Murata LBWA1KL1FX-TEMP W-lan module data sheet Datasheet

Preliminary Specification Number : SP-KL1FX-G
W-LAN Module Data Sheet
Cypress Chipset
for 802.11b/g/n
Sample P/N : LBWA1KL1FX-TEMP
Preliminary
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Preliminary Specification Number : SP-KL1FX-G
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The revision history of the product specification
Issued
Date
Apr. 29. 2015
Sep. 17, 2015
Revision
Code
A
Revision
Page
Mar. 18. 2016
Oct 31, 2016
Dec 14, 2016
Feb 9, 2017
Feb 28, 2017
B
C
D
E
F
G
Change Reason
P4
First Issue
4. Dimensions, Marking and Terminal
Configurations: Change Pin14 NC to
GND
Reference schematic
4. Dimensions, Marking and Terminal
Configurations, Add note of SDIO
4. Dimensions, Marking, and Terminal
Configurations, Add pin 20, 27, 41
functional description.
6. Operating Condition, Add
Specification Temperature Range
4. Dimensions, Marking and Terminal
P8
6.1. Operating condition
Correction
P12
10. DC/RF Characteristics
Correction
P8
P24
P16
6.1. Operating condition
APPENDIX
12. Reference Circuit
IC Part Number
Correction
Addition
Correction
Changed
P. 5
P.16
P.7
Oct. 29, 2015
Changed Items
P.8
Preliminary
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Correction
Addition
Addition
Preliminary Specification Number : SP-KL1FX-G
2 / 29
TABLE OF CONTENTS
1. Scope ..................................................................................................................................................... 3
2. Part Number ........................................................................................................................................... 3
3. Block Diagram ........................................................................................................................................ 3
4. Dimensions, Marking and Terminal Configurations ............................................................................... 4
5. Rating ..................................................................................................................................................... 8
6. Operating Condition ............................................................................................................................... 8
6.1. Operating condition ......................................................................................................................... 8
6.2. Power Up Sequence........................................................................................................................ 8
7. Digital I/O Requirements ........................................................................................................................ 9
8. External LPO Specification..................................................................................................................... 9
9. Interface Timing .................................................................................................................................... 10
9.1. SDIO Timing (Default Mode) ......................................................................................................... 10
9.2. SDIO Timing (High Speed Mode) ...................................................................................................11
10. DC/RF Characteristics........................................................................................................................ 12
10.1. DC/RF Characteristics for IEEE802.11b ..................................................................................... 12
10.2. DC/RF Characteristics for IEEE802.11g ..................................................................................... 13
10.3. DC/RF Characteristics for IEEE802.11n ..................................................................................... 14
11. Land pattern........................................................................................................................................ 15
12. Reference Circuit................................................................................................................................ 16
13. Tape and Reel Packing ...................................................................................................................... 17
14. NOTICE .............................................................................................................................................. 20
14.1. Storage Conditions: ..................................................................................................................... 20
14.2. Handling Conditions: ................................................................................................................... 20
14.3. Standard PCB Design (Land Pattern and Dimensions): ............................................................. 20
14.4. Notice for Chip Placer:................................................................................................................. 20
14.5. Soldering Conditions: .................................................................................................................. 21
14.6. Cleaning:...................................................................................................................................... 21
14.7. Operational Environment Conditions: ......................................................................................... 21
14.8. Input Power Capacity: ................................................................................................................. 22
15. PRECONDITION TO USE OUR PRODUCTS ................................................................................... 23
Please be aware that an important notice concerning availability, standard warranty and use in critical
applications of Murata products and disclaimers thereto appears at the end of this specification sheet.
Preliminary
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1. Scope
This specification is applied to the IEEE802.11b/g/n W-LAN module.
- Interface
- IC/Firmware
- Reference Clock
- MSL
- RoHS
: SDIO (WLAN)
: Cypress/CYW43364
: Reference clock is embedded.
: Level 3
: This module is compliant with the RoHS directive.
2. Part Number
Sample Part Number
EVK Part Number
LBWA1KL1FX-TEMP
LBWA1KL1FX-TEMP-D
3. Block Diagram
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Preliminary Specification Number : SP-KL1FX-G
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4. Dimensions, Marking and Terminal Configurations
< Top View >
B
< Side View >
< Bottom View >
D
012345678
1FX
C
A
Marking
A
B
C
D
Dimensions
Mark
L
a1
b1
c2
e2
e5
e8
Dimensions
6.95 +/- 0.2
0.25 +/- 0.10
0.30 +/- 0.2
0.50 +/- 0.1
0.2 +/- 0.1
1.175 +/- 0.100
0.50 +/- 0.10
Meaning
Pin 1 Marking
Murata Logo
Module Type
Inspection Number
Mark
W
a2
b2
c3
e3
e6
m1
Dimensions
5.15 +/- 0.2
0.5 +/- 0.1
0.30 +/- 0.2
0.375 +/- 0.100
0.2 +/- 0.1
1.0 +/- 0.1
1.0 +/- 0.1
Mark
T
a3
c1
e1
e4
e7
m2
Structure
Preliminary
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Murata Manufacturing Co., Ltd.
