TI1 M38510/11906BCX Wide bandwidth quad jfet input operational amplifier Datasheet

LF147JAN
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LF147JAN Wide Bandwidth Quad JFET Input Operational Amplifier
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FEATURES
DESCRIPTION
•
•
•
•
•
•
•
•
The LF147 is a low cost, high speed quad JFET input
operational amplifier with an internally trimmed input
offset voltage ( BI-FET™ II technology). The device
requires a low supply current and yet maintains a
large gain bandwidth product and a fast slew rate. In
addition, well matched high voltage JFET input
devices provide very low input bias and offset
currents. The LF147 is pin compatible with the
standard LM148. This feature allows designers to
immediately upgrade the overall performance of
existing LF148 and LM124 designs.
1
23
•
•
Internally Trimmed Offset Voltage: 5 mV Max
Low Input Bias Current: 50 pA Typ.
Low Input Noise Current: 0.01 pA/√Hz Typ.
Wide Gain Bandwidth: 4 MHz Typ.
High Slew Rate: 13 V/μs Typ.
Low Supply Current: 7.2 mA Typ.
High Input Impedance: 1012Ω Typ.
Low Total Harmonic Distortion:
– AV = 10, RL = 10KΩ, VO = 20VP-P
– BW = 20Hz — 20KHz ≤0.02% Typ.
Low 1/f Noise Corner: 50 Hz Typ.
Fast Settling Time to 0.01%: 2 μs Typ.
The LF147 may be used in applications such as high
speed integrators, fast D/A converters, sample-andhold circuits and many other circuits requiring low
input offset voltage, low input bias current, high input
impedance, high slew rate and wide bandwidth. The
device has low noise and offset voltage drift.
Connection Diagram
Figure 1. CDIP Package
Top View
See Package Number J
1
2
3
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
BI-FET is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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Simplified Schematic
Figure 2. ¼ Quad
Detailed Schematic
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
2
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Absolute Maximum Ratings (1)
Supply Voltage
±18V
Differential Input Voltage
±30V
Input Voltage Range (2)
±15V
Output Short Circuit Duration (3)
Continuous
Power Dissipation (4) (5)
900 mW
TJ max
150°C
θJA CDIP
70°C/W
Operating Temperature Range
−55°C ≤ TA ≤ 125°C
Storage Temperature Range
−65°C ≤ TA ≤ 150°C
Lead Temperature (Soldering, 10 sec.)
ESD
(1)
(2)
(3)
(4)
(5)
(6)
260°C
(6)
900V
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
Unless otherwise specified the absolute maximum negative input voltage is equal to the negative power supply voltage.
Any of the amplifier outputs can be shorted to ground indefinitely, however, more than one should not be simultaneously shorted as the
maximum junction temperature will be exceeded.
The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature),
θJA (Package junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any
temperature is PDmax = (TJmax — TA) / θJA or the number given in the Absolute Maximum Ratings, whichever is lower.
Max. Power Dissipation is defined by the package characteristics. Operating the part near the Max. Power Dissipation may cause the
part to operate outside specified limits.
Human body model, 1.5 kΩ in series with 100 pF.
Recommended Operating Conditions
Supply Voltage Range
±5V to ±15V
Quality Conformance Inspection
Mil-Std-883, Method 5005 - Group A
Subgroup
Description
Temp (°C)
1
Static tests at
25
2
Static tests at
125
3
Static tests at
-55
4
Dynamic tests at
25
5
Dynamic tests at
125
6
Dynamic tests at
-55
7
Functional tests at
25
8A
Functional tests at
125
8B
Functional tests at
-55
9
Switching tests at
25
10
Switching tests at
125
11
Switching tests at
-55
12
Settling Time at
25
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LF147JAN Electrical Characteristics DC Parameters
The following conditions apply, unless otherwise specified:VCC = ±15V, VCM = 0V
Symbol
VIO
Parameter
Input Offset Voltage
±IIB
Input Bias Current
IIO
Input Offset Current
Conditions
Notes
Subgroups
Min
Max
Unit
+VCC = 26V, -VCC = -4V,
VCM = -11V
-5.0
5.0
mV
1
-7.0
7.0
mV
2, 3
+VCC = 4V, -VCC = -26V,
VCM = 11V
-5.0
5.0
mV
1
-7.0
7.0
mV
2, 3
+VCC = 15V, -VCC = -15V,
VCM = 0V
-5.0
5.0
mV
1
-7.0
7.0
mV
2, 3
+VCC = 5V, -VCC = -5V,
VCM = 0V
-5.0
5.0
mV
1
-7.0
7.0
mV
2, 3
+VCC = 26V, -VCC = -4V,
VCM = -11V
-0.4
0.2
nA
1
-10
50
nA
2
+VCC = 15V, -VCC = -15V,
VCM = 0V
-0.2
0.2
nA
1
-10
50
nA
2
+VCC = 4V, -VCC = -26V,
VCM = 11V
-0.2
1.2
nA
1
-10
70
nA
2
+VCC = 15V, -VCC = -15V,
VCM = 0V
-0.1
0.1
nA
1
-20
20
nA
2
+PSRR
Power Supply Rejection Ratio
-VCC = -15V,
+VCC = 20V to 10V
80
dB
1, 2, 3
-PSRR
Power Supply Rejection Ratio
+VCC = 15V,
-VCC = -20V to -10V
80
dB
1, 2, 3
CMRR
Input Voltage Common Mode
Rejection
±VCC = ±4V to ±26V,
VCM = -11V to +11V
80
dB
1, 2, 3
+IOS
Output Short Circuit Current
+VCC = 15V, -VCC = -15V,
VCM = -10V, t ≤ 25mS
-80
mA
1, 2, 3
−IOS
Output Short Circuit Current
+VCC = 15V, -VCC = -15V,
VCM = 10V, t ≤ 25mS
80
mA
1, 2, 3
ICC
Supply Current
14
mA
1, 2
16
mA
3
Delta VIO /
Delta T
Input Offset Voltage Temp.
Sensitivity
25°C ≤ TA ≤ +125°C
See (1)
-30
30
µV/°C
2
-55°C ≤ TA ≤ 25°C
See (1)
-30
30
µV/°C
3
+VOP
Output Voltage Swing
+VCC = 15V, -VCC = -15V,
RL=10KΩ, VCM = -15V
12
V
4, 5, 6
+VCC = 15V, -VCC = -15V, RL=2KΩ,
VCM = -15V
10
V
4, 5, 6
-VOP
+AVS
Output Voltage Swing
Open Loop Voltage Gain
+VCC = 15V, -VCC = -15V
+VCC = 15V, -VCC = -15V,
RL=10KΩ, VCM = 15V
-12
V
4, 5, 6
+VCC = 15V, -VCC = -15V,
RL = 2KΩ, VCM = 15V
-10
V
4, 5, 6
+VCC = 15V, -VCC = -15V,
RL = 2KΩ, VO = 0 to 10V
50
V/mV
4
25
V/mV
5, 6
50
V/mV
4
25
V/mV
5, 6
20
V/mV
4, 5, 6
−AVS
Open Loop Voltage Gain
+VCC = 15V, -VCC = -15V,
RL = 2KΩ, VO = 0 to -10V
AVS
Open Loop Voltage Gain
+VCC = 5V, -VCC = -5V,
RL = 10KΩ, VO = ±2V
(1)
4
Calculated parameters.
