Material Content Data Sheet Sales Product Name BSC028N06NS MA# MA001014854 Package PG-TDSON-8-7 Issued 15. June 2015 Weight* 118.75 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal noble metal organic material plastics inorganic material non noble metal noble metal noble metal non noble metal non noble metal non noble metal inorganic material non noble metal non noble metal inorganic material non noble metal < 10% silicon iron phosphorus copper gold carbon black epoxy resin silicondioxide tin silver silver tin lead iron phosphorus copper iron phosphorus copper 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 7440-31-5 7439-92-1 7439-89-6 7723-14-0 7440-50-8 7439-89-6 7723-14-0 7440-50-8 0.837 0.70 0.038 0.03 wire encapsulation leadfinish plating solder heatspreader heat sink CLIP *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.70 7047 7047 318 0.011 0.01 37.762 31.80 31.84 317999 96 318413 0.045 0.04 0.04 377 377 0.087 0.07 733 6.183 5.21 37.271 31.39 36.67 313868 366668 1.470 1.24 1.24 12378 12378 0.166 0.14 0.14 1394 1394 0.031 0.03 0.024 0.02 1.168 0.98 0.011 0.01 0.003 0.00 11.320 9.53 0.022 0.02 0.007 0.01 22.292 18.77 52067 258 206 1.03 9839 29 9.54 95329 2. 3. 56 18.80 187723 Sum in total: 100.00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption 7a, Lead in high melting temperature type solders. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 95453 188 Important Remarks: 1. 10303 95 187967 1000000