TI1 LM137KGMD8 3-terminal adjustable negative regulator Datasheet

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LM137QML
SNVS313E – DECEMBER 2010 – REVISED DECEMBER 2016
LM137QML 3-Terminal Adjustable Negative Regulators
1 Features
3 Description
•
•
•
•
The LM137 are adjustable 3-terminal negative
voltage regulators capable of supplying in excess of
1.5 A over an output voltage range of −37 V to −1.2
V. These regulators are exceptionally easy to apply,
requiring only 2 external resistors to set the output
voltage and 1 output capacitor for frequency
compensation. The circuit design has been optimized
for excellent regulation and low thermal transients.
Further, the LM137 series features internal current
limiting,
thermal
shutdown
and
safe-area
compensation, making them virtually blowout-proof
against overloads.
1
•
•
•
•
•
•
•
•
•
•
SMD 5962-99517
Available TID Qualified to 30 krad(Si)
Output Voltage Adjustable from −37 V to −1.2 V
1.5A Output Current Guaranteed, −55°C to
+150°C
Line Regulation Typically 0.01%/V
Load Regulation Typically 0.3%
Excellent Thermal Regulation, 0.002%/W
77 dB Ripple Rejection
Excellent Rejection of Thermal Transients
50 ppm/°C Temperature Coefficient
Temperature-independent Current Limit
Internal Thermal Overload Protection
Standard 3-lead Transistor Package
Output is Short Circuit Protected
2 Applications
•
•
•
•
•
Multipurpose Power Supply
On-card Voltage Regulation
Programmable Voltage Supply
Precision Current Supply
Harsh Environments
The LM137 serve a wide variety of applications
including local on-card regulation, programmableoutput voltage regulation or precision current
regulation. The LM137 are ideal complements to the
LM117 adjustable positive regulators.
Device Information(1)
PART NUMBER
SMD NUMBER
PACKAGE
LM137K/883
TO-3 (K)
LM137H/883
TO-39 (NDT)
LM137H1PQMLV
5962P9951708VXA
TO-39 (NDT)
30 krad
LM137H-MD8
Die
LM137KG-MD8
Die
LM137KG-MW8
Wafer
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM137QML
SNVS313E – DECEMBER 2010 – REVISED DECEMBER 2016
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Table of Contents
1
2
3
4
5
6
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
6.1
6.2
6.3
6.4
6.5
6.6
4
4
4
4
5
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information .................................................
Quality Conformance Inspection ...............................
LM137H 883 Electrical Characteristics DC
Parameters.................................................................
6.7 LM137H 883 Electrical Characteristics AC
Parameters.................................................................
6.8 LM137K 883 Electrical Characteristics DC
Parameters.................................................................
6.9 LM137K 883 Electrical Characteristics AC
Parameters.................................................................
6.10 LM137H RH Electrical Characteristics DC
Parameters 5962P9951708VXA................................