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LF147JAN Electrical Characteristics AC Parameters
The following conditions apply, unless otherwise specified:VCC = ±15V
Symbol
+SR
Parameter
Slew Rate
Conditions
Notes
VI = -5V to +5V
Min
Max
Unit
Subgroups
7
V/µS
7
5
V/µS
8A, 8B
7
V/µS
7
5
V/µS
8A, 8B
-SR
Slew Rate
TRTR
Transient Response Rise Time
AV=1, VI=50mV, CL= 100pF,
RL=2KΩ
200
nS
7, 8A, 8B
TROS
Transient Response Overshoot
AV=1, VI=50mV, CL= 100pF,
RL=2KΩ
40
%
7, 8A, 8B
NIBB
Noise Broadband
BW = 10Hz to 15KHz, RS = 0Ω
15
µVRMS
7
NIPC
Noise Popcorn
BW = 10Hz to 15KHz,
RS = 100KΩ
80
µVPK
7
CS
Channel Separation
RL = 2KΩ
80
dB
7
RL = 2KΩ, VI = ±10V, A to B
80
dB
7
RL = 2KΩ, VI = ±10V, A to C
80
dB
7
RL = 2KΩ, VI = ±10V, A to D
80
dB
7
RL = 2KΩ, VI = ±10V, B to A
80
dB
7
RL = 2KΩ, VI = ±10V, B to C
80
dB
7
RL = 2KΩ, VI = ±10V, B to D
80
dB
7
RL = 2KΩ, VI = ±10V, C to A
80
dB
7
RL = 2KΩ, VI = ±10V, C to B
80
dB
7
RL = 2KΩ, VI = ±10V, C to D
80
dB
7
RL = 2KΩ, VI = ±10V, D to A
80
dB
7
RL = 2KΩ, VI = ±10V, D to B
80
dB
7
RL = 2KΩ, VI = ±10V, D to C
80
dB
7
nS
12
±tS
Settling Time
VI = +5V to -5V
1,50
0
AV = 1
LF147JAN Electrical Characteristics Drift Values
The following conditions apply, unless otherwise specified: DC ±VCC = ±15V, VCM = 0V, “Delta calculations performed on JAN
S and QMLV devices at group B, subgroup 5 only”
Min
Max
Unit
Subgroups
+VCC = 15V, -VCC = -15V,
VCM = 0V
-1.0
1.0
mV
1
Input Bias Current
+VCC = 15V, -VCC = -15V,
VCM = 0V
-0.1
0.1
nA
1
Input Bias Current
+VCC = 15V, -VCC = -15V,
VCM = 0V
-0.1
0.1
nA
1
Symbol
Parameters
Conditions
VIO
Input Offset Voltage
+IIB
-IIB
Notes
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Typical Performance Characteristics
6
Input Bias Current
Input Bias Current
Figure 3.
Figure 4.
Supply Current
Positive Common-Mode
Input Voltage Limit
Figure 5.
Figure 6.
Negative Common-Mode
Input Voltage Limit
Positive Current Limit
Figure 7.
Figure 8.
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Typical Performance Characteristics (continued)
Negative Current Limit
Output Voltage Swing
Figure 9.
Figure 10.
Output Voltage Swing
Gain Bandwidth
Figure 11.
Figure 12.
Bode Plot
Slew Rate
Figure 13.
Figure 14.
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Typical Performance Characteristics (continued)
8
Distortion vs Frequency
Undistorted Output Voltage
Swing
Figure 15.
Figure 16.
Open Loop Frequency
Response
Common-Mode Rejection
Ratio
Figure 17.
Figure 18.
Power Supply Rejection
Ratio
Equivalent Input Noise
Voltage
Figure 19.
Figure 20.
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Typical Performance Characteristics (continued)
Open Loop Voltage Gain
Output Impedance
Figure 21.
Figure 22.
Inverter Settling Time
Figure 23.
Pulse Response
RL=2 kΩ, CL=10 pF
Small Signal Inverting
Small Signal Non-Inverting
Figure 24.
Figure 25.
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Pulse Response (continued)
RL=2 kΩ, CL=10 pF
Large Signal Inverting
Large Signal Non-Inverting
Figure 26.
Figure 27.
Current Limit (RL=100Ω)
Figure 28.
10
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APPLICATION HINTS
The LF147 is an op amp with an internally trimmed input offset voltage and JFET input devices (BI-FET II).
These JFETs have large reverse breakdown voltages from gate to source and drain eliminating the need for
clamps across the inputs. Therefore, large differential input voltages can easily be accommodated without a large
increase in input current. The maximum differential input voltage is independent of the supply voltages. However,
neither of the input voltages should be allowed to exceed the negative supply as this will cause large currents to
flow which can result in a destroyed unit.
Exceeding the negative common-mode limit on either input will force the output to a high state, potentially
causing a reversal of phase to the output. Exceeding the negative common-mode limit on both inputs will force
the amplifier output to a high state. In neither case does a latch occur since raising the input back within the
common-mode range again puts the input stage and thus the amplifier in a normal operating mode.
