Order Now Product Folder Support & Community Tools & Software Technical Documents INA381 SBOS848 – DECEMBER 2017 1 Features 3 Description • • The INA381 device includes both a 26-V commonmode, current-sensing amplifier and a high-speed comparator configured to detect overcurrent conditions through measuring the voltage developed across a current-shunt resistor and comparing that voltage to a defined threshold limit set by the comparator reference pin. The current-shunt monitor can measure differential voltage signals on commonmode voltages that can vary from –0.2 V up to 26 V, independent of the supply voltage. 1 • • • • Common-Mode Input Range: –0.2 V to 26 V High Accuracy Amplifier: – Offset Voltage, VCM = 12 V: 500 µV (Maximum) – Offset Voltage, VCM = 0 V: 150 µV (Maximum) – Offset Voltage Drift: 1 µV/°C (Maximum) – Gain Error: 1% (Maximum) – Gain Error Drift: 20 ppm/°C (Maximum) Available Amplifier Gains: – INA381A1: 20 V/V – INA381A2: 50 V/V – INA381A3: 100 V/V – INA381A4: 200 V/V Comparator Specifications: – Hysteresis: 50 mV – Response Time: 500 ns – Alert Threshold Set Through External Reference Voltage Open-Drain Comparator Output With Latching Mode Package: WSON-8 (2 mm × 2 mm) The open-drain alert output can be configured to operate in either a transparent mode where the output status follows the input state or in a latched mode where the alert output is cleared when the latch is reset. The standalone comparator alert response time is under 5 µs, allowing for quick detection of overcurrent events. The total system overcurrent protection provided by the INA381 is under 10 µs. This device operates from a single 2.7-V to 5.5-V supply, drawing a maximum supply current of 400 µA. The device is specified over the extended operating temperature range (–40°C to +125°C), and is available in an 8-pin WSON package. Device Information(1) PART NUMBER PACKAGE 2 Applications • • • • • (1) For all available packages, see the orderable addendum at the end of the data sheet. Overcurrent Protection Power-Supply Protection Low-Side Phase Motor Control Computers and Servers Telecom Equipment WSON (8) BODY SIZE (NOM) INA381 2.00 mm × 2.00 mm Typical Application VS+ 2.7 V to 5.5 V 0 V to 26 V INA381 IN+ 10 k: RPULLUP + VOUT G = 20, 50, 100, 200 RSENSE IN- Microcontroller ADC CMPIN + GPIO - ALERT Load GND RESET GPIO CMPREF 5V R1 R2 Copyright © 2017, Texas Instruments Incorporated 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. ADVANCE INFORMATION for pre-production products; subject to change without notice. ADVANCE INFORMATION INA381 26-V, Low-Cost, Zero-Drift, Voltage-Output, Current-Shunt Monitor With Integrated Comparator INA381 SBOS848 – DECEMBER 2017 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 4 6.1 6.2 6.3 6.4 6.5 4 4 4 4 5 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... 8 8.1 Application Information............................................ 19 8.2 Typical Application .................................................. 19 9 Power Supply Recommendations...................... 22 10 Layout................................................................... 22 10.1 Layout Guidelines ................................................. 22 10.2 Layout Example .................................................... 22 11 Device and Documentation Support ................. 23 11.1 11.2 11.3 11.4 11.5 11.6 Detailed Description .............................................. 7 7.1 7.2 7.3 7.4 Applications and Implementation ...................... 19 Overview ................................................................... 7 Functional Block Diagram ......................................... 7 Feature Description................................................... 8 Device Functional Modes........................................ 14 Documentation Support ........................................ Receiving Notification of Documentation Updates Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 23 23 23 23 23 23 12 Mechanical, Packaging, and Orderable Information ........................................................... 23 ADVANCE INFORMATION 4 Revision History 2 DATE REVISION NOTES December 2017 * Initial release. Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA381 INA381 www.ti.com SBOS848 – DECEMBER 2017 5 Pin Configuration and Functions DSG Package 8-Pin WSON Top View IN+ 1 8 IN- VS+ 2 7 VOUT ALERT 3 6 CMPIN RESET 4 5 CMPREF GND Not to scale Pin Functions I/O DESCRIPTION NAME NO. ALERT 3 Digital output Overlimit alert, active low, open-drain output CMPIN 6 Analog input Signal input to the comparator CMPREF 5 Analog input Input reference to the comparator IN– 8 Analog input Connect to the load side of the shunt resistor IN+ 1 Analog input Connect to the supply side of the shunt resistor RESET 4 Digital input Transparent or latch mode selection input. See the Alert Mode section for a detailed description on pin connections. VOUT 7 Analog output VS+ 2 Supply ADVANCE INFORMATION PIN Current-sense amplifier output voltage Power supply, 2.7 V to 5.5 V Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA381 3 INA381 SBOS848 – DECEMBER 2017 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT 6 V Supply voltage, VS Differential (VIN+) – (VIN–) Analog inputs (IN+, IN–) Analog input –26 26 V Common-mode GND – 0.3 26 V CMPIN GND – 0.3 (VS) + 0.3 V CMPREF GND – 0.3 (VS) + 0.3 V Analog output OUT GND – 0.3 (VS) + 0.3 V Digital input RESET GND – 0.3 (VS) + 0.3 V Digital output ALERT GND – 0.3 Junction