ON NL17SG17AMUTCG Schmitt buffer Datasheet

NL17SG17
Schmitt Buffer
The NL17SG17 MiniGatet is an advanced high−speed CMOS
Schmitt Buffer in ultra−small footprint.
The NL17SG17 input structures provides protection when voltages
up to 4.6 V are applied.
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Features
Wide Operating VCC Range: 0.9 V to 3.6 V
MARKING
DIAGRAMS
High Speed: tPD = 3.7 ns (Typ) at VCC = 3.0 V, CL = 15 pF
Low Power Dissipation: ICC = 0.5 mA (Max) at TA = 25°C
SOT−953
CASE 527AE
4.6 V Overvoltage Tolerant (OVT) Input Pins
A
Ultra−Small Packages
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
1
GND
2
NC
3
5
4
VCC
OUT Y
NC
1
IN A
2
GND
3
4
VCC
SC−88A
DF SUFFIX
CASE 419A
M
G
1
6
VCC
IN A
2
5
NC
UDFN6
1.45 x 1.0
CASE 517AQ
M
M
OUT Y
Figure 2. SC−88A
(Top View)
NC
UDFN6
1.0 x 1.0
CASE 517BX
M
Figure 1. SOT−953
(Top Thru View)
5
A
= Specific Device Code
(A with 90 degree clockwise rotation)
T
IN A
M
1
5
•
•
•
•
•
•
AN M G
G
= Date Code*
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or position may vary
depending upon manufacturing location.
PIN ASSIGNMENT
GND
3
4
OUT Y
Figure 3. UDFN6
(Top View)
OUT Y
IN A
SOT−953
SC−88A
UDFN6
NC
NC
1
IN A
2
GND
IN A
IN A
3
NC
GND
GND
4
OUT Y
OUT Y
OUT Y
5
VCC
VCC
NC
6
VCC
Figure 4. Logic Symbol
FUNCTION TABLE
A Input
Y Output
L
H
L
H
ORDERING INFORMATION
See detailed ordering and shipping information on page 5 of
this data sheet.
© Semiconductor Components Industries, LLC, 2015
July, 2015 − Rev. 6
1
Publication Order Number:
NL17SG17/D
NL17SG17
MAXIMUM RATINGS
Symbol
Parameter
VCC
DC Supply Voltage
VIN
DC Input Voltage
VOUT
DC Output Voltage
IIK
DC Input Diode Current
Value
Unit
−0.5 to +5.5
V
−0.5 to +4.6
V
−0.5 to VCC + 0.5
−0.5 to +4.6
V
VIN < GND
−20
mA
VOUT < GND
Output at High or Low State
Power−Down Mode (VCC = 0 V)
IOK
DC Output Diode Current
−20
mA
IOUT
DC Output Source/Sink Current
±20
mA
ICC
DC Supply Current per Supply Pin
±20
mA
IGND
DC Ground Current per Ground Pin
±20
mA
TSTG
Storage Temperature Range
−65 to +150
°C
260
°C
+150
°C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
TJ
Junction Temperature Under Bias
MSL
Moisture Sensitivity
FR
Flammability Rating
VESD
Level 1
Oxygen Index: 28 to 34
ESD Withstand Voltage
UL 94 V−0 @ 0.125 in
Human Body Model (Note 2)
Machine Model (Note 3)
>2000
>100
V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Characteristics
Min
Max
Unit
VCC
Positive DC Supply Voltage
0.9
3.6
V
VIN
Digital Input Voltage
0.0
3.6
V
0.0
0.0
VCC
3.6
V
−55
+125
°C
0
No Limit
ns/V
VOUT
TA
Dt / DV
Output Voltage
Output at High or Low State
Power−Down Mode (VCC = 0 V)
Operating Temperature Range
Input Transition Rise or Fail Rate
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
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2
