Material Content Data Sheet Sales Product Name BSC011N03LSI MA# MA001010846 Package PG-TDSON-8-7 Issued 29. June 2015 Weight* 118.96 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal noble metal organic material plastics inorganic material non noble metal noble metal noble metal non noble metal non noble metal non noble metal inorganic material non noble metal non noble metal inorganic material non noble metal < 10% silicon iron phosphorus copper gold carbon black epoxy resin silicondioxide tin silver silver tin lead iron phosphorus copper iron phosphorus copper 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 7440-31-5 7439-92-1 7439-89-6 7723-14-0 7440-50-8 7439-89-6 7723-14-0 7440-50-8 1.009 0.85 0.038 0.03 wire encapsulation leadfinish plating solder heatspreader heat sink CLIP *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.85 8485 8485 318 0.011 0.01 37.762 31.72 31.76 317425 95 317838 0.044 0.04 0.04 374 374 0.087 0.07 729 6.156 5.18 37.112 31.20 36.45 311962 364442 1.470 1.24 1.24 12355 12355 0.166 0.14 0.14 1391 1391 0.036 0.03 0.029 0.02 1.387 1.17 0.011 0.01 0.003 0.00 11.320 9.52 0.022 0.02 0.007 0.01 22.292 18.74 51751 305 244 1.22 11658 29 9.53 95156 2. 3. 56 18.77 187384 Sum in total: 100.00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption 7a, Lead in high melting temperature type solders. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 95280 188 Important Remarks: 1. 12207 95 187628 1000000