temperature, TJ Storage temperature, Tstg (1) –65 6 V 150 °C 150 °C ADVANCE INFORMATION Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6.2 ESD Ratings VALUE V(ESD) (1) (2) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) ±2000 Charged-device model (CDM), per JEDEC specification JESD22C101 (2) ±1000 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX -0.2 12 26 Operating supply voltage 2.7 5 Operating free-air temperature –40 VCM Common-mode input voltage VS TA UNIT V V +125 °C 6.4 Thermal Information INA381 THERMAL METRIC (1) DSG (WSON) UNIT 8 PINS RθJA Junction-to-ambient thermal resistance 77 °C/W RθJC(top) Junction-to-case (top) thermal resistance 96.5 °C/W RθJB Junction-to-board thermal resistance 43.4 °C/W ΨJT Junction-to-top characterization parameter 5.4 °C/W YJB Junction-to-board characterization parameter 43.6 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 18.8 °C/W (1) 4 For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA381 INA381 www.ti.com SBOS848 – DECEMBER 2017 6.5 Electrical Characteristics at TA = 25°C, VSENSE = VIN+ – VIN– = 10 mV, VS = 5 V, VIN+ = 12 V, and CMPREF = 2 V, (unless otherwise noted.) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT INPUT VCM Common-mode input voltage range CMRR Common-mode rejection ratio, RTI VOS Offset voltage, RTI (1) dVOS/dT –0.2 VIN+ = 0 V to 26 V, TA= –40ºC to +125ºC 84 VIN+ = 12 V, VIN– = 12 V 26 V 100 dB ±100 ±500 VIN+ = 0 V, VIN– = 0 V ±25 ±150 Offset voltage drift, RTI (1) TA= –40ºC to +125ºC 0.1 1 μV/°C PSRR Power-supply rejection ratio VS = 2.7 V to 5.5 V, TA= –40ºC to +125ºC ±8 ±40 μV/V IB Input bias current VSENSE = 0 mV, IB+, IB– IOS Input offset current VSENSE = 0 mV μV μV 80 μA ±0.05 μA INA381A1 20 V/V INA381A2 50 V/V INA381A3 100 V/V INA381A4 200 G Gain EG Gain error VOUT = 0.5 V to VS – 0.5 V Gain error vs temperature TA= –40ºC to +125ºC Nonlinearity error VOUT = 0.5 V to VS – 0.5 V Maximum capacitive load No sustained oscillation ADVANCE INFORMATION OUTPUT V/V ±0.1% ±1% 1.5 20 ppm/°C ±0.01% 1 nF VS – 0.02 V VGND + 0.001 V VOLTAGE OUTPUT Swing to VS power-supply rail RL = 10 kΩ to GND, TA= –40ºC to 125ºC Swing to GND VSENSE = 0 V, VIN+ = 0 V, VIN– = 0 V, RL = 10 kΩ to GND, TA= –40ºC to +125ºC FREQUENCY RESPONSE BW Bandwidth SR Slew rate INA381A1 350 kHz INA381A2 210 kHz INA381A3 150 kHz INA381A4 105 kHz 2 V/µs 30 nV/√Hz µs NOISE Voltage noise density COMPARATOR tp Propagation delay time, comparator only CMPIN Input overdrive = 20 mV 0.2 Large-signal propagation delay, comparator only CMPIN step = 0.5 V to 4.5 VCMPREF = 4 V 0.3 Small signal total alert propogation delay, comparator and amplifier Input overdrive = 1 mV 3 Slew rate limited total alert propagation delay, comparator and amplifier VOUT step = 0.5 V to 4.5, VCMPREF = 4 V 5 10 µs 1 5 mV 1 µs µs VOS Comparator offset voltage HYS Hysteresis VIH High-level input voltage 1.4 6 VIL Low-level input voltage 0 0.4 V VOL Alert low-level output voltage IOL = 3 mA 70 300 mV ALERT pin leakage input current VOH = 3.3 V 0.1 μA Digital leakage input current 0 ≤ VIN ≤ VS 1 μA (1) 50 mV V RTI = referred-to-input. Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA381 5 INA381 SBOS848 – DECEMBER 2017 www.ti.com Electrical Characteristics (continued) at TA = 25°C, VSENSE = VIN+ – VIN– = 10 mV, VS = 5 V, VIN+ = 12 V, and CMPREF = 2 V, (unless otherwise noted.) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 5.5 V 300 400 μA 500 μA 125 °C POWER SUPPLY VS IQ Operating supply range Quiescent current TA = –40ºC to +125ºC 2.7 VSENSE = 10 mV, TA = +25ºC TA = –40ºC to +125ºC TEMPERATURE RANGE Specified range –40 ADVANCE INFORMATION 6 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA381 INA381 www.ti.com SBOS848 – DECEMBER 2017 7 Detailed Description 7.1 Overview The INA381 is a zero-drift topology, current-sensing amplifier with an integrated comparator that can be used in both low-side and high-side current-sensing and protection applications. These specially-designed, currentsensing amplifiers are able to accurately measure voltages developed across current-sensing resistors (also known as current-shunt resistors) on common-mode voltages that far exceed the supply voltage powering the device. Current can be measured on input voltage rails as high as 26 V, and the device can be powered from supply voltages as low as 2.7 V. The device can also withstand the full 26-V common-mode voltage at the input pins when the supply voltage is removed without causing damage. The INA381 uses a reference input that allows for a simple method of setting the corresponding current threshold level for the device to use for out-of-range comparison. Combining the precision measurement of the currentsense amplifier and the on-board comparator enables an all-in-one overcurrent detection device. This combination creates a highly-accurate solution that is capable of fast detection of out-of-range conditions and allows the system to take corrective actions to prevent potential component or system-wide damage. 7.2 Functional Block Diagram VS+ 2.7 V to 5.5 V 0 V to 26 V INA381 IN+ 10 k: RPULLUP + VOUT G = 20, 50, 100, 200 RSENSE IN- Microcontroller ADC CMPIN + GPIO - ALERT Load GND RESET GPIO CMPREF 5V R1 R2 Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA381 7 ADVANCE INFORMATION The zero-drift topology enables high-precision measurements with maximum input offset voltages as low as 150 µV with a temperature contribution of only 1 µV/°C over the full temperature range of –40°C to +125°C. The low total offset voltage of the INA381 enables smaller current-sense resistor values to be used, and allows for a more efficient system operation without sacrificing measurement accuracy resulting from the smaller input signal. INA381 SBOS848 – DECEMBER 2017 www.ti.com 7.3 Feature Description 7.3.1 Wide Input Common-Mode Voltage Range The INA381 supports input common-mode voltages from –0.2 V to 26 V. Because of the internal topology, the common-mode range is not restricted by the power-supply voltage (VS) as long as VS stays within the operational range of 2.7 V to 5.5 V. As Figure 1 shows, the ability to operate with common-mode voltages greater or less than VS allows the INA381 to be used in high-side (and low-side) current-sensing applications. -0.2 V to 26 V Power Supply IN+ RSENSE ADVANCE INFORMATION IN- High-Side Sensing Common-mode voltage (VCM) is bus-voltage dependent. Load IN+ RSENSE IN- Low-Side Sensing Common-mode voltage (VCM) is always near ground and is isolated from bus-voltage spikes. GND Figure 1. High-Side and Low-Side Current Sensing 7.3.2 Precise Low-Side Current Sensing When used in low-side current-sensing applications, the offset voltage of the INA381 is less than 150 µV. The low offset performance of the INA381 has several benefits. First, the low offset allows the device to be used in applications that must measure current over a wide dynamic range. In this case, the low offset improves the accuracy when the sense currents are on the low end of the measurement range. Another advantage of low offset is the ability to sense lower voltage drop across the sense resistor accurately, thus allowing for a lowervalue shunt resistor. Lower-value shunt resistors reduce power loss in the current-sense circuit, and help improve the power efficiency of the end application. The gain error of the INA381 is specified to be within 1% of the actual value. As the sensed voltage becomes much larger than the offset voltage, this gain error becomes the dominant source of error in the current-sense measurement. 8 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA381 INA381 www.ti.com SBOS848 – DECEMBER 2017 Feature Description (continued) 7.3.3 High Bandwidth and Slew Rate The INA381 supports small-signal bandwidths as high as 350 kHz, and large-signal slew rates of 2 V/µs. The ability to detect rapid changes in the sensed current, as well as the ability to quickly slew the output, makes the INA381 a good choice for applications that require a quick response to input current changes. One application that requires high bandwidth and slew rate is low-side motor control, where the ability to follow rapid changing current in the motor allows for more accurate control over a wider operating range. Another application that requires higher bandwidth and slew rates is system fault detection. The integrated comparator within the INA381 is designed to quickly detect when the sense current is out of range and provides a digital output on the ALERT pin for quicker and faster responses. 7.3.4 Alert Output Figure 2 shows the alert output response of the internal comparator. When the output voltage of the amplifier is lower than the set reference voltage on CMPREF, the comparator output is in the default high state. When the amplifier output voltage exceeds the reference voltage set at the CMPREF pin, the comparator output becomes active and pulls low. This active low output indicates that the measured signal at the amplifier input has exceeded the programmed threshold level, indicating an overcurrent or out-of-range condition has occurred. 6 ALERT VOUT CMPREF 5 Voltage (V) 4 3 2 1 0 -1 Time (2ms/div) Figure 2. Overcurrent Alert Response 7.3.5 Alert Mode The device has two output operating modes, transparent and latched, that are selected based on the RESET pin setting. These modes change how the ALERT pin responds following an alert when the overcurrent condition is removed. 7.3.5.1 Transparent Output Mode The device is set to transparent mode when the RESET pin is pulled low, allowing the output alert state to change and follow the input signal with respect to the programmed alert threshold. For example, when the differential input signal rises above the alert threshold, the alert output pin is pulled low. When the differential input signal drops below the alert threshold, the output returns to the default high output state. A common implementation using the device in transparent mode is connecting the ALERT pin to a hardware interrupt input on a microcontroller. When an overcurrent condition is detected and the ALERT pin is pulled low, the controller interrupt pin detects the output state change and begins making changes to the system operation required to address the overcurrent condition. Under this configuration, the ALERT pin high-to-low transition is captured by the microcontroller so the output returns to the default high state when the overcurrent event is removed. Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA381 9 ADVANCE INFORMATION The device ALERT pin is an active-low, open-drain output that is designed to be pulled low when the input conditions are detected to be out-of-range. This open-drain output pin is recommended to include a 10-kΩ pullup resistor to the supply voltage. This open-drain pin can be pulled up to a voltage beyond the supply voltage, VS, but must not exceed 5.5 V. INA381 SBOS848 – DECEMBER 2017 www.ti.com Feature Description (continued) 7.3.5.2 Latch Output Mode Some applications do not have the functionality available to continuously monitor the state of the output ALERT pin to detect an overcurrent condition, as described in the Transparent Output Mode section. A typical example of this application is a system that is only able to poll the ALERT pin state periodically to determine if the system is functioning correctly. If the device is set to transparent mode in this type of application, the state change of the ALERT pin can be missed when ALERT is pulled low to indicate an out-of-range event if the out-of-range condition does not appear during one of these periodic polling events. Latch mode is specifically intended to accommodate these applications. As shown in Table 1, the device is placed into the corresponding output mode based on the signal connected to RESET. The difference between latch mode and transparent mode is how the alert output responds when an overcurrent event ends. In transparent mode (RESET = low), when the differential input signal drops below the limit threshold level after the ALERT pin asserts because of an overcurrent event, the state of the ALERT pin returns to the default high setting to indicate that the overcurrent event is complete. Table 1. Output Mode Settings ADVANCE INFORMATION OUTPUT MODE RESET PIN SETTING Transparent mode RESET = low Latch mode RESET = high In latch mode (RESET = high), when an overlimit condition is detected and the ALERT pin is pulled low, the ALERT pin does not return to the default high state when the differential input signal drops below the alert threshold level. To clear the alert, the RESET pin must be pulled low for at least 100 ns. Pulling the RESET pin low returns the ALERT to the default high level, if the differential input signal is below the alert threshold. If the input signal is above the threshold limit when the RESET pin is pulled low, the ALERT pin remains low. When the alert condition is detected by the system controller, the RESET pin can be set back to high to place the device back in latch mode. Figure 3 shows the latch and transparent modes. In Figure 3, when VIN drops back below the VLIMIT threshold for the first time, the RESET pin is pulled high. With the RESET pin is pulled high, the device is set to latch mode so that the alert output state does not return high when the input signal drops below the VLIMIT threshold. Only when the RESET pin is pulled low does the ALERT pin return to the default high level, thus indicating that the input signal is below the limit threshold. When the input signal drops below the limit threshold for the second time, the RESET pin is already pulled low. The device is set to transparent mode at this point and the ALERT pin is pulled back high when the input signal drops below the alert threshold. VCPMPREF VOUT (VIN+ - VIN-) x GAIN 0V LATCH1 Latch Mode Transparent Mode Alert Clears ALERT1 Alert Does Not Clear Figure 3. Transparent versus Latch Mode 10 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA381 INA381 www.ti.com SBOS848 – DECEMBER 2017 7.3.6 Setting The Current-Limit Threshold The VOUT voltage is the amplified voltage developed across the current-sensing resistor. The signal at the VOUT pin developed is the input voltage across IN+ and IN– multiplied by the gain of the amplifier. The INA381 has four gain options, as shown in Figure 4: 20 V/V, 50 V/V, 100 V/V, and 200 V/V. The VOUT pin can be externally shorted to the CMPIN pin. The INA381 determines if an overcurrent event is present by comparing the voltage on the CMPIN pin to the corresponding signal developed at the CMPREF pin. The threshold voltage for the CMPREF pin can be set with a resistive divider or by connecting an external voltage source (such as a reference generator device). Figure 5 depicts the REF3140 used as an external reference source. VS+ 2.7 V to 5.5 V INA381 VOUT G = 20, 50, 100, 200 Microcontroller ADVANCE INFORMATION 10 k: RPULLUP + ADC CMPIN + - ALERT RESET GPIO GPIO CMPREF GND 5V R1 R2 Copyright © 2017, Texas Instruments Incorporated Figure 4. Resistor Divider Voltage Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA381 11 INA381 SBOS848 – DECEMBER 2017 www.ti.com VS+ 2.7 V to 5.5 V INA381 10 k: RPULLUP + CMPIN, VOUT 4V VOUT G = 20, 50, 100, 200 Vs - ALERT CMPIN + - ALERT 4V CMPREF RESET CMPREF GND ADVANCE INFORMATION 4V 5V REF3140 0.2% , 15ppm/° C Copyright © 2017, Texas Instruments Incorporated Figure 5. External Reference Voltage 7.3.7 Selecting a Current-Sensing Resistor The device measures the differential voltage developed across a resistor when current flows through the component to determine if the current being monitored exceeds a defined limit. This resistor is commonly referred to as a current-sensing resistor or a current-shunt resistor, with each term commonly used interchangeably. The flexible design of the device allows for measuring a wide differential input signal range across this current-sensing resistor. Selecting the value of this current-sensing resistor is based primarily on two factors: the required accuracy of the current measurement and the allowable power dissipation across the current-sensing resistor. Larger voltages developed across this resistor allow for more accurate measurements to be made. Amplifiers have fixed internal errors that are largely dominated by the inherent input offset voltage. When the input signal decreases, these fixed internal amplifier errors become a larger portion of the measurement