Semikron C1-18N-10 Ceramic chip inductor Datasheet

CERAMIC CHIP INDUCTORS
C1 SERIES
1. PART NO. EXPRESSION :
C 1 - 1 N 0 S - □□
(a)
(b) (c)
(d)
(a) Series code
(c) Inductance Tolerence : S=± 0.3nH , J=± 5% , K=± 10%
(b) Inductance code : 1N0 = 1.0nH
(d) 10: Standard
11 ~ 99 : Internal control number
2. C0NFIGURATION & DIMENSIONS :
A
B
D
L
H
C
G
Recommended PC Board Pattern
Unit:m/m
B
A
C
G
H
L
0.45~0.55
0.45~0.55
1.50
D
1.00± 0.05 0.50± 0.05 0.50± 0.05 0.25± 0.10
3. SCHEMATIC :
4. MATERIALS :
b
a
Ag(100%)
Ni(100%)-1.5um(min.)
Sn(100%)-3.0um(min.)
(a) Body : ceramic ( Pb Free )
(b) Termination : ( Pb Free )
5. GENERAL SPECIFICATION :
a) Operating temp. : -40° C to +105° C ( including self-temperature. rise )
b) Storage condition (component in its packaging)
i) Temperature : -10 to 40° C
ii) Humidity : 60%
NOTE : Specifications subject to change without notice. Please check our website for latest information.
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PG. 1
CERAMIC CHIP INDUCTORS
C1 SERIES
6. ELECTRICAL CHARACTERISTICS :
Part Number
Inductance
Test Frequency
Q
(nH)
( MHz )
Min
Q(Typ.) Frequency(MHz)
100 300
500 800 1000
Rated Current
DC Resistance
(Ω)
SRF
( MHz )
(mA) Max
Max.
Typ.
Min
0.04
10000
>13000
Typ.
C1-1N0S-10
1.0
100
8
11
25
34
43
52
300
0.08
C1-1N2S-10
1.2
100
8
11
25
35
44
52
300
0.09
0.04
10000
>13000
C1-1N5S-10
1.5
100
8
11
24
33
44
48
300
0.10
0.05
6000
>13000
C1-1N8S-10
1.8
100
8
11
23
30
36
42
300
0.12
0.06
6000
11000
C1-2N0S-10
2.0
100
8
11
21
27
34
39
300
0.12
0.06
6000
10500
C1-2N2S-10
2.2
100
8
10
18
25
31
36
300
0.13
0.07
6000
10000
C1-2N4S-10
2.4
100
8
10
18
24
31
35
300
0.13
0.07
6000
9500
9000
C1-2N7S-10
2.7
100
8
10
18
24
31
34
300
0.13
0.08
6000
C1-3N0S-10
3.0
100
8
10
18
24
31
35
300
0.16
0.09
6000
8500
C1-3N3S-10
3.3
100
8
10
18
24
31
35
300
0.16
0.10
6000
8000
C1-3N6S-10
3.6
100
8
10
18
24
31
35
300
0.20
0.11
5000
7500
C1-3N9S-10
3.9
100
8
10
18
24
31
35
300
0.21
0.12
4000
7000
C1-4N3S-10
4.3
100
8
10
18
24
31
35
300
0.20
0.12
4000
6500
C1-4N7S-10
4.7
100
8
10
18
24
31
34
300
0.21
0.12
4000
6000
C1-5N1S-10
5.1
100
8
10
18
24
31
34
300
0.21
0.13
4000
5800
10
18
24
30
35
300
0.23
0.15
4000
5700
C1-5N6S-10
5.6
100
8
C1-6N2S-10
6.2
100
8
10
18
24
30
34
300
0.25
0.16
3900
5600
C1-6N8□-10
6.8
100
8
10
18
23
29
32
300
0.25
0.17
3900
5500
C1-7N5□-10
7.5
100
8
10
18
23
29
32
300
0.25
0.18
3700
5200
C1-8N2□-10
8.2
100
8
10
18
23
29
31
300
0.28
0.21
3600
4900
0.22
3400
4500
4300
C1-9N1□-10
9.1
100
8
10
18
23
29
31
300
10
18
23
29
31
300
