Sample & Buy Product Folder Support & Community Tools & Software Technical Documents bq2947 SLUSB15E – SEPTEMBER 2012 – REVISED FEBRUARY 2016 bq2947 Overvoltage Protection for 2-Series to 4-Series Cell Li-Ion Batteries with External Delay Capacitor 1 Features 3 Description • • • The bq2947 family is an overvoltage monitor and protector for Li-Ion battery pack systems. Each cell is monitored independently for an overvoltage condition. 1 • • • • • 2-, 3-, and 4-Series Cell Overvoltage Protection External Capacitor-Programmed Delay Timer Factory Programmed OVP Threshold (Threshold Range 3.85 V to 4.6 V) Output Options: Active High or Open Drain Active Low High-Accuracy Overvoltage Protection: ±10 mV Low Power Consumption ICC ≈ 1 µA (VCELL(ALL) < VPROTECT) Low Leakage Current Per Cell Input < 100 nA Small Package Footprint – 8-Pin WSON (2.00 mm x 2.00 mm) In the bq2947 device, an external delay timer is initiated upon detection of an overvoltage condition on any cell. Upon expiration of the delay timer, the output is triggered into its active state (either high or low, depending on the configuration). The external delay timer feature also includes the ability to detect an open or shorted delay capacitor on the CD pin, which will similarly trigger the output driver in an overvoltage condition. For quicker production-line testing, the bq2947 device provides a Customer Test Mode with reduced delay time. 2 Applications • • Device Information(1) Notebook UPS Battery Backup PART NUMBER PACKAGE BODY SIZE (NOM) bq294700 WSON (8) 2.00 mm × 2.00 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. spacer Simplified Schematic Pack+ 100 Ω VCELL4 VCELL3 VCELL2 1k 0.1µF 1k 0.1µF 1k OUT VDD 1k 0.1µF V4 CD V3 VSS V2 V1 PWPD 0.1 µF VCELL1 0.1 µF 0.1µF Pack– 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA. bq2947 SLUSB15E – SEPTEMBER 2012 – REVISED FEBRUARY 2016 www.ti.com Table of Contents 1 2 3 4 5 6 7 8 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Device Options....................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 3 4 7.1 7.2 7.3 7.4 7.5 7.6 4 4 4 4 5 7 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Typical Characteristics .............................................. Detailed Description .............................................. 8 8.1 Overview ................................................................... 8 8.2 Functional Block Diagram ......................................... 8 8.3 Feature Description................................................... 8 8.4 Device Functional Modes........................................ 10 9 Application and Implementation ........................ 12 9.1 Application Information............................................ 12 9.2 Typical Applications ................................................ 12 10 Power Supply Recommendations ..................... 15 11 Layout................................................................... 15 11.1 Layout Guidelines ................................................. 15 11.2 Layout Example .................................................... 15 12 Device and Documentation Support ................. 16 12.1 12.2 12.3 12.4 12.5 Documentation Support ........................................ Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 16 16 16 16 16 13 Mechanical, Packaging, and Orderable Information ........................................................... 16 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision D (November 2015) to Revision E • Page Changed bq297406 device status From: Product Preview To: Active in the Device Options Table .................................... 3 Changes from Revision C (November 2015) to Revision D Page • Changed the device number to bq2947 ................................................................................................................................ 1 • Deleted the Related Links table from the Device and Documentation Support section....................................................... 16 Changes from Revision B (August 2014) to Revision C Page • Added bq294708 and bq294709 to the datasheet ................................................................................................................. 1 • Added preview footnote to Device Options Table ................................................................................................................. 3 • Added bq294708 and bq294709 to Device Options Table .................................................................................................... 3 Changes from Revision A (June 2013) to Revision B • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .................................................................................................. 1 Changes from Original (September 2012) to Revision A • 2 Page Page Added the bq294707 device to Production Data.................................................................................................................... 1 Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated Product Folder Links: bq2947 bq2947 www.ti.com SLUSB15E – SEPTEMBER 2012 – REVISED FEBRUARY 2016 5 Device Options PART NUMBER OVP (V) OV HYSTERESIS OUTPUT DRIVE bq294700 4.350 0.300 CMOS Active High bq294701 4.250 0.300 CMOS Active High bq294702 4.300 0.300 CMOS Active High bq294703 4.325 0.300 CMOS Active High bq294704 4.400 0.300 CMOS Active High bq294705 4.450 0.300 CMOS Active High bq294706 4.550 0.300 CMOS Active High bq294707 4.225 0.050 NCH Open Drain Active Low bq294708 4.500 0.300 CMOS Active High bq294709 (1) bq2947 (1) 4.160 0.300 CMOS Active High 3.850–4.60 0–0.300 CMOS Active High or Open Drain Active Low Product Preview only 6 Pin Configuration and Functions DSG Package 8-Pin WSON Top View 1 VDD OUT 8 2 V4 CD 7 3 V3 VSS 6 4 V2 V1 5 Pin Functions PIN I/O DESCRIPTION NAME NO. CD 7 OA External capacitor connection for delay timer Analog Output drive for overvoltage fault signal. Active High or Open Drain Active Low OUT 8 OA PWPD 9 P TI recommends connecting the exposed pad to VSS on PCB. V1 5 IA Sense input for positive voltage of the lowest cell in the stack V2 4 IA Sense input for positive voltage of the second cell from the bottom of the stack V3 3 IA Sense input for positive voltage of the third cell from the bottom of the stack V4 2 IA Sense input for positive voltage of the fourth cell from the bottom of the stack VDD 1 P Power supply input VSS 6 P Electrically connected to IC ground and negative terminal of the lowest cell in the stack Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated Product Folder Links: bq2947 3 bq2947 SLUSB15E – SEPTEMBER 2012 – REVISED FEBRUARY 2016 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings Over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Supply voltage range VDD–VSS –0.3 30 V Input voltage range V4–V3, V3–V2, V2–V1, V1–VSS, or CD–VSS –0.3 30 V Output voltage range OUT–VSS –0.3 30 V Continuous total power dissipation, PTOT See Thermal Information Lead temperature (soldering, 10 s), TSOLDER 300 Storage temperature, Tstg (1) –65 °C 150 Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum–rated conditions for extended periods may affect device reliability. 7.2 ESD Ratings VALUE Electrostatic discharge V(ESD) (1) (2) Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins (1) ±2000 Charged device model (CDM), per JEDEC specification JESD22-C101, all pins (2) ±500 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions Over-operating free-air temperature range (unless otherwise noted) MIN Supply voltage, VDD Input voltage range V4–V3, V3–V2, V2–V1, V1–VSS, or CD–VSS Operating ambient temperature range, TA NOM MAX UNIT 3 20 V 0 5 V –40 110 °C 7.4 Thermal Information bq2947 THERMAL METRIC (1) SON UNIT 8 PINS RθJA Junction-to-ambient thermal resistance RθJC(top) Junction-to-case(top) thermal resistance RθJB Junction-to-board thermal resistance 32.5 ψJT Junction-to-top characterization parameter 1.6 ψJB Junction-to-board characterization parameter 33 RθJC(bottom) Junction-to-case(bottom) thermal resistance 10 (1) 4 62 72 °C/W For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report (SPRA953). Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated Product Folder Links: bq2947 bq2947 www.ti.com SLUSB15E – SEPTEMBER 2012 – REVISED FEBRUARY 2016 7.5 Electrical Characteristics Typical values stated where TA = 25°C and VDD = 14.4 V, MIN/MAX values stated where TA = –40°C to 110°C and VDD = 3 V to 20 V (unless otherwise noted). PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VOLTAGE PROTECTION THRESHOLDS V(PROTECT) Overvoltage Detection VOV bq294700, RIN = 1 kΩ 4.350 V bq294701, RIN = 1 kΩ 4.250 V bq294702, RIN = 1 kΩ 4.300 V bq294703, RIN = 1 kΩ 4.325 V bq294704, RIN = 1 kΩ 4.400 V bq294705, RIN = 1 kΩ 4.450 V bq294706, RIN = 1 kΩ 4.550 V bq294707, RIN = 1 kΩ 4.225 V bq294708, RIN = 1 kΩ 4.500 V bq294709 (1), RIN = 1 kΩ 4.160 V (2) 250 VHYS OV Detection Hysteresis bq2947 400 mV VOA OV Detection Accuracy TA = 25°C –10 10 mV TA = –40°C –40 40 mV TA = 0°C –20 20 mV TA = 60°C –24 24 mV TA = 110°C –54 54 mV 2 µA 0.1 µA VOADRIFT OV Detection Accuracy Across Temperature 300 SUPPLY AND LEAKAGE CURRENT IDD Supply Current (V4–V3) = (V3–V2) = (V2–V1) = (V1–VSS) = 4.0 V at TA = 25°C (See Figure 11.) IIN Input Current at Vx Pins (V4–V3) = (V3–V2) = (V2–V1) = (V1–VSS) = 4.0 V at TA = 25°C (See Figure 11.) ICELL Input Current (ALL Vx and VDD Input Pins) Current Consumption at Power down, (V4–V3) = (V3–V2) = (V2–V1) = (V1–VSS) = 2.30 V at TA = 25°C (1) (2) 1 –0.1 1.1 µA Product Preview only Future option, contact TI. Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated Product Folder Links: bq2947 5 bq2947 SLUSB15E – SEPTEMBER 2012 – REVISED FEBRUARY 2016 www.ti.com Electrical Characteristics (continued) Typical values stated where TA = 25°C and VDD = 14.4 V, MIN/MAX values stated where TA = –40°C to 110°C and VDD = 3 V to 20 V (unless otherwise noted). PARAMETER TEST CONDITIONS MIN TYP MAX UNIT OUTPUT DRIVE OUT, CMOS ACTIVE HIGH VERSIONS ONLY (V4–V3), (V3–V2), (V2–V1), or (V1–VSS) > VOV, VDD = 14.4 V, IOH = 100 µA Output Drive Voltage, Active High VOUT 6 If three of four cells are short circuited, only one cell remains powered and > VOV, VDD = Vx (cell voltage), IOH = 100 µA VDD – 0.3 (V4–V3), (V3–V2), (V2–V1), and (V1–VSS) < VOV, VDD = 14.4 V, IOL = 100 µA measured into OUT pin. IOUTH OUT Source Current (during OV) (V4–V3), (V3–V2), (V2–V1), or (V1–VSS) > VOV, VDD = 14.4 V, OUT = 0 V, measured out of OUT pin. IOUTL OUT Sink Current (no OV) (V4–V3), (V3–V2), (V2–V1), and (V1–VSS) < VOV, VDD = 14.4 V, OUT = VDD, measured into OUT pin .Pull resistor RPU = 5 kΩ to VDD = 14.4 V V 250 0.5 V 400 mV 4.5 mA 14 mA 400 mV 14 mA 100 nA OUTPUT DRIVE OUT, CMOS OPEN DRAIN ACTIVE LOW VERSIONS ONLY VOUT Output Drive Voltage, Active High (V4–V3), (V3–V2), (V2–V1), and (V1–VSS) < VOV, VDD = 14.4 V, IOL = 100 µA measured into OUT pin. IOUTL OUT Sink Current (no OV) (V4–V3), (V3–V2), (V2–V1), and (V1–VSS) < VOV, VDD = 14.4 V, OUT = VDD, measured into OUT pin. Pull resistor RPU = 5 kΩ to VDD = 14.4 V IOUTLK OUT pin leakage (V4–V3), (V3–V2), (V2–V1), and (V1–VSS) < VOV, VDD = 14.4 V, OUT = VDD, measured into OUT pin. tCD OV Delay Time CCD = 0.1 µF (see Equation 1) tCD_GND OV Delay Time with