and increase the uncertainty in the measurement accuracy. When the input signal increases, the measurement uncertainty is reduced because the fixed errors are a smaller percentage of the signal being measured. Therefore, the use of larger-value, currentsensing resistors inherently improves the measurement accuracy. However, a system design trade-off must be evaluated through use of larger input signals for improving the measurement accuracy. Increasing the current-sense resistor value results in increased power dissipation across the current-sensing resistor. Increasing the value of the current-shunt resistor increases the differential voltage developed across the resistor when current passes through the component. This increase in voltage across the resistor increases the power that the resistor must be able to dissipate. Decreasing the value of the current-shunt resistor value reduces the power dissipation requirements of the resistor, but increases the measurement errors resulting from the decreased input signal. Selecting the optimal value for the shunt resistor requires factoring both the accuracy requirement for the specific application and the allowable power dissipation of this component. An increasing number of very low ohmic-value resistors are becoming more widely available with values reaching down as low as 1 mΩ or lower with power dissipations of up to 5 W that enable large currents to be accurately monitored with sensing resistors. 12 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA381 INA381 www.ti.com SBOS848 – DECEMBER 2017 7.3.7.1 Selecting a Current-Sensing Resistor: Example In this example, the trade-offs involved in selecting a current-sensing resistor are discussed. This example requires 5% accuracy for detecting a 10-A overcurrent event under 20 µs where only 250 mW is allowable for the dissipation across the current-sensing resistor at the full-scale current level. Although the maximum power dissipation is defined as 250 mW, a lower dissipation is preferred to improve system efficiency. Given the total error budget of 5%, the INA381 total error is less than 1%. The INA381 is well suited for this application as up to 1% of error is available to be attributed to the measurement error of the device under these conditions. As shown in Table 2, the maximum value calculated for the current-sensing resistor with these requirements is 2.5 mΩ. Although this value satisfies the maximum power dissipation requirement of 250 mW, headroom is available from the 2.5% maximum total overcurrent detection error to reduce the value of the current-sensing resistor and reduce the power dissipation further. Selecting a 1.5-mΩ, current-sensing resistor value offers a good tradeoff for reducing the power dissipation in this scenario by approximately 40% and still remaining within the accuracy region. Table 2. Calculating the Current-Sensing Resistor (RSENSE) EQUATION VALUE UNIT IMAX Maximum current 10 A PD_MAX Maximum allowable power dissipation 250 mW RSENSE_MAX Maximum allowable RSENSE 2.5 mΩ VOS Offset voltage, VCM = 12 V 500 µV VOS_ERROR Initial offset voltage error EG Gain error ERRORTOTAL Total measurement error tp PD_MAX / IMAX2 (VOS / (RSENSE_MAX × IMAX ) × 100 2% 1% √(VOS_ERROR2 + EG2) 2.23% Allowable current threshold accuracy 5% Total system overcurrent response time 10 µs Allowable overcurrent response 20 µs 7.3.8 Hysteresis The on-board comparator in the INA381 is designed to reduce the possibility of oscillations in the alert output when the measured signal level is near the overlimit threshold level as a result of noise. When the voltage (VCMPIN) exceeds the voltage developed at the CMPREF pin, the ALERT pin asserts and pulls low. The output voltage must drop below the CMPREF pin threshold voltage, as shown in Figure 6, by the hysteresis level of 50 mV for the ALERT pin to de-assert and return to the nominal high state. The INA381 is designed with a hysteresis of 50 mV. ALERT Alert Output VCMPIN VCMPREF ± 50 mV VCMPREF Figure 6. Typical Comparator Hysteresis Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA381 13 ADVANCE INFORMATION PARAMETER INA381 SBOS848 – DECEMBER 2017 www.ti.com 7.4 Device Functional Modes 7.4.1 Input Filtering Provided that the INA381 output is connected to a high-impedance input, the best location to filter is at the device output using a simple RC network from VOUT to GND. Filtering at the output attenuates high-frequency disturbances in the common-mode voltage, differential input signal, and INA381 power-supply voltage. If filtering at the output is not possible, or if only the differential input signal needs filtering, a filter can be applied at the input pins of the device. External filtering can help reduce the amount of noise that reaches the comparator, and thereby reduce the likelihood of a false alert from occurring. The tradeoff to adding this noise filter is that the alert response time is increased because both the input signal and noise are filtered. Figure 7 shows the implementation of an input filter for the device. VS+ 2.7 V ± 5.5 V 0 V to 26 V INA381 ADVANCE INFORMATION < 10 IN+ VOUT G = 20, 50, 100, 200 CFILTER RSENSE 10 k RPULLUP + IN- CMPIN < 10 + - ALERT Load GND RESET CMPREF 5V R1 R2 Copyright © 2017, Texas Instruments Incorporated Figure 7. Input Filter The addition of external series resistance creates an additional error in the measurement; therefore, the value of these series resistors must be kept to 10 Ω (or less, if