Material Content Data Sheet Sales Product Name BTS50070-1TMA MA# MA001044084 Package PG-TO220-7-4 Issued 29. August 2013 Weight* 1525.76 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal inorganic material plastics noble metal non noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel phosphorus Polyimide silver tin lead 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7723-14-0 26023-21-2 7440-22-4 7440-31-5 7439-92-1 6.391 0.42 0.910 0.06 wire encapsulation leadfinish plating glue solder *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.42 4188 4188 597 0.273 0.02 909.052 59.57 59.65 595805 179 596582 2.384 0.16 0.16 1562 1562 8.856 0.58 5804 97.412 6.38 484.107 31.73 38.69 317291 63845 386940 12.090 0.79 0.79 7924 7924 0.216 0.01 0.001 0.00 0.01 1 141 0.143 0.01 0.01 93 93 0.098 0.01 0.078 0.01 3.746 0.25 141 64 51 0.27 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 2455 2570 1000000