Infineon BSC0923NDI Material content data sheet Datasheet

Material Content Data Sheet
Sales Product Name
BSC0923NDI
MA#
MA001013780
Package
PG-TISON-8-2
Issued
14. August 2015
Weight*
96.80 mg
Construction Element
Material Group
Substances
CAS#
if applicable
Weight
[mg]
Average
Mass
[%]
chip
leadframe
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
non noble metal
< 10%
silicon
phosphorus
zinc
iron
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
silver
tin
lead
phosphorus
zinc
iron
copper
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-57-5
1333-86-4
60676-86-0
7440-31-5
7440-22-4
7440-22-4
7440-31-5
7439-92-1
7723-14-0
7440-66-6
7439-89-6
7440-50-8
0.785
0.81
0.010
0.01
0.041
0.04
424
0.822
0.85
8487
33.360
34.46
35.36
344627
353644
0.061
0.06
0.06
635
635
0.095
0.10
wire
encapsulation
leadfinish
plating
solder
heat sink CLIP
*deviation
Sum
[%]
Average
Mass
[ppm]
Sum
[ppm]
0.81
8111
8111
106
983
4.899
5.06
42.571
43.99
49.15
439779
491374
1.122
1.16
1.16
11589
11589
0.186
0.19
0.19
1919
1919
0.031
0.03
0.025
0.03
1.185
1.22
0.003
0.00
0.014
0.01
144
0.279
0.29
2878
11.312
11.69
50612
320
256
1.28
12239
11.99
116855
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption
7a, Lead in high melting temperature type solders.
Company
Infineon Technologies AG
Address
81726 München
Internet
www.infineon.com
12815
36
119913
1000000
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