(unit : mm)
Dimensions
1.1 max.
0.25 +/- 0.10
0.50 +/- 0.1
0.2 +/- 0.1
0.3 +/- 0.1
0.525 +/- 0.100
1.0 +/- 0.1
Preliminary Specification Number : SP-KL1FX-G
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Terminal Configurations
Connection to IC
Terminal
No.
Terminal Name
Type
Description
(1)
GND
-
(2)
NC
-
NC
(3)
NC
-
NC
(4)
NC
-
NC
(5)
NC
-
NC
(6)
NC
-
NC
(7)
NC
-
NC
(8)
NC
-
NC
(9)
NC
-
NC
(10)
NC
-
NC
(11)
NC
-
NC
(12)
GND
-
(13)
NC
-
NC
(14)
GND
-
GND
(15)
WL_GPIO_4
I/O
(16)
NC
-
(17)
WL_GPIO_2
I/O
GPIO_2
(18)
WL_GPIO_1
I/O
GPIO_1
(19)
GND
-
(20)
SDIO_CLK
I
(21)
GND
-
(22)
SDIO_CMD
(23)
GPIO_4
NC
SDIO_CLK
SDIO clock input
I/O
SDIO_CMD
SDIO command line
SDIO_DATA_2
I/O
SDIO_DATA_2
SDIO data line 2
(24)
SDIO_DATA_0
I/O
SDIO_DATA_0
SDIO data line 0
(25)
SDIO_DATA_3
I/O
SDIO_DATA_3
SDIO data line 3
(26)
SDIO_DATA_1
I/O
SDIO_DATA_1
SDIO data line 1
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(27)
WL_GPIO_0_HOST_
WAKE
O
GPIO_0
WLAN Host Wake
WL_REG_ON
Used by PMU to power up or
power down the internal
regulators used by the WLAN
section. Also, when deasserted,
this pin holds the WLAN section
in reset. This pin has an internal
200kΩ pull-down resistor that is
enabled by default. It can be
disabled through programming.
(28)
WL_REG_ON
I
(29)
GND
-
(30)
VBAT
PI
(31)
VIN_LDO
PI
(32)
GND (SR_PVSS)
-
(33)
GND (SR_PVSS)
-
(34)
SR_VLX
PO
(35)
GND
-
(36)
VIO
PI
(37)
LPO_IN (32kHz)
I
(38)
NC
-
NC
(39)
NC
-
NC
(40)
GND
-
(41)
ANT
-
(42)
～
(46)
GND
-
LDO_VDDBAT5V,
SR_VDDBAT5V
LDO_VDD1P5,
WLRF_VDD_1P35
SR_VLX
CBUCK switching regulator
output.
SCC_VDDIO,
SYS_VDDIO
LPO_IN
l
External sleep clock input
(32.768kHz).
RF(WiFi) Signal
Preliminary
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SDIO Pin Description
No.
Pin Name
(i) SD 4-bit Mode
(ii) SD 1-bit Mode
20
SDIO_CLK
CLK
Clock
CLK
Clock
24
SDIO_D0
DATA0
Data line 0
DATA
Data line
26
SDIO_D1
DATA1
Data line 1 /Interrupt
IRQ
Interrupt
23
SDIO_D2
DATA2
Data line 2
NC
Not used
25
SDIO_D3
DATA3
Data line 3
NC
Not used
22
SDIO_CMD
CMD
Command line
CMD
Command line
CLK
SD Host
CMD
CLK
CMD
LBWA1KL1FX
LBWA1KL1FX
SD Host
DATA
DATA[3:0]
(i) SD 4-bit Mode
IRQ
(ii) SD 1-bit Mode
Note : 10 to 100kΩ pull-ups are required on the four DATA lines and the CMD line. This requirement
must be met during all operating states by using external pull-up resisters or properly programming
internal SDIO host pull-ups.
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5. Rating
Storage Temperature
Supply Voltage
VBAT
VDDIO
min.
-40
-0.5
-0.5
max.
+85
5.0
3.9
unit
deg.C
V
V
* Stresses in excess of the absolute ratings may cause permanent damage. Functional operation
is not implied under these conditions. Exposure to absolute ratings for extended periods of time
may adversely affect reliability. No damage assuming only one parameter is set at limit at a time
with all other parameters are set within operating condition.
6. Operating Condition
6.1. Operating condition
Operating Temperature Range
Specification Temperature Range
VBAT
Operating Voltage
VDDIO
VBAT
Specification
Voltage
VDDIO
min.
-40
-10
3.0
1.71
3.2
1.71
typ.
+25
+25
3.6
1.8 or 3.3
3.6
1.8 or 3.3
max.
+85
+55
4.8
3.63
4.2
3.63
unit
deg.C
deg.C
V
V
V
V
[Note] All RF characteristics in this datasheet are defined by Specification Temperature Range and
Specification Voltage.
