BF122M Order Code: BF122M Version: A0 2013-10-30 Gas Discharge Tube Features Exterior Small Size Design 4.2×5.0×5.0mm Current Handling Capability 3,000A @ 8/20μs Low Capacitance and Insertion Loss Fast Response and Long Service Life Moisture sensitivity level：Level 1 SMD Application information Package (Top View) AC Power ` 1 Agency Approvals 2 Schematic Symbol Icon Description Compliance with 2011/65/EU 2 1 Compliance with IEC61249-2-21:2003 Mean lead free UL Certificated E232249 Electrical Parameter DC Breakdown Voltage 1)2) Impulse Spark-over Voltage 100V/s 960-1440 V At 1kV/μs for 99 % of measured values 2000 At 1kV/μs Typical values of distribution 1900 V V Impulse Discharge Current 3) 8/20μs 3,000 A Arc Voltage At 1A ~15 V Insulation Resistance DC=100V ≥1 GΩ Capacitance at 1MHz VDC=0.5V ≤1.0 pF Weight ~0.5 g Operating And Storage Temperature -40-90 ℃ Marking Without 1) At delivery AQL 0.65 level II GB/T 2828.1-2003 2) In ionized mode 3) Terms and waveforms in accordance with ITU-T Rec. K. 12; IEC 61643-21 1/3 www.bencent.com.cn Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications BF122M Order Code: BF122M Version: A0 2013-10-30 Gas Discharge Tube Product Characteristics Part Numbering System BF 122 M (1) (2) (3) (1)Bencent Gas Discharge Tube (2) Series: DC Breakdown Voltage, e.g.：122=12×102=1200V (3) Tolerance of DC Breakdown Voltage, M=+-20%, Lead Material Copper Body Material Ceramics Terminal Finish 100% Matte-Tin Plated N=+-30%,the Specific tolerance is decided by the table of“Electrical Parameter” Environmental Reliability Characteristics Testing items Technical standards Temperature: 85℃ Time:2H Temperature: -40℃ Time:2H Frequency：10-500Hz Amplitude：0.15mm Time：45min Temperature: 260±5℃ Time of dip soldering：10s，1time High Temperature Storage Test Low Temperature Storage Test Vibration Resistance of soldering heat Note: Up-screen program can be specified by customer’s request via contacting Bencent service Solderability test Solderability Solder Pot Temperature: 245℃±5℃ Solder Dwell Time: 4-6 seconds Product Dimensions D A C REF mm inch A 0.5±0.1 0.020±0.004 B 4.2±0.3 0.165±0.012 C 5.0±0.2 0.197±0.008 D 5.0±0.2 0.197±0.008 REF mm inch A 4.95 0.195 B 3.0 0.118 C 5.5 0.217 B Recommended Soldering Pad A B C 2/3 www.bencent.com.cn Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications BF122M Order Code: BF122M Version: A0 2013-10-30 Gas Discharge Tube Reflow Profile Reflow Condition Heat Temperature Min 150°C Temperature Max 200°C Time （min to max） 60 – 180 secs Average ramp up rate（Liquids）Tamp （TL） to peal TS(max) to TL - Ramp-up Rate 3°C/second max - Temperature (TL) - Temperature (TL) Peak Temperature (TP) 217°C 60 – 150 seconds tS 25 Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C 3/3 Reel Ramp-down Preheat TS(min) ~10 seconds Temperature (tp) Package TL TS(max) 260+0/-5 °C Time within 5°C of actual peak Critical Zone TL to TP Ramp-up TL 3°C/second max (Liquids) Reflow tP TP Temperature Pre Pb-Free assembly Time time to peak temper ature Information REF mm inch A 5.3±0.1 0.209±0.004 B 4.5±0.2 0.177±0.008 d Φ1.5±0.1 Φ0.059±0.004 P0 4.0±0.1 0.157±0.004 P1 2.0±0.1 0.079±0.004 P 12.0±0.1 0.472±0.004 E 1.75±0.1 0.069±0.004 F 7.5±0.1 0.295±0.004 W 16.0±0.3 0.630±0.012 D Φ330.0 Φ13.0 D1 Φ50Min Φ1.97Min D2 Φ13±0.5 0.512±0.020 W1 16.8±2.0 0.661±0.079 Outline Reel (PCS) Per Carton (PCS) Reel Diameter (mm) TAPING 1,000 16,000 330 www.bencent.com.cn Carton Size(mm) L W H 360 360 380 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications