ACPF-7141 Bandpass Filter for LTE Band 41 Data Sheet Description Features The Avago ACPF-7141 is a miniature Bandpass Filter designed for use in LTE Band 41 (2496 – 2690 MHz) wireless applications. • 50 Ω Input/Output The ACPF-7141 is designed to enable concurrent operation of Band 41 with applications in adjacent 2.4 GHz Bands (Wi-Fi, WLAN, Bluetooth, ISM). The ACPF-7141 utilizes Avago Technologies’ innovative Film Bulk Acoustic Resonator (FBAR) technology, which makes possible ultra-small, high-Q filters at a fraction of their usual size. The ACPF-7141 is compatible with high volume, lead-free SMT soldering processes and can be direct surface mounted to a PCB or a transfer molded module. Applications • No external matching required • Low Insertion Loss, High Interference Rejection • Specifications guaranteed –20 °C to +85 °C • High Power Rating – +31 dBm Abs Max Input Power • Miniature Size – 2.0 × 1.6 mm Footprint – 0.90 mm Max Height • Environmental – RoHS 6 Compliant – Halogen free – TBBPA Free LTE Band 41 applications such as smartphones, tablets, and other mobile or portable communications devices. Specifications Functional Block Diagram • IEEE 802.11 b/g/n, Ch 1-13 Rejection ≥ 35 dB (Typ., 25 °C) Port 1 Port 2 TX (Pin 1) ANT (Pin 2) • Band 41 Insertion Loss ≤ 2.1 dB (Typ., 25 °C) Electrical Specifications [1], Z0 = 50 Ω, TC [2] –20 °C to +85 °C, unless otherwise specified Symbol Parameter Units S21 Insertion Loss, Band 41 dB Min. Typ. [3] Max. 2496 – 2500 MHz (+25 °C) 2496 – 2500 MHz (–20 °C to –5 °C) 2496 – 2500 MHz (–5 °C to +85 °C) 2.8 2500 – 2520 MHz (+25 °C) 2500 – 2520 MHz (–20 °C to +85 °C) 2.4 3.3 3.8 2520 – 2680 MHz (+25 °C) 2520 – 2680 MHz (–20 °C to +85 °C) 2.0 3.0 3.2 2680 – 2690 MHz (+25 °C) 2680 – 2690 MHz (–20 °C to +85 °C) 2.2 3.6 3.8 S21 Attenuation, 0 – 699 MHz dB 35 76 S21 Attenuation, 699 – 916 MHz dB 35 56 S21 Attenuation, 916 – 1248 MHz dB 25 47 S21 Attenuation, 1248 – 1565 MHz dB 25 35 S21 Attenuation, 1565 – 1615 MHz dB 30 40 S21 Attenuation, 1615 – 1660 MHz dB 25 34 S21 Attenuation, 1660 – 1750 MHz dB 18 27 S21 Attenuation, 1750 – 2400 MHz dB 12 22 S21 Attenuation, Wi-Fi 802.11 b/g/n Band [4] 2401 – 2453 MHz ( Wi-Fi Ch 1–7) 2436 – 2468 MHz ( Wi-Fi Ch 8–10) 2451 – 2473 MHz ( Wi-Fi Ch 11) 2456 – 2478 MHz ( Wi-Fi Ch 12) 2461 – 2483 MHz ( Wi-Fi Ch 13) dB 35 35 30 — — 45 44 44 30 18 S21 Attenuation, 2750 – 2850 MHz dB 20 37 S21 Attenuation, 2850 – 3000 MHz dB 18 28 S21 Attenuation, 3000 – 4992 MHz dB 20 27 S21 Attenuation, 4992 – 5380 MHz dB 24 32 S21 Attenuation, 5380 – 7488 MHz dB 20 32 S21 Attenuation, 7488 – 8070 MHz dB 20 30 S11, S22 Return Loss (SWR), 2496 –2690 MHz dB 8 16 (1.4) 3.9 3.7 (2.3) Notes: 1. Min./Ma.x. specifications are guaranteed at the indicated temperature, unless otherwise noted. 2. TC is the case temperature and is defined as the temperature of the underside of the filter where it makes contact with the circuit board. 