6.2. Power Up Sequence
32.768 kHz
Sleep Clock
90% of VH
VBAT
VDDIO
> 2 Sleep cycles
WL_REG_ON
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7. Digital I/O Requirements
SDIO Interface I/O Pins
Input low voltage (VDDIO = 3.3V)
Input high voltage (VDDIO = 3.3V)
Input low voltage (VDDIO = 1.8V))
Input high voltage (VDDIO = 1.8V)
Output low voltage (VDDIO = 3.3V)
Output high voltage (VDDIO = 3.3V)
Output low voltage (VDDIO = 1.8V)
Output high voltage (VDDIO = 1.8V)
Sym
VIL
VIH
VIL
VIH
VOL
VOH
VOL
VOH
min.
0.625*VDDIO
1.27
0.75*VDDIO
1.40
max.
0.25*VDDIO
0.58
0.125*VDDIO
0.45
-
unit
V
V
V
V
V
V
V
V
Other Digital I/O Pins
Input low voltage (VDDIO = 3.3V)
Input high voltage (VDDIO = 3.3V)
Input low voltage (VDDIO = 1.8V))
Input high voltage (VDDIO = 1.8V)
Output low voltage (VDDIO = 3.3V)
Output high voltage (VDDIO = 3.3V)
Output low voltage (VDDIO = 1.8V)
Output high voltage (VDDIO = 1.8V)
Sym
VIL
VIH
VIL
VIH
VOL
VOH
VOL
VOH
min.
2.0
0.65*VDDIO
VDDIO-0.4
VDDIO-0.45
max.
0.8
0.35*VDDIO
0.40
0.45
-
unit
V
V
V
V
V
V
V
V
8. External LPO Specification
Parameter
Condition/Notes
Frequency
Frequency accuracy
Duty cycle
Input amplitude
Signal type
-
Input impedancea
Square wave or sine wave
Resistive
Capacitive
Clock jitter
a. When power is applied or switched off.
Minimu
m
-200
30
200
100
-
Specification
Maximu
Typical
m
32.768
+200
70
3300
5
10,000
Preliminary
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Units
KHz
ppm
%
mV, p-p
kΩ
pF
ppm
Preliminary Specification Number : SP-KL1FX-G
10 / 29
9. Interface Timing
9.1. SDIO Timing (Default Mode)
fPP
tWL
tWH
CLK
tTHL
tISU
tTLH
tIH
Input
Output
tODLY
(max)
tODLY
(min)
Parameter
Symbol Min(1)
Clock CLK (All values are referred to min. VIH and max. VIL(2)
Frequency-Data Transfer Mode
fPP
0
Frequency-Identification Mode
fOD
0
Clock Low Time
tWL
10
Clock High Time
tWH
10
Clock Rise Time
tTLH
Clock Fall Time
tTHL
Inputs: CMD, DAT (referenced to CLK)
Input Setup Time
tISU
5
Input Hold Time
tIH
5
Outputs: CMD, DAT (referenced to CLK)
Output Delay time-Data Transfer Mode
tODLY
0
Output Delay time-Identification Mode
tODLY
0
Typ(1)
Max(1)
Unit
-
25
400
10
10
MHz
kHz
ns
ns
ns
ns
-
-
ns
ns
-
14
50
ns
ns
(1). Timing is based on CL < 40pF load on CMD and Data.
(2). Min (Vih) = 0.7*VDDIO and max (Vil) = 0.2*VDDIO.
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9.2. SDIO Timing (High Speed Mode)
fPP
tWL
50% VDD
tWH
CLK
tTHL
tISU
tTLH
tIH
Input
Output
tODLY
tOH
Parameter
Symbol Min(1)
Clock CLK (All values are referred to min. VIH and max. VIL(2)
Frequency-Data Transfer Mode
fPP
0
Frequency-Identification Mode
fOD
0
Clock Low Time
tWL
7
Clock High Time
tWH
7
Clock Rise Time
tTLH
Clock Fall Time
tTHL
Inputs: CMD, DAT (referenced to CLK)
Input Setup Time
tISU
6
Input Hold Time
tIH
2
Outputs: CMD, DAT (referenced to CLK)
Output Delay time-Data Transfer Mode
tODLY
Output Hold time
tOH
2.5
Total System Capacitance (each line)
CL
-
Typ(1)
Max(1)
Unit
-
50
400
3
3
MHz
kHz
ns
ns
ns
ns
-
-
ns
ns
-
14
40
ns
ns
pF
(1). Timing is based on CL < 40pF load on CMD and Data.
(2). Min (Vih) = 0.7*VDDIO and max (Vil) = 0.2*VDDIO.
