TI1 LMC6482MMD8 Lmc6482qml cmos dual rail-to-rail input and output operational amplifier Datasheet

LMC6482QML
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LMC6482QML CMOS Dual Rail-To-Rail Input and Output Operational Amplifier
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FEATURES
1
(Typical unless otherwise noted)
2
•
•
•
•
•
•
•
Rail-to-Rail Input Common-Mode Voltage
Range (Ensured Over Temperature)
Rail-to-Rail Output Swing (within 20mV of
supply rail, 100KΩ load)
Ensured 5V and 15V Performance
Excellent CMRR and PSRR: 82dB
Ultra Low Input Current: 20fA
High Voltage Gain (RL = 500KΩ): 130dB
Specified for 2KΩ and 600Ω loads
APPLICATIONS
•
•
•
•
•
•
Data Acquisition Systems
Transducer Amplifiers
Hand-held Analytic Instruments
Medical Instrumentation
Active Filter, Peak Detector, Sample and Hold,
pH Meter, Current Source
Improved Replacement for TLC272, TLC277
DESCRIPTION
The LMC6482 provides a common-mode range that
extends to both supply rails. This rail-to-rail
performance combined with excellent accuracy, due
to a high CMRR, makes it unique among rail-to-rail
input amplifiers.
It is ideal for systems, such as data acquisition, that
require a large input signal range. The LMC6482 is
also an excellent upgrade for circuits using limited
common-mode range amplifiers such as the TLC272
and TLC277.
Maximum dynamic signal range is assured in low
voltage and single supply systems by the LMC6482's
rail-to-rail output swing. The LMC6482's rail-to-rail
output swing is ensured for loads down to 600Ω.
Ensured low voltage characteristics and low power
dissipation make the LMC6482 especially well-suited
for battery-operated systems.
See the LMC6484 data sheet for a Quad CMOS
operational amplifier with these same features.
Connection Diagram
3V Single Supply Buffer Circuit
Rail-To-Rail Input
Rail-To-Rail Output
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings (1)
Supply Voltage (V+ − V−)
16V
Differential Input Voltage
± Supply Voltage
(V+) + 0.3V, (V−) − 0.3V
Voltage at Input/Output Pin
Current at Input Pin
(2)
±5 mA
Current at Output Pin (3) (4)
±30 mA
Current at Power Supply Pin
40 mA
Maximum Junction Temperature (TJmax)
(5) (3)
150°C
Power Dissipation (5)
160mW
−65°C ≤ TA ≤ +150°C
Storage Temperature Range
Thermal Resistance
(6)
θJA
θJC
8LD Ceramic DIP (Still Air)
117°C/W
8LD Ceramic DIP (500LF/Min Air Flow)
62.0°C/W
8LD Ceramic DIP
16.0°C/W
Lead Temp. (Soldering, 10 sec.)
ESD Tolerance
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(7)
260°C
1.5KV
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
Limiting input pin current is only necessary for input voltages that exceed absolute maximum input voltage ratings.
Applies to both single supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C. Output currents in excess of ±30 mA over long term may adversely
affect reliability.
Do not short circuit output to V+, when V+ is greater than 13V or reliability will be adversely affected.
The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature),
θJA (package junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any
temperature is PDmax = (TJmax - TA)/θJA or the number given in the Absolute Maximum Ratings, whichever is lower.
All numbers apply for packages soldered directly into a PC board.
Human body model, 1.5 KΩ in series with 100 pF.
Recommended Operating Range (1)
3.0V ≤ V+ ≤ 15.5V
Supply Voltage
−55°C ≤ TA ≤ +125°C
Operating Temperature Range
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
Quality Conformance Inspection
Mil-Std-883, Method 5005 - Group A
2
Subgroup
Description
Temp (°C)
1
Static tests at
+25
2
Static tests at
+125
3
Static tests at
-55
4
Dynamic tests at
+25
5
Dynamic tests at
+125
6
Dynamic tests at
-55
7
Functional tests at
+25
8A
Functional tests at
+125
8B
Functional tests at
-55
9
Switching tests at
+25
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Quality Conformance Inspection (continued)
Mil-Std-883, Method 5005 - Group A
Subgroup
Description
Temp (°C)
10
Switching tests at
+125
11
Switching tests at
-55
12
Settling time at
+25
13
Settling time at
+125
14
Settling time at
-55
LMC6482 Electrical Characteristics DC Parameters
The following conditions apply, unless otherwise specified.
