Product Folder Sample & Buy Support & Community Tools & Software Technical Documents LMH6645, LMH6646, LMH6647 SNOS970D – JUNE 2001 – REVISED NOVEMBER 2014 LMH664x 2.7 V, 650 μA, 55 MHz, Rail-to-Rail Input and Output Amplifiers with Shutdown Option 1 Features • 1 • • • • • • • • • • 3 Description + (VS = 2.7V, TA = 25°C, RL = 1kΩ to V /2, AV = +1. Typical Values Unless Specified. −3dB BW 55 MHz Supply Voltage Range 2.5 V to 12 V Slew Rate 22 V/μs Supply Current 650 μA/channel Output Short Circuit Current 42 mA Linear Output Current ±20 mA Input Common Mode Voltage 0.3 V Beyond Rails Output Voltage Swing 20 mV from Rails Input Voltage Noise 17 nV/√Hz Input Current Noise 0.75 pA/√Hz 2 Applications • • • • • Active Filters High Speed Portable Devices Multiplexing Applications (LMH6647) Current Sense Buffer High Speed Transducer Amp The LMH6645 (single) and LMH6646 (dual), rail-torail input and output voltage feedback amplifiers, offer high speed (55 MHz), and low voltage operation (2.7 V) in addition to micro-power shutdown capability (LMH6647, single). Input common mode voltage range exceeds either supply by 0.3 V, enhancing ease of use in multitude of applications where previously only inferior devices could be used. Output voltage range extends to within 20 mV of either supply rails, allowing wide dynamic range especially in low voltage applications. Even with low supply current of 650 μA/amplifier, output current capability is kept at a respectable ±20 mA for driving heavier loads. Important device parameters such as BW, Slew Rate and output current are kept relatively independent of the operating supply voltage by a combination of process enhancements and design architecture. Device Information(1) PART NUMBER LMH6645 LMH6646 LMH6647 PACKAGE BODY SIZE (NOM) SOT-23 (5) 2.90 mm × 1.60 mm SOIC (8) 4.90 mm × 3.91 mm SOIC (8) 4.90 mm × 3.91 mm VSSOP (8) 3.00 mm × 3.00 mm SOT-23 (6) 2.92 mm × 1.60 mm SOIC (8) 4.90 mm × 3.91 mm (1) For all available packages, see the orderable addendum at the end of the datasheet. Frequency Response for Various AV Closed Loop Frequency Response for Various Temperature AV = +2 GAIN AV = +1 0 GAIN PHASE 50 100 -4 0 PHASE 50 100 AV = +5 100k 1M 10M Frequency (Hz) Phase (°) 0 25°C -2 Gain (dB) AV = +10 -4 Phase (°) Gain (dB) 85°C 0 -2 -40°C 200M 100k 1M 10M 100M 200M Frequency (Hz) 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LMH6645, LMH6646, LMH6647 SNOS970D – JUNE 2001 – REVISED NOVEMBER 2014 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Description (continued)......................................... Pin Configuration and Functions ......................... Specifications......................................................... 7.1 7.2 7.3 7.4 7.5 7.6 7.7 7.8 8 1 1 1 2 3 3 4 Absolute Maximum Ratings ..................................... 4 Handling Ratings....................................................... 4 Recommended Operating Conditions....................... 4 Thermal Information .................................................. 4 Electrical Characteristics 2.7 V ................................. 5 Electrical Characteristics 5V .................................... 7 Electrical Characteristics ±5V .................................. 9 Typical Performance Characteristics ...................... 11 Detailed Description ............................................ 18 8.1 Overview ................................................................. 18 8.2 Functional Block Diagram ....................................... 18 8.3 Feature Description................................................. 19 8.4 Device Functional Modes........................................ 20 9 Application and Implementation ........................ 22 9.1 Application Information............................................ 22 9.2 Typical Application .................................................. 22 10 Power Supply Recommendations ..................... 23 11 Layout................................................................... 24 11.1 Layout Guidelines ................................................. 24 11.2 Layout Example .................................................... 24 12 Device and Documentation Support ................. 25 12.1 12.2 12.3 12.4 12.5 Documentation Support ........................................ Related Links ........................................................ Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 25 25 25 25 25 13 Mechanical, Packaging, and Orderable Information ........................................................... 25 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision C (April 2013) to Revision D • Page Added, updated, or renamed the following sections: Device Information Table, Pin Configuration and Functions, Application and Implementation; Power Supply Recommendations; Layout; Device and Documentation Support; Mechanical, Packaging, and Ordering Information................................................................................................................. 1 Changes from Revision B (April 2013) to Revision C • 2 Page Changed layout of National Data Sheet to TI format ............................................................................................................. 