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10. DC/RF Characteristics
10.1. DC/RF Characteristics for IEEE802.11b
Specification
Mode
Frequency
Data rate
IEEE802.11b
DSSS / CCK
2400 - 2483.5MHz
1, 2, 5.5, 11Mbps
Conditions : 25deg.C, VBAT=3.6V, VDDIO= 3.3V, Output power setting=17dBm, 11Mbps mode
Items
Contents
- DC Characteristics min.
typ.
max.
unit
DC current
1) Tx mode (1024byte, 20usec interval)
320
370
mA
2) Rx mode
47
60
mA
- Tx Characteristics min.
typ.
max.
unit
Output Power (tolerance)
15
17
19
dBm
Spectrum Mask
1) 1st side lobes
-43
-30
dBr
2) 2nd side lobes
-54
-50
dBr
Power-on and Power-down ramp
2.0
μsec
RF Carrier Suppression
15
dB
Modulation Accuracy (EVM)
15
35
%
Outband Spurious Emissions
1) 30MHz to 1GHz (BW=100kHz)
-36
dBm
2) 1GHz to 12.75GHz (BW=100kHz)
-30
dBm
3) 1.8GHz to 1.9GHz (BW=100kHz)
-47
dBm
4) 5.15GHz to 5.3GHz (BW=100kHz)
-47
dBm
- Rx Characteristics min.
typ.
max.
unit
Minimum Input Level (FER < 8%)
-89
-76
dBm
Maximum Input Level (FER < 8%)
-10
dBm
Adjacent Channel Rejection (FER < 8%)
35
dB
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10.2. DC/RF Characteristics for IEEE802.11g
Specification
Mode
Frequency
Data rate
IEEE802.11g
OFDM
2400 - 2483.5MHz
6, 9, 12, 18, 24, 36, 48, 54Mbps
Conditions : 25deg.C, VBAT=3.6V, VDDIO= 3.3V, Output power setting=13dBm, 54Mbps mode
Items
Contents
- DC Characteristics min.
typ.
max.
unit
DC current
1) Tx mode (1024byte, 20usec interval)
270
310
mA
2) Rx mode
47
60
mA
- Tx Characteristics min.
typ.
max.
unit
Output Power (tolerance)
11
13
15
dBm
Spectrum Mask
1) 9MHz to 11MHz (0dB ~ -20dB)
-33
-20
dBr
2) 11MHz to 20MHz (-20dB ~ -28dB)
-41
-28
dBr
3) 20MHz to 30MHz (-28dB ~ -40dB)
-53
-40
dBr
4) 30MHz to 33MHz (-40dB)
-53
-40
dBr
Constellation Error (EVM)
-30
-25
dB
Outband Spurious Emissions
1) 30MHz to 1GHz (BW=100kHz)
-36
dBm
2) 1GHz to 12.75GHz (BW=100kHz)
-30
dBm
3) 1.8GHz to 1.9GHz (BW=100kHz)
-47
dBm
4) 5.15GHz to 5.3GHz (BW=100kHz)
-47
dBm
- Rx Characteristics min.
typ.
max.
unit
Minimum Input Level (PER < 10%)
-75
-65
dBm
Maximum Input Level (PER < 10%)
-20
dBm
Adjacent Channel Rejection (PER < 10%)
-1
dB
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10.3. DC/RF Characteristics for IEEE802.11n
Specification
Mode
Frequency
Data rate
IEEE802.11n
OFDM
2400 - 2483.5MHz
6.5, 13, 19.5, 26, 39, 52, 58.5, 65Mbps
Conditions : 25deg.C, VBAT=3.6V, VDDIO= 3.3V, Output power setting=12dBm, 65Mbps mode
Items
Contents
- DC Characteristics min.
typ.
max.
unit
DC current
1) Tx mode (1024byte, 20usec interval)
260
300
mA
2) Rx mode
47
60
mA
- Tx Characteristics min.
typ.
max.
unit
Output Power (tolerance)
10
12
14
dBm
Spectrum Mask
1) 9MHz to 11MHz (0dB ~ -20dB)
-33
-20
dBr
2) 11MHz to 20MHz (-20dB ~ -28dB)
-41
-28
dBr
3) 20MHz to 30MHz (-28dB ~ -45dB)
-53
-45
dBr
4) 30MHz to 33MHz (-45dB)
-53
-45
dBr
Constellation Error (EVM)
-31
-27
dB
Outband Spurious Emissions
1) 30MHz to 1GHz
-36
dBm
2) 1GHz to 12.75GHz
-30
dBm
3) 1.8GHz to 1.9GHz
-47
dBm
4) 5.15GHz to 5.3GHz
-47
dBm
- Rx Characteristics min.
typ.
max.
