Diodes DMNH10H028SPSQ-13 100v 175c n-channel enhancement mode mosfet Datasheet

DMNH10H028SPSQ
Green
100V 175°C N-CHANNEL ENHANCEMENT MODE MOSFET
®
POWERDI
Product Summary
Features
V(BR)DSS
RDS(ON)
100V
28mΩ @ VGS = 10V
ID
TC = +25°C
40A



Thermally Efficient Package-Cooler Running Applications
High Conversion Efficiency
Low RDS(ON) – Minimizes On State Losses







Low Input Capacitance
Fast Switching Speed
<1.1mm Package Profile – Ideal for Thin Applications
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
PPAP Capable (Note 4)
Description and Applications
Mechanical Data
This MOSFET is designed to meet the stringent requirements of
Automotive applications. It is qualified to AEC-Q101, supported by a
PPAP and is ideal for use in:



Engine Management Systems

Body Control Electronics

DC-DC Converters



Case: POWERDI®5060-8
Case Material: Molded Plastic, ―Green‖ Molding Compound. UL
Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections: See Diagram Below
Terminals: Finish – Matte Tin Annealed over Copper Leadframe
Solderable per MIL-STD-202, Method 208
Weight: 0.097 grams (Approximate)

®
POWERDI 5060-8
D
Pin1
S
D
S
D
S
D
G
D
G
S
Top View
Internal Schematic
Bottom View
Top View
Pin Configuration
Ordering Information (Note 5)
Part Number
DMNH10H028SPSQ-13
Notes:
Case
POWERDI®5060-8
Packaging
2500 / Tape & Reel
1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green‖ products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. Automotive products are AEC-Q101 qualified and are PPAP capable. For more information, please refer to
http://www.diodes.com/product_compliance_definitions.html.
5. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
D
D
D
D
=Manufacturer’s Marking
H1H28SS = Product Type Marking Code
YYWW = Date Code Marking
YY = Last Two Digits of Year (ex: 15 = 2015)
WW = Week Code (01 to 53)
H1H28SS
YYWW
S
S
S
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DMNH10H028SPSQ
Document number: DS38226 Rev. 1 - 2
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DMNH10H028SPSQ
Maximum Ratings (@TC = +25°C, unless otherwise specified.)
Characteristic
Symbol
VDSS
VGSS
Drain-Source Voltage
Gate-Source Voltage
Steady
State
Pulsed Drain Current (10μs Pulse, Duty Cycle = 1%) (Note 6)
Maximum Continuous Body Diode Forward Current (Note 7)
Avalanche Current (Note 9) L=0.1mH
Avalanche Energy (Note 9) L=0.1mH
Continuous Drain Current, VGS = 10V
TC = +25°C
TC = +100°C
ID
IDM
IS
IAS
EAS
Value
100
±20
40
25
54
3.9
26
35
Unit
V
V
Value
1.6
97
2.9
52
1.8
-55 to +175
Unit
W
°C/W
W
A
A
A
A
mJ
Thermal Characteristics
Characteristic
Total Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient (Note 6)
Total Power Dissipation (Note 7)
Thermal Resistance, Junction to Ambient (Note 7)
Thermal Resistance, Junction to Case
Operating and Storage Temperature Range
Electrical Characteristics
Steady state
Steady state
°C/W
°C
(@TC = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 8)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
ON CHARACTERISTICS (Note 8)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 9)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Total Gate Charge (VGS = 10V)
Total Gate Charge (VGS = 6.0V)
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Reverse Recovery Time
Reverse Recovery Charge
Notes:
Symbol
PD
RJA
PD
RJA
RJC
TJ, TSTG
Symbol
Min
Typ
Max
Unit
Test Condition
BVDSS
IDSS
IGSS
100
—
—
—
—
—
—
1.0
±100
V
µA
nA
VGS = 0V, ID = 250µA
VDS = 100V, VGS = 0V
VGS = 20V, VDS = 0V
VGS(TH)
RDS(ON)
VSD
2.0
—
—
2.5
19
0.7
4.0
28
1.2
V
m
V
VDS = VGS, ID = 250µA
VGS = 10V, ID = 20A
VGS = 0V, IS = 1.0A
Ciss
Coss
Crss
RG
Qg
Qg
Qgs
Qgd
tD(ON)
tR
tD(OFF)
tF
tRR
QRR
—
—
—
—
—
—
—
—
—
—
—
—
—
—
2245
173
68
1.9
36
22
7.3
9.2
6.4
5.8
17.8
4.8
35
47
—
—
—
—
—
—
—
—
—
—
—
—
—
—
pF
VDS = 50V, VGS = 0V
f = 1.0MHz

