Diodes DMNH4006SK3Q-13 Low qg â minimizes switching loss Datasheet

DMNH4006SK3Q
Green
40V 175°C N-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
Features
BVDSS
RDS(ON) Max
ID Max
TC = +25°C

40V
6mΩ @ VGS = 10V
140A







Description and Applications
This MOSFET is designed to meet the stringent requirements of
Automotive applications. It is qualified to AEC-Q101, supported by a
PPAP and is ideal for use in:

Engine Management Systems


Body Control Electronics
DC-DC Converters
Rated to +175°C – Ideal for High Ambient Temperature
Environments
100% Unclamped Inductive Switching – Ensures More Reliable
and Robust End Application
Low Qg – Minimizes Switching Loss
Low RDS(ON) – Minimizes On State Loss
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
PPAP Capable (Note 4)
Mechanical Data




Case: TO252 (DPAK)
Case Material: Molded Plastic, ―Green‖ Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020

Terminal Finish - Matte Tin Annealed over Copper Leadframe.
Solderable per MIL-STD-202, Method 208
Weight: 0.315 grams (Approximate)

Top View
Pin Out Top View
Equivalent Circuit
Ordering Information (Note 5)
Part Number
DMNH4006SK3Q-13
Notes:
Case
TO252 (DPAK)
Packaging
2500/Tape & Reel
1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green‖ products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. Automotive products are AEC-Q101 qualified and are PPAP capable. Refer to http://www.diodes.com/product_compliance_definitions.html.
5. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
H4006S
YYWW
DMNH4006SK3Q
Document number: DS38321 Rev. 1 - 2
=Manufacturer’s Marking
H4006S = Product Type Marking Code
YYWW = Date Code Marking
YY = Last Two Digits of Year
(ex: 16 = 2016)
WW = Week Code (01 to 53)
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DMNH4006SK3Q
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
VDSS
VGSS
Drain-Source Voltage
Gate-Source Voltage
TA = +25°C
TA = +70°C
TC = +25°C
TC = +100°C
Continuous Drain Current , VGS = 10V (Note 7)
Continuous Drain Current , VGS = 10V (Note 8)
Value
40
±20
20
16
ID
A
140
100
200
120
64
208
ID
Pulsed Drain Current (380s Pulse, Duty Cycle = 1%)
Maximum Continuous Body Diode Forward Current (Note 8)
Avalanche Current, L = 0.1mH (Note 9)
Avalanche Energy, L = 0.1mH (Note 9)
Unit
V
V
IDM
IS
IAS
EAS
A
A
A
A
mJ
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
PD
Total Power Dissipation (Note 6)
Steady State
t<10s
Thermal Resistance, Junction to Ambient (Note 6)
Value
2.2
68
29
3.6
42
21
0.8
-55 to +175
RJA
Total Power Dissipation (Note 7)
PD
Steady State
t<10s
Thermal Resistance, Junction to Ambient (Note 7)
Thermal Resistance, Junction to Case (Note 8)
Operating and Storage Temperature Range
RJA
RJC
TJ, TSTG
Unit
W
°C/W
W
°C/W
°C
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 10)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current, TJ = +25°C
Gate-Source Leakage
ON CHARACTERISTICS (Note 10)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 11)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Total Gate Charge (VGS = 6V)
Total Gate Charge (VGS = 10V)
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Notes:
Symbol
Min
Typ
Max
Unit
BVDSS
IDSS
IGSS
40
—
—
—
—
—
—
1
±100
V
µA
nA
VGS = 0V, ID = 250μA
VDS = 40V, VGS = 0V
VGS = ±20V, VDS = 0V
VGS(TH)
RDS(ON)
VSD
2
—
—
—
—
0.7
4
6
1.2
V
mΩ
V
VDS = VGS, ID = 250μA
VGS = 10V, ID = 86A
VGS = 0V, IS = 1.0A
Ciss
Coss
Crss
Rg
Qg
Qg
Qgs
Qgd
—
—
—
—
—
—
—
—
—
—
—
—
—
—
2280
556
282
1.7
32
51
9.6
20.4
7.7
9.3
18
8.1
—
—
—
—
—
—
—
—
—
—
—
—
—
—
pF
pF
pF
Ω
nC
nC
nC
nC
ns
ns
ns
ns
ns
nC
tD(ON)
tR
tD(OFF)
tF
tRR
QRR
32
28
Test Condition
VDS = 25V, VGS = 0V,
f = 1MHz
VDS = 0V, VGS = 0V, f = 1MHz
VDS = 32V, ID = 86A
VGS = 10V, VDS = 20V,
Rg = 3.5Ω, ID = 86A
IF = 50A, di/dt = 100A/μs
IF = 50A, di/dt = 100A/μs
6. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
7. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
8. Thermal resistance from junction to soldering point (on the exposed drain pad).
9. IAS and EAS ratings are based on low frequency and duty cycles to keep TJ = +25°C.
10. Short duration pulse test used to minimize self-heating effect.
11. Guaranteed by design. Not subject to product testing.
DMNH4006SK3Q
Document number: DS38321 Rev. 1 - 2
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DMNH4006SK3Q
30
100.0
VDS=5V
VGS=6.0V
80.0
VGS=8.0V
70.0
VGS=10.0V
25
VGS=5.0V
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
90.0
60.0
50.0
40.0
30.0
VGS=4.0V
20.0
10.0
20
15
10
125℃
150℃
5
175℃
VGS=3.5V
0
0
0.5
1 1.5 2 2.5 3 3.5 4 4.5
VDS, DRAIN-SOURCE VOLTAGE (V)
5
1
Figure 1. Typical Output Characteristic
2
3
4
5
VGS, GATE-SOURCE VOLTAGE (V)
Figure 2. Typical Transfer Characteristic
6
0.06
0.006
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(Ω)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(Ω)
25℃
-55℃
0.0
0.005
VGS=10V
0.004
0.003
0.002
0
5
10
15
20
25
30
35
40
45
0.05
0.04
0.03
ID=86A
0.02
0.01
0
50
0
0.01
VGS= 10V
125℃
150℃
175℃
0.008
85℃
0.006
25℃
0.004
-55℃
0.002
0
10
20
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(NORMALIZED)
ID, DRAIN-SOURCE CURRENT (A)
Figure 3. Typical On-Resistance vs. Drain Current and
Gate Voltage
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
85℃
30
40 50 60 70 80 90 100
ID, DRAIN CURRENT (A)
Figure 5. Typical On-Resistance vs. Drain Current and
Junction Temperature
DMNH4006SK3Q
Document number: DS38321 Rev. 1 - 2
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4
8
12
16
VGS, GATE-SOURCE VOLTAGE (V)
Figure 4. Typical Transfer Characteristic
20
2
1.8
1.6
VGS=10V, ID=86A
1.4
1.2
1
0.8
0.6
-50
-25
0
25 50 75 100 125 150 175
TJ, JUNCTION TEMPERATURE (℃)
Figure 6. On-Resistance Variation with Junction
Temperature
April 2016
© Diodes Incorporated
4
VGS(TH), GATE THRESHOLD VOLTAGE (V)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
DMNH4006SK3Q
0.009
VGS=10V, ID=86A
0.006
0.003
3.5
3
ID=1mA
2.5
2
ID=250μA
1.5
1
0.5
0
0
-50
-25
0
25 50 75 100 125 150 175
TJ, JUNCTION TEMPERATURE (℃)
Figure 7. On-Resistance Variation with Junction
Temperature
30
-50
-25
0
25 50 75 100 125 150 175
TJ, JUNCTION TEMPERATURE (℃)
Figure 8. Gate Threshold Variation vs. Junction
Temperature
100000
150℃
25
20
15
TJ=150℃
10
TJ=125℃
TJ=85℃
TJ=175℃
TJ=25℃
5
10000
IDSS, LEAKAGE CURRENT (nA)
IS, SOURCE CURRENT (A)
VGS=0V
125℃
175℃
1000
85℃
100
10
25℃
1
0.1
TJ=-55℃
0
0.01
0
0.3
0.6
0.9
1.2
1.5
VSD, SOURCE-DRAIN VOLTAGE (V)
Figure 9. Diode Forward Voltage vs. Current
0
10
15
20
25
30
35
40
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 10. Typical Drain-Source Leakage Current vs.
Voltage
10
f=1MHz
9
8
Ciss
7
VGS (V)
CT, JUNCTION CAPACITANCE (pF)
10000
5
1000
Coss
VDS=32V, ID=86A
6
5
4
3
2
Crss
1
100
0
0
5
10
15
20
25
30
35
VDS, DRAIN-SOURCE VOLTAGE(V)
40
Document number: DS38321 Rev. 1 - 2
10
20
30
Qg (nC)
40
50
Figure 12. Gate Charge
Figure 11. Typical Junction Capacitance
DMNH4006SK3Q
0
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DMNH4006SK3Q
1000
PW =10μs
RDS(ON) Limited
PW =1μs
ID, DRAIN CURRENT (A)
PW =100μs
100
PW =1ms
10
PW =10ms
PW =100ms
TJ(MAX)=175℃
TC=25℃
Single Pulse
DUT on infinite heatsink
VGS=10V
1
0.1
0.1
PW =1s
1
10
100
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 13. SOA, Safe Operation Area
r(t), TRANSIENT THERMAL RESISTANCE
1
D=0.5
D=0.3
D=0.9
D=0.7
0.1
D=0.1
D=0.05
D=0.02
0.01
D=0.01
D=0.005
RθJC(t)=r(t) * RθJC
RθJC=0.8℃/W
Duty Cycle, D=t1 / t2
D=Single Pulse
0.001
1E-06
1E-05
0.0001
0.001
0.01
0.1
1
10
t1, PULSE DURATION TIME (sec)
Figure 14. Transient Thermal Resistance
DMNH4006SK3Q
Document number: DS38321 Rev. 1 - 2
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DMNH4006SK3Q
Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
TO252 (DPAK)
E
A
b3
7° ± 1°
c
L3
D
A2
L4
e
H
b(3x)
b2(2x)
Gauge Plane
0.508
D1
E1
Seating Plane
a
L
A1
2.74REF
TO252 (DPAK)
Dim Min Max Typ
A 2.19 2.39 2.29
A1 0.00 0.13 0.08
A2 0.97 1.17 1.07
b 0.64 0.88 0.783
b2 0.76 1.14 0.95
b3 5.21 5.46 5.33
c
0.45 0.58 0.531
D 6.00 6.20 6.10
D1 5.21
e
2.286
E 6.45 6.70 6.58
E1 4.32
H 9.40 10.41 9.91
L 1.40 1.78 1.59
L3 0.88 1.27 1.08
L4 0.64 1.02 0.83
a
0°
10°
All Dimensions in mm
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
TO252 (DPAK)
X1
Y1
Dimensions
C
X
X1
Y
Y1
Y2
Y2
C
Value (in mm)
4.572
1.060
5.632
2.600
5.700
10.700
Y
X
DMNH4006SK3Q
Document number: DS38321 Rev. 1 - 2
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IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
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Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
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indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
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final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
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representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2016, Diodes Incorporated
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