6
6
6.11 LM137H RH Electrical Characteristics AC
Parameters 5962P9951708VXA ................................ 9
6.12 LM137H RH Electrical Characteristics DC
Parameters Drift Values 5962P9951708VXA.......... 9
6.13 LM137H RH Electrical Characteristics DC
Parameters Post Radiation Limits +25°C
5962P9951708VXA.................................................... 9
6.14 Typical Performance Characteristics .................... 10
7
Detailed Description ............................................ 12
8
Application and Implementation ........................ 13
7.1 Functional Block Diagram ....................................... 12
8.1 Application Information and Schematic Diagram .... 13
8.2 Typical Applications ................................................ 13
9
Power Supply Recommendations...................... 16
9.1 Thermal Regulation................................................. 16
10 Device and Documentation Support ................. 17
7
10.1 Trademarks ........................................................... 17
10.2 Electrostatic Discharge Caution ............................ 17
10.3 Glossary ................................................................ 17
8
11 Mechanical, Packaging, and Orderable
Information ........................................................... 17
7
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision D (February 2015) to Revision E
•
Page
Updated the package orderable addendum ........................................................................................................................... 1
Changes from Revision C (April 2013) to Revision D
Page
•
Added, updated, or renamed the following sections: Device Information table, Specifications, Feature Description,
Layout, Application and Implementation, Power supply Recommendations, Device and Documentation Support,
Mechanical, Packaging, and Ordering Information................................................................................................................. 1
•
Changed Vout Recovery condition from -4.25 V to -40 V ..................................................................................................... 9
Changes from Revision B (March 2013) to Revision C
•
Page
Changed layout of National Data Sheet to TI format. ........................................................................................................... 1
Changes from Revision A (December 2010) to Revision B
Page
•
Added new LM137H1PQMLV to Ordering Information .......................................................................................................... 1
•
Added to the HEADER of DC Parameters — Post Radiation Limits 5962P9951701VXA. Added the HEADER and
TABLE of DC Parameters — Post Radiation Limits 5962P9951708VXA for Electrical Characteristics tables...................... 6
2
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5 Pin Configuration and Functions
TO-3 Metal Can Package
Package K
(Bottom View)
NOTE: Case is Input
T0-39 Metal Can Package
Package NDT
(Top View)
NOTE: Case Is Input
Pin Functions
PIN
NAME
ADJUSTMENT
INPUT
OUTPUT /VOUT
NUMBER
I/O
K
NDT
1
1
Case
2
DESCRIPTION
O
Adjustment
3/Case
I
Input
2
O
Output
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SNVS313E – DECEMBER 2010 – REVISED DECEMBER 2016
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6 Specifications
6.1 Absolute Maximum Ratings (1)
UNIT
Power Dissipation (2)
Internally Limited
Input-Output Voltage Differential
40
V
Operating Ambient Temperature
−55 ≤ TA ≤ +125
°C
Operating Junction Temperature
−55 ≤ TJ ≤ +150
°C
Storage Temperature
−65 ≤ TA ≤ +150
°C
Maximum Junction Temperature
150
°C
Lead Temperature (Soldering, 10 sec.)
300
°C
Maximum Power Dissipation
(@25°C)
T0–3
28
W
T0–39
2.5
W
Package Weight (typical)
T0–3
12,750
mg
955
mg
T0–39 Metal Can
(1)
(2)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not guarantee specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature),
RθJA (package junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any
temperature is PDmax = (TJmax - TA)/RθJA or the number given in the Absolute Maximum Ratings, whichever is lower.
6.2 ESD Ratings
V(ESD)
(1)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
VALUE
UNIT
±4000
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 500-V HBM is possible with the necessary precautions. Pins listed as ±4000 V may actually have higher performance. Human
body model, 100 pF discharged through 1.5 KΩ.
6.3 Recommended Operating Conditions
MIN
TA
−41.25
Input Voltage
MAX
UNIT
−55 ≤ TA ≤ +125
°C
−4.25
V
6.4 Thermal Information
THERMAL METRIC (1)
RθJA
RθJC
(1)
4
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
TO-3 METAL CAN
TO-39 METAL CAN
2 PINS
3 PINS
40 (Still Air)
174 (Still Air @ 0.5W)
14 (500 LFM)
64 (500 LFM @ 0.5W)
4
15 (@ 1.0W)
UNIT
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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6.5 Quality Conformance Inspection
Table 1. Mil-Std-883, Method 5005 — Group A (1)
(1)
SUBGROUP
DESCRIPTION
1
Static tests at
TEMP (°C)
+25
2
Static tests at
+125
3
Static tests at
-55
4
Dynamic tests at
+25
5
Dynamic tests at
+125
6
Dynamic tests at
-55
7
Functional tests at
+25
8A
Functional tests at
+125
8B
Functional tests at
-55
9
Switching tests at
+25
10
Switching tests at
+125
11
Switching tests at
-55
Group “A” sample only, test at all temps.
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6.6 LM137H 883 Electrical Characteristics DC Parameters
The following conditions apply, unless otherwise specified. VIN = −4.25V, IL = 8mA, VOUT = VRef (1) (2)
PARAMETER
TEST CONDITIONS
SUBGROUPS
1
VRef
Reference Voltage
IQ
Minimum Load Current
2, 3
VIN = -42 V
1
Line Regulation
RLoad
Load Regulation
IAdj
Adjustment Pin Current
Δ IAdj / ILoad
VRth
Thermal Regulation
VO
(1)
(2)
Current Limit
-1.225
V
-1.3
-1.2
V
-1.275
-1.225
V
-1.3
2, 3
-1.2
V
3.0
mA
VOUT = -1.7 V, VIN = -11.75 V
1, 2, 3
3.0
mA
1
5.0
mA
2, 3
5.0
mA
VOUT = -1.7 V, VIN = -42 V
-42 V ≤ VIN ≤ -4.25 V
1
-9.0
9.0
mV
2, 3
-23
23
mV
5 mA ≤ IL ≤ 500 mA, VIN = -6.25 V
1, 2, 3
-25
25
mV
5mA ≤ IL ≤ 500 mA, VIN = -14.5 V
1
-25
25
mV
5mA ≤ IL ≤ 150 mA, VIN = -40 V
1, 2, 3
-25
25
mV
IL = 5 mA
1, 2, 3
100
µA
1
100
µA
2, 3
100
µA
-41.3 V ≤ VIN ≤ -4.25 V
VIN = -42 V
1
-5.0
5.0
µA
2, 3
-5.0
5.0
µA
5 mA ≤ IL ≤ 500 mA, VIN = -6.5 V
1, 2, 3
-5.0
5.0
µA
VIN = -14.5 V, IL = 500 mA, t = 10
mS
1
-5.0
5.0
mV
VIN = -14.5 V, IL = 5 mA, t = 10 mS
ICL
-1.275
1, 2, 3
-42 V ≤ VIN ≤ -4.25 V, IL = 5 mA
Adjust Pin Current
Change vs. Line Voltage -41.3 V ≤ VIN ≤ -4.25 V, IL = 5 mA
Adjust Pin Current
Change vs. Load
Current
UNIT
VOUT = -1.7 V
VIN = -41.3 V
Δ IAdj / VLine
MAX
VIN = -41.3 V
VOUT = -1.7 V, VIN = -41.3 V
RLine
MIN
1
-5.0
5.0
mV
VIN = -5 V
1, 2, 3
-1.8
-0.5
A
VIN = -40 V
1, 2, 3
-0.65
-0.15
A
1
-1.28
-1.22
V
2, 3
-1.3
-1.2
V
TEST CONDITIONS
SUBGROUPS
MIN
MAX
UNIT
VIN = -6.25 V, VOUT = VRef,
IL = 125 mA, eI = 1VRMS, F = 120 Hz
4,5,6
Output Voltage
VIN = −41.3V at +125°C and −55°C
−41.3V ≤ VIN ≤ −4.25V at +125°C and −55°C
6.7 LM137H 883 Electrical Characteristics AC Parameters
PARAMETER
RR
(1)
6
Ripple Rejection Ratio
(1)
66
dB
Test at +25°C, ensured but not tested at +125°C and −55°C
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6.8 LM137K 883 Electrical Characteristics DC Parameters
The following conditions apply, unless otherwise specified. VIN = −4.25V, IL = 8mA, VOUT = VRef (1) (2)
PARAMETER
TEST CONDITIONS
SUBGROUPS
1
VRef
Reference Voltage
IQ
Minimum Load Current
2, 3
VIN = -42 V
1
RLoad
Line Regulation
Load Regulation
(1)
(2)
-1.225
V
-1.3
V
mA
VOUT = -1.7 V, VIN = -11.75 V
1, 2, 3
3.0
mA
1
5.0
mA
2, 3
5.0
mA
VOUT = -1.7 V, VIN = -42 V
-42 V ≤ VIN ≤ -4.25 V
1
-9.0
9.0
mV
-41.3V ≤ VIN ≤ -4.25V
2, 3