possible) to reduce impact to accuracy. The internal bias network shown in Figure 7 present at the input pins creates a mismatch in input bias currents when a differential voltage is applied between the input pins. If additional external series filter resistors are added to the circuit, the mismatch in bias currents results in a mismatch of voltage drops across the filter resistors. This mismatch creates a differential error voltage that subtracts from the voltage developed across the shunt resistor. This error results in a voltage at the device input pins that is different than the voltage developed across the shunt resistor. Without the additional series resistance, the mismatch in input bias currents has little effect on device operation. The amount of error these external filter resistors add to the measurement can be calculated using Equation 2. Equation 1 calculates the gain error factor. Equation 1 shows that the amount of variance in the differential voltage present at the device input relative to the voltage developed at the shunt resistor is based both on the external series resistance (RF) value as well as internal input resistor RINT. The reduction of the shunt voltage reaching the device input pins appears as a gain error when comparing the output voltage relative to the voltage across the shunt resistor. A factor can be calculated to determine the amount of gain error that is introduced by the addition of external series resistance. Use Equation 1 to calculate the expected deviation from the shunt voltage to what is measured at the device input pins: 1250 u RINT Gain Error Factor (1250 u RF ) (1250 u RINT ) (RF u RINT ) where: • • 14 RINT is the internal input resistor RF is the external series resistance Submit Documentation Feedback (1) Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA381 INA381 www.ti.com SBOS848 – DECEMBER 2017 Device Functional Modes (continued) With the adjustment factor from Equation 1, including the device internal input resistance shown in Table 3, this factor varies with each gain version. Table 4 lists each individual device gain error factor. Table 3. Input Resistance PRODUCT GAIN RINT (kΩ) INA381A1 20 25 INA381A2 50 10 INA381A3 100 5 INA381A4 200 2.5 PRODUCT SIMPLIFIED GAIN ERROR FACTOR INA381A1 25000 (21u RF ) 25000 INA381A2 10000 (9 u RF ) 10000 INA381A3 1000 RF 1000 INA381A4 2500 (3 u RF ) 2500 Equation 2 can then calculate the gain error that can be expected from the addition of the external series resistors: Gain Error (%) = 100 - (100 ´ Gain Error Factor) (2) For example, using an INA381A2 and the corresponding gain error equation from Table 4, a series resistance of 10 Ω results in a gain error factor of 0.991. The corresponding gain error is then calculated using Equation 2, resulting in an additional gain error of approximately 0.89% solely because of the external 10-Ω series resistors. Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA381 15 ADVANCE INFORMATION Table 4. Device Gain Error Factor INA381 SBOS848 – DECEMBER 2017 www.ti.com 7.4.2 Adjustable Hysteresis The device onboard comparator is designed with a hysteresis of 50 mV. The INA381 is designed for the user to change the hysteresis from a preset value of 50 mV by connecting an external resistor between VOUT and CMPIN. Figure 8 shows a detailed block diagram of adding additional hysteresis. VS+ 2.7 V to 5.5 V 0 V to 26 V INA381 IN+ 10 k: RPULLUP + VOUT G = 20, 50, 100, 200 RSENSE IN- VS+ 4 µA - RHYS 12.5 k ADVANCE INFORMATION Internal Hysteresis Control Load CMPIN + - ALERT RESET CMPREF GND 5V R1 R2 Copyright © 2017, Texas Instruments Incorporated Figure 8. Adding Additional Hysteresis to the Comparator Hysteresis is internally designed to preset to 50 mV in the INA381. Internal to the comparator, the INA381 has a current source of 4 µA in series with 12.5 kΩ. The internal current source and hysteresis of the comparator is set by the internal hysteresis control circuit that is enabled only after ALERT is asserted low. ALERT is asserted during an overcurrent condition when the voltage on VOUT exceeds the threshold set on the CMPREF pin. The internal 4-µA hysteresis circuits are triggered only after ALERT is asserted. To set additional hysteresis higher than 50 mV, the RHYS resistor must be connected between the VOUT and CMPIN pin. Equation 3 and Equation 4 describe the internal configuration to set the external hysteresis resistor. VHYS R HYS 4 PA u 12500 : V HYS R HYS (3) 4 PA u 12500 : 4 PA where • • 16 VHYS is the desired hysteresis voltage RHYS is the external resistor on the input of the CMPIN pin Submit Documentation Feedback (4) Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA381 INA381 www.ti.com SBOS848 – DECEMBER 2017 Table 5 lists the external resistors required at the input of the CMPIN pin to set the hysteresis. Table 5. Hysteresis Resistor Selection HYSTERESIS VOLTAGE EXTERNAL RESISTOR AT THE CMPIN PIN 50 mV 0Ω 75 mV 6.25 kΩ 100 mV 12.5 kΩ 125 mV 18.75 kΩ 150 mV 25 kΩ 200 mV 37.5 kΩ 250 mV 50 kΩ 300 mV 62.5 kΩ With a small amount of additional circuitry, the INA381 can be used in circuits subject to transients higher than 26 V. Use only Zener diodes or Zener-type transient absorbers (sometimes referred to as transzorbs)—any other type of transient absorber has an unacceptable time delay. Start by adding a pair of resistors as shown in Figure 9 as a working impedance for the Zener diode. Keep these resistors as small as possible; most often approximately 10 Ω. Larger values can be used with an effect on gain that is discussed in the Input Filtering section. This circuit limits only short-term transients and, therefore, many applications are satisfied with a 10-Ω resistor along with conventional Zener diodes of the lowest acceptable power rating. This combination uses the least amount of board space. These diodes can be found in packages as small as SOT-523 or SOD-523. 