Symbol
Parameter
VIO
Input Offset Voltage
IIB
Input Bias Current
IIO
V+ = 5V, V− = 0V, VCM = VO = V+/2 and RL > 1M.
Conditions
Notes
Input Offset Current
0V ≤ VCM ≤ 15.0V
V+ = 15V
CMRR
Common Mode Rejection Ratio
0V ≤ VCM ≤ 5.0V
5V ≤ V+ ≤ 15V
VO = 2.5V
+PSRR
Positive Power Supply Rejection
Ratio
-PSRR
Negative Power Supply Rejection -15V ≤ V-≤ -5V
Ratio
VO = -2.5V, V+ = 0V
VCM
Input Common Mode Voltage
Range
VO
(1)
Supply Current
Output Swing
mV
1
1.35
mV
2, 3
25
pA
1
100
pA
2, 3
25
pA
1
100
pA
2, 3
dB
1
62
dB
2, 3
65
dB
1
62
dB
2, 3
65
dB
1
62
dB
2, 3
65
dB
1
62
dB
2, 3
0.0
V
1
V
2, 3
mA
1
12
mA
2, 3
11
mA
1
9.0
mA
2, 3
28
mA
1
22
mA
2, 3
See (1)
30
mA
1
(1)
24
mA
2, 3
See
Both Amps
ICC
0.75
16
V+ = 15V
Sourcing, VO = 0V
V+ = 15V
Sinking, VO = 12V
Units
65
V+
Sinking VO = 5V
Output Short Circuit Current
Subgroups
Max
V++0.25 -0.25
5V ≤ VCM ≤ 15V
For CMRR ≥ 50dB
Sourcing VO = 0V
ISC
Min
Both Amps
V+ = +15V
1.4
mA
1
1.8
mA
2, 3
1.6
mA
1
2.0
mA
2, 3
V+ = 5V
RL = 2KΩ to V+/2
4.8
0.18
V
4
4.7
0.24
V
5, 6
V+ = 5V
RL = 600Ω to V+/2
4.5
0.50
V
4
4.24
0.65
V
5, 6
V+ = 15V
RL = 2KΩ to V+/2
14.4
0.32
V
4
14.2
0.45
V
5, 6
V+ = 15V
RL = 600Ω to V+/2
13.4
1.00
V
4
13.0
1.30
V
5, 6
Do not short circuit output to V+, when V+ is greater than 13V or reliability will be adversely affected.
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LMC6482 Electrical Characteristics DC Parameters (continued)
The following conditions apply, unless otherwise specified.
Symbol
Parameter
V+ = 5V, V− = 0V, VCM = VO = V+/2 and RL > 1M.
Conditions
RL = 2KΩ Sourcing
RL = 2KΩ Sinking
AV
Large Signal Voltage Gain
Min
See (2)
140
V/mV
4
See (2)
84
V/mV
5, 6
See (2)
35
V/mV
4
(2)
20
V/mV
5, 6
See (2)
80
V/mV
4
See (2)
48
V/mV
5, 6
See (2)
18
V/mV
4
See (2)
13
V/mV
5, 6
See
RL = 600Ω Sourcing
RL = 600Ω Sinking
Max
Units
Subgroups
Notes
V+ = 15V, VCM = 7.5V and RL connected to 7.5V. For Sourcing tests, 7.5V ≤ VO ≤ 11.5V. For Sinking tests, 3.5V ≤ VO ≤ 7.5V.
(2)
LMC6482 Electrical Characteristics AC Parameters
The following conditions apply, unless otherwise specified.
Symbol
SR
4
Conditions
Slew Rate
GBW
(1)
Parameter
V+ = 5V, V− = 0V, VCM = VO = V+/2 and RL > 1M.
Gain Bandwidth
Subgroups
0.9
V/µS
4
5, 6
Min
See (1)
See
V+ = 15V
Set up for non-inverting
Units
Notes
(1)
Max
0.6
V/µS
1.25
MHz
4
1.15
MHz
5, 6
V+ = 15V. Connected as Voltage Follower with 10V step input, 2.5V to 12.5V for +slew, and 12.5V to 2.5V for −slew.. Number specified
is the slower of either the positive or negative slew rates.