unit
Minimum Input Level (PER<10%)
-73
-64
dBm
Maximum Input Level (PER < 10%)
-20
dBm
Adjacent Channel Rejection (PER < 10%)
-2
dB
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11. Land pattern
Top View. Unit : mm
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12. Reference Circuit
A
B
C
D
E
F
G
H
VIO
1
1
Antenna
*1) LQM18PN2R2MGH recommended
Antenna matching
2.2uF
*2) GRM155R61A475MEAA recommended
VIO
2
2
LPO_IN
GND1
2
NC
3
NC
4
NC
5
6
7
10~100k
10~100k
10~100k
10~100k
10~100k
36
34
37
35
GND35
SR_VLX
VIO
33
3
4.7uF *2)
32
VIN_LDO
31
VBAT
VBAT
30
GND29
29
NC
WL_REG_ON
28
NC
WL_HOST_WAKE
27
NC
SDIO_DATA_1
26
SDIO_DATA_1
8
NC
SDIO_DATA_3
25
SDIO_DATA_3
9
NC
SDIO_DATA_0
24
SDIO_DATA_2
23
SDIO_CMD
22
B
GND21
WL_HOST_WAKE
4
SDIO_DATA_0
SDIO_DATA_2
SDIO_CMD
21
GND19
SDIO_CLK
20
19
WL_REG_ON
SDIO_CLK
WL_GPIO_1
WL_GPIO_2
17
18
WL_GPIO_1
WL_GPIO_2
NC
16
WL_GPIO_4
WL_GPIO_4
15
NC
GND14
14
NC
GND12
NC
11
12
10
TYPE1FX
5
A
4.7uF *2)
GND(SR_PVSS)
13
4
1
2.2uH
*1)
GND(SR_PVSS)
3
LPO_IN(32KHZ)
40
39
38
NC
NC
42
43
44
45
41
ANT
GND40
GND42
GND43
GND44
GND45
GND46
46
GND(SR_PVSS) have to be isolated from typical GND
C
5
D
E
F
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G
H
Preliminary Specification Number : SP-KL1FX-G
17 / 29
13. Tape and Reel Packing
2.0±0.1
4.0±0.1
φ 1.5+0.1/-0.0
0.3±0.05
7.5±0.1
7.45±0.1
16.2±0.3
1.75±0.1
(1) Dimensions of Tape (Plastic tape)
φ 1.5±0.1
8.0±0.1
5.55±0.1
1.8 max.
(1.7±0.1)
feeding direction
The corner and ridge radiuses (R) of inside cavity are 0.3mm max.
Cumulative tolerance of 10 pitches of the sprocket hole is +/-0.2mm
Measuring of cavity positioning is based on cavity center in accordance with JIS/IES standard.
(2) Dimensions of Reel
17.5
(Φ330)
2±0.5
(Φ100)
1)
2)
3)
Φ13±2
22.5 max.
(unit : mm)
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(3) Taping Diagrams
[1] Feeding Hole : As specified in (1)
[2] Hole for chip : As specified in (1)
[3] Cover tape
: 62μm in thickness
[4] Base tape
: As specified in (1)
Feeding Hole
Feeding Direction
Pin 1 Marking
Chip
(4) Leader and Tail tape
Feeding direction
Tail tape
(No components)
40 to 200mm
Components
No components
Leader tape
(Cover tape alone)
150mm min.
250mm min.
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Murata Manufacturing Co., Ltd.
Preliminary Specification Number : SP-KL1FX-G
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(5) The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled
toward the user.
(6) The cover tape and base tape are not adhered at no components area for 250mm min.
(7) Tear off strength against pulling of cover tape : 5N min.
(8) Packaging unit : 1000pcs./ reel
(9) material : Base tape : Plastic
Real
: Plastic
Cover tape, cavity tape and reel are made the anti-static processing.
(10) Peeling of force : 1.1N max. in the direction of peeling as shown below.
1.1N max.
165 to 180 °
Cover tape
Base tape
(11) Packaging (Humidity proof Packing)
Label
表示ラべル
Desiccant
乾燥剤
Humidity
湿度
Indicator
インジケ－タ
表示ラベル
Label
防湿梱包袋
Anti-humidity
Plastic Bag
Tape and reel must be sealed with the anti-humidity plastic bag. The bag contains the desiccant
and the humidity indicator.
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14. NOTICE
14.1. Storage Conditions:
Please use this product within 6month after receipt.
- The product shall be stored without opening the packing under the ambient temperature from 5 to
35deg.C and humidity from 20 to 70%RH.
(Packing materials, in particular, may be deformed at the temperature over 40deg.C.)
- The product left more than 6months after reception, it needs to be confirmed the solderbility before
used.
- The product shall be stored in non corrosive gas (Cl2, NH3, SO2, NOx, etc.).
- Any excess mechanical shock including, but not limited to, sticking the packing materials by sharp
object and dropping the product, shall not be applied in order not to damage the packing materials.
This product is applicable to MSL3 (Based on JEDEC Standard J-STD-020)
- After the packing opened, the product shall be stored at <30deg.C / <60%RH and the product shall be
used within 168hours.
- When the color of the indicator in the packing changed, the product shall be baked before soldering.
Baking condition: 125+5/-0deg.C, 24hours, 1time
The products shall be baked on the heat-resistant tray because the material (Base Tape, Reel Tape and
Cover Tape) are not heat-resistant.
14.2. Handling Conditions:
Be careful in handling or transporting products because excessive stress or mechanical shock may
break products.
Handle with care if products may have cracks or damages on their terminals, the characteristics of
products may change. Do not touch products with bear hands that may result in poor solder ability and
destroy by static electrical charge.
14.3. Standard PCB Design (Land Pattern and Dimensions):
All the ground terminals should be connected to the ground patterns. Furthermore, the ground pattern
should be provided between IN and OUT terminals. Please refer to the specifications for the standard
land dimensions.
