ALM-GN001 GNSS Filter-LNA Front-End Module Data Sheet Description Features Avago Technologies’ ALM-GN001 is an ultra low-noise GNSS front-end module that combines a low-noise amplifier (LNA) with a GNSS FBAR pre-LNA filter. The LNA uses Avago Technologies’ proprietary GaAs Enhancementmode pHEMT process to achieve high gain with very low noise figure and high linearity. Noise figure distribution is very tightly controlled. A CMOS-compatible shutdown pin is included either for turning the LNA on/off, or for current adjustment. The integrated filter utilizes an Avago Technologies’ leading-edge FBAR filter for exceptional rejection at Cellular, DCS, PCS and WLAN band frequencies. Bypass functionality with an external RF switch is possible with separate RF switching. • Operating Temperature Range -40 °C to +85 °C The low noise figure and high gain, coupled with low current consumption make it suitable for use in critical low-power GNSS applications or during low-battery situations. • Meets MSL3, Lead-free and halogen free At 1.575 GHz, Vdd = 2.7 V, Idd = 6 mA Component Image • Gain = 16 dB Surface Mount (2.3 × 1.7 × 0.85) mm3 6-lead DFN Vdd (pin 1) Vsd (pin 2) RFOut (pin 6) GN001 YMXXXX RFin (pin 3) LNA_In (pin 5) Filter_Out (pin 4) TOP VIEW RFOut (pin 6) LNA_In (pin 5) Filter_Out (pin 4) • Exceptional Cell/DCS/PCS/WLAN-Band rejection • Advanced GaAs E-pHEMT & FBAR Technology • Shutdown current : < 1 mA • CMOS compatible shutdown pin (Vsd) • ESD : > 1 kV at RFin pin • 0.85 mm typical thickness • Adjustable bias current via single control voltage pin • Small package dimension: (2.3 × 1.7 × 0.85) mm3 Target Specifications (Typical performance @ 25 °C) • NF = 1.54 dB • IIP3 = 2.5 dBm, IP1dB = -4 dBm • S11 = -8 dB, S22 =-13 dB • Rejection @ 824 – 849 MHz: 58 dBc • Rejection @ 880 – 924 MHz: 56 dBc • Rejection @ 1710 – 1785 MHz: 47 dBc Vdd (pin 1) Gnd (pin 7) • Very Low Noise Figure: 1.54 dB typ. Vsd (pin 2) RFin (pin 3) BOTTOM VIEW Package marking provides orientation and identification: “GN001“ = Product Code “Y” = Year of manufacture “M” = Month of manufacture “XXXX” = Last 4 digits of lot number Attention: Observe precautions for handling electrostatic sensitive devices. ESD Machine Model = 70 V ESD Human Body Model = 300 V Refer to Avago Application Note A004R: Electrostatic Discharge, Damage and Control. • Rejection @ 1850 – 1910 MHz: 51 dBc • Rejection @ 2400 – 2570 MHz: 51 dBc Application • GNSS Front-end Module Application Circuit +Vdd = 2.7 V C1 L2 1 ALM-GN001 6 RFout C3 2 Vsd 5 LNA_In 3 L4 RFin 4 Filter_Out L3 Absolute Maximum Rating [1] TA = 25 °C Symbol Parameter Units Absolute Max. Vdd Device Drain-to-Source Voltage [2] V 4.0 Idd Drain Current [2] mA 15 Pin,max CW RF Input Power (Vdd = 2.7 V, Idd = 6 mA) dBm 15 Pdiss Total Power Dissipation [4] mW 60 Tj Junction Temperature °C 150 TSTG Storage Temperature °C -65 to 150 Thermal Resistance [3] (Vdd = 2.7 V, Idd = 6 mA), Θjc = 107 °C/W Notes: 1. Operation of this device in excess of any of these limits may cause permanent damage. 2. Assuming DC quiescent conditions. 3. Thermal resistance measured using InfraRed measurement technique. 