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Typical Performance Characteristics
VS = +15V, Single Supply, TA = 25°C unless otherwise specified
Supply Current vs. Supply Voltage
Input Current vs. Temperature
Figure 1.
Figure 2.
Sourcing Current vs. Output Voltage
Sourcing Current vs. Output Voltage
Figure 3.
Figure 4.
Sourcing Current vs. Output Voltage
Sinking Current vs. Output Voltage
Figure 5.
Figure 6.
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Typical Performance Characteristics (continued)
VS = +15V, Single Supply, TA = 25°C unless otherwise specified
6
Sinking Current vs. Output Voltage
Sinking Current vs. Output Voltage
Figure 7.
Figure 8.
Output Voltage Swing vs. Supply Voltage
Input Voltage Noise vs. Frequency
Figure 9.
Figure 10.
Input Voltage Noise vs. Input Voltage
Input Voltage Noise vs. Input Voltage
Figure 11.
Figure 12.
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Typical Performance Characteristics (continued)
VS = +15V, Single Supply, TA = 25°C unless otherwise specified
Input Voltage Noise vs. Input Voltage
Crosstalk Rejection vs. Frequency
Figure 13.
Figure 14.
Crosstalk Rejection vs. Frequency
Positive PSRR vs. Frequency
Figure 15.
Figure 16.
Negative PSRR vs. Frequency
CMRR vs. Frequency
Figure 17.
Figure 18.
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Typical Performance Characteristics (continued)
VS = +15V, Single Supply, TA = 25°C unless otherwise specified
8
CMRR vs. Input Voltage
CMRR vs. Input Voltage
Figure 19.
Figure 20.
CMRR vs. Input Voltage
ΔVOS vs. CMR
Figure 21.
Figure 22.
ΔVOS vs. CMR
Input Voltage vs. Output Voltage
Figure 23.
Figure 24.
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Typical Performance Characteristics (continued)
VS = +15V, Single Supply, TA = 25°C unless otherwise specified
Input Voltage vs. Output Voltage
Open Loop Frequency Response
Figure 25.
Figure 26.
Open Loop Frequency Response
Open Loop Frequency Response vs. Temperature
Figure 27.
Figure 28.
Maximum Output Swing vs. Frequency
Gain and Phase vs. Capacitive Load
Figure 29.
Figure 30.
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Typical Performance Characteristics (continued)
VS = +15V, Single Supply, TA = 25°C unless otherwise specified
10
Gain and Phase vs. Capacitive Load
Open Loop Output Impedance vs. Frequency
Figure 31.
Figure 32.
Open Loop Output Impedance vs. Frequency
Slew Rate vs. Supply Voltage
Figure 33.
Figure 34.
Non-Inverting Large Signal Pulse Response
Non-Inverting Large Signal Pulse Response
Figure 35.
Figure 36.
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Typical Performance Characteristics (continued)
VS = +15V, Single Supply, TA = 25°C unless otherwise specified
Non-Inverting Large Signal Pulse Response
Non-Inverting Small Signal Pulse Response
Figure 37.
Figure 38.
Non-Inverting Small Signal Pulse Response
Non-Inverting Small Signal Pulse Response
Figure 39.
Figure 40.
Inverting Large Signal Pulse Response
Inverting Large Signal Pulse Response
Figure 41.
Figure 42.
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Typical Performance Characteristics (continued)
VS = +15V, Single Supply, TA = 25°C unless otherwise specified
12
Inverting Large Signal Pulse Response
Inverting Small Signal Pulse Response
Figure 43.
Figure 44.
Inverting Small Signal Pulse Response
Inverting Small Signal Pulse Response
Figure 45.
Figure 46.
Stability vs. Capacitive Load
Stability vs. Capacitive Load
Figure 47.
Figure 48.
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Typical Performance Characteristics (continued)
VS = +15V, Single Supply, TA = 25°C unless otherwise specified
Stability vs. Capacitive Load
Stability vs. Capacitive Load
Figure 49.
Figure 50.
Stability vs. Capacitive Load
Stability vs. Capacitive Load
Figure 51.
Figure 52.