The recommended land pattern and dimensions is as Murata's standard. The characteristics of products
may vary depending on the pattern drawing method, grounding method, land dimensions, land forming
method of the NC terminals and the PCB material and thickness. Therefore, be sure to verify the
characteristics in the actual set. When using non-standard lands, contact Murata beforehand.
14.4. Notice for Chip Placer:
When placing products on the PCB, products may be stressed and broken by uneven forces from a
worn-out chucking locating claw or a suction nozzle. To prevent products from damages, be sure to
follow the specifications for the maintenance of the chip placer being used. For the positioning of
products on the PCB, be aware that mechanical chucking may damage products.
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14.5. Soldering Conditions:
The recommendation conditions of soldering are as in the following figure.
When products are immersed in solvent after mounting, pay special attention to maintain the
temperature difference within 100 °C. Soldering must be carried out by the above mentioned
conditions to prevent products from damage. Set up the highest temperature of reflow within 260 °C.
Contact Murata before use if concerning other soldering conditions.
Reflow soldering standard conditions (Example)
Within 3s
240to 250 deg.C
220 deg.C
Cooling down
Slowly
180 deg.C
150 deg.C
Pre-heating
Within 120s
Within 60s
time(s)
Please use the reflow within 2 times.
Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less.
14.6. Cleaning:
Since this Product is Moisture Sensitive, any cleaning is not permitted.
14.7. Operational Environment Conditions:
Products are designed to work for electronic products under normal environmental conditions (ambient
temperature, humidity and pressure). Therefore, products have no problems to be used under the similar
conditions to the above-mentioned. However, if products are used under the following circumstances, it
may damage products and leakage of electricity and abnormal temperature may occur.
- In an atmosphere containing corrosive gas (Cl2, NH3, SOx, NOx, etc.).
- In an atmosphere containing combustible and volatile gases.
- Dusty place.
- Direct sunlight place.
- Water splashing place.
- Humid place where water condenses.
- Freezing place.
If there are possibilities for products to be used under the preceding clause, consult with Murata before
actual use.
As it might be a cause of degradation or destruction to apply static electricity to products, do not apply
static electricity or excessive voltage while assembling and measuring.
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14.8. Input Power Capacity:
Products shall be used in the input power capacity as specified in this specifications.
Inform Murata beforehand, in case that the components are used beyond such input power capacity
range.
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Murata Manufacturing Co., Ltd.
Preliminary Specification Number : SP-KL1FX-G
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15. PRECONDITION TO USE OUR PRODUCTS
PLEASE READ THIS NOTICE BEFORE USING OUR PRODUCTS.
Please make sure that your product has been evaluated and confirmed from the aspect of the fitness for the specifications
of our product when our product is mounted to your product.
All the items and parameters in this product specification/datasheet/catalog have been prescribed on the premise that our
product is used for the purpose, under the condition and in the environment specified in this specification. You are
requested not to use our product deviating from the condition and the environment specified in this specification.
Please note that the only warranty that we provide regarding the products is its conformance to the specifications provided
herein. Accordingly, we shall not be responsible for any defects in products or equipment incorporating such products,
which are caused under the conditions other than those specified in this specification.
WE HEREBY DISCLAIMS ALL OTHER WARRANTIES REGARDING THE PRODUCTS, EXPRESS OR IMPLIED,
INCLUDING WITHOUT LIMITATION ANY WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE, THAT THEY ARE
DEFECT-FREE, OR AGAINST INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS.
The product shall not be used in any application listed below which requires especially high reliability for the prevention of
such defect as may directly cause damage to the third party's life, body or property. You acknowledge and agree that, if
you use our products in such applications, we will not be responsible for any failure to meet such requirements.
Furthermore, YOU AGREE TO INDEMNIFY AND DEFEND US AND OUR AFFILIATES AGAINST ALL CLAIMS,
DAMAGES, COSTS, AND EXPENSES THAT MAY BE INCURRED, INCLUDING WITHOUT LIMITATION, ATTORNEY
FEES AND COSTS, DUE TO THE USE OF OUR PRODUCTS IN SUCH APPLICATIONS.
- Aircraft equipment.
- Aerospace equipment
- Undersea equipment.
- Power plant control equipment - Medical equipment.
- Transportation equipment (vehicles, trains, ships, elevator, etc.).
- Traffic signal equipment.
- Disaster prevention / crime prevention equipment.
-Burning / explosion control equipment
- Application of similar complexity and/ or reliability requirements to the applications listed in the above.
We expressly prohibit you from analyzing, breaking, reverse-engineering, remodeling altering, and reproducing our
product. Our product cannot be used for the product which is prohibited from being manufactured, used, and sold by the
regulations and laws in the world.
We do not warrant or represent that any license, either express or implied, is granted under any our patent right, copyright,
mask work right, or our other intellectual property right relating to any combination, machine, or process in which our
products or services are used. Information provided by us regarding third-party products or services does not constitute a
license from us to use such products or services or a warranty or endorsement thereof. Use of such information may
require a license from a third party under the patents or other intellectual property of the third party, or a license from us
under our patents or other intellectual property.
