CYSTEKEC EF10CXXE3 10amp. glass passivated efficient fast recovery rectifier Datasheet

Spec. No. : C749E3
Issued Date : 2006.07.26
Revised Date :
Page No. : 1/3
CYStech Electronics Corp.
10Amp. Glass Passivated Efficient Fast Recovery Rectifiers
EF10CXXE3 Series
Features
• Fast switching for high efficiency
• Low forward voltage drop
• High current capability
• Low reverse leakage current
• High surge current capability
Mechanical Data
• Case: Molded plastic, TO-220AB
• Terminals: Solderrable per MIL-STD-202 method 208
• Epoxy: UL 94V-0 rate flame retardant
• Mounting Position: Any
• Weight: 2.24 grams
Maximum Ratings and Electrical Characteristics
(Rating at 25°C ambient temperature unless otherwise specified.
resistive or inductive load.
Single phase, half wave, 60Hz,
For capacitive load, derate current by 20%.)
Parameter
Maximum Recurrent peak reverse
voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum instantaneous forward
voltage@ IF=5A
Maximum Average forward rectified
current @ TL=100℃
Peak forward surge current @8.3ms
single half sine wave superimposed
on rated load (JEDEC method)
Maximum DC reverse current
VR=VRRM,TJ=25℃
VR=VRRM,TJ=125℃
Diode junction capacitance @ f=1MHz
and applied 4V reverse voltage
Maximum reverse recovery time@
IF=0.5A, IR=1A, Irr=0.25A
Typical thermal resistance, junction to
lead
Storage temperature
Operating temperature
EF10CXXE3
Symbol
EF
10C01
EF
10C02
Type
EF
10C03
EF
10C05
EF
10C06
Units
VRRM
50
100
200
400
600
V
VRMS
35
70
140
280
420
V
VDC
50
100
200
400
600
V
1.25
1.85
V
VF
0.95
I(AV)
10
A
IFSM
100
A
IR
10
250
µA
CJ
65
pF
trr
25
ns
RθJC
2.2
℃/W
Tstg
TJ
-55 ~ +150
-55 ~ +150
℃
℃
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C749E3
Issued Date : 2006.07.26
Revised Date :
Page No. : 2/3
Characteristic Curves
EF10CXXE3
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C749E3
Issued Date : 2006.07.26
Revised Date :
Page No. : 3/3
TO-220AB Dimension
Equivalent Circuit :
Style: Pin 1.Anode 2.Cathode 3.Anode
3-Lead TO-220AB Plastic Package
CYStek Package Code: E3
Inches
Min.
Max.
0.412
0.103
0.113
0.05
0.06
0.587
0.594
0.14
0.16
0.53
0.56
0.037
0.027
DIM
A
B
C
D
E
F
G
Millimeters
Min.
Max.
10.5
2.62
2.87
1.27
1.52
14.9
15.1
3.56
4.06
13.46
14.22
0.94
0.68
DIM
H
I
J
K
L
M
R
Inches
Min.
Max.
0.105
0.095
0.175
0.185
0.045
0.055
0.27
0.23
0.10
0.11
0.014
0.025
0.148
0.154
Millimeters
Min.
Max.
2.67
2.41
4.44
4.70
1.14
1.40
6.86
5.84
2.54
2.79
0.35
0.64
3.74
3.91
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: 42 Alloy ; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
EF10CXXE3
CYStek Product Specification
Similar pages