-23
23
mV
VIN = -6.25 V, 8 mA ≤ IL ≤ 1.5 A
1, 2, 3
-25
25
mV
VIN = -14.5 V, 8 mA ≤ IL ≤ 1.5 A
1
-25
25
mV
VIN = -40 V, 8 mA ≤ IL ≤ 300 mA
1
-25
25
mV
2, 3
-25
25
mV
1, 2, 3
100
µA
1
100
µA
VIN = -42 V
VIN = -41.3 V
Current Limit
V
-1.275
3.0
-42 V ≤ VIN ≤ -4.25 V
Adjust Pin Current
Change vs. Line Voltage -41.3 V ≤ VIN ≤ -4.25 V
ICL
V
-1.2
-1.2
Δ IAdj / VLine
Thermal Regulation
-1.225
-1.3
2, 3
Adjustment Pin Current
VRth
-1.275
1, 2, 3
IAdj
Adjust Pin Current
Change vs. Load
Current
UNIT
VOUT = -1.7 V
VIN = -40 V, 8 mA ≤ IL ≤ 250 mA
Δ IAdj / ILoad
MAX
VIN = -41.3 V
VOUT = -1.7 V, VIN = -41.3 V
RLine
MIN
2, 3
100
µA
1
-5.0
5.0
µA
2, 3
-5.0
5.0
µA
1, 2, 3
-5.0
5.0
µA
1
-5.0
5.0
mV
8 mA ≤ IL ≤ 1.5 A, VIN = -6.25 V
VIN = -14.5 V, IL = 1.5 mA, t = 10 mS
VIN = -14.5 V, IL = 8 mA, t = 10 mS
1
-5.0
5.0
mV
VIN = -5 V
1, 2, 3
-3.5
-1.5
A
VIN = -40 V
1, 2, 3
-1.2
-0.24
A
MIN
MAX
UNIT
VIN = −41.3V at +125°C and −55°C
−41.3V ≤ VIN ≤ −4.25V at +125°C and −55°C
6.9 LM137K 883 Electrical Characteristics AC Parameters
PARAMETER
RR
(1)
Ripple Rejection Ratio
(1)
TEST CONDITIONS
SUBGROUPS
VIN = -6.25 V, VOUT = VRef,
f = 120 Hz, IL = 0.5 A,
eI = 1VRMS
4,5,6
66
dB
Test at +25°C, ensured but not tested at +125°C and −55°C
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6.10 LM137H RH Electrical Characteristics DC Parameters 5962P9951708VXA
The following conditions apply, unless otherwise specified.
PARAMETER
(1)
TEST CONDITIONS
SUBGROUPS
1
VIN = -4.25 V, IL = 5 mA
2, 3
1
VIN = -4.25 V, IL = 500 mA
VOUT
2, 3
Output Voltage
1
VIN = -41.25 V, IL = 5 mA
2, 3
1
VIN = -41.25 V, IL = 50 mA
VR Line
Line Regulation
VIN = -41.25 V to -4.25 V, IL = 5 mA
VIN = -6.25 V, IL = 5 mA to 500 mA
VR Load
Load Regulation
VIN = -41.25 V, IL = 5 mA to 50 mA
VIN = -6.25 V, IL = 5 mA to 200 mA
VRth
Thermal Regulation
VIN = -14.6 V, IL = 500 mA
MIN
MAX
UNIT
-1.275
-1.225
V
-1.3
-1.2
V
-1.275
-1.225
V
-1.3
-1.2
V
-1.275
-1.225
V
-1.3
-1.2
V
V
-1.275
-1.225
2, 3
-1.3
-1.2
V
1
-9.0
9.0
mV
2, 3
-23
23
mV
1
-12
12
mV
2, 3
-24
24
mV
1
-6.0
6.0
mV
2, 3
-12
12
mV
1
-6.0
6.0
mV
2, 3
-12
12
mV
1
-5.0
5.0
mV
VIN = -4.25 V, IL = 5 mA
1, 2, 3
25
100
µA
VIN = -41.25 V, IL = 5 mA
1, 2, 3
25
100
µA
IAdj
Adjust Pin Current
Δ IAdj / VLine
Adjust Pin Current
VIN = -41.25 V to -4.25 V, IL = 5 mA
Change vs. Line Voltage
1, 2, 3
-5.0
5.0
µA
Δ IAdj / ILoad
