ALMD-LG37, ALMD-LL37, ALMD-LM37, ALMD-LB37 High Brightness SMT Oval LED Lamps Amber, Red, Green and Blue Data Sheet Description Features The new Avago ALMD-Lx37 Oval LED series has the same or just slightly less luminous intensity than conventional high brightness through holes LEDs. • Well defined spatial radiation pattern The new Oval LED lamps can be assembled using common SMT assembly processes and are compatible with industrial reflow soldering processes. The LEDs are made with an advanced optical grade epoxy for superior performance in outdoor sign applications. The surface mount Oval LEDs are specifically designed for full color / video signs and indoor or outdoor passenger information sign applications. • High brightness material • Available in Red, Amber, Green and Blue color: – Red AlInGaP 626 nm – Amber AlInGaP 590 nm – Green InGaN 525 nm – Blue InGaN 470 nm • JEDEC MSL 2A • Compatible with reflow soldering process • Tinted and diffused lens For easy pick and place assembly, the LEDs are shipped in tape and reel. Every reeled is shipped from a single intensity and color bin except the red color for better uniformity. • Wide viewing angle: 40° x 100° Package Dimensions • Mono color signs C Applications • Full color signs C 4.20 ± 0.20 A A - Anode C - Cathode A 4.20 ± 0.20 Package Marking (Anode Mark) 4.75 ± 0.50 5.20 ± 0.50 3.40 ± 0.50 1.60 ± 0.50 2.50 1.4 (4X) 1.00 Notes: 1. All dimensions in millimeters (inches). 2. Tolerance is ± 0.20 mm unless other specified. 3. Mildsteel leadframe. CAUTION: InGaN devices are Class 1C HBM ESD sensitive, AlInGaP devices are Class 1B ESD sensitive per JEDEC Standard. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details. CAUTION: Customer is advised to always keep the LED in the moisture barrier bag with <5%RH when not in use as prolonged exposure to environment might cause the leads to tarnish or rust, which might cause difficulties in soldering. Device Selection Guide Part Number Color and Dominant Wavelength λd (nm) Typ Luminous Intensity Iv (mcd) [1,2,5] Min Max Viewing Angle Typ - ° [4] ALMD-LG37-XZ002 Red 626 1660 2900 40° x 100° ALMD-LL37-XZ002 Amber 590 1660 2900 40° x 100° ALMD-LM37-24002 Green 525 3500 6050 40° x 100° ALMD-LB37-SU002 Blue 470 660 1150 40° x 100° Notes: 1. The luminous intensity is measured on the mechanical axis of the lamp package and it is tested with pulsing condition. 2. The optical axis is closely aligned with the package mechanical axis. 3. Dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp. 4. θ½ is the off-axis angle where the luminous intensity is half the on-axis intensity. 5. Tolerance for each bin limit is ± 15% Part Numbering System A L M D - x1 x2 x3 x4 - x5 x6 x7 x8 x9 Code Description Option x1 Package type L Oval AlInGaP/InGaN x2 Color B G L M Blue Red Amber Green x3x4 Viewing angle 37 40 x 100° x5 Minimum intensity bin Refer to device selection guide x6 Maximum intensity bin Refer to device selection guide x7 Color bin selection 0 Full distribution x8x9 Packaging option 02 Tested 20mA, 13inch carrier tape 2 Absolute Maximum Rating, TJ = 25 °C Parameter Red and Amber Green Blue Unit 30 20 mA 100 [3] 100 [3] mA 76 mW DC Forward Current [1] 50 Peak Forward Current 100 [2] 120 114 Power Dissipation LED Junction Temperature 110 °C Operating Temperature Range -40 to +85 °C Storage Temperature Range -40 to +100 °C Notes: 1. Derate linearly as shown in Figure 4 and Figure 9. 