Formosa FM4006-MH1 Chip general purpose rectifier Datasheet

Chip General Purpose Rectifiers
Formosa
MS
FM4001-M H1 THRU FM4007-M H1
List
List................................................................................................. 1
Package outline............................................................................... 2
Features.......................................................................................... 2
Mechanical data............................................................................... 2
Maximum ratings and electrical characteristics ................................. 2
Rating and characteristic curves........................................................ 3
Pinning information........................................................................... 4
Marking........................................................................................... 4
Suggested solder pad layout............................................................. 4
Packing information.......................................................................... 5
Reel packing.................................................................................... 6
Suggested thermal profiles for soldering processes............................. 6
High reliability test capabilities........................................................... 7
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TEL:886-2-22696661
FAX:886-2-22696141
Page 1
Document ID
Issued Date
DS-121143
2013/05/02
Revised Date
-
Revision
A
Page.
7
Chip General Purpose Rectifiers
Formosa
MS
FM4001-M H1 THRU FM4007-M H1
1.0A Surface Mount General
Purpose Rectifiers- 50V-1000V
Features
Package outline
• Batch process design, excellent power dissipation offers
•
•
•
•
•
•
•
SOD-123H1
better reverse leakage current and thermal resistance.
Low profile surface mounted application in order to
optimize board space.
T iny plastic SMD package.
High current capability.
High surge capability.
Glass passivated chip junction.
Lead-free parts meet environmental standards of
MIL-STD-19500 /228
Suffix "-H" indicates Halogen-free parts, ex. FM4001-MH1-H.
0.146(3.7)
0.130(3.3)
0.071(1.8)
0.056(1.4)
0.012(0.3) Typ.
0.004(0.1) Typ.
Mechanical data
•
•
•
Epoxy : UL94-V0 rated flame retardant
0.040(1.0)
0.024(0.6)
Case : Molded plastic, SOD-123H1
Terminals :Plated terminals, solderable per MIL-STD-750,
0.031(0.8) Typ.
0.031(0.8) Typ.
Method 2026
•
•
•
Polarity : Indicated by cathode band
Dimensions in inches and (millimeters)
Mounting Position : Any
Weight : Approximated 0.0103 gram
Maximum ratings and Electrical characteristics (AT
PARAMETER
o
T A=25 C unless otherwise noted)
SYMBOLS FM4001-MH1 FM4002-MH1 FM4003-MH1 FM4004-MH1 FM4005-MH1 FM4006-MH1 FM4007-MH1 UNIT
Maximum repetitive peak reverse voltage
VRRM
50
100
200
400
600
800
1000
V
Maximum RMS voltage
VRMS
35
70
140
280
420
560
700
V
Maximum DC blocking voltage
VDC
50
100
200
400
600
800
1000
V
Maximum average forward rectified current
IO
1.0
A
Peak forward surge current 8.3ms
single half sine-wave(JEDEC method)
IFSM
25
A
Maximum forward voltage at I F =1.0A
VF
1.1
V
Maximum DC reverse current T J =25 ° C
at rated DC blocking voltage T J =125 ° C
IR
5.0
50
uA
uA
Typical thermal resistance junction to ambient
Typical thermal resistance junction to case
RθJA
RθJC
65
40
°C/W
°C/W
Typical junction capacitance (Note 1)
CJ
15
pF
Operating junction temperature range
TJ
-55 to +150
°C
Storage temperature range
TSTG
-65 to +175
°C
Note 1. Measured at 1 MHz and applied reverse voltage of 4.0 VDC
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Page 2
Document ID
Issued Date
DS-121143
2013/05/02
Revised Date
-
Revision
A
Page.
7
Rating and characteristic curves (FM4001-MH1 THRU FM4007-MH1)
FIG.1-TYPICAL FORWARD
FIG.2-TYPICAL FORWARD CURRENT DERATING CURVE
AVERAGE FORWARD CURRENT,(A)
CHARACTERISTICS
10
3.0
1.0
1.2
1.0
0.8
0.6
0.4
0.2
0
0
20
40
TJ=25 C
60
80
100
120
140
160
180
200
LEAD TEMPERATURE (°C)
Pulse Width 300us
1% Duty Cycle
0.1
FIG.4-MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
.01
.6
.7
.8
.9
1.0
1.1
1.2
1.3
FORWARD VOLTAGE,(V)
FIG.3 - TYPICAL REVERSE
CHARACTERISTICS
PEAK FORWAARD SURGE CURRENT,(A)
INSTANTANEOUS FORWARD CURRENT,(A)
50
50
40
30
8.3ms Single Half
TJ=25 C
JEDEC method
10
0
1
100
Sine Wave
20
5
50
10
100
NUMBER OF CYCLES AT 60Hz
FIG.5-TYPICAL JUNCTION CAPACITANCE
35
TJ=125 C
JUNCTION CAPACITANCE,(pF)
REVERSE LEAKAGE CURRENT, (mA)
10
1.0
TJ=25 C
.1
30
25
20
15
10
5
.01
0
0
20
40
60
80
.01
.1
.5
1
5
10
50
100
Revision
Page.
