–4
I1
n VT log
(10)
I2
VOUT = K LOG
Fixed value of I2.
Q2
–
I1
1
VBE
I2 = 1µA
6
+
VBE
I2 = 10nA
8
I2
A2
VOUT
A1
I1
VOUT = K LOG
I2
I2
I2 = 100µA
4
2
VOUT (V)
–
+
I1
I2
FIGURE 2. Transfer Function with Varying K and I1.
(11)
I2
1mA
I2 = 1µA
–8
–10
I1
Q1
10µA 100µA
–6
10
I1
K=3
6
also
=
K=5
10
8
where n = 2.3
VOUT = VOUT'
I2
K = the scale factor with units of volts/decade
VOUT' = VBE1 – VBE2
VOUT' = n VT log
I1
R2
2
1nA
10nA
100nA
1µA
10µA 100µA
1mA
I1
0
–2
VOUT
–4
R1
–6
–8
–10
VOUT = K LOG
I1
I2
K=3
Fixed value of K.
FIGURE 3. Transfer Function with Varying I2 and I1.
FIGURE 1. Simplified Model of Log Amplifier.
®
5
LOG100
TOTAL ERROR
Log conformity is defined as the peak deviation from the
best-fit straight line of the VOUT versus log (I1/I2) curve. This
is expressed as a percent of peak-to-peak full scale output.
Thus, the nonlinearity error expressed in volts over m
decades is
The total error is the deviation (expressed in mV) of the
actual output from the ideal output of VOUT = K log (I1/I2).
Thus,
VOUT (ACTUAL) = VOUT (IDEAL) ± Total Error.
VOUT (NONLIN) = K 2Nm V
It represents the sum of all the individual components of
error normally associated with the log amp when operated in
the current input mode. The worst-case error for any given
ratio of I1/I2 is the largest of the two errors when I1 and I2 are
considered separately.
where N is the log conformity error, in percent.
INDIVIDUAL ERROR COMPONENTS
The ideal transfer function with current input is
Example:
VOUT = K Log
I1 varies over a range of 10nA to 1µA and I2 varies from
100nA to 10µA. What is the maximum error?
I2 (maximum error)(1)
I1 (maximum error)(1)
100nA
(25mV)
1µA
(20mV)
100nA
(25mV)
0.1
(30mV)
1
(25mV)
10
(25mV)
1µA
(20mV)
0.01
(30mV)
0.1
(25mV)
1
(20mV)
10µA
(25mV)
0.001
(30mV)
0.01
(25mV)
0.1
(25mV)
I1
(13)
I2
The actual transfer function with the major components of
error is
I1 – IB1
VOUT = K (1 ± ∆K) log
±K 2Nm ± VOS OUT (14)
I2 – IB2
Table I shows the maximum errors for each decade combination of I1 and I2.
10nA
(30mV)
(12)
The individual component of error is
∆K = scale factor error (0.3%, typ)
IB1 = bias current of A1 (1pA, typ)
IB2 = bias current of A2 (1pA, typ)
N = log conformity error ( 0.05%, 0.1%, typ)
VOS OUT = output offset voltage (1mV, typ)
m = number of decades over which N is specified:
0.05% for m = 5, 0.1% for m = 6
NOTE: (1) Maximum errors are in parenthesis.
Example: what is the error with K = 3 when
TABLE I. I1/I2 and Maximum Errors.
I1 = 1µA and I2 = 100nA
VOUT = 3(1 ± 0.003) log
Since the largest value of I1/I2 is 10 and the smallest is 0.001,
K is set at 3V per decade so the output will range from +3V
to –9V. The maximum total error occurs when I1 = 10nA and
is equal to K x 30mV. This represents a 0.75% of peak-topeak FSO error 3 x 0.030/12 x 100% = 0.75% where the full
scale output is 12V (from +3V to –9V).
≈ 3.009 log
ERRORS RTO AND RTI
As with any transfer function, errors generated by the
function itself may be Referred-to-Output (RTO) or Referred-to-Input (RTI). In this respect, log amps have a
unique property:
10–6
+ 0.015 + 0.001
10–7
(16)
= 3.009 (1) + 0.015 + 0.001
(17)
= 3.025V
(18)
Since the ideal output is 3.000V, the error as a percent of
reading is
% error =
0.025
x 100% = 0.83%
3
(19)
For the case of voltage inputs, the actual transfer function is
Given some error voltage at the log amp’s output, that
error corresponds to a constant percent of the input
regardless of the actual input level.
V1
Refer to: Yu Jen Wong and William E. Ott, “Function
Circuits: Design & Applications”, McGraw-Hill Book, 1976.
