CYStech Electronics Corp. 20Amp. Ultrafast Plastic Rectifiers MUR2060FP Features IF(AV) VRRM IFSM trr Tj VF(MAX) • 175℃ operating junction temperature • Low leakage current • Low switching loss, high efficiency • High forward surge capability • Insulating package, insulating voltage=2500V AC • High temperature soldering guaranteed : 260℃/40s, 0.25”(6.35mm) from case • Pb-free lead plating package Spec. No. : C472FP Issued Date : 2012.02.24 Revised Date : Page No. : 1/4 2 × 10A 600V 120A 60ns 175°C 1.5V Mechanical Data • Case: TO-220FP molded plastic • Mounting Position: Any • Weight: 2.2 grams, 0.078 ounce approximately • Terminals: Pure tin plated, solderable per MIL-STD-750 method 2026 • Epoxy: UL 94V-0 rate flame retardant • Mounting torque: 5 in.-lb. maximum Equivalent Circuit MUR2060FP Outline TO-220FP AKA MUR2060FP CYStek Product Specification Spec. No. : C472FP Issued Date : 2012.02.24 Revised Date : Page No. : 2/4 CYStech Electronics Corp. Maximum Ratings and Electrical Characteristics (Per Diode Leg) (Rating at 25°C ambient temperature unless otherwise specified. resistive or inductive load. Single phase, half wave, 60Hz, For capacitive load, derate current by 20%.) Parameter Maximum Recurrent peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage IF=10A, TC=25°C IF=10A, TC=150°C IF=20A, TC=25°C IF=20A, TC=150°C Per Diode Per Device Maximum instantaneous forward voltage Maximum Average forward rectified current @ TC=100℃ Non-repetitive peak forward surge current @ 8.3ms single half sine wave superimposed on rated load (JEDEC method) VR=600 V, TC=25℃ Maximum instantaneous reverse current at VR=600 V, TC=125℃ Maximum reverse IF=1A, VR=30V, dIF/dt=100A/μs recovery time Typical junction capacitance @ f=1MHz and applied 4V reverse voltage Isolation voltage from terminal to heatsink, t=1minute Storage temperature range Operating junction temperature range Symbol VRRM VRMS VDC Min. Typ. Max. 600 420 600 Units V V V 1.25 1.06 1.42 1.29 1.5 1.3 1.8 1.6 V IF(AV) 10 20 A IFSM 120 A IR 10 100 μA trr 60 ns VF CJ VAC Tstg TJ 80 pF 2500 -65 -65 +175 +175 V ℃ ℃ Thermal Data Parameter Maximum Thermal Resistance, Junction-to-case Maximum Thermal Resistance, Junction-to-ambient Lead Temperature for Soldering Purposes : 1/8” from Case for 5 seconds Symbol Rth,j-c Rth,j-a TL Value 4 60 300 Unit °C/W °C/W °C Ordering Information Device MUR2060FP MUR2060FP Package TO-220FP (RoHS compliant package) Shipping 50 pcs / Tube, 40 Tubes/Box CYStek Product Specification CYStech Electronics Corp. Spec. No. : C472FP Issued Date : 2012.02.24 Revised Date : Page No. : 3/4 Typical Characteristics Forward Current Derating Curve Forward Current vs Forward Voltage 12 100000 Instantaneous Forward Current---IF (mA) Average Forward Current---Io(A) Per leg 10 8 6 4 2 resistive or inductive load Per leg 10000 1000 Tj=150℃ 100 Tj=25℃ 10 Pulse width=300μs, 1% Duty cycle 1 0 0 25 50 75 100 125 150 0 175 Case Temperature---TC(℃) 0.4 0.6 0.8 1 1.2 Forward Voltage---VF(V) 1.4 Junction Capacitance vs Reverse Voltage Reverse Leakage Current vs Reverse Voltage 1000 10 Tj=125℃ Junction Capacitance---C J(pF) Reverse Leakage Current---I R (μA) 0.2 1 Tj=75℃ 0.1 Tj=25℃ 0.01 100 Tj=25℃, f=1.0MHz Per Leg Per leg 10 0.001 0 100 200 300 400 Reverse Voltage---VR (V) MUR2060FP 500 600 0.1 1 10 100 Reverse Voltage---VR(V) CYStek Product Specification CYStech Electronics Corp. Spec. No. : C472FP Issued Date : 2012.02.24 Revised Date : Page No. : 4/4 TO-220FP Dimension Marking: Device Name Date Code 3-Lead TO-220FP Plastic Package CYStek Package Code: FP Style: Pin 1.Anode 2.Cathode 3.Anode *Typical Inches Min. Max. 0.171 0.183 0.051 REF 0.112 0.124 0.102 0.110 0.020 0.030 0.031 0.041 0.047 REF 0.020 0.030 0.396 0.404 0.583 0.598 0.100 * 0.106 REF DIM A A1 A2 A3 b b1 b2 c D E e F Millimeters Min. Max. 4.35 4.65 1.300 REF 2.85 3.15 2.60 2.80 0.50 0.75 0.80 1.05 1.20 REF 0.500 0.750 10.06 10.26 14.80 15.20 2.54* 2.70 REF DIM G H H1 H2 J K L L1 L2 M N Inches Min. Max. 0.246 0.258 0.138 REF 0.055 REF 0.256 0.272 0.031 REF 0.020 1.102 1.118 0.043 0.051 0.036 0.043 0.067 REF 0.012 REF Millimeters Min. Max. 6.25 6.55 3.50 REF 1.40 REF 6.50 6.90 0.80 REF 0.50 REF 28.00 28.40 1.10 1.30 0.92 1.08 1.70 REF 0.30 REF Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: Pure tin plated. • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. MUR2060FP CYStek Product Specification