Please do not use our products, our technical information and other data provided by us for the purpose of developing of
mass-destruction weapons and the purpose of military use.
Moreover, you must comply with "foreign exchange and foreign trade law", the "U.S. export administration regulations",
etc.
Please note that we may discontinue the manufacture of our products, due to reasons such as end of supply of materials
and/or components from our suppliers.
By signing on specification sheet or approval sheet, you acknowledge that you are the legal representative for your
company and that you understand and accept the validity of the contents herein. When you are not able to return the
signed version of specification sheet or approval sheet within 30 days from receiving date of specification sheet or
approval sheet, it shall be deemed to be your consent on the content of specification sheet or approval sheet. Customer
acknowledges that engineering samples may deviate from specifications and may contain defects due to their
development status. We reject any liability or product warranty for engineering samples. In particular we disclaim liability
for damages caused by
- the use of the engineering sample other than for evaluation purposes, particularly the installation or integration in the
product to be sold by you,
-deviation or lapse in function of engineering sample,
-improper use of engineering samples.
We disclaim any liability for consequential and incidental damages.
If you can’t agree the above contents, you should inquire our sales.
Preliminary
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Murata Manufacturing Co., Ltd.
Preliminary Specification Number : SP-KL1FX-G
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APPENDIX
Preliminary
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Murata Manufacturing Co., Ltd.
Preliminary Specification Number : SP-KL1FX-G
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1DX Installation Manual (FCC)
FCC ID of this product is as follows.
FCC ID:VPYLB1DX
For OEM integration only – device cannot be sold to general public.
Therefore we will ask OEM to include the following statements required by FCC on the product and in
the Installation manual Notice.
Contents
1. Antenna
2. Notice
1. Antenna
■Please perform the antenna design that followed the specifications of the antenna.
The concrete contents of a check are the following three points.
1) It is the same type as the antenna type of antenna specifications.
Confirm the same size as the Gerber file.
2) An antenna gain is lower than a gain given in antenna specifications.
Measure the gain, and confirm the peak gain is less than the application value (1.4dBi)
3) The emission level is not getting worse.
Measure the spurious, and confirm degradation of less than 3dB than spurious value of worst of report
used for the application. However it is spurious defined below.
Please send those reports to Murata.
2. Notice
For OEM integration only – device cannot be sold to general public.
Therefore we will ask OEM to include the following statements required by FCC/IC on the product and in
the Installation manual Notice.
Please describe the following warning on the final product which contains this module.
Contains Transmitter Module FCC ID:VPYLB1DX
or
Contains FCC ID:VPYLB1DX
●Please describe the following warning to the manual.
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation.
FCC CAUTION
Changes or modifications not expressly approved by the party responsible for compliance could void the
user’s authority to operate the equipment.
This transmitter must not be co-located or operated in conjunction with any other antenna or transmitter.
※When the product is small, as for these words mentioned above, the posting to a manual is possible.
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●When installing it in a mobile equipment. Please describe the following warning to the manual.
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment
and meets the FCC radio frequency (RF) Exposure Guidelines. This equipment should be installed and
operated keeping the radiator at least 20cm or more away from person’s body.
RF Exposure requirements are met when installed in mobile equipment.
This module cannot be installed in portable equipment without further testing and a change to FCC's
grant of authorization.
Contact Murata regarding portable applications.
Note)
Portable equipment : Equipment for which the spaces between human body and antenna are used
within 20cm.
Mobile equipment : Equipment used at position in which the spaces between human body and antenna
exceeded 20cm.
This device is intended only for OEM integrators under the following conditions:
1)The antenna must be installed such that 20 cm is maintained between the antenna and users, and
2)The transmitter module may not be co-located with any other transmitter or antenna.
3)The use of an antenna with gain less than 1.4 dBi.
As long as 3 conditions above are met, further transmitter test will not be required. However, the OEM
integrator is still responsible for testing their end-product for any additional compliance requirements
required with this module installed
IMPORTANT NOTE: In the event that these conditions cannot be met (for example certain laptop
configurations or co-location with another transmitter), then the FCC authorization is no longer
considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM
integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a
separate FCC authorization.
End Product Labeling
This transmitter module is authorized only for use in device where the antenna may be installed such
that 20 cm may be maintained between the antenna and users. The final end product must be labeled in
a visible area with the following: “Contains FCC ID:XXXXXXXXXX”. The grantee's FCC ID can be used
only when all FCC compliance requirements are met.
Manual Information To the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or
remove this RF module in the user’s manual of the end product which integrates this module.
The end user manual shall include all required regulatory information/warning as show in this manual.
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Preliminary Specification Number : SP-KL1FX-G
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1DX Installation Manual (IC)
IC No. of this product is as follows.
IC : 772C-LB1DX
For OEM integration only – device cannot be sold to general public.
Therefore we will ask OEM to include the following statements required by IC on the product and in the
Installation manual Notice.
Contents
1. Antenna
2. Notice
1. Antenna
■Please perform the antenna design that followed the specifications of the antenna.