Adjust Pin Current
Change vs. Load
Current
VIN = -6.25 V, IL = 5 mA to 500 mA
1, 2, 3
-5.0
5.0
µA
VIN = -4.25 V
1, 2, 3
0.5
1.8
A
VIN = -40 V
1, 2, 3
0.05
0.5
A
-1.275
-1.225
V
Output Short Circuit
Current
IOS
VOUT Recovery
IQ
Output Voltage
Recovery After Output
Short Circuit Current
Minimum Load Current
VIN = -4.25 V
-1.3
-1.2
V
-1.275
-1.225
V
2, 3
-1.3
-1.2
V
VIN = -4.25 V
1, 2, 3
0.2
3.0
mA
VIN = -14.25 V
1, 2, 3
0.2
3.0
mA
VIN = -41.25 V
1, 2, 3
1.0
5.0
mA
Voltage Start-up
VIN = -4.25 V, IL = 500 mA
VOUT
Output Voltage (2)
VIN = -6.25 V, IL = 5 mA
(2)
8
2, 3
1
VIN = -40 V
VStart
(1)
1
-1.275
-1.225
V
2, 3
1
-1.3
-1.2
V
2
-1.3
-1.2
V
Pre and post irradiation limits are identical to those listed under AC and DC electrical characteristics except as listed in the Post
Radiation Limits Table. These parts may be dose rate sensitive in a space environment and demonstrate enhanced low dose rate effect.
Radiation end point limits for the noted parameters are specified only for the conditions as specified in Mil-Std-883, Method 1019.5,
Condition A.
Tested at +125°C ; correlated to +150°C
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6.11 LM137H RH Electrical Characteristics AC Parameters 5962P9951708VXA
The following conditions apply, unless otherwise specified. (1)
PARAMETER
SUBGROUPS
TEST CONDITIONS
MIN
MAX
UNIT
ΔVIN / ΔVOUT
Ripple Rejection
VIN = -6.25 V, IL = 125 mA,
eI = 1VRMS at 2400 Hz
9
VNO
Output Noise Voltage
VIN = -6.25 V, IL = 50 mA
9
ΔVOUT / ΔVIN
Line Transient
Response
VIN = -6.25 V, VPulse = -1V, IL = 50 mA
9
80
mV/V
ΔVO / Δ IL
Load Transient
Response (2)
VIN = -6.25 V, IL = 50 mA, Δ IL = 200 mA
9
60
mV
(1)
(2)
48
dB
120 µVRMS
Pre and post irradiation limits are identical to those listed under AC and DC electrical characteristics except as listed in the Post
Radiation Limits Table. These parts may be dose rate sensitive in a space environment and demonstrate enhanced low dose rate effect.
Radiation end point limits for the noted parameters are specified only for the conditions as specified in Mil-Std-883, Method 1019.5,
Condition A.
Limit of 0.3mV/mA is equivalent to 60mV
6.12 LM137H RH Electrical Characteristics DC Parameters
Drift Values 5962P9951708VXA
(1)
The following conditions apply, unless otherwise specified.
Delta calculations performed on QMLV devices at group B, subgroup 5 only.
