Cypress MB95F562KPF-G-SNE2 New 8fx 8-bit microcontroller Datasheet

The following document contains information on Cypress products. The document has the series
name, product name, and ordering part numbering with the prefix “MB”. However, Cypress will
offer these products to new and existing customers with the series name, product name, and
ordering part number with the prefix “CY”.
How to Check the Ordering Part Number
1. Go to www.cypress.com/pcn.
2. Enter the keyword (for example, ordering part number) in the SEARCH PCNS field and click
Apply.
3. Click the corresponding title from the search results.
4. Download the Affected Parts List file, which has details of all changes
For More Information
Please contact your local sales office for additional information about Cypress products and
solutions.
About Cypress
Cypress is the leader in advanced embedded system solutions for the world's most innovative
automotive, industrial, smart home appliances, consumer electronics and medical products.
Cypress' microcontrollers, analog ICs, wireless and USB-based connectivity solutions and reliable,
high-performance memories help engineers design differentiated products and get them to market
first. Cypress is committed to providing customers with the best support and development
resources on the planet enabling them to disrupt markets by creating new product categories in
record time. To learn more, go to www.cypress.com.
MB95560H Series
MB95570H Series
MB95580H Series
New 8FX 8-bit Microcontrollers
The MB95560H/570H/580H is a series of general-purpose, single-chip microcontrollers. In addition to a compact instruction set, the
microcontrollers of this series contain a variety of peripheral resources.
Features
■
■
■
There are four standby modes as follows:
• Stop mode
• Sleep mode
• Watch mode
• Time-base timer mode
❐ In standby mode, the device can be made to enter either
normal standby mode or deep standby mode.
❐
F2MC-8FX CPU core
❐ Instruction set optimized for controllers
• Multiplication and division instructions
• 16-bit arithmetic operations
• Bit test branch instructions
• Bit manipulation instructions, etc.
■
Clock (The main oscillation clock and the suboscillation clock
are only available on MB95F562H/F562K/F563H/F563K/
F564H/F564K/F582H/F582K/F583H/F583K/F584H/F584K.)
❐ Selectable main clock source
• Main oscillation clock (up to 16.25 MHz, maximum machine clock frequency: 8.125 MHz)
• External clock (up to 32.5 MHz, maximum machine clock
frequency: 16.25 MHz)
• Main CR clock (4 MHz  2%)
- The main CR clock frequency becomes 8 MHz when
the PLL multiplication rate is 2.
- The main CR clock frequency becomes 10 MHz when
the PLL multiplication rate is 2.5.
- The main CR clock frequency becomes 12 MHz when
the PLL multiplication rate is 3.
- The main CR clock frequency becomes 16 MHz when
the PLL multiplication rate is 4.
❐ Selectable subclock source
• Suboscillation clock (32.768 kHz)
• External clock (32.768 kHz)
• Sub-CR clock (Typ: 100 kHz, Min: 50 kHz, Max: 150 kHz)
Timer
8/16-bit composite timer  2 channels (only one channel on
MB95F572H/F572K/F573H/F573K/F574H/F574K/F582H/
F582K/F583H/F583K/F584H/F584K)
❐ Time-base timer  1 channel
❐ Watch prescaler  1 channel
❐
■
■
LIN-UART (only available on MB95F562H/F562K/F563H/
F563K/F564H/F564K/F582H/F582K/F583H/F583K/F584H/
F584K)
❐ Full duplex double buffer
❐ Capable of clock synchronous serial data transfer and clock
asynchronous serial data transfer
External interrupt
Interrupt by edge detection (rising edge, falling edge, and
both edges can be selected)
❐ Can be used to wake up the device from different low power
consumption (standby) modes
■
8/10-bit A/D converter
■
Low power consumption (standby) modes
8-bit or 10-bit resolution can be selected.
Cypress Semiconductor Corporation
Document Number: 002-04629 Rev. *D
•
- General-purpose I/O ports (CMOS I/O): 15
- General-purpose I/O ports (N-ch open drain): 1
❐
MB95F562K/F563K/F564K (maximum no. of I/O ports: 17)
❐
MB95F572H/F573H/F574H (maximum no. of I/O ports: 4)
❐
MB95F572K/F573K/F574K (maximum no. of I/O ports: 5)
❐
MB95F582H/F583H/F584H (maximum no. of I/O ports: 12)
❐
MB95F582K/F583K/F584K (maximum no. of I/O ports: 13)
- General-purpose I/O ports (CMOS I/O): 15
- General-purpose I/O ports (N-ch open drain): 2
- General-purpose I/O ports (CMOS I/O): 3
- General-purpose I/O ports (N-ch open drain): 1
- General-purpose I/O ports (CMOS I/O): 3
- General-purpose I/O ports (N-ch open drain): 2
- General-purpose I/O ports (CMOS I/O): 11
- General-purpose I/O ports (N-ch open drain): 1
- General-purpose I/O ports (CMOS I/O): 11
- General-purpose I/O ports (N-ch open drain): 2
On-chip debug
1-wire serial control
❐ Serial writing supported (asynchronous mode)
❐
■
Hardware/software watchdog timer
Built-in hardware watchdog timer
❐ Built-in software watchdog timer
❐
■
Power-on reset
A power-on reset is generated when the power is switched
on.