4. Board (module belly) temperature TB is 25 °C. Derate 9.4 mW/°C for TB > 143 °C. Electrical Specifications TA = 25 °C, Freq=1.575 GHz and 1.602 GHz, measured on board, as in Figure 1. Table 1. Performance at Vdd = Vsd = 2.7 V, Idd = 6 mA (R2 = 12 kΩ) nominal operating conditions at 1.575 GHz Symbol at 1.602 GHz Parameter and Test Condition Unit Min. Typ. Max. Min. Typ. Max. G Gain dB 14.2 16.0 18 12.7 14.9 17 NF [1] Noise Figure dB - 1.54 2.2 - 1.84 2.5 IP1dB Input 1dB Compressed Power dBm - -4 - - -4 - IIP3 [2] Input 3rd Order Intercept Point (2-tone at Fc ± 1 MHz) dBm - 2.5 - - 2.5 - S11 Input Return Loss dB - -8 - - -10 - S22 Output Return Loss dB - -13 - - -11 - S12 Reverse Isolation dB - -24 - - -25 - Idd Supply DC current at Shutdown voltage Vsd = 2.7 V mA 2.8 6 10.5 - - - Ish Shutdown Current at Vsd = 0 V µA - 0.5 - - - - B5 / CDMA / GSM850 / B8 / GSM900 Rejection Worst-case relative to 1.575 GHz within (824-924) MHz band, tested at 924 MHz dBc 42 - - - - B3 / GSM1700 Rejection Worst-case relative to 1.575 GHz within (1710-1785) MHz band, tested at 1710 MHz dBc 36 47 - - - - B2 / CDMA1900 / GSM1900 Rejection Worst-case relative to 1.575 GHz within (1850-1910) MHz band, tested at 1850 MHz dBc 42 51 - - - - ISM / WiMax Rejection Worst-case relative to 1.575 GHz within (2400-2570) MHz band, tested at 2400 MHz dBc 42 51 - - - - IP1dB890MHz Input 1 dB gain compression interferer signal level at 890 MHz dBm - > 40 - - - - IP1dB1710MHz Input 1 dB gain compression interferer signal level at 1710 MHz dBm - 38 - - - - IP1dB1850MHz Input 1 dB gain compression interferer signal level at 1850 MHz dBm - 39 - - - - OOB IIP3 [3] Out of Band Input 3rd Order Intercept Point (2-tone at 1712.7 MHz and 1850 MHz) dBm - 48 - - - - Passband Performance Out-of-Band Performance 2 56 Table 2. Performance at Vdd = Vsd = 1.8 V, Idd = 6 mA (R2 = 0 kΩ) nominal operating conditions Symbol Parameter and Test Condition Units at 1.575 GHz (Typ.) G Gain dB 15 NF [1] Noise Figure dB 1.59 IP1dB Input 1dB Compressed Power dBm -9.8 IIP3 [2] Input 3rd Order Intercept Point (2-tone at Fc ± 1 MHz) dBm 2.1 S11 Input Return Loss dB -9 S22 Output Return Loss dB -19 S12 Reverse Isolation dB -23 Idd Supply DC current at Shutdown (SD) voltage Vsd = 1.8 V mA 6 Ish Shutdown Current at Vsd = 0 V µA 0.5 B5 / CDMA / GSM850 / B8 / GSM900 Rejection Worst-case relative to 1.575 GHz within (824-924) MHz band, tested at 924 MHz dBc 55 B3 / GSM1700 Rejection Worst-case relative to 1.575 GHz within (1710-1785) MHz band, tested at 1710 MHz dBc 46 B2 / CDMA1900 / GSM1900 Rejection Worst-case relative to 1.575 GHz within (1850-1910) MHz band, tested at 1850 MHz dBc 50 ISM / WiMax Rejection Worst-case relative to 1.575 GHz within (2400-2570) MHz band, tested at 2400 MHz dBc 50 Passband Performance Out-of-Band Performance Notes: 1. Losses from demoboard de-embedded 2. 1.575 GHz IIP3 test condition: FRF1 = 1574 MHz, FRF2 = 1576 MHz with input power of -20 dBm per tone measured at the worst-case side band 3. 