JMNIC BAP64-03 2015 Silicon pin diode Datasheet

DISCRETE SEMICONDUCTORS
DATA SHEET
dbook, halfpage
M3D049
BAP64-03
Silicon PIN diode
Product specification
Supersedes data of 1999 Jul 01
1999 Aug 27
Philips Semiconductors
Product specification
Silicon PIN diode
BAP64-03
FEATURES
PINNING
• High voltage, current controlled
PIN
DESCRIPTION
• RF resistor for RF attenuators and switches
1
cathode
• Low diode capacitance
2
anode
• Low diode forward resistance
• Low series inductance
• For applications up to 3 GHz.
handbook, halfpage
1
2
APPLICATIONS
• RF attenuators and switches.
MAM406
DESCRIPTION
Marking code: A3.
Planar PIN diode in a SOD323 very small plastic SMD
package.
Fig.1 Simplified outline (SOD323) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VR
continuous reverse voltage
−
175
V
IF
continuous forward current
−
100
mA
Ptot
total power dissipation
−
500
mW
Tstg
storage temperature
−65
+150
°C
Tj
junction temperature
−65
+150
°C
1999 Aug 27
Ts = 90 °C
2
Philips Semiconductors
Product specification
Silicon PIN diode
BAP64-03
ELECTRICAL CHARACTERISTICS
Tj = 25 °C unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
TYP.
MAX.
UNIT
VF
forward voltage
IF = 50 mA
0.95
1.1
V
IR
reverse current
VR = 175 V
−
10
µA
VR = 20 V
−
1
µA
Cd
rD
diode capacitance
diode forward resistance
τL
charge carrier life time
LS
series inductance
VR = 0; f = 1 MHz
0.48
−
pF
VR = 1 V; f = 1 MHz
0.35
−
pF
VR = 20 V; f = 1 MHz
0.23
0.35
pF
IF = 0.5 mA; f = 100 MHz; note 1
20
40
Ω
IF = 1 mA; f = 100 MHz; note 1
10
20
Ω
IF = 10 mA; f = 100 MHz; note 1
2
3.8
Ω
IF = 100 mA; f = 100 MHz; note 1
0.7
1.35
Ω
when switched from IF = 10 mA to
IR = 6 mA; RL = 100 Ω; measured at
IR = 3 mA
1.55
−
µs
1.68
−
nH
Note
1. Guaranteed on AQL basis: inspection level S4, AQL 1.0.
THERMAL CHARACTERISTICS
SYMBOL
Rth j-s
1999 Aug 27
PARAMETER
thermal resistance from junction to soldering point
3
VALUE
UNIT
120
K/W
Philips Semiconductors
Product specification
Silicon PIN diode
BAP64-03
GRAPHICAL DATA
MCD773
102
handbook, halfpage
MCD774
500
Cd
handbook, halfpage
rD
(Ω)
(fF)
400
10
300
200
1
100
10−1
10−1
10
1
IF (mA)
0
102
4
0
f = 1 MHz; Tj = 25 °C.
Fig.2
Fig.3
Forward resistance as a function of forward
current; typical values.
MCD775
0
12
16
20
VR (V)
f = 100 MHz; Tj = 25 °C.
handbook, halfpage
S 2
8
Diode capacitance as a function of reverse
voltage; typical values.
MCD776
0
handbook, halfpage
(1)
21
(dB)
−1
(2)
S21 2
(dB)
(3)
−10
(4)
−2
−3
−20
−4
−5
0.5
(1) IF = 100 mA.
(2) IF = 10 mA.
1
1.5
2
2.5
f (GHz)
−30
0.5
3
2
2.5
3
(3) IF = 1 mA.
(4) IF = 0.5 mA.
Diode zero biased and inserted in series with a 50 Ω stripline circuit.
Tamb = 25 °C.
Insertion loss (|S21|2) of the diode as a
function of frequency; typical values.
1999 Aug 27
1.5
f (GHz)
Diode inserted in series with a 50 Ω stripline circuit
and biased via the analyzer Tee network.
Tamb = 25 °C.
Fig.4
1
Fig.5
4
Isolation (|S21|2) of the diode as a function of
frequency; typical values.
Philips Semiconductors
Product specification
Silicon PIN diode
BAP64-03
PACKAGE OUTLINE
SOD323
Plastic surface mounted package; 2 leads
A
A1
,
Q
c
Lp
v M A
HE
A
D
1
E
bp
2
(1)
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
max.
bp
mm
1.1
0.8
+ 0.05
− 0.05
0.40
0.25
c
D
E
HE
Lp
Q
v
0.25
0.10
1.8
1.6
1.35
1.15
2.7
2.3
0.45
0.15
0.25
0.15
0.2
Note
1. The marking bar indicates the cathode.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
EIAJ
SOD323
1999 Aug 27
EUROPEAN
PROJECTION
ISSUE DATE
98-09-14
5
Philips Semiconductors
Product specification
Silicon PIN diode
BAP64-03
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1999 Aug 27
6
Philips Semiconductors
Product specification
Silicon PIN diode
BAP64-03
NOTES
1999 Aug 27
7
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SCA 67
© Philips Electronics N.V. 1999
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Printed in The Netherlands
125004/04/pp8
Date of release: 1999
Aug 27
Document order number:
9397 750 06279
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