Exceeding the positive common-mode limit on a single input will not change the phase of the output; however, if
both inputs exceed the limit, the output of the amplifier will be forced to a high state.
The amplifiers will operate with a common-mode input voltage equal to the positive supply; however, the gain
bandwidth and slew rate may be decreased in this condition. When the negative common-mode voltage swings
to within 3V of the negative supply, an increase in input offset voltage may occur.
Each amplifier is individually biased by a zener reference which allows normal circuit operation on ±4.5V power
supplies. Supply voltages less than these may result in lower gain bandwidth and slew rate.
The LF147 will drive a 2 kΩ load resistance to ±10V over the full temperature range. If the amplifier is forced to
drive heavier load currents, however, an increase in input offset voltage may occur on the negative voltage swing
and finally reach an active current limit on both positive and negative swings.
Precautions should be taken to ensure that the power supply for the integrated circuit never becomes reversed in
polarity or that the unit is not inadvertently installed backwards in a socket as an unlimited current surge through
the resulting forward diode within the IC could cause fusing of the internal conductors and result in a destroyed
unit.
As with most amplifiers, care should be taken with lead dress, component placement and supply decoupling in
order to ensure stability. For example, resistors from the output to an input should be placed with the body close
to the input to minimize “pick-up” and maximize the frequency of the feedback pole by minimizing the
capacitance from the input to ground.
A feedback pole is created when the feedback around any amplifier is resistive. The parallel resistance and
capacitance from the input of the device (usually the inverting input) to AC ground set the frequency of the pole.
In many instances the frequency of this pole is much greater than the expected 3 dB frequency of the closed
loop gain and consequently there is negligible effect on stability margin. However, if the feedback pole is less
than approximately 6 times the expected 3 dB frequency a lead capacitor should be placed from the output to the
input of the op amp. The value of the added capacitor should be such that the RC time constant of this capacitor
and the resistance it parallels is greater than or equal to the original feedback pole time constant.
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Typical Applications
Figure 29. Digitally Selectable Precision Attenuator
All resistors 1% tolerance
12
•
Accuracy of better than 0.4% with standard 1% value resistors
No offset adjustment necessary
•
Expandable to any number of stages
•
Very high input impedance
VO
Attenuation
A1
A2
A3
0
0
0
0
0
0
1
−1 dB
0
1
0
−2 dB
0
1
1
−3 dB
1
0
0
−4 dB
1
0
1
−5 dB
1
1
0
−6 dB
1
1
1
−7 dB
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Figure 30. Long Time Integrator with Reset, Hold and Starting Threshold Adjustment
•
VO starts from zero and is equal to the integral of the input voltage with respect to the threshold voltage:
•
Output starts when VIN ≥ VTH
•
Switch S1 permits stopping and holding any output value
•
Switch S2 resets system to zero
Figure 31. Universal State Variable Filter
For circuit shown:
fO=3 kHz, fNOTCH=9.5 kHz
Q=3.4
Passband gain:
Highpass – 0.1
Bandpass – 1
Lowpass – 1
Notch – 10
• fo× Q ≤ 200 kHz
• 10V peak sinusoidal output swing without slew limiting to 200 kHz
• See LM148 data sheet for design equations
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Date
Released
Revision
04/18/05
03/20/13
14
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Section
Originator
Changes
A
New Release into corporate format
L. Lytle
1 MDS datasheets converted into one Corp.
datasheet format. MJLF147–X rev 1B1 MDS
will be archived
A
All
Changed layout of National Data Sheet to TI
format
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PACKAGE OPTION ADDENDUM
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7-Nov-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
25
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
TBD
Call TI
Call TI
-55 to 125
Device Marking
(4/5)
JL147BCA
ACTIVE
CDIP
J
14
JM38510/11906BCX
ACTIVE
CDIP
J
14
TBD
Call TI
Call TI
-55 to 125
M38510/11906BCX
ACTIVE
CDIP
J
14
TBD
Call TI
Call TI
-55 to 125
JL147BCA
JM38510/11906BCA Q
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
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continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
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TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
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www.ti.com/omap
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www.ti.com/wirelessconnectivity
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