1.575 GHz IIP3 test condition: FRF1 = 1712.7 MHz, FRF2 = 1850 MHz with input power of 10 dBm per tone measured at the worst-case side band 3 Circuit Symbol Size Description L1 0402 22 nH Inductor (Taiyo Yuden HK100522NJ-T) L2 0402 3.9 nH Inductor (Taiyo Yuden HK10053N9S-T) L3 0402 9.1 nH Inductor (Taiyo Yuden HK10059N1J-T) L4 0402 12 nH Inductor (Taiyo Yuden HK100512NJ-T) C1 0402 0.1 µF Capacitor (Murata GRM155R71C104KA88D) C3 0402 15 pF Capacitor (Murata GJM1555C1H150JB01D) C4 0402 6.8 pF Capacitor (Murata GJM1555C1H6R8DB01D) R1 0402 12 Ω Resistor (Kamaya RMC1/16S-120JTH) R2 0402 12 kΩ Resistor (Kamaya RMC1/16SK123FTH) Figure 1. Demoboard and application circuit components table 4 R1 L2 +Vdd = 2.7 V C1 1 2 C4 R2 6 RFout C3 L1 ALM-GN001 Vsd 3 RFin 5 LNA_In L3 4 Filter_Out L4 Figure 2. Application Circuit Notes: 1. RF input match is achieved by a single shunt inductor, L4. It is used to match the module for best NF and S11. 2. The output of the module is matched. 3. Best noise performance is obtained using high-Q wirewound inductors. Low noise figures are also obtainable with standard 0402 chip inductors. 4. C1 is for low frequency stability and C3 is the bypass capacitor for RF matching and linearity. 5. Bias control is achieved by either varying the Vsd voltage with R2, or fixing the Vsd voltage to Vdd and adjusting R2 for the desired current. The component values specified in Table 1 results in 6 mA current drain. Noise figure, Gain and linearity can be further improved by increasing the bias current. 6. L1 and R1 isolates the demoboard from external disturbances during measurement. They are not needed in actual application. Likewise, C4 mitigate the effect of external noise pickup on the Vsd line. This component is not required in actual operation. 7. L3 matches the filter output to the input of the LNA for optimum noise performance. 5 ALM-GN001 Typical Performance Curves at 25 °C 10 8 7 8 5 Idd (mA) Idd (mA) 6 4 3 2 0.0 0.5 1.0 1.5 2.0 Vsd (V) 2.5 3.0 3.5 4.0 Idd (mA) Vdd = Vsd = 2.7 V Vdd = Vsd = 1.8 V 0 5 10 R2 (kohm) 15 Figure 5. Idd vs. R2 for Vdd = Vsd = 2.7 V and Vdd = Vsd = 1.8 V 6 0 0.0 0.5 1.0 1.5 Vsd (V) Figure 4. Idd vs. Vsd for Vdd = 1.8 V, R2 = 0 Ω Figure 3. Idd vs. Vsd for Vdd = 2.7 V, R2 = 12 kΩ 10 9 8 7 6 5 4 3 2 1 0 4 2 1 0 6 20 2.0 2.5 3.0 ALM-GN001 Typical Performance Curves at 25 °C Unless otherwise stated, all measurements were made with the demoboard and components on Fig 1 at Vdd = Vsd = 2.7 V, Idd = 6 mA, R2 = 12 kΩ 10 5 10 5 0 0 0 -10 -5 -10 -5 -20 -10 -20 -10 -30 -15 -30 -15 -40 -20 -40 -50 -25 -50 10 Gain (dB) 0 -28 -36 -30 S21 (dB) S21 (dB) -38 -40 -42 0.82 0.84 0.86 0.88 Freq (GHz) 0.90 0.92 0.94 Figure 6c. S21 plot for (800-940) MHz -32 S21 (dB) -34 -34 -36 -38 2.45 2.50 Freq (GHz) Figure 6e. S21 plot for (2400 – 2600) MHz -38 1.70 1.75 1.80 1.85 Freq (GHz) Figure 6d. S21 plot for (1700 – 1950) MHz -30 7 -32 -36 -44 -40 2.40 -25 Figure 6b. Passband response of typical S-Parameter Plot -34 -46 0.80 -20 Gain S11 S22 -30 -60 1.50 1.52 1.54 1.56 1.58 1.60 1.62 1.64 1.66 Freq (GHz) -60 -30 0.0 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 3.6 4.0 Freq (GHz) Figure 6a. Typical S-Parameter Plot S11 / S22 (dB) 20 S11 / S22 (dB) 10 Gain S11 S22 Gain (dB) 20 2.55 2.60 1.90 1.95 6 -2 4 -4 2 -6 0 IIP3 (dBm) IP1dB (dBm) 0 -8 -10 4 mA 5.5 mA 8 mA 10 mA -12 -14 -16 1.8 2.0 2.2 2.4 2.6 2.8 Vdd (V) 3.0 3.2 -8 3.4 19 18 18 17 17 16 Gain (dB) Gain (dB) -10 19 15 25 °C - 40 °C 85 °C 14 12 3 4 4 mA 5.5 mA 8 mA 10 mA 1.8 2.0 2.2 2.4 2.6 2.8 Vdd (V) 3.0 3.2 3.4 Figure 8. IIP3 vs. Vdd 