NL17SG17
DC ELECTRICAL CHARACTERISTICS
Symbol
Parameter
VT+
Positive−Going
Input Threshold
Voltage
−555C 3 TA 3 1255C
TA = 255C
VCC
(V)
Min
Typ
Max
Min
Max
0.9
0.64
0.7
0.86
0.62
0.87
1.1
0.73
0.81
0.95
0.71
1
1.4
0.86
0.94
1.16
0.84
1.2
1.65
0.95
1.06
1.25
0.94
1.3
2.3
1.22
1.36
1.6
1.18
1.65
3.0
1.51
1.8
2.05
1.38
2.1
0.9
0.09
0.23
0.30
0.08
0.33
1.1
0.15
0.33
0.39
0.12
0.43
1.4
0.3
0.47
0.54
0.25
0.55
1.65
0.35
0.6
0.65
0.3
0.65
2.3
0.55
0.85
0.88
0.5
0.88
3.0
0.95
1.13
1.16
0.9
1.16
0.9
0.15
0.5
0.75
0.2
0.8
1.1
0.15
0.5
0.75
0.2
0.8
1.4
0.15
0.5
0.75
0.2
0.8
1.65
0.15
0.5
0.75
0.2
0.8
2.3
0.15
0.5
0.75
0.2
0.8
3.0
0.25
0.65
0.85
0.3
0.9
IOH = −20 mA
0.9
0.75
0.75
IOH = −0.3 mA
1.1 to 1.3
0.75 x
VCC
0.75 x
VCC
IOH = −1.7 mA
1.4 to 1.6
0.75 x
VCC
0.75 x
VCC
IOH = −3.0 mA
1.65 to
1.95
VCC −
0.45
VCC −
0.45
IOH = −4.0 mA
2.3 to 2.7
2.0
2.0
IOH = −8.0 mA
3.0 to 3.6
2.48
2.48
IOL = 20 mA
0.9
0.1
0.1
IOL = 0.3 mA
1.1 to 1.3
0.25 x
VCC
0.25 x
VCC
IOL = 1.7 mA
1.4 to 1.6
0.25xV
CC
0.25 x
VCC
Condition
Unit
V
VT−
VH
VOH
VOL
Negative−Going
Input Threshold
Voltage
Hysteresis Voltage
High−Level
Output Voltage
Low−Level Output Voltage
VIN =
VIH
or
VIL
VIN =
VIH or
VIL
V
V
V
IOL = 3.0 mA
1.65 to
1.95
0.45
0.45
IOL = 4.0 mA
2.3 to 2.7
0.4
0.4
IOL = 8.0 mA
3.0 to 3.6
0.4
0.4
V
IIN
Input Leakage
Current
0 ≤ VIN ≤ 3.6 V
0 to 3.6
±0.1
±1.0
mA
ICC
Quiescent Supply Current
VIN = VCC or GND
3.6
0.5
10.0
mA
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
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3
NL17SG17
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns)
TA =
−555C to +1255C
TA = 25 5C
Symbol
Parameter
Test Condition
VCC (V)
Min
Typ
Max
Min
Max
Unit
tPLH,
tPHL
Propagation Delay,
A to Y
CL = 10 pF,
RL = 1 MW
0.9
−
27.3
−
−
−
ns
1.1 to 1.3
−
13.0
22.6
1.0
35.9
1.4 to 1.6
−
7.5
10.5
1.0
11.3
1.65 to 1.95
−
6.0
7.8
1.0
8.2
2.3 to 2.7
−
4.3
5.4
1.0
5.8
3.0 to 3.6
−
3.5
4.4
1.0
4.6
0.9
−
29.5
−
−
−
1.1 to 1.3
−
14.3
25.1
1.0
41.8
1.4 to 1.6
−
8.0
11.5
1.0
12.6
1.65 to 1.95
−
6.3
8.4
1.0
8.7
2.3 to 2.7
−
4.6
5.7
1.0
6.1
3.0 to 3.6
−
3.7
4.6
1.0
5.0
0.9
−
40.5
−
−
−
1.1 to 1.3
−
19.6
35.7
1.0
58.1
1.4 to 1.6
−
10.7
15.8
1.0
17.6
1.65 to 1.95
−
7.8
10.7
1.0
11.7
2.3 to 2.7
−
5.4
6.9
1.0
8.1
3.0 to 3.6
−
4.3
5.2
1.0
6.1
CL = 15 pF,
RL = 1 MW
CL = 30 pF,
RL = 1 MW
ns
ns
CIN
Input Capacitance
0 to 3.6
3
−
−
−
pF
CO
Output Capacitance
VO = GND
0
3
−
−
−
pF
CPD
Power Dissipation
Capacitance (Note 5)
f = 10 MHz
0.9 to 3.6
4
−
−
−
pF
−
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
5. CPD is defined as the value of the internal equivalent capacitance which is calculated from the dynamic operating current consumption without
load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load
dynamic power consumption; PD = CPD VCC2 fin + ICC VCC.