2. Duty Factor 30%, frequency 1kHz. 3. Duty Factor 10%, frequency 1kHz. Electrical / Optical Characteristics, TJ = 25 °C Parameter Symbol Forward Voltage Red Amber Green Blue VF Reverse Voltage [3] Red & Amber Green & Blue VR Dominant Wavelength [1] Red Amber Green Blue ld Peak Wavelength Red Amber Green Blue Thermal Resistance Red Amber Green Blue Luminous Efficacy [2] Red Amber Green Blue Thermal coefficient of ld Red Amber Green Blue lPEAK RqJ-PIN hV Min. Typ. Max. 1.8 1.8 2.8 2.8 2.1 2.1 3.2 3.2 2.4 2.4 3.8 3.8 5 5 618.0 584.5 519.0 460.0 626.0 590.0 530.0 470.0 634 594 516 464 270 270 270 480 200 490 530 65 0.059 0.103 0.028 0.024 Units Test Conditions V IF = 20 mA V IR = 100 mA IR = 10 mA IF = 20 mA 630.0 594.5 539.0 480.0 nm Peak of Wavelength of Spectral Distribution at IF = 20 mA °C/W LED Junction-to-Pin lm/W Emitted Luminous Power/Emitted Radiant Power nm/°C IF = 20 mA ; +25°C ≤ TJ ≤ +100°C Notes: 1. The dominant wavelength is derived from the chromaticity Diagram and represents the color of the lamp. 2. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = IV/hV where IV is the luminous intensity in candelas and hV is the luminous efficacy in lumens/watt. 3. Indicates product final testing condition. Long term reverse bias is not recommended. 3 AlInGaP 60 1.0 50 Amber FORWARD CURRENT - mA RELATIVE INTENSITY 0.8 Red 0.6 0.4 0.2 0.0 500 550 600 WAVELENGTH - nm MAXIMUM FORWARD CURRENT - mA RELATIVE LUMINOUS INENSITY (NORMALIZED AT 20mA) 2.0 1.5 1.0 0.5 0 10 20 30 40 FORWARD CURRENT - mA 50 60 DOMINANT WAVELENGTH SHIFT - nm 0 0.5 1 1.5 2 FORWARD VOLTAGE - V 2.5 3 Red Amber 10 20 30 40 FORWARD CURRENT - mA 50 RJA = 460 °C/W 40 30 RJA = 660 °C/W 20 10 0 0 20 40 60 80 AMBIENT TEMPERATURE (°C) Figure 4. Maximum Forward Current vs Ambient Temperature Figure 3. Relative Intensity vs Forward Current 50 Figure 5. Relative Dominant Wavelength Shift vs Forward Current 4 10 60 Red Amber 2.5 0 20 Figure 2. Forward Current vs Forward Voltage 3.0 1.2 1 0.8 0.6 0.4 0.2 0 -0.2 -0.4 -0.6 -0.8 30 0 650 Figure 1. Relative Intensity vs Wavelength 0.0 40 60 100 InGaN 1.0 30 Blue 25 FORWARD CURRENT-mA RELATIVE INTENSITY 0.8 Green 0.6 0.4 0.2 430 480 530 WAVELENGTH - nm 580 MAXIMUM FORWARD CURRENT - mA 1.0 0.8 0.6 0.4 0.2 0 5 10 15 20 DC FORWARD CURRENT-mA 25 30 Figure 8. Relative Intensity vs Forward Current 5 0 Blue -5 Green 0 2 FORWARD VOLTAGE-V 3 4 20 40 60 FORWARD CURRENT-mA Figure 10. Dominant Wavelength Shift vs Forward Current 30 Blue 20 Green 10 0 0 20 40 60 AMBIENT TEMPERATURE (°C) 80 Figure 9. Maximum Forward Current vs Ambient Temperature 10 -10 1 40 1.2 0.0 0 Figure 7. Forward Current vs Forward Voltage 1.4 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20mA) 10 0 630 Figure 6. Relative Intensity vs Wavelength RELATIVE DOMINANT WAVELENGTH SHIFT (NORMALIZED AT 20mA) 15 5 0.0 380 5 20 80 100 100 0.8 0.8 NORMALIZED INTENSITY 1 0.6 0.4 Amber Red Green Blue 0.2 0 -90 -60 -30 0 30 ANGULAR DISPLACEMENT - DEGREES 60 Green Blue Red Amber 1 0 -90 -60 -30 0 30 60 ANGULAR DISPLACEMENT - DEGREES 90 0.4 Red Green Blue Amber 0.3 0.2 0.1 0 -0.1 -0.2 -0.3 -20 0 20 40 60 80 TJ - JUNCTION TEMPERATURE (°C) 100 120 -0.4 -40 0.7 2.1 5.2 Note: Recommended stencil thickness is 0.1524mm (6 mils) minimum and above Figure 14. Recommended Soldering Land Pattern -20 0 20 40 60 80 TJ - JUNCTION TEMPERATURE (°C) Figure 13. Forward Voltage Shift vs Junction Temperature 4.0 Figure 12. Relative Intensity Shift vs Junction Temperature 6 Amber Red Green Blue 0.2 Figure 11b. Radiation Pattern for Minor Axis 10 NORMALZIED INTENSITY (PHOTO) 0.4 90 Figure 11a. Radiation Pattern for Major Axis 0.1 -40 0.6 FORWARD VOLTAGE SHIFT - V NORMALIZED INTENSITY 1 100 120 4.00±0.20 0.50±0.10 1.55±0.20 2.00±0.20 1.75±0.20 1.80±0.20 7.50±0.20 2.20±0.20 5.20±0.20 8.00±0.20 16.00±0.30 4.50±0.20 1.60±0.20 4.10±0.20 5.90±0.20 Figure 15. Carrier Tape Dimension ∅100 ± 0.50 16.40 ± 0.20 ∅330 MAX. 13.00 ± 0.20 Figure 16. Reel Dimension 2 anode leads lead unreeling direction Figure 17. Unit Orientation from reel 7 Intensity Bin Limit Table (1.2:1 Iv bin ratio) Bin VF Bin Table (V at 20 mA) for Red & Amber Intensity (mcd) at 20 mA Bin ID Min Max Min Max VD 1.8 2.0 VA 2.0 2.2 VB 2.2 2.4 S 660 800 T 800 960 U 960 1150 V 1150 1380 W 1380 1660 X 1660 1990 Y 1990 2400 Z 2400 2900 1 2900 3500 2 3500 4200 3 4200 5040 4 5040 6050 Tolerance for each bin limit is ± 0.05V