1 Submit Documentation Feedback Copyright © 2001–2014, Texas Instruments Incorporated Product Folder Links: LMH6645 LMH6646 LMH6647 LMH6645, LMH6646, LMH6647 www.ti.com SNOS970D – JUNE 2001 – REVISED NOVEMBER 2014 5 Description (continued) In portable applications, the LMH6647 provides shutdown capability while keeping the turn-off current to less than 50 μA. Both turn-on and turn-off characteristics are well behaved with minimal output fluctuations during transitions. This allows the part to be used in power saving mode, as well as multiplexing applications. Miniature packages (SOT-23, VSSOP-8, and SOIC-8) are further means to ease the adoption of these low power high speed devices in applications where board area is at a premium. 6 Pin Configuration and Functions SOT-23-5 (LMH6645) Package DBV05A Top View SOIC-8 (LMH6645) Package D08A Top View 5 1 OUTPUT V 1 + SOIC-8 and VSSOP-8 (LMH6646) Packages D08A and DGK08A Top View 1 8 N/C 8 + V OUT A N/C A -IN V - 2 7 - + V - 2 + 7 -IN A 2 +IN - + 3 6 + OUT B OUTPUT 3 6 +IN A +IN 4 3 -IN - 4 V SOT-23-6 (LMH6647) Package DBV06A Top View 5 V - 2 + +IN V + N/C 4 5 +IN B -IN +IN 4 1 2 SD - 3 - SOIC-8 (LMH6647) Package D08A Top View 6 1 OUTPUT - + N/C V -IN B B 5 -IN - 3 8 7 - 6 + 4 5 V SD + V OUTPUT N/C Pin Functions PIN NUMBER NAME LMH6645 LMH6646 DBV05A D08A -IN 4 2 +IN 3 3 DGK08A I/O LMH6647 DESCRIPTION DBV06A D08A 4 2 I Inverting input 3 3 I Non-inverting input -IN A 2 I Inverting Input Channel A +IN A 3 I Non-inverting input Channel A -IN B 6 I Inverting input Channel B I Non-inverting input Channel B +IN B 5 N/C OUTPUT 1,5,8 1 6 1 1,5 –– No Connection 6 O Output OUT A 1 O Output Channel A OUT B 7 O Output Channel B SD 5 8 I Shutdown - V 2 4 4 2 4 I Negative Supply V+ 5 7 8 6 7 I Positive Supply Copyright © 2001–2014, Texas Instruments Incorporated Product Folder Links: LMH6645 LMH6646 LMH6647 Submit Documentation Feedback 3 LMH6645, LMH6646, LMH6647 SNOS970D – JUNE 2001 – REVISED NOVEMBER 2014 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings (1) (2) over operating free-air temperature range (unless otherwise noted) MIN MAX Output short circuit duration See VIN differential (3) UNIT (4) and ±2.5 V V+ +0.8, V− −0.8 V Supply voltage (V+ - V−) 12.6 V Junction temperature (5) +150 Voltage at input/output pins Soldering Information (1) (2) (3) (4) (5) Infrared or Convection (20 sec) 235 Wave Soldering (10 sec) 260 °C Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test conditions, see the Electrical Characteristics. If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications. Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150°C. Output short circuit duration is infinite for VS < 6 V at room temperature and below. For VS > 6 V, allowable short circuit duration is 1.5 ms. The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) - TA)/ RθJA. All numbers apply for packages soldered directly onto a PC board. 7.2 Handling Ratings Tstg Storage temperature range V(ESD) Electrostatic discharge (1) (2) MIN MAX UNIT −65 +150 °C Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins (1) 2000 Machine model (MM) (2) 200 V JEDEC document JEP155 states that 2000-V HBM allows safe manufacturing with a standard ESD control process. Human body model, 1.5 kΩ in series with 100pF. JEDEC document JEP157 states that 200-V MM allows safe manufacturing with a standard ESD control process. Machine model, 0 Ω in series with 200 pF. 7.3 Recommended Operating Conditions (1) over operating free-air temperature range (unless otherwise noted) MIN MAX Supply Voltage (V+ – V−) 2.5 12 V Temperature Range (2) −40 +85 °C (1) (2) UNIT Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test conditions, see the Electrical Characteristics. The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) - TA)/ RθJA . All numbers apply for packages soldered directly onto a PC board. 7.4 Thermal Information LMH6645 THERMAL METRIC RθJA (1) 4 (1) SOT-23 Junction-to-ambient thermal resistance LMH6646 LMH6647 SOIC-8 VSSOP-8 SOT-23 SOIC-8 5 PINS 8 PINS 8 PINS 8 PINS 6 PINS 8 PINS 265 190 190 235 265 190 UNIT °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Submit Documentation Feedback Copyright © 2001–2014, Texas Instruments Incorporated Product Folder Links: LMH6645 LMH6646 LMH6647 LMH6645, LMH6646, LMH6647 www.ti.com SNOS970D – JUNE 2001 – REVISED NOVEMBER 2014 7.5 Electrical Characteristics 2.7 V Unless otherwise specified, all limits ensured for at TJ = 25°C, V+ = 2.7V, V− = 0V, VCM = VO = V+/2, and Rf = 2kΩ, and RL = 1kΩ to V+/2. PARAMETER TEST CONDITIONS AV = +1, VOUT = 200 mVPP, VCM = 0.7 V BW −3dB BW en Input-referred voltage noise in Input-referred current noise CT Rej. Cross-talk rejection (LMH6646 only) f = 5MHz, Receiver: Rf = Rg = 510 Ω, AV = +2 SR Slew rate AV = −1, VO = 2 VPP See (3), (4) TON MIN (1) TYP (2) 40 55 f = 100 kHz 17 f = 1 kHz 25 f = 100 kHz 0.75 f = 1 kHz 1.20 MAX (1) UNIT MHz nV/√Hz pA/√Hz 47 dB 22 V/μs Turn-on time (LMH6647 only) 250 ns TOFF Turn-off time (LMH6647 only) 560 ns THSD Shutdown threshold (LMH6647 only) IS ≤ 50μA ISD Shutdown pin input current (LMH6647 only) See VOS Input offset voltage 0V ≤ VCM ≤ 2.7 V TC VOS Input offset average drift See 1.95 (5) V −3 -40°C ≤ TJ ≤ 85°C ±1 −4 μA 3 0.40 (5) mV 4 μV/°C ±5 -40°C ≤ TJ ≤ 85°C Input bias current VCM = 0.5 V 2.30 −20 (6) VCM = 2.5 V IB 15 2 2.2 −0.68 (5) -40°C ≤ TJ ≤ 85°C −2 μA −2.2 0 V ≤ VCM ≤ 2.7 V IOS Input offset current 1 RIN Common mode input resistance 3 MΩ CIN Common mode input capacitance 2 pF −0.5 CMVR Input common-mode voltage range CMRR ≥ 50dB -40°C ≤ TJ ≤ 85°C CMRR Common mode rejection ratio AVOL Large signal voltage gain VO = 0.35 V to 2.35 V Output swing high VO Output swing low (1) (2) (3) (4) (5) (6) 3.2 46 77 58 76 76 87 RL = 1k to V+/2 + RL = 10k to V /2 V 2.8 VCM Stepped from 0 V to 1.55 V -40°C ≤ TJ ≤ 85°C nA −0.3 −0.1 3.0 -40°C ≤ TJ ≤ 85°C VCM Stepped from 0 V to 2.7 V 500 dB dB 74 2.55 2.66 V 2.68 RL = 1k to V+/2 40 RL = 10k to V+/2 20 150 mV All limits are ensured by testing or statistical analysis. Typical values represent the most likely parametric norm. Slew rate is the average of the rising and falling slew rates. ensured based on characterization only. Positive current corresponds to current flowing into the device. Offset voltage average drift determined by dividing the change in VOS at temperature extremes into the total temperature change. Copyright © 2001–2014, Texas Instruments Incorporated Product Folder Links: LMH6645 LMH6646 LMH6647 Submit Documentation Feedback 5 LMH6645, LMH6646, LMH6647 SNOS970D – JUNE 2001 – REVISED NOVEMBER 2014 www.ti.com Electrical Characteristics 2.7 V (continued) Unless otherwise specified, all limits ensured for at TJ = 25°C, V+ = 2.7V, V− = 0V, VCM = VO = V+/2, and Rf = 2kΩ, and RL = 1kΩ to V+/2. PARAMETER ISC Output short circuit current IOUT 43 Sinking to V+ VID = −200mV 42 PSRR Power supply rejection ratio V+ − IS Supply current (per channel) MAX (1) UNIT mA (7) (8) VOUT = 0.5V from rails 6 TYP (2) Sourcing to V− VID = 200mV (7) (8) Output current (7) (8) MIN (1) TEST CONDITIONS = 2.7V to 3.7V or V = 0V to −1V 75 Normal Operation Shutdown Mode (LMH6647 only) ±20 mA 83 dB 650 1250 15 50 μA Short circuit test is a momentary test. Output short circuit duration is infinite for VS < 6V at room temperature and below. For VS > 6V, allowable short circuit duration is 1.5ms. Submit Documentation Feedback Copyright © 2001–2014, Texas Instruments Incorporated Product Folder Links: LMH6645 LMH6646 LMH6647 LMH6645, LMH6646, LMH6647 www.ti.com SNOS970D – JUNE 2001 – REVISED NOVEMBER 2014 7.6 Electrical Characteristics 5V Unless otherwise specified, all limits ensured for at TJ = 25°C, V+ = 5V, V− = 0V, VCM = VO = V+/2, and Rf = 2kΩ, and RL = 1kΩ to V+/2. PARAMETER TEST CONDITIONS BW −3dB BW en Input-referred voltage noise in Input-referred current noise CT Rej. Cross-talk rejection (LMH6646 only) f = 5MHz, Receiver: Rf = Rg = 510Ω, AV = +2 SR Slew rate AV = −1, VO = 2 VPP See (3), (4) TON AV = +1, VOUT = 200 mVPP MIN (1) TYP (2) 40 55 f = 100kHz 17 f = 1kHz 25 f = 100kHz 0.75 f = 1kHz 1.20 MAX (1) UNIT MHz nV/√Hz pA/√Hz 47 dB 22 V/μs Turn-on time (LMH6647 only) 210 ns TOFF Turn-off time (LMH6647 only) 500 ns THSD Shutdown threshold (LMH6647 only) IS ≤ 50μA ISD Shutdown pin input current (LMH6647 only) See VOS Input offset voltage TC VOS Input offset average drift 15 4.25 V (5) −20 0V ≤ VCM ≤ 5V −3 -40°C ≤ TJ ≤ 85°C See 4.60 ±1 −4 (6) μA 3 4 μV/C ±5 VCM = 4.8V (5) +0.36 -40°C ≤ TJ ≤ 85°C mV +2 −2.2 μA IB Input bias current IOS Input offset current RIN Common mode input resistance 3 MΩ CIN Common mode input capacitance 2 pF CMVR Input common-mode voltage range VCM = 0.5V (5) −0.68 -40°C ≤ TJ ≤ 85°C −2.2 0V ≤ VCM ≤ 5V 1 −0.5 CMRR ≥ 50dB -40°C ≤ TJ ≤ 85°C V 5.1 Common mode rejection ratio VCM Stepped from 0V to 5V 56 82 VCM Stepped from 0V to 3.8V 66 85 AVOL Large signal voltage gain VO = 1.5V to 3.5V 76 85 (1) (2) (3) (4) (5) (6) nA −0.3 5.5 CMRR -40°C ≤ TJ ≤ 85°C 500 −0.1 5.3 -40°C ≤ TJ ≤ 85°C −2 74 dB dB All limits are ensured by testing or statistical analysis. Typical values represent the most likely parametric norm. Slew rate is the average of the rising and falling slew rates. ensured based on characterization only. Positive current corresponds to current flowing into the device. Offset voltage average drift determined by dividing the change in VOS at temperature extremes into the total temperature change. Copyright © 2001–2014, Texas Instruments Incorporated Product Folder Links: LMH6645 LMH6646 LMH6647 Submit Documentation Feedback 7 LMH6645, LMH6646, LMH6647 SNOS970D – JUNE 2001 – REVISED NOVEMBER 2014 www.ti.com Electrical Characteristics 5V (continued) Unless otherwise specified, all limits ensured for at TJ = 25°C, V+ = 5V, V− = 0V, VCM = VO = V+/2, and Rf = 2kΩ, and RL = 1kΩ to V+/2. PARAMETER Output swing high VO Output swing low ISC Output short circuit current TEST CONDITIONS RL = 1k to V+/2 4.95 MAX (1) 50 20 Sourcing to V− VID = 200mV (7) (8) 55 200 53 (7) (8) VOUT = 0.5V From rails Power supply rejection ratio V+ = 5V to 6V or V− = 0V to −1V Supply current (per channel) Normal Operation mV mA + Sinking to V VID = −200mV UNIT V 4.98 RL = 10k to V+/2 Output current 8 4.80 RL = 1k to V+/2 PSRR (7) (8) TYP (2) RL = 10k to V+/2 IOUT IS MIN (1) ±20 75 Shutdown Mode (LMH6647 only) mA 95 dB 700 1400 10 50 μA Short circuit test is a momentary test. Output short circuit duration is infinite