2.7 V to 5.5 V 0 V to 26 V INA381 < 10 IN+ VOUT G = 20, 50, 100, 200 RSENSE < 10 10 k: RPULLUP + IN- - CMPIN + Load GND ALERT RESET CMPREF 5V R1 R2 Copyright © 2017, Texas Instruments Incorporated Figure 9. Transient Protection In the event that low-power Zener diodes do not have sufficient transient absorption capability, a higher-power transzorb must be used. Figure 9 shows that the most package-efficient solution involves using a single transzorb and back-to-back diodes between the device inputs. The most space-efficient solutions are dual, series-connected diodes in a single SOT-523 or SOD-523 package. In either of the examples provided in Figure 9 and Figure 10, the total board area required by the INA381 with all protective components is less than that of an SOIC-8 package, and only slightly greater than that of a VSSOP-8 package. Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA381 17 ADVANCE INFORMATION 7.4.3 Using the INA381 With Common-Mode Transients Above 26 V INA381 SBOS848 – DECEMBER 2017 www.ti.com 2.7 V to 5.5 V ±0.2 V to 26 V INA381 < 10 IN+ VOUT G = 20, 50, 100, 200 RSENSE < 10 10 k: RPULLUP + IN- CMPIN + Load - ALERT GND RESET ADVANCE INFORMATION CMPREF 5 V R1 R2 Copyright © 2017, Texas Instruments Incorporated Figure 10. Transient Protection Using a Single Transzorb and Input Clamps 18 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA381 INA381 www.ti.com SBOS848 – DECEMBER 2017 8 Applications and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Application Information The INA381 is designed to enable easy configuration for detecting overcurrent conditions in an application. This device is individually targeted towards unidirectional overcurrent detection of a single threshold. However, this device can also be paired with additional devices and circuitry to create more complex monitoring functional blocks. 8.2 Typical Application VS+ INA381 VS IN+ IN- ADVANCE INFORMATION 2.7 V to 5.5 V 10 k: RPULLUP + VOUT G = 20, 50, 100, 200 - CMPIN + -0.2 V to 26 V ALERT - RESET R1 RSENSE R2 CMPREF 5V VS+ 2.7 V to 5.5 V Load IN+ IN- INA381 + VOUT G = 20, 50, 100, 200 10 k: RPULLUP - + CMPIN - ALERT RESET R3 R4 CMPREF 5V Copyright © 2017, Texas Instruments Incorporated Figure 11. Bidirectional Application Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA381 19 INA381 SBOS848 – DECEMBER 2017 www.ti.com Typical Application (continued) 8.2.1 Design Requirements Although the INA381 is only able to measure current through a current-sensing resistor flowing in one direction, a second INA381 can be used to create a bidirectional monitor. Table 6 lists a system design example of a highside INA381 measuring in the forward direction and one low-side INA381 measuring in the reverse direction. This example designs for maximum accuracy. The following example also uses the alert function of both devices. Table 6. Design Parameters DESIGN PARAMETER EXAMPLE VALUE Rsense 12 mΩ Power-supply voltage 5V Common-mode voltage 20 V Maximum sense current 20 A Small-signal bandwidth > 120 kHz Alert current threshold 19 A ADVANCE INFORMATION 8.2.2 Detailed Design Procedure Although the device is only able to measure current through a current-sensing resistor flowing in one direction, a second INA381 can be used to create a bidirectional monitor. With the input pins of a second device reversed across the same current-sensing resistor, the second device is now able to detect current flowing in the other direction relative to the first device; see Figure 11. The outputs of each device connect to an AND gate to detect if either of the limit threshold levels are exceeded. As shown in Table 7, the output of the AND gate is high if neither overcurrent limit thresholds are exceeded. A low output state of the AND gate indicates that either the positive overcurrent limit or the negative overcurrent limit is surpassed. In this scenario, the maximum current expected through the shunt resistor is 20 A in either the forward or reverse direction. Because maximum accuracy is desired, the shunt resistor is maximized by taking the maximum output swing divided by the smallest gain and divided by the maximum current. The design example in Table 6 yields a shunt value of 12.3 mΩ. The closest standard 1% and 0.1% device is 12 mΩ and this value is used by both INA381 devices. Because corrective action must be taken when the current exceeds ±19 A, the comparators require a value of 4.56 V (19 A × 0.012 Ω × 20 V/V). In this instance, a voltage divider consisting of two 4.53-kΩ resistors (R1 and R3) and two 5-kΩ resistors (R2 and R4) off the 5-V rail supply a voltage close to this value. To ensure that both device alert functions can trigger a single GPIO pin on a microcontroller, both comparator outputs feed into an AND gate. As shown in Table 7, the output of the AND gate is high if neither overcurrent limit thresholds are exceeded. A low output state of the AND gate indicates that either the positive overcurrent limit or the negative overcurrent limit is surpassed. Table 7. Bidirectional Overcurrent Output Status OCP STATUS OUTPUT OCP+ 0 OCP– 0 No OCP 1 8.2.3 Application Curve Figure 12 shows two INA381 devices being used in a bidirectional configuration and an output control circuit to detect if one of the two alerts is exceeded. 