CD pin = 0 V Delay due to CCD capacitor shorted to ground for Customer Test Mode 250 0.5 DELAY TIMER 6 Submit Documentation Feedback 1 20 1.5 2 170 s ms Copyright © 2012–2016, Texas Instruments Incorporated Product Folder Links: bq2947 bq2947 www.ti.com SLUSB15E – SEPTEMBER 2012 – REVISED FEBRUARY 2016 7.6 Typical Characteristics 4.40 4.39 4.38 0.316 Mean Min Max 0.315 4.36 VHYS (V) VOUT (V) 4.37 4.35 4.34 4.33 0.314 0.313 4.32 4.31 4.30 −50 −25 0 25 50 Temperature (°C) 75 100 125 0.312 −50 −25 0 G001 Figure 1. Overvoltage Threshold (Nominal = 4.35 V) vs. Temperature 25 50 Temperature (°C) 75 100 125 G002 Figure 2. Hysteresis VHYS vs. Temperature 1.6 1.8 1.5 1.6 1.4 1.4 1.2 ICELL (µA) IDD (µA) 1.3 1.1 1.0 1.2 1.0 0.9 0.8 0.8 0.7 0.6 −50 −25 0 25 50 Temperature (°C) 75 100 125 0.6 −50 Figure 3. IDD Current Consumption vs. Temperature at VDD = 16 V 8 −3.70 7 −3.72 25 50 Temperature (°C) 75 100 125 G004 6 −3.74 −3.76 VOUT (V) IOUT (mA) 0 Figure 4. ICELL vs. Temperature at VCELL= 9.2 V −3.68 −3.78 −3.80 −3.82 5 4 3 2 −3.84 1 −3.86 −3.88 −50 −25 G003 −25 0 25 50 Temperature (°C) 75 100 125 0 0 G005 Figure 5. Output Current IOUT vs. Temperature 5 10 15 VDD (V) 20 25 30 G006 Figure 6. VOUT vs. VDD Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated Product Folder Links: bq2947 7 bq2947 SLUSB15E – SEPTEMBER 2012 – REVISED FEBRUARY 2016 www.ti.com 8 Detailed Description 8.1 Overview The bq2947 is a second level overvoltage (OV) protector. Each cell is monitored independently by comparing the actual cell voltage to a protection voltage threshold, VOV. The protection threshold is preprogrammed at the factory with a range between 3.85 V and 4.65 V. 8.2 Functional Block Diagram Figure 7 shows a CMOS Active High configuration. PACK+ RVD CVD VDD 1 RIN V4 2 RIN V3 3 CIN RIN V2 4 Sensing Circuit CIN VOV Enable OUT Active Delay Charge/ Discharge Circuit CIN RIN V1 8 5 CIN VSS 6 PWPD 9 7 CD CCD PACK– Figure 7. Block Diagram NOTE In the case of an Open Drain Active Low configuration, an external pull-up resistor is required on the OUT terminal. 8.3 Feature Description In the bq2947 family of devices, if any cell voltage exceeds the programmed OV value, a timer circuit is activated. This timer circuit charges the CD pin to a nominal value, then slowly discharges it with a fixed current back down to VSS. When the CD pin falls below a nominal threshold near VSS, the OUT terminal goes from inactive to active state. Additionally, a timeout detection circuit checks to ensure that the CD pin successfully begins charging to above VSS and subsequently drops back down to VSS, and if a timeout error is detected in either direction, it will similarly trigger the OUT pin to become active. See Figure 9 for details on CD and OUT pin behavior during an overvoltage event. 8 Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated Product Folder Links: bq2947 bq2947 www.ti.com SLUSB15E – SEPTEMBER 2012 – REVISED FEBRUARY 2016 Feature Description (continued) Cell Voltage (V) (V4–V3, V3 3 –V2, V2 – V1, V1–VSS) For an NCH Open Drain Active Low configuration, the OUT pin pulls down to VSS when active (OV present) and is high impedance when inactive (no OV). VOV VOV –VHYS tCD OUT (V) Figure 8. Timing for Overvoltage Sensing (OUT Pin Is Active High) Figure 9 shows the behavior of CD pin during an OV sequence. Fault condition present Fault response becomes active VCD V(CD) tCHGDELAY tCD VOUT1 V(OUT) Note: Active High OUT version shown Figure 9. CD Pin Mechanism (OUT Pin Is Active High) NOTE In the case of an Open Drain Active Low version, the VOUT signal will be high and transition to low state when the voltage on the VCD capacitor discharges to the set level based on the tCD timer. Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated Product Folder Links: bq2947 9 bq2947 SLUSB15E – SEPTEMBER 2012 – REVISED FEBRUARY 2016 www.ti.com Feature Description (continued) 8.3.1 Pin Details 8.3.1.1 Input Sense Voltage, Vx These inputs sense each battery cell voltage. A series resistor and a capacitor across the cell for each input is required for noise filtering and stable voltage monitoring. 8.3.1.2 Output Drive, OUT This terminal serves as the fault signal output, and may be ordered in either Active High or Open Drain Active Low options. 8.3.1.3 Supply Input, VDD This terminal is the unregulated input power source for the IC. A series resistor is connected to limit the current, and a capacitor is connected to ground for noise filtering. 8.3.1.4 External Delay Capacitor, CD This terminal is connected to an external capacitor that sets the delay timer during an overvoltage fault event. The CD pin includes a timeout detection circuit to ensure that the output drives active even with a shorted or open capacitor during an overvoltage event. The capacitor connected on the CD pin rapidly charges to a voltage if any one of the cell inputs exceeds the OV threshold. Then the delay circuit gradually discharges the capacitor on the CD pin. Once this capacitor discharges below a set voltage, the OUT transitions from an inactive to active state. To calculate the delay, use the following equation: tCD (sec) = K × CCD (µF), where K = 10 to 20 range. (1) Example: If CCD= 0.1 µF (typical), then the delay timer range is tCD (s) = 10 × 0.1 = 1 s (Minimum) tCD (s) = 20 × 0.1 = 2 s (Maximum) NOTE The tolerance on the capacitor used for CCD increases the range of the tCD timer. 8.4 Device Functional Modes 8.4.1 NORMAL Mode When all of the cell voltages are below the overvoltage threshold, VOV, the device operates in NORMAL mode. The device monitors the differential cell voltages connected across (V1–VSS), (V2–V1), (V3–V2), and (V4–V3). The OUT pin is inactive, and is low if configured active high, or, if configured active low, is an open drain being externally pulled up. 8.4.2 OVERVOLTAGE Mode OVERVOLTAGE mode is detected if any of the cell voltage exceeds the overvoltage threshold, VOV for configured OV delay time. The OUT pin is activated after a delay time set by the capacitance in the CD pin. The OUT pin will either pull high internally, if configured as active high, or will be pulled low internally if configured as active low. An external FET is then turned on, shorting the fuse to ground, which allows the battery and/or charger power to blow the fuse. When all of the cell voltages fall below the (VOV–VHYS), the device returns to NORMAL mode. 8.4.3 Customer Test Mode It is possible to reduce test time for checking the overvoltage function by simply shorting the external CD capacitor to VSS. In this case, the OV delay would be reduced to the t(CD_GND) value, which has a maximum of 170 ms. 10 Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated Product Folder Links: bq2947 bq2947 www.ti.com SLUSB15E – SEPTEMBER 2012 – REVISED FEBRUARY 2016 Device Functional Modes (continued) Figure 10 shows the timing for the Customer Test Mode. OV Condition V(VCELL) ≤ 170 ms V(OUT) CD pin held low V(CD) Figure 10. Timing for Customer Test Mode Figure 11 shows the measurement for current consumption of the product for both VDD and Vx. IDD 1 VDD IIN4 I IN3 OUT 8 2 V4 CD 7 3 V3 VSS 6 4 V2 V1 5 ICELL IIN2 IIN1 ICELL = IDD + IIN1 + I IN2 + IIN3 + I IN4 Figure 11. Configuration for IC Current Consumption Test Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated Product Folder Links: bq2947 11 bq2947 SLUSB15E – SEPTEMBER 2012 – REVISED FEBRUARY 2016 www.ti.com 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 9.1 Application Information The bq2947 devices are a family of second-level protectors used for overvoltage protection of the battery pack in the application. The device, when configuring the OUT pin with active high, drives a NMOS FET that connects the fuse to ground in the event of a fault condition. This provides a shorted path to use the battery and/or charger power to blow the fuse and cut the power path. The OUT pin, when configured as active low, can be used to drive a PMOS FET to connect the fuse to ground instead. 