The concrete contents of a check are the following three points.
１）It is the same type as the antenna type of antenna specifications.
Confirm the same size as the Gerber file.
２）An antenna gain is lower than a gain given in antenna specifications.
Measure the gain, and confirm the peak gain is less than the application value (1.4dBi)
３）The emission level is not getting worse.
Measure the spurious, and confirm degradation of less than 3dB than spurious value of worst of
report used for the application. However it is spurious defined below.
Please send those reports to Murata.
2. Notice
For OEM integration only – device cannot be sold to general public.
Therefore we will ask OEM to include the following statements required by FCC/IC on the product and in
the Installation manual Notice.
Please describe the following warning on the final product which contains this module.
Contains IC:772C-LB1DX
This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the following
two conditions:
(1) This device may not cause interference; and
(2) This device must accept any interference, including interference that may cause undesired operation
of the device.
Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts
de licence.
L’exploitation est autorisée aux deux conditions suivantes :
1) l’appareil ne doit pas produire de brouillage;
2) l’utilisateur de l’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est
susceptible d’en compromettre le fonctionnement.
※When the product is small, as for these words mentioned above, the posting to a manual is possible
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●When installing it in a mobile equipment. Please describe the following warning to the manual.
This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment and
meets RSS-102 of the IC radio frequency (RF) Exposure rules. This equipment should be installed and
operated keeping the radiator at least 20cm or more away from person’s body.
Cet équipement est conforme aux limites d’exposition aux rayonnements énoncées pour un
environnement non contrôlé et respecte les règles d’exposition aux fréquences radioélectriques (RF)
CNR-102 de l’IC. Cet équipement doit être installé et utilisé en gardant une distance de 20 cm ou plus
entre le radiateur et le corps humain.
RF Exposure requirements are met when installed in mobile equipment.
This module cannot be installed in portable equipment without further testing and a change to FCC's
grant of authorization.
Contact Murata regarding portable applications.
Note)
Portable equipment : Equipment for which the spaces between human body and antenna are used
within 20cm.
Mobile equipment : Equipment used at position in which the spaces between human body and antenna
exceeded 20cm.
This device is intended only for OEM integrators under the following conditions: (For module
device use)
1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and
2) The transmitter module may not be co-located with any other transmitter or antenna.
3)The use of an antenna with gain less than 1.4 dBi.
As long as 3 conditions above are met, further transmitter test will not be required. However, the OEM
integrator is still responsible for testing their end-product for any additional compliance requirements
required with this module installed.
Cet appareil est conçu uniquement pour les intégrateurs OEM dans les conditions suivantes:
(Pour utilisation de dispositif module)
1)L'antenne doit être installée de telle sorte qu'une distance de 20 cm est respectée entre l'antenne et
les utilisateurs, et
2)Le module émetteur peut ne pas être coïmplanté avec un autre émetteur ou antenne.
Tant que les 3 conditions ci-dessus sont remplies, des essais supplémentaires sur l'émetteur ne seront
pas nécessaires. Toutefois, l'intégrateur OEM est toujours responsable des essais sur son produit final
pour toutes exigences de conformité supplémentaires requis pour ce module installé.
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IMPORTANT NOTE:
In the event that these conditions cannot be met (for example certain laptop configurations or co-location
with another transmitter), then the Canada authorization is no longer considered valid and the IC ID
cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for
re-evaluating the end product (including the transmitter) and obtaining a separate Canada authorization.
NOTE IMPORTANTE:
Dans le cas où ces conditions ne peuvent être satisfaites (par exemple pour certaines configurations
d'ordinateur portable ou de certaines co-localisation avec un autre émetteur), l'autorisation du Canada
n'est plus considéré comme valide et l'ID IC ne peut pas être utilisé sur le produit final. Dans ces
circonstances, l'intégrateur OEM sera chargé de réévaluer le produit final (y compris l'émetteur) et
l'obtention d'une autorisation distincte au Canada.
End Product Labeling
This transmitter module is authorized only for use in device where the antenna may be installed such
that 20 cm may be maintained between the antenna and users. The final end product must be labeled in
a visible area with the following: “Contains IC: ”.
Plaque signalétique du produit final
Ce module émetteur est autorisé uniquement pour une utilisation dans un dispositif où l'antenne peut
être installée de telle sorte qu'une distance de 20cm peut être maintenue entre l'antenne et les
utilisateurs. Le produit final doit être étiqueté dans un endroit visible avec l'inscription suivante: "Contient
des IC:
".
Manual Information To the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or
remove this RF module in the user’s manual of the end product which integrates this module.
The end user manual shall include all required regulatory information/warning as show in this manual.
Manuel d'information à l'utilisateur final
L'intégrateur OEM doit être conscient de ne pas fournir des informations à l'utilisateur final quant à la
façon d'installer ou de supprimer ce module RF dans le manuel de l'utilisateur du produit final qui intègre
ce module.
Le manuel de l'utilisateur final doit inclure toutes les informations réglementaires requises et
avertissements comme indiqué dans ce manuel.
Preliminary
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.