for VS < 6V at room temperature and below. For VS > 6V, allowable short circuit duration is 1.5ms. Submit Documentation Feedback Copyright © 2001–2014, Texas Instruments Incorporated Product Folder Links: LMH6645 LMH6646 LMH6647 LMH6645, LMH6646, LMH6647 www.ti.com SNOS970D – JUNE 2001 – REVISED NOVEMBER 2014 7.7 Electrical Characteristics ±5V Unless otherwise specified, all limits ensured for at TJ = 25°C, V+ = 5V, V− = −5V, VCM = VO = 0V, Rf = 2kΩ, and RL = 1kΩ to GND. PARAMETER TEST CONDITIONS BW −3dB BW en Input-referred voltage noise in Input-referred current noise CT Rej. Cross-talk rejection (LMH6646 only) f = 5MHz, Receiver: Rf = Rg = 510 Ω, AV = +2 SR Slew rate AV = −1, VO = 2 VPP (3) TON AV = +1, VOUT = 200 mVPP MIN (1) TYP (2) 40 55 f = 100 kHz 17 f = 1 kHz 25 f = 100 kHz 0.75 f = 1 kHz 1.20 MAX (1) UNIT MHz nV/√Hz pA/√Hz 47 dB 22 V/μs Turn-on time (LMH6647 only) 200 ns TOFF Turn-off time (LMH6647 only) 700 ns THSD Shutdown threshold (LMH6647 only) IS ≤ 50 μA ISD Shutdown pin input current (LMH6647 only) See VOS Input offset voltage −5V ≤ VCM ≤ 5 V TC VOS Input offset average drift See 4.25 (4) 4.60 V −20 −3 -40°C ≤ TJ ≤ 85°C ±1 −4 (5) VCM = 4.8 V IB 15 μA 3 μV/°C ±5 +0.40 (4) -40°C ≤ TJ ≤ 85°C Input bias current VCM = −4.5 V mV 4 +2 +2.2 −0.65 (4) -40°C ≤ TJ ≤ 85°C −2 μA −2.2 −5V ≤ VCM ≤ 5 V IOS Input offset current 3 RIN Common mode input resistance 3 MΩ CIN Common mode input capacitance 2 pF −5.5 CMVR Input common-mode voltage range CMRR ≥ 50dB -40°C ≤ TJ ≤ 85°C 5.5 Common mode rejection ratio VCM Stepped from −5 V to 5 V 60 84 VCM Stepped from −5 V to 3.5 V 66 104 AVOL Large signal voltage gain VO = −2 V to 2 V 76 85 (1) (2) (3) (4) (5) V 5.1 CMRR -40°C ≤ TJ ≤ 85°C nA −5.3 −5.1 5.3 -40°C ≤ TJ ≤ 85°C 500 74 dB dB All limits are ensured by testing or statistical analysis. Typical values represent the most likely parametric norm. Slew rate is the average of the rising and falling slew rates. Positive current corresponds to current flowing into the device. Offset voltage average drift determined by dividing the change in VOS at temperature extremes into the total temperature change. Copyright © 2001–2014, Texas Instruments Incorporated Product Folder Links: LMH6645 LMH6646 LMH6647 Submit Documentation Feedback 9 LMH6645, LMH6646, LMH6647 SNOS970D – JUNE 2001 – REVISED NOVEMBER 2014 www.ti.com Electrical Characteristics ±5V (continued) Unless otherwise specified, all limits ensured for at TJ = 25°C, V+ = 5V, V− = −5V, VCM = VO = 0V, Rf = 2kΩ, and RL = 1kΩ to GND. PARAMETER Output swing high VO Output swing low ISC Output short circuit current TEST CONDITIONS RL = 1 kΩ 4.92 RL = 1 kΩ −4.93 RL = 10 kΩ −4.98 Sourcing to V− VID = 200 mV (6) (7) MAX (1) −4.70 VOUT = 0.5V from rails V+ = 5 V to 6 V or V− = −5 V to −6 V Supply current (per channel) Normal Operation V 66 mA Sinking to V VID = −200 mV (6) (7) Power supply rejection ratio UNIT V + Output current 10 4.70 4.97 PSRR (6) (7) TYP (2) RL = 10 kΩ IOUT IS MIN (1) 61 ±20 76 Shutdown Mode (LMH6647 only) mA 95 dB 725 1600 10 50 μA Short circuit test is a momentary test. Output short circuit duration is infinite for VS < 6V at room temperature and below. For VS > 6V, allowable short circuit duration is 1.5ms. Submit Documentation Feedback Copyright © 2001–2014, Texas Instruments Incorporated Product Folder Links: LMH6645 LMH6646 LMH6647 LMH6645, LMH6646, LMH6647 www.ti.com SNOS970D – JUNE 2001 – REVISED NOVEMBER 2014 7.8 Typical Performance Characteristics At TJ = 25°C. Unless otherwise specified. GAIN AV = +1 0 25°C 50 AV = +10 -4 0 PHASE 50 Phase (°) 0 PHASE Gain (dB) -2 -4 Phase (°) -2 Gain (dB) AV = +2 GAIN 85°C 0 100 100 -40°C AV = +5 100k Frequency (Hz) AV = + 1 VOUT = 200 mVpp 1M 100k 100M 200M 10M 1M VS = ±2.5 V RL = 1k Figure 1. Closed Loop Frequency Response for Various Temperature 10M Frequency (Hz) VS = ±5 V 200M RL = 1 kΩ Figure 2. Frequency Response for Various AV 70 -50 60 PHASE 50 40 80 GAIN 20 60 40 -40°C 10 20 0 -60 THD (dBc) 85°C 85°C 30 Phase (°) Gain (dB) -55 100 -65 VS = ±2.5 V -40°C 100k 1M -20 10M -75 -80 100M 1 2 Frequency (Hz) VS = ±2.5 V VS = ±5 V -70 0 RL = 500 Ω RL = 2k 3 4 5 VOUT (VPP) 6 7 8 f = 100 KHz AV = +2 Figure 4. THD vs. Output Swing Figure 3. Open Loop Gain/Phase vs. Frequency for Various Temperature -30 10 -35 -45 VOUT (VPP) THD (dBc) -40 -50 -55 VS = ±5 V VS = ±2.5 V 1 -60 -65 -70 1 RL = 500 Ω 2 3 4 VOUT (VPP) 5 0.1 100k 6 f = 1 MHz Figure 5. THD vs. Output Swing AV = +2 1M 10M Frequency (Hz) RL = 500 Ω Rf = Rg = 2K AV = +2 VS = ±5 V Figure 6. Output Swing vs. Frequency Copyright © 2001–2014, Texas Instruments Incorporated Product Folder Links: LMH6645 LMH6646 LMH6647 Submit Documentation Feedback 11 LMH6645, LMH6646, LMH6647 SNOS970D – JUNE 2001 – REVISED NOVEMBER 2014 www.ti.com Typical Performance Characteristics (continued) At TJ = 25°C. Unless otherwise specified. 