Material Content Data Sheet Sales Product Name TLE4678-2LD Issued MA# MA001238828 Package PG-TSON-10-2 25. June 2015 Weight* 31.65 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal non noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon phosphorus zinc iron copper copper carbon black epoxy resin silicondioxide tin silver epoxy resin silver 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-50-8 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 0.689 2.18 0.003 0.01 0.013 0.04 419 0.265 0.84 8382 10.773 34.04 34.93 340358 349264 0.056 0.18 0.18 1763 1763 0.038 0.12 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 2.18 21778 21778 105 1206 1.966 6.21 17.087 53.98 60.31 539865 603201 0.370 1.17 1.17 11693 11693 0.064 0.20 0.20 2030 2030 0.081 0.26 0.244 0.77 62130 2568 1.03 Sum in total: 100.00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 7703 10271 1000000