13 5 6 Idd (mA) 7 8 9 16 15 14 25 °C - 40 °C 85 °C 13 12 10 Figure 9. [email protected] GHz vs. Idd 3 4 5 6 7 8 9 10 7 Idd (mA) 8 9 10 Idd (mA) Figure 10. [email protected] GHz vs. Idd -50 -46 -52 25 °C - 40 °C 85 °C -54 Rejection (dBc) Rejection (dBc) -4 -6 Figure 7. IP1dB vs. Vdd -56 25 °C - 40 °C 85 °C -48 -50 -58 -60 3 4 5 6 7 Idd (mA) 8 Figure 11. Rejection at 924 MHz relative to 1.575 GHz vs. Idd 8 -2 9 10 -52 3 4 5 6 Figure 12. Rejection at 1710 MHz relative to 1.575 GHz vs. Idd -50 -52 -52 Rejection (dBc) Rejection (dBc) -50 -54 -56 25 °C - 40 °C 85 °C -58 -60 3 4 -56 5 6 7 Idd (mA) 8 9 -60 10 3 4 5 6 7 Idd (mA) 8 10 2.6 2.4 2.4 25 °C - 40 °C 85 °C 2.2 2.2 NF (dB) 2.0 1.8 1.6 2.0 1.8 1.6 1.4 1.4 1.2 1.2 3 4 5 6 7 Idd (mA) 8 9 10 1.0 25 °C - 40 °C 85 °C 3 4 5 6 7 Idd (mA) 8 Figure 15. [email protected] GHz vs. Idd Figure 16. [email protected] GHz vs. Idd Figure 17. Edwards-Sinsky Output Stability Factor (Mu) Figure 18. Edwards-Sinsky Input Stability Factor (Mu’) 9 9 Figure 14. Rejection at 2400 MHz relative to 1.575 GHz vs. Idd 2.6 1.0 25 °C - 40 °C 85 °C -58 Figure 13. Rejection at 1850 MHz relative to 1.575 GHz vs. Idd NF (dB) -54 9 10 ALM-GN001 Typical Performance Curves at 25 °C Unless otherwise stated, all measurements were made with the demoboard and components on Figure 1 at Vdd = Vsd = 1.8 V, Idd = 6 mA, R2 = 0 Ω 10 5 10 5 0 0 0 -10 -5 -10 -5 -20 -10 -20 -10 -30 -15 -30 -15 -40 -20 -40 -50 -25 -50 10 Gain (dB) 0 -20 Gain S11 S22 -25 -30 -60 1.50 1.52 1.54 1.56 1.58 1.60 1.62 1.64 1.66 Freq (GHz) -60 -30 0.0 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 3.6 4.0 Freq (GHz) Figure 19a. Typical S-Parameter Plot S11 / S22 (dB) 20 S11 / S22 (dB) 10 Gain S11 S22 Gain (dB) 20 Figure 19b. Passband response of typical S-Parameter Plot -36 -26 -28 -38 -40 S21 (dB) S21 (dB) -30 -42 -38 0.86 0.88 Freq (GHz) Figure 19c. S21 plot for (800-950) MHz 0.82 0.84 0.90 0.92 0.94 -32 -33 S21 (dB) -34 -35 -36 -37 -38 -39 -40 2.40 2.45 2.50 Freq (GHz) Figure 19e. S21 plot for (2400 – 2600) MHz 10 -34 -36 -44 -46 0.80 -32 2.55 2.60 -40 1.70 1.75 1.80 1.85 Freq (GHz) Figure 19d. S21 plot for (1700 – 1950) MHz 1.90 1.95 18 17 17 16 16 15 15 14 14 Gain (dB) Gain (dB) 18 13 12 25 °C - 40 °C 85 °C 11 10 4 3 5 Idd (mA) 6 7 13 12 11 10 8 Figure 20. [email protected] GHz vs. Idd 3 4 5 Idd (mA) 6 7 8 Figure 21. [email protected] GHz vs. Idd -50 -46 -54 Rejection (dBc) 25 °C - 40 °C 85 °C -52 Rejection (dBc) 25 °C - 40 °C 85 °C -56 25 °C - 40 °C 85 °C -48 -50 -58 -60 3 4 5 Idd (mA) 6 7 8 -50 -50 -52 -52 -54 -56 25 °C - 40 °C 85 °C -58 -60 3 4 5 Idd (mA) 6 7 4 5 Idd (mA) 6 7 8 -54 -56 25 °C - 40 °C 85 °C -58 Figure 24. Rejection at 1850 MHz relative to 1.575 GHz vs. Idd 11 3 Figure 23. Rejection at 1710 MHz relative to 1.575 GHz vs. Idd Rejection (dBc) Rejection (dBc) Figure 22. Rejection at 924 MHz relative to 1.575GHz vs. Idd -52 8 -60 3 4 5 Idd (mA) 6 7 Figure 25. Rejection at 2400 MHz relative to 1.575 GHz vs. Idd 8 2.6 2.6 2.4 25 °C - 40 °C 85 °C 2.0 2.0 1.8 1.6 1.8 1.6 1.4 1.4 1.2 1.2 1.0 3 4 5 Idd (mA) 6 7 25 °C - 40 °C 85 °C 2.2 NF (dB) NF (dB) 2.2 2.4 8 1.0 3 4 5 Idd (mA) 6 Figure 26. [email protected] GHz vs. Idd Figure 27. [email protected] GHz vs. Idd Figure 28. Edwards-Sinsky Output Stability Factor (Mu) Figure 29. Edwards-Sinsky Input Stability Factor (Mu’) 12 7 8 ALM-GN001 Scattering Parameter and Measurement Reference Planes Vsd C4 +Vdd=2.7V C1 L1 R1 R2 C3 L2 1 2 Port 1 3 ALM-GN001 REFERENCE PLANE 6 Port 2 5 LNA_In 4 L3 Filter_Out REFERENCE PLANE Figure 30. Circuit used for measuring small-signal and noise parameters of packaged part. Data is de-embedded to reference planes as shown. Component values are as detailed in Figure 1. 