SUBGROUPS
MIN
MAX
UNIT
VIN = -4.25 V, IL = 5 mA
1
-0.01
0.01
V
VIN = -4.25 V, IL = 500 mA
1
-0.01
0.01
V
VIN = -41.25 V, IL = 5 mA
1
-0.01
0.01
V
VIN = -41.25 V, IL = 50 mA
1
-0.01
0.01
V
VIN = -41.25 V to -4.25 V, IL = 5 mA
1
-4.0
4.0
mV
VIN = -4.25 V, IL = 5 mA
1
-10
10
µA
VIN = -41.25 V, IL = 5 mA
1
-10
10
µA
PARAMETER
VOUT
VR Line
IAdj
(1)
Output Voltage
Line Regulation
Adjust Pin Current
TEST CONDITIONS
Pre and post irradiation limits are identical to those listed under AC and DC electrical characteristics except as listed in the Post
Radiation Limits Table. These parts may be dose rate sensitive in a space environment and demonstrate enhanced low dose rate effect.
Radiation end point limits for the noted parameters are specified only for the conditions as specified in Mil-Std-883, Method 1019.5,
Condition A.
6.13 LM137H RH Electrical Characteristics DC Parameters
5962P9951708VXA
Post Radiation Limits +25°C
The following conditions apply, unless otherwise specified. (1)
SUBGROUPS
MIN
MAX
VIN = -41.25 V, IL = 5 mA
1
-1.30
-1.225
PARAMETER
TEST CONDITIONS
UNIT
V
VOUT
Output Voltage
VIN = -41.25 V, IL = 50 mA
1
-1.30
-1.225
VR Line
Line Regulation
VIN = -41.25 V to -4.25 V, IL = 5 mA
1
-9.0
+50
mV
IAdj
Adjust Pin Current
VIN = -41.25 V, IL = 5 mA
1
25
140
µA
Δ IAdj / VLine
Adjust Pin Current
VIN = -41.25 V to -4.25 V, IL = 5 mA
Change vs. Line Voltage
1
-70
+20
µA
VOUT Recovery
Output Voltage
Recovery After Output
Short Circuit Current
1
-1.30
-1.225
V
(1)
V
VIN = -40 V
Pre and post irradiation limits are identical to those listed under AC and DC electrical characteristics except as listed in the Post
Radiation Limits Table. These parts may be dose rate sensitive in a space environment and demonstrate enhanced low dose rate effect.
Radiation end point limits for the noted parameters are specified only for the conditions as specified in Mil-Std-883, Method 1019.5,
Condition A.
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6.14 Typical Performance Characteristics
(NDT & K Packages)
Figure 1. Load Regulation
10
Figure 2. Current Limit
Figure 3. Adjustment Current
Figure 4. Dropout Voltage
Figure 5. Temperature Stability
Figure 6. Minimum Operating Current
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Typical Performance Characteristics (continued)
(NDT & K Packages)
Figure 7. Ripple Rejection
Figure 8. Ripple Rejection
Figure 9. Ripple Rejection
Figure 10. Output Impedance
Figure 11. Line Transient Response
Figure 12. Load Transient Response
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7 Detailed Description
7.1 Functional Block Diagram
Figure 13. Schematic Diagram
12
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information and Schematic Diagram
Full output current not available at high input-output voltages
†C1 = 1 μF solid tantalum or 10 μF aluminum electrolytic required for stability
*C2 = 1 μF solid tantalum is required only if regulator is more than 4″ from power-supply filter capacitor
Output capacitors in the range of 1μF to 1000 μF of aluminum or tantalum electrolytic are commonly used to provide
improved output impedance and rejection of transients
Figure 14. Adjustable Negative Voltage Regulator
8.2 Typical Applications
Full output current not available
at high input-output voltages
*The 10 μF capacitors are optional to improve ripple rejection
Figure 15. Adjustable Lab Voltage Regulator
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Typical Applications (continued)
Figure 16. Current Regulator
*When CL is larger than 20 μF, D1 protects the LM137 in case the input supply is shorted
**When C2 is larger than 10 μF and −VOUT is larger than −25V, D2 protects the LM137 in case the output is shorted
Figure 17. Negative Regulator with Protection Diodes
*Minimum output ≃ −1.3V when control input is low
Figure 18. −5.2V Regulator with Electronic Shutdown*
Figure 19. Adjustable Current Regulator
14
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Typical Applications (continued)
Figure 20. High Stability −10V Regulator
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9 Power Supply Recommendations
9.1 Thermal Regulation
When power is dissipated in an IC, a temperature gradient occurs across the IC chip affecting the individual IC
circuit components. With an IC regulator, this gradient can be especially severe since power dissipation is large.