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APPLICATION INFORMATION
AMPLIFIER TOPOLOGY
The LMC6482 incorporates specially designed wide-compliance range current mirrors and the body effect to
extend input common mode range to each supply rail. Complementary paralleled differential input stages, like the
type used in other CMOS and bipolar rail-to-rail input amplifiers, were not used because of their inherent
accuracy problems due to CMRR, cross-over distortion, and open-loop gain variation.
The LMC6482's input stage design is complemented by an output stage capable of rail-to-rail output swing even
when driving a large load. Rail-to-rail output swing is obtained by taking the output directly from the internal
integrator instead of an output buffer stage.
INPUT COMMON-MODE VOLTAGE RANGE
Unlike Bi-FET amplifier designs, the LMC6482 does not exhibit phase inversion when an input voltage exceeds
the negative supply voltage. Figure 53 shows an input voltage exceeding both supplies with no resulting phase
inversion on the output.
Figure 53. An Input Voltage Signal Exceeds the
LMC6482 Power Supply Voltages with
No Output Phase Inversion
The absolute maximum input voltage is 300mV beyond either supply rail at room temperature. Voltages greatly
exceeding this absolute maximum rating, as in Figure 54, can cause excessive current to flow in or out of the
input pins possibly affecting reliability.
Figure 54. A ±7.5V Input Signal Greatly
Exceeds the 3V Supply in Figure 55 Causing
No Phase Inversion Due to RI
Applications that exceed this rating must externally limit the maximum input current to ±5mA with an input
resistor (RI) as shown in Figure 55.
14
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Figure 55. RI Input Current Protection for
Voltages Exceeding the Supply Voltages
RAIL-TO-RAIL OUTPUT
The approximated output resistance of the LMC6482 is 180Ω sourcing and 130Ω sinking at VS = 3V and 110Ω
sourcing and 80Ω sinking at Vs = 5V. Using the calculated output resistance, maximum output voltage swing can
be estimated as a function of load.
CAPACITIVE LOAD TOLERANCE
The LMC6482 can typically directly drive a 100pF load with VS = 15V at unity gain without oscillating. The unity
gain follower is the most sensitive configuration. Direct capacitive loading reduces the phase margin of op-amps.
The combination of the op-amp's output impedance and the capacitive load induces phase lag. This results in
either an underdamped pulse response or oscillation.
Capacitive load compensation can be accomplished using resistive isolation as shown in Figure 56. This simple
technique is useful for isolating the capacitive inputs of multiplexers and A/D converters.
Figure 56. Resistive Isolation
of a 330pF Capacitive Load
Figure 57. Pulse Response of
the LMC6482 Circuit in Figure 56
Improved frequency response is achieved by indirectly driving capacitive loads, as shown in Figure 58.
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Figure 58. LMC6482 Noninverting Amplifier,
Compensated to Handle a 330pF Capacitive Load
R1 and C1 serve to counteract the loss of phase margin by feeding forward the high frequency component of the
output signal back to the amplifiers inverting input, thereby preserving phase margin in the overall feedback loop.
The values of R1 and C1 are experimentally determined for the desired pulse response. The resulting pulse
response can be seen in Figure 59.
Figure 59. Pulse Response of
LMC6482 Circuit in Figure 58
COMPENSATING FOR INPUT CAPACITANCE
It is quite common to use large values of feedback resistance with amplifiers that have ultra-low input current,
like the LMC6482. Large feedback resistors can react with small values of input capacitance due to transducers,
photodiodes, and circuits board parasitics to reduce phase margins.
Figure 60. Canceling the Effect of Input Capacitance
16
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The effect of input capacitance can be compensated for by adding a feedback capacitor. The feedback capacitor
(as in Figure 60), Cf, is first estimated by:
(1)
or
R1 CI ≤ R2 Cf
(2)
which typically provides significant overcompensation.
Printed circuit board stray capacitance may be larger or smaller than that of a bread-board, so the actual
optimum value for Cf may be different. The values of Cf should be checked on the actual circuit. (Refer to the
LMC660 quad CMOS amplifier data sheet for a more detailed discussion.)
PRINTED-CIRCUIT-BOARD LAYOUT FOR HIGH-IMPEDANCE WORK
It is generally recognized that any circuit which must operate with less than 1000pA of leakage current requires
special layout of the PC board. When one wishes to take advantage of the ultra-low input current of the
LMC6482, typically less than 20fA, it is essential to have an excellent layout. Fortunately, the techniques of
obtaining low leakages are quite simple. First, the user must not ignore the surface leakage of the PC board,
even through it may sometimes appear acceptably low, because under conditions of high humidity or dust or
contamination, the surface leakage will be appreciable.