9.2 Typical Applications 9.2.1 Application Configuration for Active High Figure 12 shows the recommended reference design components. Pack+ 100 Ω VCELL4 VCELL3 VCELL2 1k 0.1µF 1k 0.1µF 1k OUT VDD 1k 0.1µF V4 CD V3 VSS V2 V1 PWPD 0.1 µF VCELL1 0.1 µF 0.1µF Pack– Figure 12. Application Configuration for Active High 9.2.1.1 Design Requirements NOTE In the case of an Open Drain Active Low configuration, an external pull-up resistor is required on the OUT terminal. Changes to the ranges stated in Table 1 will impact the accuracy of the cell measurements. Table 1. Parameters 12 PARAMETER EXTERNAL COMPONENT MIN NOM MAX UNIT Voltage monitor filter resistance RIN 900 1000 4700 Ω Voltage monitor filter capacitance CIN 0.01 0.1 1.0 µF Supply voltage filter resistance RVD 100 1000 Ω Supply voltage filter capacitance CVD 0.1 1.0 µF CD external delay capacitance CCD 0.1 1.0 µF Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated Product Folder Links: bq2947 bq2947 www.ti.com SLUSB15E – SEPTEMBER 2012 – REVISED FEBRUARY 2016 NOTE The device is calibrated using an RIN value = 1 kΩ. Using a value other than this recommended value changes the accuracy of the cell voltage measurements and VOV trigger level. 9.2.1.2 Detailed Design Procedure 1. Determine the number of cell in series. The device supports 2-S to 4-S cell configuration. For 2S and 3S, the top unused pin(s) should be shorted as shown in Figure 13 and Figure 14. 2. Determine the overvoltage protection delay. Follow the calculation example described in CD pin description. Select the right capacitor to connect to the CD pin. 3. Follow the application schematic to connect the device. If the OUT pin is configured to open drain, an external pull up resistor should be used. Pack+ 100 Ω VDD 1k VCELL2 0.1µF OUT V4 CD V3 VSS V2 0.1µF 1k V1 PWPD VCELL1 0.1µF 0.1µF 0.1µF Pack– Figure 13. 2-Series Cell Configuration Pack+ 100 Ω OUT VDD V4 CD V3 VSS 1k VCELL3 1k VCELL2 1k 0.1µF V2 0.1µF V1 PWPD 0.1µF VCELL1 0.1µF 0.1µF Pack– Figure 14. 3-Series Cell Configuration Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated Product Folder Links: bq2947 13 bq2947 SLUSB15E – SEPTEMBER 2012 – REVISED FEBRUARY 2016 www.ti.com 9.2.1.3 Application Curves 4.40 4.39 4.38 0.316 Mean Min Max 0.315 4.36 VHYS (V) VOUT (V) 4.37 4.35 4.34 4.33 0.314 0.313 4.32 4.31 4.30 −50 −25 0 25 50 Temperature (°C) 75 100 125 0.312 −50 Figure 15. Overvoltage Threshold (OVT) vs. Temperature 8 1.5 7 1.4 1.2 VOUT (V) IDD (µA) 25 50 Temperature (°C) 75 100 125 G002 6 1.3 1.1 1.0 0.9 5 4 3 2 0.8 1 0.7 −25 0 25 50 Temperature (°C) 75 100 125 0 0 G003 Figure 17. IDD Current Consumption vs. Temperature at VDD = 16 V 14 0 Figure 16. Hysteresis VHYS vs. Temperature 1.6 0.6 −50 −25 G001 Submit Documentation Feedback 5 10 15 VDD (V) 20 25 30 G006 Figure 18. VOUT vs. VDD Copyright © 2012–2016, Texas Instruments Incorporated Product Folder Links: bq2947 bq2947 www.ti.com SLUSB15E – SEPTEMBER 2012 – REVISED FEBRUARY 2016 10 Power Supply Recommendations The maximum power of this device is 20 V on VDD. 11 Layout 11.1 Layout Guidelines 1. Ensure the RC filters for the Vx pins and VDD pin are placed as close as possible to the target terminal, reducing the tracing loop area. 2. The capacitor for CD should be placed close to the IC terminals. 