Formosa LBS8 Smd bridge rectifier Datasheet

Formosa MS
SMD Bridge Rectifier
LBS05 THRU LBS10
List
List................................................................................................. 1
Package outline............................................................................... 2
Features.......................................................................................... 2
Mechanical data............................................................................... 2
Maximum ratings ............................................................................. 2
Rating and characteristic curves........................................................ 3
Pinning information........................................................................... 4
Marking........................................................................................... 4
Suggested solder pad layout............................................................. 4
Packing information.......................................................................... 5
Reel packing .................................................................................... 6
Suggested thermal profiles for soldering processes............................. 6
High reliability test capabilities........................................................... 7
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TEL:886-2-22696661
FAX:886-2-22696141
Page 1
Document ID
Issued Date
Revised Date
Revision
Page.
DS-241172
2011/07/25
2012/04/05
B
7
Formosa MS
SMD Bridge Rectifier
LBS05 THRU LBS10
1.0A Miniature Glass Passivated
Single-Phase Surface Mount
Bridge Rectifiers-50V-1000V
Package outline
LMBS
Features
• Low profile surface mounted application in order to
optimize board space.
• Rating to 1000V PRV
• Ideal for printed circuit board
• Reliable low cost construction utilizing
molded plastic technique results in inexpensive product
• Lead tin plated copper
• Suffix "-H" indicates Halogen-free part, ex.LBS05-H.
Mechanical data
• Epoxy:UL94-V0 rated flame retardant
• Case : Molded plastic, LMBS
• Terminals : Solder plated, solderable per
MIL-STD-202, Method 208
Dimensions in inches and (millimeters)
• Polarity : marked on body
• Mounting Position : Any
• Weight : Approximated 0.080 gram
Maximum ratings and Electrical Characteristics (AT
PARAMETER
T A=25 oC unless otherwise noted)
CONDITIONS
Forward rectified current
at TA=40°C Mounted on P.C. board
Forward surge current
8.3ms single half sine-wave superimposed on
rate load (JEDEC methode)
V R = V RRM T J = 25 OC
Reverse current
V R = V RRM T J = 125 OC
Rating for fusing (t < 8.3 ms)
V RMS*2
(V)
*3
VR
(V)
LBS05
50
35
50
LBS1
100
70
100
LBS2
200
140
200
LBS4
400
280
400
LBS6
600
420
600
LBS8
800
560
800
LBS10
1000
700
1000
*4
VF
(V)
UNIT
1.0
A
I FSM
30
A
5.0
IR
μA
500
O
80
C/W
A 2s
3.7
It
*1
V RRM
(V)
MAX.
IO
T STG
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TYP.
2
Storage temperature
SYMBOLS
MIN.
R θJA
Junction to ambient
Thermal resistance
Symbol
O
+150
-55
C
Operating
temperature
T J, ( OC)
*1 Repetitive peak reverse voltage
*2 RMS voltage
1.10
-55 to +150
*3 Continuous reverse voltage
*4 Maximum forward voltage@I F=1.0A
Page 2
Document ID
Issued Date
Revised Date
Revision
Page.
DS-241172
2011/07/25
2012/04/05
B
7
Rating and characteristic curves (LBS05 THRU LBS10)
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 3
Document ID
Issued Date
Revised Date
Revision
Page.
DS-241172
2011/07/25
2012/04/05
B
7
Formosa MS
SMD Bridge Rectifier
LBS05 THRU LBS10
Pinning information
Simplified outline
Symbol
Marking
Type number
LBS05
LBS1
LBS2
LBS4
LBS6
LBS8
LBS10
Marking code
ABS05
ABS1
ABS2
ABS4
ABS6
ABS8
ABS10
Example
1.For Halogen Device
2.For Halogen-free Device
Marking code
ABS8
1st line: Marking code
ABS8
―
2nd line: ― indicate Halogen-Free.
Suggested solder pad layout
A
D
B
C
Dimensions in inches and (millimeters)
PACKAGE
LMBS
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
A
0.031 (0.80)MIN
B
C
D
0.024 (0.60)MIN 0.157(4.00)REF 0.244 (6.20)MAX
Page 4
Document ID
Issued Date
Revised Date
Revision
Page.