13 The S- and Noise Parameters are measured using a coplanar waveguide PCB with 10 mils Rogers® RO4350. Figure 30 shows the input and output reference planes. The circuit values are as indicated in Figure 1. ALM-GN001 Typical Scattering Parameters at 25 °C, Vdd = 2.7 V, Idd = 6 mA Freq (GHz) Mag. Ang. Mag. Ang. Mag. Ang. Mag. Ang. 0.05 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.825 0.9 1.0 1.1 0.00 -0.02 -0.03 -0.04 -0.09 -0.10 -0.12 -0.13 -0.14 -0.14 -0.15 -0.16 -0.21 -2.95 -5.69 -11.33 -17.02 -22.75 -28.39 -33.92 -39.56 -45.20 -46.63 -50.96 -56.90 -61.06 -84.67 -62.93 -54.44 -48.77 -45.45 -43.43 -42.66 -42.99 -43.46 -43.30 -41.73 -38.19 -35.23 106.69 -35.08 -55.74 -71.22 -86.71 -99.38 -112.02 -116.61 -109.74 -105.37 -93.79 -91.75 -93.26 -87.10 -75.02 -86.43 -73.28 -69.87 -66.93 -63.92 -61.38 -59.49 -58.53 -56.74 -54.05 -51.39 -52.96 20.90 135.37 114.09 97.21 80.99 72.24 63.09 52.46 48.70 40.99 28.08 18.60 -3.97 -3.97 -3.98 -4.02 -4.20 -4.29 -4.37 -4.36 -4.21 -4.16 -3.96 -3.80 -3.52 -3.09 -6.31 -12.84 -19.42 -26.34 -33.05 -39.43 -45.75 -52.88 -54.84 -61.44 -72.42 -83.56 1.2 1.3 1.4 1.5 1.565 1.575 1.6 1.605 1.7 1.8 1.885 1.9 2.0 2.1 2.2 2.3 2.4 2.5 3.0 3.5 4.0 4.5 5.0 6.0 7.0 8.0 9.0 10.0 11.0 12.0 13.0 14.0 15.0 16.0 17.0 18.0 19.0 20.0 -0.22 -0.26 -0.34 -0.85 -17.91 -6.90 -10.73 -10.38 -0.29 -0.29 -0.30 -0.31 -0.34 -0.38 -0.43 -0.49 -0.56 -0.64 -1.55 -7.96 -1.73 -1.03 -0.89 -0.98 -1.11 -4.52 -3.02 -1.05 -0.94 -1.03 -2.32 -3.90 -2.68 -3.37 -1.86 -1.58 -2.34 -3.96 -67.91 -75.81 -86.72 -108.68 38.07 -82.36 -35.47 -81.98 -65.12 -82.52 -91.23 -92.58 -100.68 -108.17 -115.35 -122.46 -129.59 -137.02 177.92 33.13 -136.65 -178.98 154.69 119.36 80.31 24.75 105.79 65.41 41.50 23.95 7.16 8.48 4.92 -8.71 -17.27 -26.97 -35.06 -58.58 -32.33 -30.24 -30.67 -24.48 16.24 15.96 16.35 15.52 -36.25 -35.36 -33.51 -32.86 -30.33 -30.07 -30.80 -31.95 -33.33 -34.88 -37.18 -35.79 -33.52 -27.60 -24.80 -22.05 -17.36 -12.09 -15.55 -19.24 -24.48 -29.19 -32.35 -30.17 -29.74 -39.80 -42.25 -37.68 -33.41 -30.89 -102.54 -116.68 -124.94 -66.49 -110.31 177.23 11.35 -27.44 169.11 154.97 172.21 172.50 159.79 143.52 130.68 121.13 114.76 111.89 138.77 80.59 -158.73 161.31 133.97 89.45 41.03 -23.95 -136.30 176.72 96.48 47.31 -37.87 150.27 49.48 21.62 -0.01 94.24 69.81 43.44 -48.17 -44.44 -40.24 -35.50 -22.32 -23.86 -24.19 -23.85 -46.66 -44.13 -44.93 -45.15 -46.68 -46.76 -46.13 -45.25 -44.67 -44.19 -42.02 -39.45 -37.59 -36.40 -35.47 -34.32 -30.67 -24.52 -24.62 -22.17 -22.07 -23.33 -20.74 -19.46 -24.24 -29.61 -35.64 -33.28 -31.13 -29.57 3.24 -17.09 -46.19 -95.74 -167.16 124.01 -45.27 -84.09 -114.00 -146.08 -164.11 -166.93 -173.97 -174.81 -179.04 175.30 168.39 158.42 107.31 -25.93 -163.26 152.87 127.17 96.11 65.72 19.38 -103.92 128.79 -25.96 -89.92 -156.70 121.79 