To minimize the effect of any surface leakage, lay out a ring of foil completely surrounding the LM6482's inputs
and the terminals of capacitors, diodes, conductors, resistors, relay terminals, etc. connected to the op-amp's
inputs, as in Figure 61. To have a significant effect, guard rings should be placed on both the top and bottom of
the PC board. This PC foil must then be connected to a voltage which is at the same voltage as the amplifier
inputs, since no leakage current can flow between two points at the same potential. For example, a PC board
trace-to-pad resistance of 1012Ω, which is normally considered a very large resistance, could leak 5pA if the trace
were a 5V bus adjacent to the pad of the input. This would cause a 250 times degradation from the LMC6482's
actual performance. However, if a guard ring is held within 5 mV of the inputs, then even a resistance of 1011Ω
would cause only 0.05pA of leakage current. See Figure 62 for typical connections of guard rings for standard
op-amp configurations.
Figure 61. Example of Guard Ring in P.C. Board Layout
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Inverting Amplifier
Non-Inverting Amplifier
Follower
Figure 62. Typical Connections of Guard Rings
The designer should be aware that when it is inappropriate to lay out a PC board for the sake of just a few
circuits, there is another technique which is even better than a guard ring on a PC board: Don't insert the
amplifier's input pin into the board at all, but bend it up in the air and use only air as an insulator. Air is an
excellent insulator. In this case you may have to forego some of the advantages of PC board construction, but
the advantages are sometimes well worth the effort of using point-to-point up-in-the-air wiring. See Figure 63.
(Input pins are lifted out of PC board and soldered directly to components. All other pins connected to PC board.)
Figure 63. Air Wiring
18
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OFFSET VOLTAGE ADJUSTMENT
Offset voltage adjustment circuits are illustrated in Figure 64 Figure 65. Large value resistances and
potentiometers are used to reduce power consumption while providing typically ±2.5mV of adjustment range,
referred to the input, for both configurations with VS = ±5V.
V+
R4
R3
500 k:
5V
-
VIN
1
LMC6482
2
1 M:
VOUT
+
1 k:
-5V
499:
500 k:
VOUT
V-
VIN
=-
R4
R3
V-
Figure 64. Inverting Configuration
Offset Voltage Adjustment
Figure 65. Non-Inverting Configuration
Offset Voltage Adjustment
UPGRADING APPLICATIONS
The LMC6484 quads and LMC6482 duals have industry standard pin outs to retrofit existing applications.
System performance can be greatly increased by the LMC6482's features. The key benefit of designing in the
LMC6482 is increased linear signal range. Most op-amps have limited input common mode ranges. Signals that
exceed this range generate a non-linear output response that persists long after the input signal returns to the
common mode range.
Linear signal range is vital in applications such as filters where signal peaking can exceed input common mode
ranges resulting in output phase inversion or severe distortion.
DATA ACQUISITION SYSTEMS
Low power, single supply data acquisition system solutions are provided by buffering the ADC12038 with the
LMC6482 (Figure 66). Capable of using the full supply range, the LMC6482 does not require input signals to be
scaled down to meet limited common mode voltage ranges. The LMC4282 CMRR of 82dB maintains integral
linearity of a 12-bit data acquisition system to ±0.325 LSB. Other rail-to-rail input amplifiers with only 50dB of
CMRR will degrade the accuracy of the data acquisition system to only 8 bits.
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Operating from the same Supply Voltage, the LMC6482 buffers the ADC12038 maintaining excellent accuracy.
Figure 66. Buffering the ADC12038 with the LMC6482
INSTRUMENTATION CIRCUITS
The LMC6482 has the high input impedance, large common-mode range and high CMRR needed for designing
instrumentation circuits. Instrumentation circuits designed with the LMC6482 can reject a larger range of
common-mode signals than most in-amps. This makes instrumentation circuits designed with the LMC6482 an
excellent choice of noisy or industrial environments. Other applications that benefit from these features include
analytic medical instruments, magnetic field detectors, gas detectors, and silicon-based transducers.