0.31
0.23
3200
0.30
C1-10N□-10
10
100
8
C1-12N□-10
12
100
8
11
18
23
29
31
300
0.40
0.28
2700
3900
C1-15N□-10
15
100
8
11
18
23
28
30
300
0.46
0.31
2300
3500
C1-18N□-10
18
100
8
11
18
23
28
30
300
0.55
0.35
2100
3100
C1-22N□-10
22
100
8
11
17
22
26
27
300
0.60
0.42
1900
2800
C1-27N□-10
27
100
8
11
17
21
25
26
300
0.70
0.47
1600
2300
C1-33N□-10
33
100
8
11
16
20
23
22
200
0.80
0.50
1300
1900
C1-39N□-10
39
100
8
11
16
20
23
21
200
0.90
0.52
1200
1700
16
19
21
18
200
1.00
0.58
1000
1500
C1-47N□-10
47
100
8
11
C1-56N□-10
56
100
8
11
16
18
18
16
200
1.00
0.61
750
1300
C1-68N□-10
68
100
8
11
15
17
18
11
180
1.20
0.70
750
1200
C1-82N□-10
82
100
8
10
14
16
15
6
150
1.30
0.81
600
1100
C1-R10□-10
100
100
8
10
14
14
12
-
150
1.50
0.94
600
1000
NOTE : Specifications subject to change without notice. Please check our website for latest information.
26.01.2015
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PG. 2
CERAMIC CHIP INDUCTORS
Part Number
C1 SERIES
Inductance
Test Frequency
Q
(nH)
( MHz )
Min
10
12
10
-
Q(Typ.) Frequency(MHz)
100 300
Rated Current
DC Resistance
(Ω)
SRF
( MHz )
(mA) Max
Max.
Typ.
Min
-
150
1.60
1.10
600
800
500 800 1000
Typ.
C1-R12□-10
120
100
8
C1-R15□-10
150
100
8
12
17
17
-
-
140
3.20
2.57
550
920
C1-R18□-10
180
100
8
12
16
-
-
-
130
3.70
2.97
500
810
C1-R22□-10
220
100
8
12
16
-
-
-
120
4.20
3.29
450
700
C1-R27□-10
270
100
8
12
14
-
-
-
110
4.80
3.92
400
600
Inductance Tolerence : □
J=± 5%
K=± 10%
NOTE : Specifications subject to change without notice. Please check our website for latest information.
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PG. 3
CERAMIC CHIP INDUCTORS
C1 SERIES
7. CHARACTERISTICS CURVES :
Impedance v.s. Frequency Characteristics
HCI100 5F Z
10000
VS Freq.
IMPEDANCE(Ohm)
1000
100n
100
47n
10
22n
1
10n
6.8n
0. 1
1
10
100
1 000
10000
FREQUENCY(MHz)
Inductance v.s. Frequency Characteristics
HCI1005F L VS Fr eq.
INDUCTANCE( nH)
1000
100n
100
47n
22n
10n
10
6.8n
1
1
10
100
1000
1 0000
FREQUENCY(MHz)
Q v.s. Frequency Characteristics
HCI1005F Q VS Freq.
100
6.8n
Q
10n
22n
10
47n
100n
1
1
10
100
1000
10000
FREQUENCY(MHz)
NOTE : Specifications subject to change without notice. Please check our website for latest information.
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PG. 4
CERAMIC CHIP INDUCTORS
C1 SERIES
8. SOLDERING AND MOUNTING :
8-1. Recommended PC Board Pattern
Unit:m/m
L
H
G
L
G
H
1.50
0.45~0.55
0.45~0.55
PC board should be designed so that products can prevent damage from
mechanical stress when warping the board.