58.74 35.55 21.84 65.02 39.25 29.65 -3.30 -3.10 -2.80 -1.54 -10.17 -18.48 -12.33 -11.04 -4.40 -2.70 -3.24 -3.51 -6.09 -8.91 -10.45 -10.59 -10.10 -9.47 -7.19 -5.86 -4.90 -4.17 -3.57 -2.71 -1.72 -0.96 -0.91 -4.75 -1.62 -0.40 -0.42 -0.66 -1.10 -0.95 -0.59 -0.47 -0.46 -0.60 -102.42 -129.98 -173.09 114.18 23.96 42.06 38.68 46.7 44.06 -5.48 -37.99 -42.85 -65.86 -72.06 -67.56 -62.16 -60.07 -60.71 -76.90 -95.05 -111.52 -126.46 -140.83 -170.78 157.82 132.78 112.35 78.33 109.91 77.39 56.87 45.71 41.50 33.05 19.73 12.75 3.67 -10.38 14 S11 S21 S12 S22 ALM-GN001 Typical Scattering Parameters at 25 °C, Vdd = 1.8 V, Idd = 6 mA Freq (GHz) 0.05 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.8275 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.565 1.575 1.6 1.605 1.7 1.8 1.885 1.9 2.0 2.1 2.2 2.3 2.4 2.5 3.0 3.5 4.0 4.5 5.0 6.0 7.0 8.0 9.0 10.0 11.0 12.0 13.0 14.0 15.0 16.0 17.0 18.0 19.0 20.0 15 S11 S21 S12 S22 Mag. Ang. Mag. Ang. Mag. Ang. Mag. Ang. -0.01 -0.02 -0.03 -0.04 -0.09 -0.10 -0.12 -0.13 -0.14 -0.14 -0.15 -0.16 -0.21 -0.22 -0.26 -0.34 -0.86 -15.95 -6.45 -9.60 -9.69 -0.29 -0.29 -0.30 -0.31 -0.34 -0.38 -0.43 -0.49 -0.57 -0.64 -1.56 -7.98 -1.74 -1.04 -0.91 -1.65 -1.17 -4.78 -2.94 -1.15 -0.95 -1.15 -2.45 -3.74 -3.26 -2.35 -1.59 -1.47 -2.25 -3.96 -2.90 -5.72 -11.34 -17.02 -22.76 -28.39 -33.94 -39.58 -45.19 -46.64 -50.97 -56.90 -61.04 -67.88 -75.78 -86.67 -108.65 38.68 -84.89 -41.92 -89.13 -65.08 -82.48 -91.19 -92.53 -100.61 -108.08 -115.26 -122.36 -129.50 -136.90 178.08 32.77 -136.45 -178.93 154.29 123.18 82.58 25.47 105.37 67.55 42.55 25.18 10.48 8.86 6.43 -2.50 -17.07 -26.07 -33.83 -57.18 -89.76 -64.10 -54.68 -50.02 -46.48 -44.61 -43.93 -44.27 -44.74 -44.44 -43.02 -39.42 -36.42 -33.56 -31.55 -31.83 -25.11 15.09 14.75 14.96 14.21 -37.16 -35.52 -33.82 -33.28 -31.26 -31.16 -31.92 -32.99 -34.27 -35.60 -38.75 -40.83 -32.30 -28.23 -26.40 -17.57 -16.25 -11.90 -16.36 -27.80 -22.95 -29.00 -32.88 -26.20 -30.15 -32.03 -40.70 -37.98 -33.69 -31.14 -43.54 -36.48 -62.25 -76.83 -89.55 -102.18 -112.43 -117.84 -109.66 -105.97 -93.07 -91.06 -92.49 -101.59 -115.08 -120.91 -66.05 -111.01 176.60 11.21 -26.72 -179.54 160.12 171.57 171.09 158.30 143.06 131.28 122.50 116.47 112.95 126.35 42.97 -153.18 167.16 142.50 108.37 42.63 -22.96 -136.52 -148.36 125.22 52.10 -76.63 136.31 51.20 21.22 16.62 71.92 62.48 40.72 -70.24 -84.70 -84.22 -74.13 -72.15 -66.40 -64.78 -61.33 -59.23 -58.32 -56.48 -53.86 -50.73 -47.38 -43.69 -39.75 -35.20 -21.58 -23.14 -23.04 -22.79 -43.95 -42.49 -44.02 -44.49 -46.38 -46.37 -45.73 -45.06 -44.45 -44.37 -42.96 -37.92 -37.30 -38.41 -40.21 -21.32 -25.65 -22.93 -26.22 -29.65 -24.78 -22.79 -19.42 -18.36 -24.65 -28.49 -34.83 -33.50 -31.48 -30.02 89.83 113.65 37.14 94.24 80.29 70.11 61.54 55.93 49.04 45.09 36.19 25.50 17.11 2.21 -18.60 -46.39 -94.63 -168.67 121.53 -46.33 -83.88 -108.72 -144.74 -164.11 -166.38 -170.25 -170.03 -174.06 178.05 171.00 159.98 99.53 -39.37 -156.18 168.47 168.39 120.24 57.09 18.99 -94.09 -26.56 -45.57 -103.38 -170.80 111.33 50.57 26.15 28.66 52.12 34.45 28.28 -3.98 -3.97 -3.98 -4.02 -4.20 -4.29 -4.36 -4.35 -4.21 -4.16 -3.97 -3.83 -3.60 -3.47 -3.44 -3.42 -2.25 -11.5 -21.62 -14.75 -13.31 -5.09 -2.85 -3.39 -3.69 -6.53 -9.48 -11.00 -11.04 -10.46 -9.77 -7.34 -5.94 -4.95 -4.19 -3.56 -3.34 -1.79 -1.00 -0.97 -2.63 -2.07 -0.43 -0.55 -0.75 -0.99 -0.79 -0.53 -0.41 -0.47 -0.68 -3.02 -6.31 -12.81 -19.39 -26.27 -32.96 -39.33 -45.67 -52.75 -54.68 -61.29 -72.14 -83.11 -101.64 -128.52 -170.76 115.18 15.83 27.23 29.55 42.96 45.43 -7.41 -42.25 -47.37 -70.48 -75.41 -69.53 -63.41 -60.99 -61.56 -77.49 -95.58 -112.19 -127.33 -142.06 -169.93 158.67 133.30 113.08 90.38 112.23 77.33 56.85 46.60 42.83 33.26 19.57 12.65 3.51 -10.73 ALM-GN001 Typical Noise Parameters at 25 °C, Freq = 1.575 GHz, Vdd = 2.7 V, Idd = 6 mA Freq = 1.575 GHz, Vdd = 1.8 V, Idd = 6 mA Freq NFmin GAMMA OPT Freq NFmin (GHz) (dB) Mag Ang 1.565 1.85 0.218 124.4 1.575 1.39 0.099 1.602 1.57 0.188 GAMMA OPT Rn/50 (GHz) (dB) Mag Ang Rn/50 0.1898 1.565 1.91 0.208 121.5 0.1978 40.3 0.1792 1.575 1.41 0.130 45.7 0.1928 28.3 0.2350 1.602 1.61 0.170 38.6 0.2446 Note: The exceptional noise figure performance of the ALM-GN001 is due to its highly optimized design. Figure 30 shows the circuit and reference planes for the measurement. 16 Ordering Information Part Number No. of Devices Container ALM-GN001-TR1G 3000 7" Reel ALM-GN001-BLKG 100 Anti-static Bag Package Dimensions C'fer 0.15 × 45° 0.85 ± 0.05 2.30 ± 0.05 GN001 YMXXXX Pin1 0.20 ref. 1.70 ± 0.05 0.275 1.47 0.31 1.28 0 -0.05 TOP VIEW 0.54 Bsc SIDE VIEW BOTTOM VIEW Notes: 1. All dimensions are in millimeters. 2. Dimensions are inclusive of plating. 3. Dimensions are exclusive of mold flash and metal burr. PCB Land Patterns and Stencil Design TOP VIEW Pin1 1.990 0.279 1.029 0.275 0.310 1.470 1.355 0.540 Pin1 0.248 2.300 1.990 1.280 0.896 Land Pattern Stencil Opening 1.990 1.280 Pin1 1.029 1.470 0.896 Combination of Land Pattern & Stencil 17 Notes: 1. All dimensions are in millimeters. 2. Recommended 4 mil stencil thickness. 3. All tolerances for the dimensions of the land pattern are ± 50 µm. Device Orientation REEL UserFeed Direction GN001 YMXXXX USER FEED DIRECTION GN001 YMXXXX CARRIER TAPE Top View COVER TAPE Tape Dimensions 4.0 ± 0.10 2.00 ± 0.05 4.0 ± 0.10 ø 1.50 + 0.10 1.75 ± 0.10 5.50 ± 0.05 12.00 +0.30 –0.10 ø 1.00 ± 0.05 .28 ± 0.02 9° MAX 9° MAX 1.25 ± 0.10 A. Note: All dimensions are in millimeters 18 K. 2.58 ± 0.10 B. End View Reel Dimensions (7” reel) 6.25mm EMBOSSED LETTERS LETTERING THICKNESS: 1.6mm SLOT HOLE "a" SEE DETAIL "X" Ø178.0±0.5 SLOT HOLE "b" FRONT BACK 6 PS SLOT HOLE(2x) 180° APART. SLOT HOLE "a": 3.0±0.5mm(1x) SLOT HOLE "b": 2.5±0.5mm(1x) FRONT VIEW 45° 1.5 MIN. +1.5* -0.0 +0.5 Ø13.0 -0.2 Ø20.2 MIN. 45° EMBOSSED RIBS RAISED: 0.25mm, WIDTH: 1.25mm BACK VIEW 19 BACK Ø55.0±0.5 FRONT Ø178.0±0.5 Ø51.2±0.3 SEE DETAIL "Y" 18.0* MAX. DETAIL "X" Ø178.0±0.5 R5.2 ° R10.65 120 65° 12.4 3.5 DETAIL "Y" (Slot Hole) 1.0 6 PS RECYCLE LOGO Solder Paste recommendation The soldering and reflow profile recommended is from JEDEC standard JSTD020D-01. Refer to the JEDEC standard for latest updates. The recommended solder for mounting surface mount package is Sn63 (63% SN 37% Pb) because it is a eutectic compound with a melting point (183 °C) not high enough to exceed the standard operating limit of the devices. Furthermore, it is low enough to avoid damaging circuitry during solder reflow operations. The recommended lead free solder for SMT reflow