250 10.00 1000 ±0.1% 100 Hz) CURRENT 1.00 100 50 VOLTAGE ±1% 0 0 1 2 3 10 10 4 Step Amplitude (VPP) RL = 500 Ω VS = ±2.5 V AV = -1 100 0.10 100k 10k 1k FREQUENCY (Hz) CL = 13 pF Figure 7. Settling Time vs. Step Size Figure 8. Noise vs. Frequency -40°C -40°C 10 10 85°C VOUT from V (V) 85°C 1.0 - 1.0 + VOUT from V (V) in (pA/ 150 en (nV/ Hz) Settling Time (ns) 200 0.1 85°C 0.1 85°C 25°C -40°C -40°C 0.01 .01 .1 1 10 ISOURCE (mA) 0.01 .01 100 VS = 10 V Figure 9. VOUT from V+ vs. ISOURCE Figure 10. VOUT from V− vs. ISINK 10k VOUT from V (mV) 10k 1k 1k + + VOUT from V (mV) 100 ISINK (mA) VS = 10 V 10 V 5V 100 10 V 5V 100 2.7 V 10 0 T = 25°C 2.7 V 10 500 1k 1.5k RL (:) 2k 2.5k AV = +1 Figure 11. Output Swing from V+ vs. RL (tied to VS/2) 12 10 1 .1 Submit Documentation Feedback 0 500 1k 1.5k 2k 2.5k RL (:) T = -40°C AV = +1 Figure 12. Output Swing from V+ vs. RL (Tied to VS/2) Copyright © 2001–2014, Texas Instruments Incorporated Product Folder Links: LMH6645 LMH6646 LMH6647 LMH6645, LMH6646, LMH6647 www.ti.com SNOS970D – JUNE 2001 – REVISED NOVEMBER 2014 Typical Performance Characteristics (continued) At TJ = 25°C. Unless otherwise specified. 10k VOUT from V (mV) VOUT from V (mV) 10k 1k - + 1k 10 V 5V 100 10 V 5V 100 2.7 V 2.7 V 10 10 0 1.5k 1k 500 2k 500 0 2.5k T = 85°C T = 25°C AV = +1 2.5k AV = +1 Figure 14. Output Swing from V− vs. RL (Tied to VS/2) 10k VOUT from V (mV) 10k 1k - 1k - VOUT from V (mV) 2k RL (:) Figure 13. Output Swing from V+ vs. RL (Tied to VS/2) 10 V 5V 100 500 1.5k RL (:) T = 40°C 2k 25k 10k 1k 1k ts 100 100 CL 10 10 1 5 1 VS = +5 V 4 3 Closed Loop Gain 200 mVpp STEP 500 1k 1.5k RL (:) 2k 2.5k AV = +1 Figure 16. Output Swing from V− vs. RL (Tied to VS/2) 500 ts (± 1% Settling with CL) (ns) 10k 2 0 T = 85°C AV = +1 Figure 15. Output Swing from V− vs. RL (Tied to VS/2) 1 5V 100 10 1k 30% OVERSHOOT Figure 17. Cap Load Tolerance and Setting Time vs. Closed Loop Gain 100 ZOUT (:) 0 10 V 2.7 V 2.7 V 10 CL (pF) 1.5k 1k RL (:) 10 1.0 0.1 0.02 10k 100k VS = ±2.5 V 1M 10M Frequency (Hz) 200M AV = +1 Figure 18. ZOUT vs. Frequency Copyright © 2001–2014, Texas Instruments Incorporated Product Folder Links: LMH6645 LMH6646 LMH6647 Submit Documentation Feedback 13 LMH6645, LMH6646, LMH6647 SNOS970D – JUNE 2001 – REVISED NOVEMBER 2014 www.ti.com Typical Performance Characteristics (continued) At TJ = 25°C. Unless otherwise specified. 110 90 +PSRR 100 80 90 70 CMRR (dB) PSRR (dB) 80 70 -PSRR 60 50 60 50 40 40 30 30 20 20 10 100 10k 100k Frequency (Hz) 1k VS = ±2.5V 1M 10 1k 10M 100k 10k 10M 1M Frequency (Hz) RF = 10 kΩ RG = 1 kΩ VS = 5 V Figure 19. PSRR vs. Frequency Figure 20. CMRR vs. Frequency 100 90 CT (rej) (dB) 80 70 60 50 40 30 1k 10k 100k 1M 10M Frequency (Hz) Receive CH.: AV = +2 Rf = Rg = 510 VS = ±5 V Figure 21. Crosstalk Rejection vs. Frequency (Output to Output, LMH6646) Figure 22. VOS Distribution 0.25 0.2 -40°C 0.15 0.2 0.1 0.15 25°C VOS (mV) VOS (mV) -40°C 0.1 0.05 0 -0.05 -0.1 0.05 25°C 0 85°C -0.05 -0.1 -0.15 85°C -0.15 -0.2 -0.25 -0.2 -0.3 -0.25 -2 1 2 3 4 5 6 7 8 9 10 11 12 VS (V) Figure 23. VOS vs. VS (a Typical Unit) Submit Documentation Feedback 0 VS = 10 V VCM = 0.5 V 14 σ = 4.6 mV N = 19k UNITS 2 6 4 VOUT (V) 8 10 12 RL = 10 kΩ to VS/2 Figure 24. VOS vs. VOUT (a Typical Unit) Copyright © 2001–2014, Texas Instruments Incorporated Product Folder Links: LMH6645 LMH6646 LMH6647 LMH6645, LMH6646, LMH6647 www.ti.com SNOS970D – JUNE 2001 – REVISED NOVEMBER 2014 Typical Performance Characteristics (continued) At TJ = 25°C. Unless otherwise specified. 0.4 0.6 VS = 2.7V 0.3 40°C 0.5 -40°C 25°C 0.4 0.1 VOS (mV) VOS (mV) 0.2 25°C 0 85°C -0.1 0. 3 0.2 85°C -0.2 0.1 -0.3 -0.4 -2 0 4 2 6 8 10 0 -0.5 12 0 0.5 VS = 10 V 0.5 0.5 0.4 0.4 VOS (mV) VOS (mV) 0.6 -40°C 0.2 25°C 0.3 -40°C 0.2 0.1 25°C 0 0 85°C 0 85°C 2 1 3 4 -0.1 -2 6 5 0 2 VCM (V) 4 6 8 10 12 VCM (V) VS = 5 V VS = 10 V Figure 27. VOS vs. VCM (a Typical Unit) Figure 28. VOS vs. VCM (a Typical Unit) 0.6 0.6 85°C 85°C 0.4 0.4 25°C 0.2 25°C 0.2 -40°C 0 -40°C 0 -0.2 IB (µA) IB (µA) 3 Figure 26. VOS vs. VCM (a Typical Unit) 0.6 -0.1 -1 2.5 VS = 2.7 V Figure 25. VOS vs. VOUT (a Typical Unit) 0.1 2 VCM (V) RL = 1 kΩ to VS/2 0.3 1.5 1 VOUT (V) -40°C 25°C -0.2 -0.4 -0.4 -0.6 -0.6 25°C -40°C 85°C -0.8 -0.8 85°C -1 -0.5 -1 0 0.5 1 1.5 2 2.5 3 -5 VCM (V) -3 1 -1 VCM (V) 3 5 VS = ±5 V VS = 2.7 V Figure 29. IB vs. VCM Copyright © 2001–2014, Texas Instruments Incorporated Product Folder Links: LMH6645 LMH6646 LMH6647 Figure 30. IB vs. VCM Submit Documentation Feedback 15 LMH6645, LMH6646, LMH6647 SNOS970D – JUNE 2001 – REVISED NOVEMBER 2014 www.ti.com Typical Performance Characteristics (continued) At TJ = 25°C. Unless otherwise specified. -0.50 0.95 -0.52 85°C 0.9 -0.54 IS (mA) (per channel) IB (µA) -0.56 -0.58 25°C -0.60 -0.62 -0.64 -0.66 0.8 0.75 25°C 0.7 0.65 0.6 0.55 -40°C -0.68 -0.7 85°C 0.85 -40°C 0.5 1 2 3 4 6 5 7 8 0.45 9 10 11 12 -7 -5 -3 VS (V) Figure 31. IB vs. VS 2.35 2.85 Figure 32. IS vs. VCM 0.9 0.85 0.8 0.7 0.75 0.6 0.7 0.65 25°C 25°C 0.5 -40°C 0.4 0.6 0.3 0.55 0.2 0.5 85°C 0.8 85°C IS (mA) IS (mA) (per channel) 7 VS = ±5 V 0.9 0.1 -40°C 0 0.45 -0.1 -0.15 0.35 0.4 1 2 3 4 5 6 7 8 9 10 11 12 VS (V) VS = ±5 V 0.85 1.35 1.85 VSHUTDOWN (V) VS = 2.7 V VCM = 0.2 V Figure 34. IS vs. VSHUTDOWN (LMH6647) Figure 33. IS (mA) vs. Vs(V) 0.9 0.9 85°C VS = 5V 0.8 0.8 85°C 0.7 0.7 0.6 0. 