Kexin AO6401A-HF P-channel mosfet Datasheet

MOSFET
SMD Type
P-Channel MOSFET
AO6401A-HF (KO6401A-HF)
( SOT-23-6 )
Unit: mm
+0.1
● VDS (V) =-30V
6
5
4
1
2
3
+0.2
1.6 -0.1
● ID =-5 A (VGS =-10V)
● RDS(ON) < 64mΩ (VGS =-4.5V)
● RDS(ON) < 85mΩ (VGS =-2.5V)
0.55
● RDS(ON) < 47mΩ (VGS =-10V)
+0.2
2.8 -0.1
■ Features
0.4
0.4 -0.1
+0.02
0.15 -0.02
+0.01
-0.01
● Pb−Free Package May be Available. The G−Suffix Denotes a
+0.2
-0.1
+0.1
1.1 -0.1
Pb−Free Lead Finish
0-0.1
+0.1
0.68 -0.1
D
1 Drain 4 Source
2 Drain 5 Drain
3 Gate 6 Drain
G
S
■ Absolute Maximum Ratings Ta = 25℃
Parameter
Symbol
Rating
Drain-Source Voltage
VDS
-30
Gate-Source Voltage
VGS
±12
Continuous Drain Current
TA=25°C
TA=70°C
Pulsed Drain Current
Power Dissipation
Thermal Resistance.Junction- to-Ambient
Thermal Resistance.Junction- to-Lead
ID
IDM
TA=25°C
TA=70°C
t ≤ 10s
Steady-State
PD
RthJA
Unit
V
-5
-4
A
-28
2
1.3
W
62.5
110
RthJL
50
Junction Temperature
TJ
150
Junction Storage Temperature Range
Tstg
-55 to 150
℃/W
℃
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MOSFET
SMD Type
P-Channel MOSFET
AO6401A-HF (KO6401A-HF)
■ Electrical Characteristics Ta = 25℃
Parameter
Symbol
Drain-Source Breakdown Voltage
VDSS
Zero Gate Voltage Drain Current
IDSS
Gate-Body leakage current
IGSS
Gate Threshold Voltage
Static Drain-Source On-Resistance
On state drain current
VGS(th)
RDS(On)
ID(ON)
Forward Transconductance
gFS
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Gate resistance
Rg
Total Gate Charge (10V)
Total Gate Charge (4.5V)
Test Conditions
ID=-250μA, VGS=0V
Min
-1
VDS=-30V, VGS=0V, TJ=55℃
-5
VDS=0V, VGS=±12V
VDS=VGS , ID=-250μA
-0.5
74
64
VGS=-2.5V, ID=-1A
85
-28
645
VGS=0V, VDS=-15V, f=1MHz
4
VGS=-10V, VDS=-15V, ID=-5A
17
8.5
1.5
6.5
VGS=-10V, VDS=-15V, RL=3Ω,
RGEN=3Ω
Maximum Body-Diode Continuous Current
IS
Diode Forward Voltage
VSD
IF=-5A, dI/dt=100A/μs
IS=-1A,VGS=0V
* The static characteristics in Figures 1 to 6 are obtained using <300us pulses, duty cycle 0.5% max.
■ Marking
Marking
41** F
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Ω
nC
3.5
ns
41
9
tf
trr
80
7
td(on)
Qrr
pF
14
Turn-On DelayTime
Body Diode Reverse Recovery Time
780
12
2.5
Body Diode Reverse Recovery Charge
S
80
55
VGS=0V, VDS=0V, f=1MHz
mΩ
A
18
Qgd
tr
V
VGS=-10V, ID=-5A TJ=125℃
Gate Drain Charge
td(off)
-1.3
VGS=-4.5V, ID=-4A
Qgs
Turn-Off DelayTime
nA
47
VDS=-5V, ID=-5A
uA
±100
VGS=-10V, ID=-5A
VGS=-10V, VDS=-5V
Unit
V
VDS=-30V, VGS=0V
Qg
Turn-On Rise Time
Max
-30
Gate Source Charge
Turn-Off Fall Time
2
Typ
11
13.5
3.5
nC
-2.5
A
-1
V
MOSFET
SMD Type
P-Channel MOSFET
AO6401A-HF (KO6401A-HF)
■ Typical Characterisitics
25
20
10V
VDS=-5V
4.5V
15
15
-ID(A)
-ID (A)
20
-2.5V
10
10
5
5
0
0
1
2
3
4
0
5
0.5
1
1.5
2
2.5
3
-VGS(Volts)
Figure 2: Transfer Characteristics (Note E)
-VDS (Volts)
Fig 1: On-Region Characteristics (Note E)
100
Normalized On-Resistance
1.8
80
RDS(ON) (mΩ
Ω)
25°C
VGS=-2.0V
0
VGS=2.5V
60
VGS=4.5V
40
VGS=10V
20
VGS=-10V
ID=-5A
1.6
1.4
VGS=-4.5V
5
ID=-4A
1.2
2
VGS=-2.5V
ID=-1A
1
0.8
0
2
0
6
8
10
-ID (A)
Figure 3: On-Resistance vs. Drain Current and Gate
Voltage (Note E)
4
25
50
75
100
125
150
175
Temperature (°C)
Figure 4: On-Resistance vs. Junction Temperature
(Note E)
1.0E+01
150
ID=-5A
130
1.0E+00
1.0E-01
110
90
125°C
-IS (A)
RDS(ON) (mΩ
Ω)
125°C
125°C
1.0E-02
1.0E-03
70
25°C
50
25°C
1.0E-04
1.0E-05
30
0
2
4
6
8
10
-VGS (Volts)
Figure 5: On-Resistance vs. Gate-Source Voltage
(Note E)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
-VSD (Volts)
Figure 6: Body-Diode Characteristics (Note E)
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MOSFET
SMD Type
P-Channel MOSFET
AO6401A-HF (KO6401A-HF)
■ Typical Characterisitics
10
1000
VDS=-15V
ID=-5A
800
Capacitance (pF)
-VGS (Volts)
8
6
4
600
400
2
200
0
0
0
5
10
Qg (nC)
Figure 7: Gate-Charge Characteristics
Ciss
15
Coss
Crss
0
100.0
5
10
15
20
-VDS (Volts)
Figure 8: Capacitance Characteristics
25
10000
TA=25°C
100µs
1.0
1ms
10ms
0.1
1000
10µs
RDS(ON)
limited
TJ(Max)=150°C
TA=25°C
Power (W)
-ID (Amps)
10.0
10
10s
DC
1
0.0
0.01
0.1
1
-VDS (Volts)
10
0.00001
100
10
1
D=Ton/T
TJ,PK=TA+PDM.ZθJA.RθJA
0.001
0.1
1000
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
RθJA=110°C/W
0.1
PD
0.01
Single Pulse
Ton
0.001
0.00001
0.0001
0.001
0.01
0.1
1
T
10
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance (Note F)
4
10
Pulse Width (s)
Figure 10: Single Pulse Power Rating Junction-toAmbient (Note F)
.
Figure 9: Maximum Forward Biased Safe
Operating Area (Note F)
Zθ JA
Thermal Resistance
100
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100
1000
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