8-2. Soldering
Mildly activated rosin fluxes are preferred. The terminations are suitable for re-flow soldering systems. If hand soldering
cannot be avoided, the preferred technique is the utilization of hot air soldering tools.
Note.
If wave soldering is used ,there will be some risk.
Re-flow soldering temperatures below 240 degrees, there will be non-wetting risk
8-2.1 Lead Free Solder Re-flow :
Recommended temperature profiles for lead free re-flow soldering in Figure 1. (Refered to J-STD-020C)
8-2.2 Soldering Iron :
Products attachment with a soldering iron is discouraged due to the inherent process control limitations. If a
soldering iron must be employed the following precautions are recommended. for Iron Soldering in Figure 2.
Note :
d) 1.0mm tip diameter (max)
a) Preheat circuit and products to 150° C.
e) Use a 20 watt soldering iron with tip diameter of 1.0mm
b) 350° C tip temperature for Ferrite chip bead (max)
f) Limit soldering time to 4-5 secs.
c) Never contact the ceramic with the iron tip
Soldering
Natural
cooling
20~40s
TP(26 0° C/40 s max.)
217
200
150
60~150s
60~180s
25
4 80s max.
Preheating
TEMPERATURE ° C
TEMPERATURE ° C
Preheating
Time(sec.)
Figure 1. Re-flow Soldering:3 times max
Soldering
Natural
cooling
350
150
G rad ual
Cooling
O ve r 60s.
Within4 ~5s
Figure 2. Wave Soldering:1 times max
NOTE : Specifications subject to change without notice. Please check our website for latest information.
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PG. 5
CERAMIC CHIP INDUCTORS
C1 SERIES
8-3. Solder Volume
Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume
may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in Fig. 3.
Minimum fillet height = soldering thickness + 25% product height
Upper limit
t
ReC0mmendable
Figure 3
NOTE : Specifications subject to change without notice. Please check our website for latest information.
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PG. 6
CERAMIC CHIP INDUCTORS
C1 SERIES
9. PACKAGING INFORMATION :
9-1. Reel Dimension
A
2± 0.5
13.5± 0.5
R10.5
R0.5
C
D
B
R1.9
120°
7" x 8mm
Type
A(mm)
B(mm)
7" x 8mm
9.0± 0.5
60± 2
C(mm)
D(mm)
13.5± 0.5 178.0± 2.0
9-2 Tape Dimension / 8mm
Material : Paper
Bo
Ao
P
W:8.0± 0.1
t
F:3.5± 0.1
E:1.75± 0.1
D:1.56+0.1-0.05
Po:4± 0.1
P2:2± 0.10
Size
Bo(mm)
Ao(mm)
Ko(mm)
P(mm)
t(mm)
C1
1.15± 0.10
0.65± 0.10
0.80 max
2.0± 0.05
0.80 max
Ko
9-3. Packaging Quantity
Chip Size
C1
Chip / Reel
10000
Inner Box
50000
Middle Box
250000
Carton
500000
NOTE : Specifications subject to change without notice. Please check our website for latest information.
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PG. 7
CERAMIC CHIP INDUCTORS
C1 SERIES
9-4. Tearing Off Force
The force for tearing off cover tape is 15 to 60 grams
in the arrow direction under the following conditions.
F
165° C to 180° C
Top cover tape
Room Temp.
(° C)
Room Humidity
(%)
Room atm
(hPa)
Tearing Speed
(mm/min)
5~35
45~85
860~1060
300
Base tape
Application Notice
1. Storage Conditions :
To maintain the solderabililty of terminal electrodes :
a) Recommended products should be used within 12 months from the time of delivery.
b) The packaging material should be kept where no chlorine or sulfur exists in the air.
2. Transportation :
a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils.
b) The use of tweezers or vacuum pick up is strongly recommended for individual components.
c) Bulk handling should ensure that abrasion and mechanical shock are minimized.
NOTE : Specifications subject to change without notice. Please check our website for latest information.
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PG. 8
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