5 0.4 0.6 25°C IS (mA) IS (mA) 5 3 1 VCM (V) VCM = 0.2 V -40°C 0.3 25°C 0.5 -40°C 0.4 0.3 0.2 0.2 0.1 0.1 0 0 -0.1 -0.5 -0.1 -6 0.5 3.5 1.5 2.5 VSHUTDOWN (V) 4.5 5.5 Figure 35. IS vs. VSHUTDOWN (LMH6647) Submit Documentation Feedback -4 -2 0 2 4 6 VSHUTDOWN (V) VS = ±5 V VS = 5 V 16 -1 Figure 36. IS vs. VSHUTDOWN (LMH6647) Copyright © 2001–2014, Texas Instruments Incorporated Product Folder Links: LMH6645 LMH6646 LMH6647 LMH6645, LMH6646, LMH6647 www.ti.com SNOS970D – JUNE 2001 – REVISED NOVEMBER 2014 Typical Performance Characteristics (continued) At TJ = 25°C. Unless otherwise specified. 1000 -100 85°C ISHUTDOWN PIN (P$) 25°C -40°C 100 IVCC (µA) -10 IVCC SHUTDOWN PIN CURRENT -1 10 85°C -40°C 1 -3.5 25°C -2.5 -1.5 -0.5 0.5 1.5 VSHUTDOWN (V) 2.5 -0.1 3.5 40 mV/DIV VS = ±5 V VOUT = 0.2 Vpp VS = ±2.5 V 20 ns/DIV RL = 1kΩ AV = +1 Figure 38. Small Signal Step Response Figure 37. Shutdown Pin and Supply Current vs. Shutdown Voltage (LMH6647) 0.2 V/DIV VS = 2.7 V AV = +1 0.2 V/DIV 40 ns/DIV RL = 1 kΩ VS = 5 V AV = -1 VOUT = 1 Vpp 40 ns/DIV RL = 1 kΩ VOUT = 1 Vpp Figure 40. Large Signal Step Response Figure 39. Large Signal Step Response INPUT OUTPUT 1 V/DIV AV = +2 VS = ±2.5 V 400 ns/DIV RL = 1 kΩ Rf= Rg = 2 kΩ Figure 41. Output Overload Recovery Copyright © 2001–2014, Texas Instruments Incorporated Product Folder Links: LMH6645 LMH6646 LMH6647 Submit Documentation Feedback 17 LMH6645, LMH6646, LMH6647 SNOS970D – JUNE 2001 – REVISED NOVEMBER 2014 www.ti.com 8 Detailed Description 8.1 Overview The LMH664x family is based on proprietary VIP10 dielectrically isolated bipolar process. This device family architecture features the following: • Complimentary bipolar devices with exceptionally high ft (∼8 GHz) even under low supply voltage (2.7 V) and low Collector bias current. • Rail-to-Rail input which allows the input common mode voltage to go beyond either rail by about 0.5 V typically. • A class A-B “turn-around” stage with improved noise, offset, and reduced power dissipation compared to similar speed devices (patent pending). • Common Emitter push-pull output stage capable of 20 mA output current (at 0.5 V from the supply rails) while consuming only ∼700 μA of total supply current per channel. This architecture allows output to reach within mV of either supply rail at light loads. • Consistent performance from any supply voltage (2.7 V to 10 V) with little variation with supply voltage for the most important specifications (BW, SR, IOUT, for example) 8.2 Functional Block Diagram INVERTING INPUT RS 200-400: D4 D1 D3 D2 NON-INVERTING INPUT Figure 42. LMH6647 Equivalent Input in Shutdown Mode During shutdown, the input stage has an equivalent circuit as shown below in Figure 42. 18 Submit Documentation Feedback Copyright © 2001–2014, Texas Instruments Incorporated Product Folder Links: LMH6645 LMH6646 LMH6647 LMH6645, LMH6646, LMH6647 www.ti.com SNOS970D – JUNE 2001 – REVISED NOVEMBER 2014 8.3 Feature Description 8.3.1 LMH6647 Micro-power Shutdown To keep the output at or near ground during shutdown when there is no other device to hold the output low, a switch (transistor) could be used to shunt the output to ground. Figure 43 shows a circuit where a NPN bipolar is used to keep the output near ground (∼ 80 mV): 5V - VOUT LMH6647 VIN + SD V - SHUTDOWN INPUT Q1 RS 10k Figure 43. Active Pull-Down Schematic Figure 44 shows the output waveform. VOUT SD 2.00 µs/DIV 2 V/DIV Figure 44. Output Held Low by Active Pull-Down Circuit For normal operation, tie the SD pin to V−. NOTE If bipolar transistor power dissipation is not tolerable, the switch could be by a N-channel enhancement mode MOSFET. Copyright © 2001–2014, Texas Instruments Incorporated Product Folder Links: LMH6645 LMH6646 LMH6647 Submit Documentation Feedback 19 LMH6645, LMH6646, LMH6647 SNOS970D – JUNE 2001 – REVISED NOVEMBER 2014 www.ti.com 8.4 Device Functional Modes The LMH6647 can be shutdown to save power and reduce its supply current to less than 50 μA ensured, by applying a voltage to the SD pin. The SD pin is “active high” and needs to be tied to V− for normal operation. This input is low current (< 20 μA, 4 pF equivalent capacitance) and a resistor to V− (≤ 20 kΩ) will result in normal operation. Shutdown is ensured when SD pin is 0.4V or less from V+ at any operating supply voltage and temperature. In the shutdown mode, essentially all internal device biasing is turned off in order to minimize supply current flow and the output goes into Hi-Z (high impedance) mode. Complete device Turn-on and Turn-off times vary considerably relative to the output loading conditions, output voltage, and input impedance, but is generally limited to less than 1μs (see tables for actual data). As seen in Figure 42 in shutdown, there may be current flow through the internal diodes shown, caused by input potential, if present. This current may flow through the external feedback resistor and result in an apparent output signal. In most shutdown applications the presence of this output is inconsequential. However, if the output is “forced” by another device such as in a multiplexer, the other device will need to conduct the current described in order to maintain the output potential. The total input common mode voltage range, which extends from below V− to beyond V+, is covered by both an NPN and a PNP stage. The NPN stage is switched on whenever the input is less than 1.2 V from V+ and the PNP stage covers the rest of the range. In terms of the input voltage, there is an overlapping region