VDS = 0V, VGS = 0V, f = 1.0MHz
nC
VDD = 50V, ID = 20A
ns
VGS = 10V, VDS= 50V,
RG = 3.0, ID = 20A
ns
nC
IF = 20A, di/dt = 100A/µs
IF = 20A, di/dt = 100A/µs
6. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
7. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
8. Short duration pulse test used to minimize self-heating effect.
9. Guaranteed by design. Not subject to product testing.
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DMNH10H028SPSQ
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DMNH10H028SPSQ
30
30.0
VGS=4.5V
25.0
25
VGS=6.0V
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
VDS=5V
VGS=5.0V
VGS=8.0V
20.0
VGS=4.0V
VGS=10.0V
15.0
10.0
15
85℃
150℃
10
25℃
175℃
VGS=3.5V
-55℃
0
0.0
1
2
3
4
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 1. Typical Output Characteristic
0.024
0.022
0.02
2
5
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
0
VGS=10.0V
0.018
0.016
0.014
0.06
0.05
0.04
0.05
175℃
150℃
0.04
125℃
85℃
0.03
25℃
0.02
-55℃
0.01
ID=20A
0.03
0.02
0.01
2
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(NORMALIZED)
VGS=10V
5
0.07
5
10
15
20
25
30
ID, DRAIN-SOURCE CURRENT (A)
Figure 3. Typical On-resistance vs. Drain Current and
Gate Voltage
0.06
2.5
3
3.5
4
4.5
VGS, GATE-SOURCE VOLTAGE (V)
Figure 2. Typical Transfer Characteristic
0.08
0
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
125℃
5
5.0
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
20
4
6
8
10 12 14 16 18
VGS, GATE-SOURCE VOLTAGE (V)
Figure 4. Typical Transfer Characteristic
20
2.6
2.4
VGS=10V, ID=20A
2.2
2
1.8
1.6
1.4
VGS=10V, ID=10A
1.2
1
0.8
0.6
0.4
0
0
5
10
15
20
25
30
ID, DRAIN CURRENT (A)
Figure 5. Typical On-Resistance vs. Drain Current and
Temperature
-50
-25
0
25 50 75 100 125 150 175
TJ, JUNCTION TEMPERATURE (℃)
Figure 6. On-Resistance Variation with Temperature
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0.05
3.2
VGS(TH), GATE THRESHOLD VOLTAGE (V)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
DMNH10H028SPSQ
0.045
0.04
VGS=10V, ID=20A
0.035
0.03
0.025
VGS=10V, ID=10A
0.02
0.015
3
2.8
2.6
2.4
ID=1mA
2.2
2
ID=250µA
1.8
1.6
1.4
1.2
1
0.01
-50
-50
0
25 50 75 100 125 150 175
TJ, JUNCTION TEMPERATURE (℃)
Figure 8. Gate Threshold Variation vs. Junction
Temperature
-25
0
25 50 75 100 125 150 175
TJ, JUNCTION TEMPERATURE (℃)
Figure 7. On-Resistance Variation with Temperature
-25
10000
30
CT, JUNCTION CAPACITANCE (pF)
f=1MHz
IS, SOURCE CURRENT (A)
25
VGS=0V,
TA=85℃
20
VGS=0V,
TA=125℃
15
VGS=0V,
TA=150℃
10
VGS=0V,
TA=25℃
VGS=0V,
TA=175℃
5
VGS=0V,
TA=-55℃
Ciss
1000
Coss
Crss
100
10
0
0
0.3
0.6
0.9
VSD, SOURCE-DRAIN VOLTAGE (V)
Figure 9. Diode Forward Voltage vs. Current
0
1.2
10
20
30
40
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 10. Typical Junction Capacitance
50
100
10
RDS(ON) Limited
ID, DRAIN CURRENT (A)
VGS (V)
8
6
VDS=50V, ID=20A
4
PW =1ms
10
PW =10ms
1
0.1
2
TJ(Max)=175℃
Tj,(Max)=175℃
Tc=25℃
T
C=25℃
Single Pulse
DUT on 1*MRP
board
VGS=10V
PW =100ms
PW =1s
PW =10s
DC
0.01
0
0
5
10
15
20
25
30
Qg (nC)
Figure 11. Gate Charge
35
40
0.1
1
10
100
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 12. SOA, Safe Operation Area
1000
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DMNH10H028SPSQ
r(t), TRANSIENT THERMAL RESISTANCE
1
D=0.5
D=0.9
D=0.3
D=0.7
0.1
D=0.1
D=0.05
D=0.02
0.01
D=0.01
D=0.005
RθJA(t)=r(t) * RθJA
RθJA=97°C/W
Duty Cycle, D=t1 / t2
D=Single Pulse
0.001
0.001
0.01
0.1
1
10
t1, PULSE DURATION TIME (sec)
Figure 13. Transient Thermal Resistance
100
1000
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Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version.
POWERDI®5060-8
D
Detail A
D1
0(4X)
c
A1
E1 E
e
01 (4X)
1
b (8X)
e/2
1
L
b2 (4X)
D3
A
K
D2
E3 E2
M
b3 (4X)
M1
Detail A
L1
G
POWERDI®5060-8
Dim
Min
Max
Typ
A
0.90
1.10
1.00
A1
0.00
0.05

b
0.33
0.51
0.41
b2
0.200
0.350 0.273
b3
0.40
0.80
0.60
c
0.230
0.330 0.277
D
5.15 BSC
D1
4.70
5.10
4.90
D2
3.70
4.10
3.90
D3
3.90
4.30
4.10
E
6.15 BSC
E1
5.60
6.00
5.80
E2
3.28
3.68
3.48
E3
3.99
4.39
4.19
e
1.27 BSC
G
0.51
0.71
0.61
K
0.51


L
0.51
0.71
0.61
L1
0.100
0.200 0.175
M
3.235
4.035 3.635
M1
1.00
1.40
1.21
Θ
10º
12º
11º
Θ1
6º
8º
7º
All Dimensions in mm
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
POWERDI®5060-8
X4
Y2
X3
Y3
Y5
Y1
X2
Y4
X1
Y7
Y6
G1
C
X
G
Y(4x)
Dimensions
C
G
G1
X
X1
X2
X3
X4
Y
Y1
Y2
Y3
Y4
Y5
Y6
Y7
Value (in mm)
1.270
0.660
0.820
0.610
4.100
0.755
4.420
5.610
1.270
0.600
1.020
0.295
1.825
3.810
0.180
6.610
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IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2015, Diodes Incorporated
www.diodes.com
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