3. Ensure the trace connecting the fuse to the gate, source of the NFET to the Pack– is sufficient to withstand the current during fuse blown event. 11.2 Layout Example Place the RC filters close to the device terminals Power Trace Line VDD OUT V4 CD V3 Pack + VSS Pack - PWPD VCELL3 V2 V1 VCELL2 VCELL1 Ensure trace can support sufficient current flow for fuse blow Figure 19. Layout Example Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated Product Folder Links: bq2947 15 bq2947 SLUSB15E – SEPTEMBER 2012 – REVISED FEBRUARY 2016 www.ti.com 12 Device and Documentation Support 12.1 Documentation Support 12.1.1 Related Documentation For related documentation, see bq2945xy and bq2947xy Cascade Voltage Monitoring (SLUA662). 12.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 12.3 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 12.4 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 12.5 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 16 Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated Product Folder Links: bq2947 bq2947 www.ti.com SLUSB15E – SEPTEMBER 2012 – REVISED FEBRUARY 2016 PACKAGE OUTLINE DSG0008B WSON - 0.8 mm max height SCALE 5.500 PLASTIC SMALL OUTLINE - NO LEAD 2.1 1.9 A B (0.08) (0.05) PIN 1 INDEX AREA SECTION A-A SECTION A-A 2.1 1.9 SCALE 30.000 TYPICAL 0.3 0.2 0.4 0.2 OPTIONAL TERMINAL TYPICAL C 0.8 MAX SEATING PLANE 0.05 0.00 0.08 C EXPOSED THERMAL PAD (0.2) TYP 0.9±0.1 5 4 6X 0.5 SEE OPTIONAL TERMINAL A A 2X 1.5 1.6±0.1 8 1 PIN 1 ID (OPTIONAL) 8X 0.4 8X 0.2 0.3 0.2 0.1 0.05 C A C B 4222124/A 06/2015 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. www.ti.com Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated Product Folder Links: bq2947 17 bq2947 SLUSB15E – SEPTEMBER 2012 – REVISED FEBRUARY 2016 www.ti.com EXAMPLE BOARD LAYOUT DSG0008B WSON - 0.8 mm max height PLASTIC SMALL OUTLINE - NO LEAD (0.9) 8X (0.5) ( 0.2) VIA TYP 1 8 8X (0.25) (0.55) SYMM (1.6) 6X (0.5) 5 4 SYMM (R0.05) TYP (1.9) LAND PATTERN EXAMPLE SCALE:20X 0.07 MIN ALL AROUND 0.07 MAX ALL AROUND SOLDER MASK OPENING METAL METAL UNDER SOLDER MASK NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK OPENING SOLDER MASK DEFINED SOLDER MASK DETAILS 4222124/A 06/2015 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). www.ti.com 18 Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated Product Folder Links: bq2947 bq2947 www.ti.com SLUSB15E – SEPTEMBER 2012 – REVISED FEBRUARY 2016 EXAMPLE STENCIL DESIGN DSG0008B WSON - 0.8 mm max height PLASTIC SMALL OUTLINE - NO LEAD 8X (0.5) SYMM METAL 1 8 8X (0.25) (0.45) SYMM (0.7) 6X (0.5) 5 4 (R0.05) TYP (0.9) (1.9) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL EXPOSED PAD 87% PRINTED SOLDER COVERAGE BY AREA SCALE:25X 4222124/A 06/2015 NOTES: (continued) 5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. www.ti.com Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated Product Folder Links: bq2947 19 PACKAGE OPTION ADDENDUM www.ti.com 1-Apr-2016 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) BQ294700DSGR ACTIVE WSON DSG 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 700 BQ294700DSGT ACTIVE WSON DSG 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 700 BQ294701DSGR ACTIVE WSON DSG 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 701 BQ294701DSGT ACTIVE WSON DSG 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 701 BQ294702DSGR ACTIVE WSON DSG 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 702 BQ294702DSGT ACTIVE WSON DSG 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 702 BQ294703DSGR ACTIVE WSON DSG 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 703 BQ294703DSGT ACTIVE WSON DSG 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 703 BQ294704DSGR ACTIVE WSON DSG 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 