where both stages are processing the input signal. This region is about 0.5 V from beginning to the end. As far as the device application is concerned, this transition is a transparent operation. However, keep in mind that the input bias current value and direction will depend on which input stage is operating (see Figure 29). For low distortion applications, it is best to keep the input common mode voltage from crossing this transition point. Low gain settling applications, which generally encounter larger peak-to-peak input voltages, could be configured as inverting stages to eliminate common mode voltage fluctuations. In terms of the output, when the output swing approaches either supply rail, the output transistor will enter a quasi-saturated state. A subtle effect of this operational region is that there is an increase in supply current in this state (up to 1 mA). The onset of Quasi-saturation region is a function of output loading (current) and varies from 100 mV at no load to about 1 V when output is delivering 20 mA, as measured from supplies. Both input common mode voltage and output voltage level affect the supply current (see Figure 32). With 2.7V supplies and a common mode input voltage range that extends beyond either supply rail, the LMH664x family is well suited to many low voltage/low power applications. Even with 2.7 V supplies, the -3dB BW (@ AV = +1) is typically 55 MHz with a tested limit of 45 MHz. Production testing guarantees that process variations will not compromise speed. This device family is designed to avoid output phase reversal. With input over-drive, the output is kept near the supply rail (or as close to it as mandated by the closed loop gain setting and the input voltage). Figure 45, below, shows the input and output voltage when the input voltage significantly exceeds the supply voltages. The output does not exhibit any phase reversal as some op amps do. However, if the input voltage range is exceeded by more than a diode drop beyond either rail, the internal ESD protection diodes will start to conduct. The current flow in these ESD diodes should be externally limited. 20 Submit Documentation Feedback Copyright © 2001–2014, Texas Instruments Incorporated Product Folder Links: LMH6645 LMH6646 LMH6647 LMH6645, LMH6646, LMH6647 www.ti.com SNOS970D – JUNE 2001 – REVISED NOVEMBER 2014 Device Functional Modes (continued) Figure 45 demonstrates that the output is well behaved and there are no spikes or glitches due to the switching. Switching times are approximately around 500 ns based on the time when the output is considered “valid”. INPUT 2 V/DIV OUTPUT 10.0 µs/DIV Figure 45. Input/Output Shown with Exceeded Input CMVR Copyright © 2001–2014, Texas Instruments Incorporated Product Folder Links: LMH6645 LMH6646 LMH6647 Submit Documentation Feedback 21 LMH6645, LMH6646, LMH6647 SNOS970D – JUNE 2001 – REVISED NOVEMBER 2014 www.ti.com 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 9.1 Application Information The LMH664x family is well suited to many low voltage/low power applications and is designed to avoid output phase reversal. Figure 45, for example, depicts the Input/Output Shown with Exceeded Input CMVR and functions as a 2:1 MUX operating on a single 2.7-V power supply by utilizing the shutdown feature of the LMH6647. 9.2 Typical Application 1/5 74HC04 1/5 74HC04 SELECT INPUT 2k 2k 2.7V - SHUTDOWN LMH6647 + INPUT A RL 2.7V SHUTDOWN + INPUT B LMH664 7 - 2k 2k Figure 46. 2:1 MUX Operating off a 2.7V Single Supply 9.2.1 Design Requirements This application requires fast, glitch-less transition between selected channels. The LMH6647 turn on and turn off times are 250 ns and 560 ns respectively. Transition between channels is devoid of any excessive glitches. 9.2.2 Detailed Design Procedure In this application, the LMH6647 output pins are directly tied to each other. The shutdown pin of each LMH6647 is driven in-opposite sense of the other (that is, “Low” on 1st LMH6647 with “High” on the 2nd LMH6647, and vice versa). When shutdown is invoked, the device output enters Hi-Z state, while the alternate LMH6647 is being powered on simultaneously. This way, the shutdown function serves the dual purpose of allowing only the input associated with device which is not in shutdown to be selected and to appear at the output. 22 Submit Documentation Feedback Copyright © 2001–2014, Texas Instruments Incorporated Product Folder Links: LMH6645 LMH6646 LMH6647 LMH6645, LMH6646, LMH6647 www.ti.com SNOS970D – JUNE 2001 – REVISED NOVEMBER 2014 Typical Application (continued) 9.2.3 Application Curve Figure 47 shows the MUX output when selecting between a 1 MHz sine and a 250 KHz triangular waveform. VOUT SELECT 1 V/DIV 1 µs/DIV Figure 47. 