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4
NL17SG17
VCC
Input A
50%
50%
GND
tPLH
tPHL
VOH
Output Y
50% VCC
VOL
Figure 5. Switching Waveform
VCC
PULSE
GENERATOR
DUT
RT
CL
RL
RT = ZOUT of pulse generator (typically 50 W)
Figure 6. Test Circuit
ORDERING INFORMATION
Package
Shipping†
NL17SG17P5T5G
SOT−953
(Pb−Free)
8000 / Tape & Reel
NL17SG17DFT2G
SC−88A
(Pb−Free)
3000 / Tape & Reel
NL17SG17AMUTCG
UDFN6 1.45x1 mm
(Pb−Free)
3000 / Tape & Reel
NL17SG17CMUTCG*
UDFN6 1x1 mm
(Pb−Free)
3000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*In Development
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5
NL17SG17
PACKAGE DIMENSIONS
SOT−953
CASE 527AE
ISSUE E
X
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF THE BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS.
A
Y
5
4
PIN ONE
INDICATOR
HE
E
1
2 3
DIM
A
b
C
D
E
e
HE
L
L2
L3
C
TOP VIEW
SIDE VIEW
e
L
5X
5X
L3
MILLIMETERS
MIN
NOM
MAX
0.34
0.37
0.40
0.10
0.15
0.20
0.07
0.12
0.17
0.95
1.00
1.05
0.75
0.80
0.85
0.35 BSC
0.95
1.00
1.05
0.175 REF
0.05
0.10
0.15
−−−
−−−
0.15
SOLDERING FOOTPRINT*
5X
0.35
5X
0.20
5X
L2
5X
BOTTOM VIEW
b
PACKAGE
OUTLINE
0.08 X Y
1.20
1
0.35
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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6
NL17SG17
PACKAGE DIMENSIONS
UDFN6 1.0x1.0, 0.35P
CASE 517BX
ISSUE O
PIN ONE
REFERENCE
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. PACKAGE DIMENSIONS EXCLUSIVE OF
BURRS AND MOLD FLASH.
A B
D
ÉÉÉ
ÉÉÉ
E
0.10 C
2X
2X
0.10 C
DIM
A
A1
A3
b
D
E
e
L
L1
TOP VIEW
A3
0.05 C
A
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.13 REF
0.12
0.22
1.00 BSC
1.00 BSC
0.35 BSC
0.25
0.35
0.30
0.40
0.05 C
SIDE VIEW
A1
C
RECOMMENDED
SOLDERING FOOTPRINT*
SEATING
PLANE
5X
e
5X
0.48
L
6X
0.22
3
1
L1
1.18
6
4
BOTTOM VIEW
6X
b
0.10
M
C A B
0.05
M
C
0.53
1
PKG
OUTLINE
NOTE 3
0.35
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
7
NL17SG17
PACKAGE DIMENSIONS
UDFN6 1.45x1.0, 0.5P
CASE 517AQ
ISSUE O
A
B
D
L
L
L1
PIN ONE
REFERENCE
0.10 C
ÉÉÉ
ÉÉÉ
DETAIL A
E
OPTIONAL
CONSTRUCTIONS
DETAIL B
MOLD CMPD
DETAIL B
0.05 C
6X
DIM
A
A1
A2
b
D
E
e
L
L1
ÉÉ
ÉÉ
EXPOSED Cu
TOP VIEW
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
OPTIONAL
CONSTRUCTIONS
A
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.07 REF
0.20
0.30
1.45 BSC
1.00 BSC
0.50 BSC
0.30
0.40
−−−
0.15
MOUNTING FOOTPRINT
0.05 C
A1
A2
SIDE VIEW
e
6X
C
6X
SEATING
PLANE
L
1.24
3
1
DETAIL A
6X
0.53
6
0.30
PACKAGE
OUTLINE
4
BOTTOM VIEW
6X
0.50
PITCH
DIMENSIONS: MILLIMETERS
b
0.10 C A B
0.05 C
1
NOTE 3
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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8
NL17SG17
PACKAGE DIMENSIONS
SC−88A (SC−70−5/SOT−353)
CASE 419A−02
ISSUE L
A
G
5
4
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
−B−
S
1
2
DIM
A
B
C
D
G
H
J
K
N
S
3
D 5 PL
0.2 (0.008)
B
M
M
N
INCHES
MIN
MAX
0.071
0.087
0.045
0.053
0.031
0.043
0.004
0.012
0.026 BSC
--0.004
0.004
0.010
0.004
0.012
0.008 REF
0.079
0.087
MILLIMETERS
MIN
MAX
1.80
2.20
1.15
1.35
0.80
1.10
0.10
0.30
0.65 BSC
--0.10
0.10
0.25
0.10
0.30
0.20 REF
2.00
2.20
J
C
K
H
SOLDER FOOTPRINT*
0.50
0.0197
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
SCALE 20:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
MiniGate is a trademark of Semiconductor Components Industries, LLC (SCILLC).
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for
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any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture
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For additional information, please contact your local
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NL17SG17/D
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