Tolerance for each bin limit is ± 15% Red Color Range Green Color Range Min Dom Max Dom Xmin Ymin Xmax Ymax Min Bin Dom Max Dom Xmin 618.0 630.0 0.6872 0.3126 0.6890 0.2943 1 523.0 0.6690 0.3149 0.7080 0.2920 Tolerance for each bin limit is ± 0.5 nm Amber Color Range Min Bin Dom Max Dom Xmin Ymin Xmax Ymax 1 587.0 0.5420 0.4580 0.5530 0.4400 0.5370 0.4550 0.5570 0.4420 0.5570 0.4420 0.5670 0.4250 0.5530 0.4400 0.5720 0.4270 0.5720 0.4270 0.5820 0.4110 0.5670 0.4250 0.5870 0.4130 0.5870 0.4130 0.5950 0.3980 0.5820 0.4110 0.6000 0.3990 2 4 6 584.5 587.0 589.5 592.0 589.5 592.0 594.5 Tolerance for each bin limit is ± 0.5 nm 519.0 2 523.0 527.0 3 527.0 531.0 4 5 531.0 535.0 535.0 539.0 Ymin Xmax Ymax 0.0667 0.8323 0.1450 0.7319 0.1200 0.7375 0.0979 0.8316 0.0979 0.8316 0.1711 0.7218 0.1450 0.7319 0.1305 0.8189 0.1305 0.8189 0.1967 0.7077 0.1711 0.7218 0.1625 0.8012 0.1625 0.8012 0.2210 0.6920 0.1967 0.7077 0.1929 0.7816 0.1929 0.7816 0.2445 0.6747 0.2210 0.6920 0.2233 0.7600 Tolerance for each bin limit is ± 0.5 nm Blue Color Range Min Bin Dom Max Dom Xmin Ymin Xmax Ymax 1 460.0 464.0 0.1440 0.0297 0.1766 0.0966 0.1818 0.0904 0.1374 0.0374 2 464.0 468.0 0.1374 0.0374 0.1699 0.1062 0.1766 0.0966 0.1291 0.0495 0.1291 0.0495 0.1616 0.1209 0.1699 0.1062 0.1187 0.0671 0.1187 0.0671 0.1517 0.1423 0.1616 0.1209 0.1063 0.0945 0.1063 0.0945 0.1397 0.1728 0.1517 0.1423 0.0913 0.1327 3 468.0 472.0 4 472.0 476.0 5 476.0 480.0 Tolerance for each bin limit is ± 0.5 nm 8 Packing Label (i) Mother Label (Available on MBB bag) (1T) Lot: Lot Number STANDARD LABEL LS0002 RoHS Compliant (Q) QTY: Quantity e4 Max Temp 260C MSL 2a LPN: CAT: Intensity Bin (9D)MFG Date: Manufacturing Date BIN: Refer to below information (1P) Item: Part Number (P) Customer Item: (V) Vendor ID: (9D) Date Code: Date Code DeptID: OEAT01 Made In: Country of Origin (ii) Baby Label (Available on Plastic Reel) (1P) PART #: Part Number (1T) Lot #: Lot Number (9D)MFG Date: Manufacturing Date C/0: Country of Origin (1T) TAPE DATE: Taping Date BABY LABEL COSBOO1B V0.0 (Q) QTY: Quantity (9D) Date Code: Date Code CAT Intensity Bin BIN Refer to Below information Note: Acronyms and Definition: Example: BIN: a. Color bin only or VF bin only (i) Color bin only or VF bin only (Applicable for part number with color bins but without VF bin OR part number with VF bins and no color bin) (ii) Color bin incorporated with VF bin Applicable for part number that have both color bin and VF bin BIN: 4 (represent color bin 4 only) BIN: VA (represent VF bin “VA” only) b. Color bin incorporate with VF bin BIN: 4 VA VA: VF bin “VA” 4: Color bin 4 only 9 Soldering Recommended reflow soldering condition: (i) Leaded reflow soldering: (ii) Lead-free reflow soldering: 20 SEC. MAX. 183°C 100-150°C -6°C/SEC. MAX. 3°C/SEC. MAX. 120 SEC. MAX. 60-150 SEC. TIME a. Reflow soldering must not be done more than two times. Do observe necessary precautions for handling a moisture-sensitive device, as stated in the following section. b. Recommended board reflow direction: TEMPERATURE TEMPERATURE 10 to 30 SEC. 240°C MAX. 3°C/SEC. MAX. 217°C 200°C 255 - 260 °C 3°C/SEC. MAX. 6°C/SEC. MAX. 150°C 3 °C/SEC. MAX. 100 SEC. MAX. 60 - 120 SEC. TIME c. Do not apply any pressure or force on the LED during reflow and after reflow when the LED is still hot. d. It is preferred that you use reflow soldering to solder the LED. Use hand soldering only for rework if unavoidable but must be strictly controlled to the following conditions: - Soldering iron tip temperature = 320 °C max. - Soldering duration = 3 sec max. - Number of cycles = 1 only - Power of soldering iron = 50 W max. e. Do not touch the LED body with a hot soldering iron except the soldering terminals as this may damage the LED. f. For de-soldering, it is recommended to use appropriate double head soldering iron. User is advised to confirm beforehand whether the functionality and performance of the LED is affected by hand soldering. 