704 BQ294704DSGT ACTIVE WSON DSG 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 704 BQ294705DSGR ACTIVE WSON DSG 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 705 BQ294705DSGT ACTIVE WSON DSG 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 705 BQ294706DSGR ACTIVE WSON DSG 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 706 BQ294706DSGT ACTIVE WSON DSG 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 706 BQ294707DSGR ACTIVE WSON DSG 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 707 BQ294707DSGT ACTIVE WSON DSG 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 707 BQ294708DSGR ACTIVE WSON DSG 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU | Call TI Level-2-260C-1 YEAR -40 to 85 708 Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 1-Apr-2016 Status (1) BQ294708DSGT ACTIVE Package Type Package Pins Package Drawing Qty WSON DSG 8 250 Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Green (RoHS & no Sb/Br) CU NIPDAU | Call TI Level-2-260C-1 YEAR Op Temp (°C) Device Marking (4/5) -40 to 85 708 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 Samples PACKAGE MATERIALS INFORMATION www.ti.com 16-Mar-2016 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing BQ294700DSGR WSON DSG 8 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 3000 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2 BQ294700DSGT WSON DSG 8 250 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2 BQ294701DSGR WSON DSG 8 3000 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2 BQ294701DSGT WSON DSG 8 250 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2 BQ294702DSGR WSON DSG 8 3000 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2 BQ294702DSGT WSON DSG 8 250 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2 BQ294703DSGR WSON DSG 8 3000 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2 BQ294703DSGT WSON DSG 8 250 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2 BQ294704DSGR WSON DSG 8 3000 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2 BQ294704DSGT WSON DSG 8 250 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2 BQ294705DSGR WSON DSG 8 3000 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2 BQ294705DSGT WSON DSG 8 250 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2 BQ294706DSGR WSON DSG 8 3000 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2 BQ294706DSGT WSON DSG 8 250 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2 BQ294707DSGR WSON DSG 8 3000 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2 BQ294707DSGT WSON DSG 8 250 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2 BQ294708DSGR WSON DSG 8 3000 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2 BQ294708DSGT WSON DSG 8 250 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 16-Mar-2016 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) BQ294700DSGR WSON DSG 8 3000 210.0 185.0 35.0 BQ294700DSGT WSON DSG 8 250 210.0 185.0 35.0 BQ294701DSGR WSON DSG 8 3000 210.0 185.0 35.0 BQ294701DSGT WSON DSG 8 250 210.0 185.0 35.0 BQ294702DSGR WSON DSG 8 3000 210.0 185.0 35.0 BQ294702DSGT WSON DSG 8 250 210.0 185.0 35.0 BQ294703DSGR WSON DSG 8 3000 210.0 185.0 35.0 BQ294703DSGT WSON DSG 8 250 210.0 185.0 35.0 BQ294704DSGR WSON DSG 8 3000 210.0 185.0 35.0 BQ294704DSGT WSON DSG 8 250 210.0 185.0 35.0 BQ294705DSGR WSON DSG 8 3000 210.0 185.0 35.0 BQ294705DSGT WSON DSG 8 250 210.0 185.0 35.0 BQ294706DSGR WSON DSG 8 3000 210.0 185.0 35.0 BQ294706DSGT WSON DSG 8 250 210.0 185.0 35.0 BQ294707DSGR WSON DSG 8 3000 210.0 185.0 35.0 BQ294707DSGT WSON DSG 8 250 210.0 185.0 35.0 BQ294708DSGR WSON DSG 8 3000 210.0 185.0 35.0 BQ294708DSGT WSON DSG 8 250 210.0 185.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2016, Texas Instruments Incorporated