A small valued potentiometer is used in series with Rg to set the differential gain of the 3 op-amp instrumentation
circuit in Figure 67. This combination is used instead of one large valued potentiometer to increase gain trim
accuracy and reduce error due to vibration.
Figure 67. Low Power 3 Op-Amp Instrumentation Amplifier
20
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A 2 op-amp instrumentation amplifier designed for a gain of 100 is shown in Figure 68. Low sensitivity trimming
is made for offset voltage, CMRR and gain. Low cost and low power consumption are the main advantages of
this two op-amp circuit.
Higher frequency and larger common-mode range applications are best facilitated by a three op-amp
instrumentation amplifier.
Figure 68. Low-Power Two-Op-Amp Instrumentation Amplifier
SPICE MACROMODEL
A
•
•
•
•
•
spice macromodel is available for the LMC6482. This model includes accurate simulation of:
Input common-mode voltage range
Frequency and transient response
GBW dependence on loading conditions
Quiescent and dynamic supply current
Output swing dependence on loading conditions
and many more characteristics as listed on the macromodel disk.
Contact your local Texas Instruments sales office to obtain an operational amplifier spice model library disk.
Typical Single-Supply Applications
Figure 69. Half-Wave Rectifier
with Input Current Protection (RI)
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Product Folder Links: LMC6482QML
21
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SNOSAR9A – DECEMBER 2010 – REVISED MARCH 2013
www.ti.com
Figure 70. Half-Wave Rectifier Waveform
The circuit in Figure 69 uses a single supply to half wave rectify a sinusoid centered about ground. RI limits
current into the amplifier caused by the input voltage exceeding the supply voltage. Full wave rectification is
provided by the circuit in Figure 71.
Figure 71. Full Wave Rectifier
with Input Current Protection (RI)
Figure 72. Full Wave Rectifier Waveform
22
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Product Folder Links: LMC6482QML
LMC6482QML
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SNOSAR9A – DECEMBER 2010 – REVISED MARCH 2013
Figure 73. Large Compliance Range Current Source
Figure 74. Positive Supply Current Sense
Figure 75. Low Voltage Peak Detector with Rail-to-Rail Peak Capture Range
In Figure 75 dielectric absorption and leakage is minimized by using a polystyrene or polyethylene hold
capacitor. The droop rate is primarily determined by the value of CH and diode leakage current. The ultra-low
input current of the LMC6482 has a negligible effect on droop.
Figure 76. Rail-to-Rail Sample and Hold
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The LMC6482's high CMRR (82dB) allows excellent accuracy throughout the circuit's rail-to-rail dynamic capture
range.
Figure 77. Rail-to-Rail Single Supply Low Pass Filter
The low pass filter circuit in Figure 77 can be used as an anti-aliasing filter with the same voltage supply as the
A/D converter.
Filter designs can also take advantage of the LMC6482 ultra-low input current. The ultra-low input current yields
negligible offset error even when large value resistors are used. This in turn allows the use of smaller valued
capacitors which take less board space and cost less.
24
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Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: LMC6482QML
LMC6482QML
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SNOSAR9A – DECEMBER 2010 – REVISED MARCH 2013
REVISION HISTORY
Released
Revision
12/08/2010
A
New Release, Corporate format
Section
1 MDS data sheet converted into one Corp. data
sheet format. MNLMC6482AM-X Rev 0A0 will be
archived.
Changes
03/27/2013
A
All
Changed layout of National Data Sheet to TI format.
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PACKAGE OPTION ADDENDUM
www.ti.com
27-Jul-2016
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
5962-9453401MPA
ACTIVE
CDIP
NAB
8
40
TBD
Call TI
Call TI
-55 to 125
LMC6482AMJ88
5962-94534
01MPA Q ACO
01MPA Q >T
LMC6482AMJ/883
ACTIVE
CDIP
NAB
8
40
TBD
Call TI
Call TI
-55 to 125
LMC6482AMJ88
5962-94534
01MPA Q ACO
01MPA Q >T
LMC6482M MD8
ACTIVE
DIESALE
Y
0
169
Green (RoHS
& no Sb/Br)
Call TI
Level-1-NA-UNLIM
-55 to 125
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
27-Jul-2016
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
NAB0008A
J08A (Rev M)
www.ti.com
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