Thermal regulation is the effect of these temperature gradients on output voltage (in percentage output change)
per Watt of power change in a specified time. Thermal regulation error is independent of electrical regulation or
temperature coefficient, and occurs within 5 ms to 50 ms after a change in power dissipation. Thermal regulation
depends on IC layout as well as electrical design. The thermal regulation of a voltage regulator is defined as the
percentage change of VOUT, per Watt, within the first 10 ms after a step of power is applied. The LM137's
specification is 0.02%/W, max.
LM137, VOUT = −10V
VIN − VOUT = −40V
IIL = 0A → 0.25A → 0A
Vertical sensitivity, 5 mV/div
Figure 21.
In Figure 21, a typical LM137's output drifts only 3 mV (or 0.03% of VOUT = −10V) when a 10W pulse is applied
for 10 ms. This performance is thus well inside the specification limit of 0.02%/W × 10W = 0.2% max. When the
10W pulse is ended, the thermal regulation again shows a 3 mV step as the LM137 chip cools off. Note that the
load regulation error of about 8 mV (0.08%) is additional to the thermal regulation error. In Figure 22, when the
10W pulse is applied for 100 ms, the output drifts only slightly beyond the drift in the first 10 ms, and the thermal
error stays well within 0.1% (10 mV).
LM137, VOUT = −10V
VIN − VOUT = −40V
IL = 0A → 0.25A → 0A
Horizontal sensitivity, 20 ms/div
Figure 22.
16
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10 Device and Documentation Support
10.1 Trademarks
All trademarks are the property of their respective owners.
10.2 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
10.3 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
11 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
www.ti.com
25-Apr-2017
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
5962P9951708VXA
ACTIVE
TO
NDT
3
20
TBD
Call TI
Call TI
-55 to 125
LM137H1PQMLV
5962P9951708VXA Q
ACO
5962P9951708VXA Q
>T
LM137H MD8
ACTIVE
DIESALE
Y
0
120
Green (RoHS
& no Sb/Br)
Call TI
Level-1-NA-UNLIM
-55 to 125
LM137H/883
ACTIVE
TO
NDT
3
20
TBD
Call TI
Call TI
-55 to 125
LM137H/883 Q ACO
LM137H/883 Q >T
LM137H1PQMLV
ACTIVE
TO
NDT
3
20
TBD
Call TI
Call TI
-55 to 125
LM137H1PQMLV
5962P9951708VXA Q
ACO
5962P9951708VXA Q
>T
LM137K/883
ACTIVE
TO
K
2
50
TBD
Call TI
Call TI
-55 to 125
LM137K
/883 Q ACO
/883 Q >T
LM137KG MD8
ACTIVE
DIESALE
Y
0
120
Green (RoHS
& no Sb/Br)
Call TI
Level-1-NA-UNLIM
-55 to 125
LM137KG-MW8
ACTIVE
WAFERSALE
YS
0
1
Green (RoHS
& no Sb/Br)
Call TI
Level-1-NA-UNLIM
-55 to 125
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
25-Apr-2017
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LM137QML, LM137QML-SP :
• Military: LM137QML
• Space: LM137QML-SP
NOTE: Qualified Version Definitions:
• Military - QML certified for Military and Defense Applications
• Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
Addendum-Page 2
MECHANICAL DATA
K0002C
K02C (Rev E)
4214774/A 03/2013
NOTES:
1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Leads not to be bent greater than 15º
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MECHANICAL DATA
NDT0003A
H03A (Rev D)
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