REVERSE VOLTAGE,(V)
PERCENTAGE RATED PEAK REVERSE VOLTAGE
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.05
100 120 140
Page 3
Document ID
Issued Date
DS-121143
2013/05/02
Revised Date
-
A
7
Chip General Purpose Rectifiers
Formosa
MS
FM4001-M H1 THRU FM4007-M H1
Pinning information
Pin
Pin1
Pin2
Simplified outline
cathode
anode
Symbol
2
1
1
2
Marking
Type number
Marking code
FM4001-MH1
FM4002-MH1
FM4003-MH1
FM4004-MH1
FM4005-MH1
FM4006-MH1
FM4007-MH1
A1
A2
A3
A4
A5
A6
A7
Suggested solder pad layout
C
A
B
Dimensions in inches and (millimeters)
PACKAGE
A
B
C
SOD-123H1
0.071 (1.80)
0.051 (1.30)
0.067 (1.70)
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FAX:886-2-22696141
Page 4
Document ID
Issued Date
DS-121143
2013/05/02
Revised Date
-
Revision
A
Page.
7
Chip General Purpose Rectifiers
Formosa
MS
FM4001-M H1 THRU FM4007-M H1
Packing information
P0
P1
d
E
F
B
A
W
P
D2
D1
T
C
W1
D
unit:mm
Item
Symbol
Tolerance
SOD-123H1
Carrier width
Carrier length
Carrier depth
Sprocket hole
13" Reel outside diameter
13" Reel inner diameter
7" Reel outside diameter
7" Reel inner diameter
Feed hole diameter
Sprocket hole position
Punch hole position
Punch hole pitch
Sprocket hole pitch
Embossment center
Overall tape thickness
Tape width
Reel width
A
B
C
d
D
D1
D
D1
D2
E
F
P
P0
P1
T
W
W1
0.1
0.1
0.1
0.1
2.0
min
2.0
min
0.5
0.1
0.1
0.1
0.1
0.1
0.1
0.3
1.0
2.00
3.85
1.10
1.50
178.00
62.00
13.00
1.75
3.50
4.00
4.00
2.00
0.23
8.00
11.40
Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.
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FAX:886-2-22696141
Page 5
Document ID
Issued Date
DS-121143
2013/05/02
Revised Date
-
Revision
A
Page.
7
Chip General Purpose Rectifiers
Formosa
MS
FM4001-M H1 THRU FM4007-M H1
Reel packing
PACKAGE
REEL SIZE
SOD-123H1
7"
COMPONENT
SPACING
REEL
(pcs)
(m/m)
4.0
3,000
BOX
(pcs)
30,000
INNER
BOX
REEL
DIA,
CARTON
SIZE
CARTON
APPROX.
GROSS WEIGHT
(m/m)
(m/m)
(m/m)
(pcs)
(kg)
183*123*183
178
382*257*387
240,000
9.0
Suggested thermal profiles for soldering processes
1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25%
2.Reflow soldering of surface-mount devices
Critical Zone
TL to TP
Tp
TP
Ramp-up
TL
TL
Tsmax
Temperature
Tsmin
tS
Preheat
Ramp-down
25
t25o C to Peak
Time
3.Reflow soldering
Profile Feature
Soldering Condition
Average ramp-up rate(T L to T P )
o
<3 C /sec
Preheat
-Temperature Min(Tsmin)
-Temperature Max(Tsmax)
-Time(min to max)(t s )
o
150 C
o
200 C
60~120sec
Tsmax to T L
-Ramp-upRate
o
<3 C /sec
Time maintained above:
-Temperature(T L )
-Time(t L )
o
217 C
60~260sec
o
o
255 C- 0/ + 5 C
Peak Temperature(T P )
o
Time within 5 C of actual Peak
Temperature(t P )
10~30sec
Ramp-down Rate
<6 C /sec
o
o
Time 25 C to Peak Temperature
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<6minutes
Page 6
Document ID
Issued Date
DS-121143
2013/05/02
Revised Date
-
Revision
A
Page.
7
Chip General Purpose Rectifiers
Formosa
MS
FM4001-M H1 THRU FM4007-M H1
High reliability test capabilities
Item Test
Conditions
Reference
O
MIL-STD-750D
METHOD-2031
O
MIL-STD-202F
METHOD-208
1. Solder Resistance
at 260 ± 5 C for 10 ± 2sec.
2. Solderability
at 245 ± 5 C for 5 sec.
3. High Temperature Reverse Bias
V R=80% rate at T J=150 C for 168 hrs.
4. Forward Operation Life
Rated average rectifier current at T A=25 C for 500hrs.
MIL-STD-750D
METHOD-1038
O
MIL-STD-750D
METHOD-1027
O
O
5. Intermittent Operation Life
6. Pressure Cooker
T A = 25 C, I F = I O
On state: power on for 5 min.
off state: power off for 5 min.
on and off for 500 cycles.
MIL-STD-750D
METHOD-1036
JESD22-A102
O
15P SIG at T A=121 C for 4 hrs.
O
MIL-STD-750D
METHOD-1051
O
7. Temperature Cycling
-55 C to +125 C dwelled for 30 min.
and transferred for 5min. total 10 cycles.
8. Forward Surge
8.3ms single half sine-wave , one surge.
9. Humidity
at T A=85 C , RH=85% for 1000hrs.
10. High Temperature Storage Life
at 175 C for 1000 hrs.
MIL-STD-750D
METHOD-4066-2
MIL-STD-750D
METHOD-1021
O
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MIL-STD-750D
METHOD-1031
O
Page 7
Document ID
Issued Date
DS-121143
2013/05/02
Revised Date
-
Revision
A
Page.
7
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