20 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA381 INA381 SBOS848 – DECEMBER 2017 Input (5 mV/div) Alert Output (1 V/div) www.ti.com Positive Limit 0V Negtive Limit Time (5 ms/div) ADVANCE INFORMATION Figure 12. Bidirectional Application Curve Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA381 21 INA381 SBOS848 – DECEMBER 2017 www.ti.com 9 Power Supply Recommendations The device input circuitry can accurately measure signals on common-mode voltages beyond the power-supply voltage, VS. For example, the voltage applied to the VS power-supply pin can be 5 V, whereas the load powersupply voltage being monitored (VCM) can be as high as 26 V. The device can withstand the full –0.2 V to 26 V range at the input pins, regardless of whether the device has power applied or not. Power-supply bypass capacitors are required for stability and must be placed as closely as possible to the supply and ground pins of the device. A typical value for this supply bypass capacitor is 0.1 µF. Applications with noisy or high-impedance power supplies can require additional decoupling capacitors to reject power-supply noise. 10 Layout 10.1 Layout Guidelines • ADVANCE INFORMATION • • Place the power-supply bypass capacitor as closely as possible to the supply and ground pins. The recommended value of this bypass capacitor is 0.1 µF. Additional decoupling capacitance can be added to compensate for noisy or high-impedance power supplies. Make sure the thermal pad/GND are connected to a solid ground plane of the PCB. The open-drain output pin is recommended to be pulled up to the supply voltage rail through a 10-kΩ pullup resistor. 10.2 Layout Example RSHUNT Power Supply Load VIA to Ground Plane IN+ IN1 CBYPASS 8 VS+ VOUT 2 VIA to Power Supply 7 GND ALERT CMPIN 3 6 4 5 CMPREF RESET INA381 Copyright © 2017, Texas Instruments Incorporated NOTE: Connect the limit resistor directly to the GND pin. Figure 13. Recommended Layout 22 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA381 INA381 www.ti.com SBOS848 – DECEMBER 2017 11 Device and Documentation Support 11.1 Documentation Support 11.1.1 Related Documentation For related documentation see the following: REF31xx 15ppm/°C Maximum, 100-μA, SOT-23 Series Voltage Reference 11.2 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 11.3 Community Resources TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 11.4 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 11.5 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 11.6 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA381 23 ADVANCE INFORMATION The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. INA381 SBOS848 – DECEMBER 2017 www.ti.com PACKAGE OUTLINE DSG0008A WSON - 0.8 mm max height SCALE 5.500 PLASTIC SMALL OUTLINE - NO LEAD 2.1 1.9 A B PIN 1 INDEX AREA 2.1 1.9 ADVANCE INFORMATION 0.3 0.2 0.4 0.2 OPTIONAL TERMINAL TYPICAL C 0.8 MAX SEATING PLANE 0.05 0.00 0.08 C EXPOSED THERMAL PAD (0.2) TYP 0.9 0.1 5 4 6X 0.5 2X 1.5 SEE OPTIONAL TERMINAL 9 1.6 0.1 8 1 PIN 1 ID 8X 0.4 0.2 8X 0.3 0.2 0.1 0.05 C A B C 4218900/B 09/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. 24 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA381 INA381 www.ti.com SBOS848 – DECEMBER 2017 EXAMPLE BOARD LAYOUT DSG0008A WSON - 0.8 mm max height PLASTIC SMALL OUTLINE - NO LEAD (0.9) 8X (0.5) ( 0.2) VIA TYP 1 8 8X (0.25) (0.55) SYMM ADVANCE INFORMATION 9 (1.6) 6X (0.5) 5 4 SYMM (R0.05) TYP (1.9) LAND PATTERN EXAMPLE SCALE:20X 0.07 MIN ALL AROUND 0.07 MAX ALL AROUND SOLDER MASK OPENING METAL METAL UNDER SOLDER MASK NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK OPENING SOLDER MASK DEFINED SOLDER MASK DETAILS 4218900/B 09/2017 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA381 25 INA381 SBOS848 – DECEMBER 2017 www.ti.com EXAMPLE STENCIL DESIGN DSG0008A WSON - 0.8 mm max height PLASTIC SMALL OUTLINE - NO LEAD 8X (0.5) SYMM METAL 1 ADVANCE INFORMATION 8 8X (0.25) (0.45) SYMM 9 (0.7) 6X (0.5) 5 4 (R0.05) TYP (0.9) (1.9) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL EXPOSED PAD 9: 87% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE SCALE:25X 4218900/B 09/2017 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 26 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA381 PACKAGE OPTION ADDENDUM www.ti.com 31-Jan-2018 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) INA381A1IDSGR PREVIEW WSON DSG 8 3000 TBD Call TI Call TI -40 to 125 INA381A1IDSGT PREVIEW WSON DSG 8 250 TBD Call TI Call TI -40 to 125 INA381A2IDSGR PREVIEW WSON DSG 8 3000 TBD Call TI Call TI -40 to 125 INA381A2IDSGT PREVIEW WSON DSG 8 250 TBD Call TI Call TI -40 to 125 INA381A3IDSGR PREVIEW WSON DSG 8 3000 TBD Call TI Call TI -40 to 125 INA381A3IDSGT PREVIEW WSON DSG 8 250 TBD Call TI Call TI -40 to 125 INA381A4IDSGR PREVIEW WSON DSG 8 3000 TBD Call TI Call TI -40 to 125 INA381A4IDSGT PREVIEW WSON DSG 8 250 TBD Call TI Call TI -40 to 125 PINA381A1IDSGR ACTIVE WSON DSG 8 3000 TBD Call TI Call TI -40 to 125 PINA381A2IDSGR ACTIVE WSON DSG 8 3000 TBD Call TI Call TI -40 to 125 PINA381A3IDSGR ACTIVE WSON DSG 8 3000 TBD Call TI Call TI -40 to 125 PINA381A4IDSGR ACTIVE WSON DSG 8 3000 TBD Call TI Call TI -40 to 125 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. 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