3. Typical data is the average value (arithmetic mean) of the parameter over the indicated band at +25 °C. 4. Wi-Fi Channel Average Attenuation, which is obtained by averaging |S21| over the center 19 MHz of the channels and converting to dB value. 2 Absolute Maximum Ratings [1] Parameter Unit Value Storage temperature °C –40 to +125 Maximum RF Input Power to Pin 1 (Tx) [2] dBm +31 Maximum DC Voltage, any Pin to Gnd or between Pins [3] VDC 0 Parameter Unit Value Operating temperature, Tc [5] °C –30 to +85 Maximum Recommended Operating Conditions [4] Notes: 1. Operation in excess of any one of these conditions may result in permanent damage to the device. 2. The ACPF-7141 is not symmetrical. Pin 1 is designed for higher power handling and is intended to be connected to the Tx blocks with Pin 2 connected to the system antenna. 3. Internal DC resistance of any port to ground or between ports is approximately a short circuit. 4. The device will function over the recommended range without degradation in reliability or permanent change in performance, but is not guaranteed to meet electrical specifications. 5. TC is defined as case temperature, the temperature of the underside of the filter where it makes contact with the circuit board. Applications Information The ACPF-7141 is not symmetrical. Pin 1 should be connected to the highest system power level (e.g., Tx block) and Pin 2 to the Antenna. The DC resistance from Pin 1 and Pin2 to Gnd is approximately zero. If either port is connected to adjacent components having a DC voltage present, blocking capacitors should be used. 3 ACPF-7141 Typical Performance at Tc = 25 °C 0 0 -0.5 -10 -1.0 Attenuation (dB) Attenuation (dB) -1.5 -2.0 -2.5 -3.0 -3.5 -4.0 2500 2550 2600 2650 Frequency (MHz) 0 -0.5 -0.5 -1.0 -1.0 -1.5 -1.5 Insertion Loss (dB) Insertion Loss (dB) 0 -2.5 -3.0 -3.5 -3.5 -4.5 2494 -5.0 2680 2495 Figure 3. Insertion Loss, low side of Passband, 2490 – 2500 MHz 2685 2690 Frequency (MHz) 2695 Figure 4. Insertion Loss, high side of Passband, 2680 – 2700 MHz 0 0 -10 -5 Return Loss (dB) -20 -30 -40 -10 S11 -15 S22 -20 -50 -60 2400 8000 -3.0 -4.5 2492 2493 Frequency (MHz) 6000 -2.5 -4.0 2491 4000 Frequency (MHz) -2.0 -4.0 -5.0 2490 2000 Figure 2. Insertion Loss, wideband -2.0 Insertion Loss (dB) -40 -60 2700 Figure 1. Insertion Loss in Passband, 2460 – 2740 MHz 2420 2440 2460 Frequency (MHz) Figure 5. Attenuation, Wi-Fi Band (2400 – 2500 MHz) 4 -30 -50 -4.5 -5.0 -20 2480 2500 -25 2500 2550 2600 Frequency (MHz) Figure 6. In/Out Return Loss, Band 41 (2496 – 2690 MHz) 2650 ACPF-7141 Typical Performance at Tc = 25 °C 0.6 0.8 1 1.5 2 0.4 3 0.2 0.4 0.6 0.8 1 1.5 2 3 45 5 -1 1.600 ±0.075 1.5 2 3 45 10 20 50 10 2050 -50 -20 -10 -3 -2 -0.8 -1.5 -1 Figure 8. S22 (Port 2, Ant), 3GPP Band 41 (2496 – 2690 MHz) 0.830 ±0.075 1.40 0.90 1 RYW XXXX 5 -5 -4 -0.6 -1.5 Figure 7. S11 (Port 1, Tx), 3GPP Band 41 (2496 – 2690 MHz) PIN 1 MARK 0.4 0.6 0.8 1 -0.4 -2 -0.8 3 -0.2 -3 -0.6 2 4 0.2 -5 -4 -0.4 1.5 0.2 10 20 50 10 2050 -50 -20 -10 -0.2 1 0.4 4 0.2 0.8 0.6 0.30 × 0.30 0.10 × 45° 0.20 × 45° 1.30 2.000 ±0.075 3 1.80 1.30 2 0.30 × 0.30 TOP VIEW Notes: 1. Dimensions in millimeters 2. Tolerance, unless otherwise specified in drawing: X.XX ± 0.05 mm X.XXX ± 0.025 mm 3. Dimensions nominal. unless otherwise specified 4. Contact areas are gold plated 6. Package marking: “A” = Avago logo R = ACPF-7141 Y = Year (last digit) W = Work Week XXXX = Lot Number Figure 9. Package Outline Drawing and Marking 5 SIDE VIEW 0.90 BOTTOM VIEW Pin Connections: 1 TX 2 ANT 3 Ground 0.10 ALL AROUND 0.300 × 0.300 0.100 × 45° PACKAGE OUTLINE 0.100 SETBACK, PINs 1, 2 0.055 SETBACK, PIN 3 0.990 1 0.155 (4×) 0.155× 45° 1.390 1.890 3 1.390 2 0.990 1.490 0.300 × 0.300 Notes: 1. Top view. 2. Dimensions in mm. 3. Note: Land pattern only, RF ground vias not shown. Figure 10. Landing Pad SOLDER MASK, PIN 3 SMD, 1:1 WITH DEVICE PAD (0.045 PULL IN FROM LAND PAD) LAND PAD, PIN 3 0.045 LARGER/SIDE THAN DEVICE PAD LAND PAD, PINs 1, 2 1:1 WITH DEVICE PAD SOLDER MASK, PINs 1, 2 1:1 WITH LAND PAD (NSMD) SOLDER STENCIL, PINs 1, 2 0.015 PULL IN FROM LAND PAD Notes: 1. Top view. 2. Dimensions in mm. Figure 11. Typical Pad Construction 6 0.300 × 0.300 0.100 × 45° CHAMFER (1×) PACKAGE OUTLINE 0.100 SETBACK, ALL SIDES 0.900 1 0.200 × 45° 1.300 1.800 3 1.300 0.300 × 0.300 2 0.900 1.400 Notes: 1. Top view 2. Dimensions in mm Figure 12. Solder Mask 0.270 × 0.270 0.090 × 45° CHAMFER (1×) 0.624 PACKAGE OUTLINE 0.115 SETBACK, ALL SIDES 1 0.200 × 45° 0.140R (6×) 3 1.770 1.647 1.147 0.623 2 0.123 0.123 0.746 1.246 1.370 Notes: 1. Top view. 2. Dimensions in mm. 3. Typical stencil thickness = 75 µm. Figure 13. Solder Stencil 7 0.270 × 0.270 4.00 ±0.10 2.00 ±0.05 ∅ 1.50 + 0.10 4.00 ±0.10 1.75 ± 0.10 3.50 ± 0.05 8.00 +0.30 –0.10 Pin 1 Mark ∅ 0.50 ± 0.05 0.254 ± 0.02 3° MAX 5° MAX 1.80 ± 0.05 1.12 ± 0.05 2.16 ± 0.05 A. K. B. Dimensions in mm. Figure 14. SMD Tape Packing SPROCKET HOLES PACKAGE PIN 1 ORIENTATION DIRECTION OF FEED TAPE WIDTH RYW XXXX 8 RYW Figure 15. Orientation in Tape and Direction of Feed XXXX RYW XXXX RYW XXXX RYW XXXX POCKET CAVITY Reel Drawing FRONT VIEW 8.4 min. 9.9 max. 178 +0.5 -0.5 Hatched Area Indicates Thru Hole 50 min. 10.9 +0.0 -3.0 Flange Thickness : Min. 1.20 mm BACK VIEW 2.5±0.5 RECYCLE SYMBOL 2.0 +0.5 -0.5 12.8 min. 13.5 max. Figure 16. SMT Reel Drawing 9 20.2 min. TOLERANCE .X = ±0.25 .XX = ±0.13 Package Moisture Sensitivity Feature Test Method Performance Moisture Sensitivity Level (MSL) at 260 °C JESD22-A113D Level 3 300 250 Temperature, °C 200 150 100 50 Tested profile shown. 0 0 50 100 150 200 250 300 PROFILE.GRF PROFILE. WMF 6 February 2003 R. Waugh Time, seconds Figure 17. Verified SMT Solder Profile Ordering Information Part Number No. of Devices Container ACPF-7141-BLK 100 Tape strip or Gel-Pack ACPF-7141-TR1 3000 7-inch (178 mm) Reel For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2014 Avago Technologies. All rights reserved. AV02-4506EN - October 21, 2014