VOUT = K(1 ± ∆K) log
R1
V2
R2
LOG CONFORMITY
Log conformity corresponds to linearity when VOUT is plotted versus I1/I2 on a semilog scale. In many applications, log
conformity is the most important specification. This is true
because bias current errors are negligible (1pA compared to
input currents of 1nA and above) and the scale factor and
offset errors may be trimmed to zero or removed by system
calibration. This leaves log conformity as the major source
of error.
– IB1 ±
– IB2 ±
EOS1
R1
EOS2
±K 2Nm ±VOS OUT
R2
(20)
FREQUENCY RESPONSE
The 3dB frequency response of the LOG100 is a function of
the magnitude of the input current levels and of the value of
the frequency compensation capacitor. See Typical Performance Curves for details.
®
LOG100
10–6 –10–12
±3(2)(0.0005)5±1mV
10–7 –10–12
(15)
6
A voltage divider may be used to reduce the value of the
resistor. When this is done, one must be aware of possible
errors caused by the amplifier’s input offset voltage. This is
shown in Figure 5.
The frequency response curves are shown for constant DC I1
and I2 with a small signal AC current on one of them.
The transient response of the LOG100 is different for increasing and decreasing signals. This is due to the fact that
a log amp is a nonlinear gain element and has different gains
at different levels of input signals. Frequency response
decreases as the gain increases.
In this case the voltage at pin 14 is not exactly zero, but is
equal to the value of the input offset voltage of A1, which
ranges from zero to ±5mV. VT must be kept much larger
than 5mV in order to make this effect negligible. This
concept also applies to pin 1.
GENERAL INFORMATION
INPUT CURRENT RANGE
The stated input range of 1nA to 1mA is the range for
specified accuracy. Smaller or larger input currents may be
applied with decreased accuracy. Currents larger than 1mA
result in increased nonlinearity. The 10mA absolute maximum is a conservative value to limit the power dissipation
in the output stage of A1 and the logging transistor. Currents
below 1nA will result in increased errors due to the input
bias currents of A1 and A2 (1pA typical). These errors may
be nulled. See Optional Adjustments section.
VT
R1
14
VREF
A1
IREF
R2
FIGURE 5. “T” Network for Reference Current.
OPTIONAL ADJUSTMENTS
FREQUENCY COMPENSATION
Frequency compensation for the LOG100 is obtained by
connecting a capacitor between pins 7 and 14. The size of
the capacitor is a function of the input currents as shown in
the Typical Performance Curves. For any given application,
the smallest value of the capacitor which may be used is
determined by the maximum value at I2 and the minimum
value of I1. Larger values of CC will make the LOG100 more
stable, but will reduce the frequency response.
The LOG100 will meet its specified accuracy with no user
adjustments. If improved performance is desired, the following optional adjustments may be made.
INPUT BIAS CURRENT
The circuit in Figure 6 may be used to compensate for the
input bias currents of A1 and A2. Since the amplifiers have
FET inputs with the characteristic bias current doubling
every 10°C, this nulling technique is practical only where
the temperature is fairly stable.
SETTING THE REFERENCE CURRENT
When the LOG100 is used as a straight log amplifier I2 is
constant and becomes the reference current in the expression
I1
VOUT = K log
(21)
IREF
R2
10kΩ
–VCC
+VCC
R1
1kMΩ
IREF can be derived from an external current source (such as
shown in Figure 4), or it may be derived from a voltage
source with one or more resistors.
9
1
7
+
I1
LOG100
When a single resistor is used, the value may be quite large
when IREF is small. If IREF is 10nA and +15V is used
RREF =
VOS
+
–
R3
VOUT
14
15V
= 1500MΩ.
10nA
I2
R1'
1kMΩ
10
6
5
4
–
3
CC
–VCC
IREF
2N2905
3.6kΩ
2N2905
6V
IN834
+VCC
FIGURE 6. Bias Current Nulling.
RREF
+15V
R2'
10kΩ
–15V
IREF
OUTPUT OFFSET
The output offset may be nulled with the circuit in Figure 7.
I1 and I2 are set equal at some convenient value in the range
of 100nA to 100µA. R1 is then adjusted for zero output
voltage.
6V
=
RREF
FIGURE 4. Temperature-Compensated Current Reference.
®
7
LOG100
–VCC
10kΩ
+VCC
–VCC
–VCC
R1
100kΩ
9
2
9
1
7
LOG100
+
I1
LOG100
VOUT
14
10
6
I2
5
4
6
–
3
+VCC
CC
FIGURE 8. Reverse Polarity Protection.
I1 = I2
+VCC
techniques should be used to avoid damage caused by low
energy electrostatic discharge (ESD).
FIGURE 7. Output Offset Nulling.
LOG RATIO
One of the more common uses of log ratio amplifiers is to
measure absorbance. A typical application is shown in
Figure 9.
ADJUSTMENTS OF SCALE FACTOR K
The value of K may be changed by increasing or decreasing
the voltage divider resistor normally connected to the output, pin 7. To increase K put resistance in series between pin
7 and the appropriate scaling resistor pin (3, 4 or 5). To
decrease K place a parallel resistor between pin 2 and either
pin 3, 4 or 5.
Absorbance of the sample is A = log
λ1'
(22)
λ1
If λ2 = λ1 and D1 and D2 are matched A ∝ K log
APPLICATION INFORMATION
WIRING PRECAUTIONS
In order to prevent frequency instability due to lead inductance of the power supply lines, each power supply should
be bypassed. This should be done by connecting a 10µF
tantalum capacitor in parallel with a 1000pF ceramic capacitor from the +VCC and –VCC pins to the power supply
common. The connection of these capacitors should be as
close to the LOG100 as practical.
I2
. (23)
–VCC
I1
9
1
7
+
Sample
λ1
D1
LOG100
λ1
I2
Light λ 2
Source
CAPACITIVE LOADS
Stable operation is maintained with capacitive loads of up to
100pF, typically. Higher capacitive loads can be driven if a
22Ω carbon resistor is connected in series with the LOG100’s
output. This resistor will, of course, form a voltage divider
with other resistive loads.
D2
VOUT
14
10
6
5
4
–
3
CC
+VCC
FIGURE 9. Absorbance Measurement.
CIRCUIT PROTECTION
The LOG100 can be protected against accidental power
supply reversal by putting a diode (1N4001 type) in series
with each power supply line as shown in Figure 8. This
precaution is necessary only in power systems that momentarily reverse polarity during turn-on or turn-off. If this
protection circuit is used, the accuracy of the LOG100 will
be degraded slightly by the voltage drops across the diodes
as determined by the power supply sensitivity specification.
DATA COMPRESSION
In many applications the compressive effects of the logarithmic transfer function is useful. For example, a LOG100
preceding an 8-bit analog-to-digital converter can produce
equivalent 20-bit converter operation.
SELECTING OPTIMUM VALUES OF I2 AND K
In straight log applications (as opposed to log ratio), both K
and I2 are selected by the designer. In order to minimize
errors due to output offset and noise, it is normally best to
The LOG100 uses small geometry FET transistors to achieve
the low input bias currents. Normal FET handling
®
LOG100
I1
8
scale the log amp to use as much of the ±10V output range
as possible. Thus, with the range of I1 from I1 MIN to
I1 MAX ;
For I1
MAX
For I1 MIN
+ 10V = K log I1
MAX /I2
– 10V = K log I1
MIN
/I2
QA
IIN
QB
National
LM394
(24)
D1
(25)
D2
Addition of these two equations and solving for I2 shows that
its optimum value, I2 OPT, is the geometric mean of I1 MAX and
I1 MIN.
I2 OPT = I1 MAX x I1 MIN
KOPT =
log
10
I1 MAX
IOUT
(26)
(27)
FIGURE 10. Current Inverter.
I2 OPT
ANTILOG CONFIGURATION (an implicit technique)
Since K is selectable in discrete steps, use the largest value
of K available which does not exceed KOPT.
–VCC
9
NEGATIVE INPUT CURRENTS
The LOG100 will function only with positive input currents
(conventional current flow into pins 1 and 14). Some current
sources (such as photomultiplier tubes) provide negative
input currents. In such situations, the circuit in Figure 10
may be used.(1)
1
7
+
IREF
LOG100
VOUT
14
–
10
6
5
4
3
R
VOLTAGE INPUTS
The LOG100 gives the best performance with current inputs. Voltage inputs may be handled directly with series
resistors, but the dynamic input range is limited to approximately three decades of input voltage by voltage noise and
offsets. The transfer function of equation (20) applies to this
configuration.
+VCC
CC = 0.01µF
VIN
VOUT = IREF R Antilog –
VIN
K
K = 1 when VIN connected to pin 3.
K = 3 when VIN connected to pin 4.
K = 5 when VIN connected to pin 5.
FIGURE 11. Connections for Antilog Function.
NOTE: (1) More detailed information may be found in “Properly Designed Log
Amplifiers Process Bipolar Input Signals” by Larry McDonald, EDN, 5 Oct. 80,
pp 99–102.
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes
no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change
without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant
any BURR-BROWN product for use in life support devices and/or systems.
®
9
LOG100
PACKAGE OPTION ADDENDUM
www.ti.com
16-Jun-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
LOG100JP
NRND
CDIP BB
JDE
14
TBD
Call TI
Call TI
LOG100JP-2
NRND
CDIP BB
JDE
14
TBD
Call TI
Call TI
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DLP® Products
DSP
Clocks and Timers
Interface
Logic
Power Mgmt
Microcontrollers
RFID
RF/IF and ZigBee® Solutions
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lprf
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Military
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2009, Texas Instruments Incorporated
Similar pages