2:1 MUX Output 10 Power Supply Recommendations The LMH664x device family can operate off a single supply or with dual supplies. The input CM capability of the parts (CMVR) extends covers the entire supply voltage range for maximum flexibility. Supplies should be decoupled with low inductance, often ceramic, capacitors to ground less than 0.5 inches from the device pins. The use of ground plane is recommended, and as in most high speed devices, it is advisable to remove ground plane close to device sensitive pins such as the inputs. Copyright © 2001–2014, Texas Instruments Incorporated Product Folder Links: LMH6645 LMH6646 LMH6647 Submit Documentation Feedback 23 LMH6645, LMH6646, LMH6647 SNOS970D – JUNE 2001 – REVISED NOVEMBER 2014 www.ti.com 11 Layout 11.1 Layout Guidelines Generally, a good high-frequency layout will keep power supply and ground traces away from the inverting input and output pins. Parasitic capacitances on these nodes to ground will cause frequency response peaking and possible circuit oscillations. For more information, see Application Note OA-15, Frequent Faux Pas in Applying Wideband Current Feedback Amplifiers (SNOA367). Another important parameter in working with high speed/high performance amplifiers is the component values selection. Choosing large valued external resistors will affect the closed loop behavior of the stage because of the interaction of these resistors with parasitic capacitances. These capacitors could be inherent to the device or a by-product of the board layout and component placement. Either way, keeping the resistor values lower will diminish this interaction. On the other hand, choosing very low value resistors could load down nodes and will contribute to higher overall power dissipation. 11.2 Layout Example Figure 48. Layer2 Silk (SOT-23 Board Layout) 24 Submit Documentation Feedback Figure 49. Layer1 Silk (SOT-23 Board Layout) Copyright © 2001–2014, Texas Instruments Incorporated Product Folder Links: LMH6645 LMH6646 LMH6647 LMH6645, LMH6646, LMH6647 www.ti.com SNOS970D – JUNE 2001 – REVISED NOVEMBER 2014 12 Device and Documentation Support 12.1 Documentation Support 12.1.1 Related Documentation For related documentation, see the following: • Absolute Maximum Ratings for Soldering (SNOA549) • Frequent Faux Pas in Applying Wideband Current Feedback Amplifiers, Application Note OA-15 (SNOA367) • Semiconductor and IC Package Thermal Metrics (SPRA953) 12.2 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 1. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY LMH6645 Click here Click here Click here Click here Click here LMH6646 Click here Click here Click here Click here Click here LMH6647 Click here Click here Click here Click here Click here 12.3 Trademarks All trademarks are the property of their respective owners. 12.4 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 12.5 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Copyright © 2001–2014, Texas Instruments Incorporated Product Folder Links: LMH6645 LMH6646 LMH6647 Submit Documentation Feedback 25 PACKAGE OPTION ADDENDUM www.ti.com 27-Jul-2016 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LMH6645MA/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LMH66 45MA LMH6645MAX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LMH66 45MA LMH6645MF/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 A68A LMH6645MFX/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 A68A LMH6646 MDC ACTIVE DIESALE Y 0 374 Green (RoHS & no Sb/Br) Call TI Level-1-NA-UNLIM -40 to 85 LMH6646MA/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LMH66 46MA LMH6646MAX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LMH66 46MA LMH6646MM NRND VSSOP DGK 8 1000 TBD Call TI Call TI -40 to 85 LMH6646MM/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 A70A LMH6646MMX/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 A70A LMH6647MA/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LMH66 47MA LMH6647MAX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LMH66 47MA LMH6647MF NRND SOT-23 DBV 6 1000 TBD Call TI Call TI -40 to 85 LMH6647MF/NOPB ACTIVE SOT-23 DBV 6 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 A69A LMH6647MFX/NOPB ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 A69A (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 27-Jul-2016 (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 16-Dec-2015 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LMH6645MAX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LMH6645MF/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LMH6645MFX/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LMH6646MAX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LMH6646MM/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LMH6646MMX/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LMH6647MAX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LMH6647MF/NOPB SOT-23 DBV 6 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LMH6647MFX/NOPB SOT-23 DBV 6 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 16-Dec-2015 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LMH6645MAX/NOPB SOIC D 8 2500 367.0 367.0 35.0 LMH6645MF/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LMH6645MFX/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LMH6646MAX/NOPB SOIC D 8 2500 367.0 367.0 35.0 LMH6646MM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0 LMH6646MMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0 LMH6647MAX/NOPB SOIC D 8 2500 367.0 367.0 35.0 LMH6647MF/NOPB SOT-23 DBV 6 1000 210.0 185.0 35.0 LMH6647MFX/NOPB SOT-23 DBV 6 3000 210.0 185.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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