is Sn-Ag-Cu (95.5% Tin/3.8% Silver/0.7% Copper). This lead free solder paste has a melting point of 217 °C (423 °F), the ternary eutectic of Sn-Ag-Cu system, giving it the advantage of being the lowest melting lead free alternative. This temperature is still low enough to avoid damaging the internal circuitry during solder reflow operations provided the time of exposure at peak reflow temperature versus time is shown in Figure 31. The solder paste used in this evaluation is RX 303-92 SK HO(S) by Nihon Handa. Profile in Figure 31 is recommended in automated reflow process to ensure reliable finished joints. However, profile will vary among different solder paste from different manufacturers. Other factors that may affect the profile includes the density and type of components on the board, type of solder and type of board or substrate material being used. The profile shows the actual temperature that should occur on the surface of a test board at or near a central solder joint. During this type of reflow soldering, the circuit board and solder joints tend to heat first. The components on the board are then heated by conduction. The circuit because it has a large surface area, absorbs thermal energy more efficiently, and then distributes this heat to the components. Reflow temperature profiles designed for tin/ lead alloys will need to be revised accordingly to cater for the melting point of the lead free solder being 34 °C (93 °F) higher than that of tin / lead eutectic or near eutectic alloys. Outlined in the following is a typical convection reflow lead-free profile. However, this should only be taken as a guideline from which to start. Temp (°C) 300 Peak (Tp) = 260°C +0°C/-5°C 250 Melting point = 217°C/s 200 150 Rampdown = <6°C/sec 100 60 sec ~ 120 sec 50 60 sec ~ 120 sec 0 1 min 2 min 3 min Time (mins) Figure 31. Recommended reflow profile 20 4 min 5 min 6 min Remarks Ramp Max slope for this zone is limited to 2 °C/ sec. Higher than 2 °C may result in excessive solder balling and slump. Preheat Preheating setting is usually calculated from 100 °C to 150 °C with typical time setting of between 70 and100 seconds. If possible, do not preheat beyond the time setting recommended to prevent excessive oxidation to the solder surface. Reflow The peak reflow temperature is calculated by adding ~30 °C to the melting point of the solder alloy 92 SK, which melts at 217 °C. The peak reflow temperature is 217 °C +30 °C =247 °C (-0 °C+5 °C). The time at peak is not critical and usually not measured as it is very dependent on the type of oven used. Time over 217 °C is however critical as it will determine the appearance of the solder joints after reflow. Typical time over 217 °C for solder alloy 92 is from 40 to 60 seconds. Longer reflow time may result in dull and gritty solder joints and charring of flux residues. Time below 30 seconds may result in insufficient wetting and poor inter-metallic formation. Cooling Max slope for cooling is limited to 4 °C/sec. Cooling at a faster rate may result in cracked solder joints. Slower cooling may result in dull solder joints. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2014 Avago Technologies. All rights reserved. AV02-4468EN - July 21, 2014