10 PRECAUTIONARY NOTES d. Control of assembled boards 1. Handling precautions For automated pick and place, Avago has tested nozzle size below made with urethane material to be working fine with this LED. However, due to the possibility of variations in other parameters such as pick and place machine maker/model and other settings of the machine, customer is recommended to verify the nozzle selected. Pick & Place nozzle 3.20 4.00 4.00 5.00 Note: 1. Nozzle tip should touch the LED flange during pick and place. 2. Outer dimensions of the nozzle should be able to fit into the carrier tape pocket. 2. Handling of moisture-sensitive device This product has a Moisture Sensitive Level 2a rating per JEDEC J-STD-020. Refer to Avago Application Note AN5305, Handling of Moisture Sensitive Surface Mount Devices, for additional details and a review of proper handling procedures. a. Before use - An unopened moisture barrier bag (MBB) can be stored at <40°C/90%RH for 12 months. If the actual shelf life has exceeded 12 months and the humidity Indicator Card (HIC) indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating. - It is recommended that the MBB not be opened prior to assembly (e.g. for IQC). b. Control after opening the MBB - The humidity indicator card (HIC) shall be read immediately upon opening of MBB. - The LEDs must be kept at <30°C / 60%RH at all times and all high temperature related processes including soldering, curing or rework need to be completed within 672 hours. c. Control for unfinished reel - Unused LEDs must be stored in a sealed MBB with desiccant or desiccator at <5%RH. 11 e. Baking is required if: - The HIC indicator is not BROWN at 10% and is AZURE at 5%. >2.2mm LED flange - If the PCB soldered with the LEDs is to be subjected to other high temperature processes, the PCB need to be stored in sealed MBB with desiccant or desiccator at <5%RH to ensure that all LEDs have not exceeded their floor life of 672 hours. - The LEDs are exposed to condition of >30°C / 60% RH at any time. - The LED floor life exceeded 672hrs. The recommended baking condition is: 60±5ºC for 20hrs. Baking should only be done once. f. Storage - The soldering terminals of these Avago LEDs are silver plated. If the LEDs are being exposed in ambient environment for too long, the silver plating might be oxidized and thus affecting its solderability performance. As such, unused LEDs must be kept in sealed MBB with desiccant or in desiccator at <5%RH. 3. Application precautions a. Drive current of the LED must not exceed the maximum allowable limit across temperature as stated in the datasheet. Constant current driving is recommended to ensure consistent performance. b. LED is not intended for reverse bias. Do use other appropriate components for such purpose. When driving the LED in matrix form, it is crucial to ensure that the reverse bias voltage is not exceeding the allowable limit of the LED. c. Avoid rapid change in ambient temperature especially in high humidity environment as this will cause condensation on the LED. d. If the LED is intended to be used in outdoor or harsh environment, the LED leads must be protected with suitable potting material against damages caused by rain water, oil, corrosive gases etc. It is recommended to have louver or shade to reduce direct sunlight on the LEDs. 4. Eye safety precautions LEDs may pose optical hazards when in operation. It is not advisable to view directly at operating LEDs as it may be harmful to the eyes. For safety reasons, use appropriate shielding or personal protective equipments. DISCLAIMER: Avago’s products and software are not specifically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenenace or direct operation of a nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2015 Avago Technologies. All rights reserved. AV02-4541EN - May 14, 2015