DS-241172
2011/07/25
2012/04/05
B
7
Formosa MS
SMD Bridge Rectifier
LBS05 THRU LBS10
Packing information
C
D
D1
D2
W1
unit:mm
Item
Symbol
Tolerance
Carrier width
Carrier length
Carrier depth
Sprocket hole
13" Reel outside diameter
13" Reel inner diameter
7" Reel outside diameter
7" Reel inner diameter
Feed hole diameter
Sprocket hole position
Punch hole position
Punch hole pitch
Sprocket hole pitch
Embossment center
Overall tape thickness
Tape width
Reel width
A
B
C
d
D
D1
D
D1
D2
E
F
P
P0
P1
t
W
W1
0.1
0.1
0.1
0.05
2.0
min
2.0
min
0.5
0.1
0.05
0.1
0.1
0.05
0.1
0.3
1.0
LMBS
5.31
6.68
1.60
1.55
330.00
50.00
13.00
1.75
5.50
8.00
4.00
2.00
0.30
12.00
12~14.4
Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 5
Document ID
Issued Date
Revised Date
Revision
Page.
DS-241172
2011/07/25
2012/04/05
B
7
Formosa MS
SMD Bridge Rectifier
LBS05 THRU LBS10
Reel packing
PACKAGE
REEL SIZE
13"
LMBS
REEL
(pcs)
COMPONENT
SPACING
(m/m)
5,000
8.0
BOX
(pcs)
10,000
INNER
BOX
(m/m)
REEL
DIA,
(m/m)
360*340*45
330
CARTON
SIZE
(m/m)
CARTON
(pcs)
APPROX.
GROSS WEIGHT
(kg)
80,000
14.0
380*365*400
Suggested thermal profiles for soldering processes
o
o
1.Storage environment: Temperature=5 C ~40 C Humidity=55%±25%
2.Reflow soldering of surface-mount devices
Critical Zone
TL to TP
Tp
TP
Ramp-up
TL
TL
Tsmax
Temperature
Tsmin
tS
Preheat
Ramp-down
25
t25o C to Peak
Time
3.Reflow soldering
Profile Feature
Soldering Condition
Average ramp-up rate(T L to T P )
o
<3 C /sec
Preheat
-Temperature Min(Tsmin)
-Temperature Max(Tsmax)
-Time(min to max)(t s )
150 oC
200 oC
60~120sec
Tsmax to T L
-Ramp-upRate
<3 oC/sec
Time maintained above:
-Temperature(T L )
-Time(t L )
217 oC
60~260sec
255 oC-0/+5 oC
Peak Temperature(T P )
Time within 5 oC of actual Peak
Temperature(t P )
10~30sec
Ramp-down Rate
<6 C/sec
Time 25 oC to Peak Temperature
<6minutes
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TEL:886-2-22696661
FAX:886-2-22696141
o
Page 6
Document ID
Issued Date
Revised Date
Revision
Page.
DS-241172
2011/07/25
2012/04/05
B
7
Formosa MS
SMD Bridge Rectifier
LBS05 THRU LBS10
High reliability test capabilities
Item Test
Conditions
Reference
O
1. Solder Resistance
at 260 ± 5 C for 10 ± 2sec.
immerse body into solder 1/16"±1/32"
MIL-STD-750D
METHOD-2031
2. Solderability
at 245±5 OC for 5 sec.
MIL-STD-202F
METHOD-208
3. High Temperature Reverse Bias
V R=80% rate at T J=150 OC for 168 hrs.
MIL-STD-750D
METHOD-1038
4. Forward Operation Life
Rated average rectifier current at T A=25 OC for 500hrs.
MIL-STD-750D
METHOD-1027
T A = 25 OC, I F = I O
On state: power on for 5 min.
off state: power off for 5 min.
on and off for 500 cycles.
MIL-STD-750D
METHOD-1036
5. Intermittent Operation Life
6. Pressure Cooker
JESD22-A102
15P SIG at T A=121 OC for 4 hrs.
7. Temperature Cycling
-55 OC to +125 OC dwelled for 30 min.
and transferred for 5min. total 10 cycles.
8. Thermal Shock
0 OC for 5 min. rise to 100 OC for 5 min. total 10 cycles.
MIL-STD-750D
METHOD-1056
9. Forward Surge
8.3ms single half sine-wave superimposed
on rated load, one surge.
MIL-STD-750D
METHOD-4066-2
10. Humidity
at T A=85 OC, RH=85% for 1000hrs.
MIL-STD-750D
METHOD-1021
11. High Temperature Storage Life
at 175 OC for 1000 hrs.
MIL-STD-750D
METHOD-1031
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Page 7
MIL-STD-750D
METHOD-1051
Document ID
Issued Date
Revised Date
Revision
Page.
DS-241172
2011/07/25
2012/04/05
B
7
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