❐
■
■
❐
■
I/O port
MB95F562H/F563H/F564H (maximum no. of I/O ports: 16)
❐
Low-voltage detection reset circuit (only available on
MB95F562K/F563K/F564K/F572K/F573K/F574K/F582K/
F583K/F584K)
❐ Built-in low-voltage detector
Clock supervisor counter
Built-in clock supervisor counter function
❐
■
Dual operation Flash memory
The program/erase operation and the read operation can be
executed in different banks (upper bank/lower bank) simultaneously.
❐
■
Flash memory security function
Protects the content of the Flash memory.
❐
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised September 27, 2017
MB95560H Series
MB95570H Series
MB95580H Series
Contents
16. Block Diagram (MB95580H Series) ......................... 28
Features............................................................................. 1
1. Product Line-up ............................................................ 3
2. Packages And Corresponding Products.................... 7
3. Differences Among Products And Notes On
Product Selection ............................................................. 8
4. Pin Assignment ............................................................ 9
5. Pin Functions (MB95560H Series, 32 pins) .............. 11
6. Pin Functions (MB95560H Series, 20 pins) .............. 13
7. Pin Functions (MB95570H Series, 8 pins) ................ 15
8. Pin Functions (MB95580H Series, 32 pins) .............. 16
9. Pin Functions (MB95580H Series, 16 pins) .............. 18
10. I/O Circuit Type ......................................................... 20
11. Handling Precautions...............................................
11.1 Precautions for Product Design.........................
11.2 Precautions for Package Mounting ...................
11.3 Precautions for Use Environment......................
21
21
23
24
17. CPU Core................................................................... 29
18. I/O Map (MB95560H Series) ..................................... 30
19. I/O Map (MB95570H Series) ..................................... 34
20. I/O Map (MB95580H Series) ..................................... 37
21. Interrupt Source Table (MB95560H Series)............ 40
22. Interrupt Source Table (MB95570H Series)............ 41
23. Interrupt Source Table (MB95580H Series)............ 42
24. Electrical Characteristics.........................................
24.1 Absolute Maximum Ratings...............................
24.2 Recommended Operating Conditions ...............
24.3 DC Characteristics ............................................
24.4 AC Characteristics.............................................
24.5 A/D Converter....................................................
24.6 Flash Memory Program/Erase Characteristics..
43
43
45
46
49
63
67
25. Sample Characteristics............................................ 68
26. Mask Options ............................................................ 74
27. Ordering Information................................................ 75
12. Notes On Device Handling....................................... 24
28. Package Dimension.................................................. 77
13. Pin Connection ......................................................... 25
29. Major Changes In This Edition ................................ 84
Document History Page ................................................. 87
Sales, Solutions, and Legal Information ...................... 88
14. Block Diagram (MB95560H Series) ......................... 26
15. Block Diagram (MB95570H Series) ......................... 27
Document Number: 002-04629 Rev. *D
Page 2 of 88
MB95560H Series
MB95570H Series
MB95580H Series
1. Product Line-up
• MB95560H Series
Part number
MB95F562H
MB95F563H
MB95F564H
MB95F562K
MB95F563K
MB95F564K
Parameter
Type
Flash memory product
Clock
supervisor
It supervises the main clock oscillation.
counter
Flash memory
8 Kbyte
12 Kbyte
20 Kbyte
8 Kbyte
12 Kbyte
20 Kbyte
capacity
RAM capacity
240 bytes
496 bytes
496 bytes
240 bytes
496 bytes
496 bytes
Power-on reset
Yes
Low-voltage
No
Yes
detection reset
Reset input
Dedicated
Selected through software
• Number of basic instructions
: 136
• Instruction bit length
: 8 bits
• Instruction length
: 1 to 3 bytes
CPU functions
• Data bit length
: 1, 8 and 16 bits
• Minimum instruction execution time : 61.5 ns (machine clock frequency = 16.25 MHz)
• Interrupt processing time
: 0.6 µs (machine clock frequency = 16.25 MHz)
• I/O ports (Max) : 17
• I/O ports (Max) : 16
General• CMOS I/O
: 15
• CMOS I/O
: 15
purpose I/O
• N-ch open drain: 2
• N-ch open drain: 1
Time-base timer Interval time: 0.256 ms to 8.3 s (external clock frequency = 4 MHz)
• Reset generation cycle
Hardware/
Main oscillation clock at 10 MHz: 105 ms (Min)
software
watchdog timer • The sub-CR clock can be used as the source clock of the hardware watchdog timer.
Wild register
It can be used to replace 3 bytes of data.
• A wide range of communication speed can be selected by a dedicated reload timer.
• It has a full duplex double buffer.
LIN-UART
• Both clock synchronous serial data transfer and clock asynchronous serial data transfer are
enabled.
• The LIN function can be used as a LIN master or a LIN slave.
8/10-bit A/D
6 channels
converter
8-bit or 10-bit resolution can be selected.
2 channels
• The timer can be configured as an "8-bit timer  2 channels" or a "16-bit timer  1 channel".
• It has the following functions: interval timer function, PWC function, PWM function and input
8/16-bit
composite timer capture function.
• Count clock: it can be selected from internal clocks (7 types) and external clocks.
• It can output square wave.
6 channels
External
• Interrupt by edge detection (The rising edge, falling edge, or both edges can be selected.)
interrupt
• It can be used to wake up the device from the standby mode.
• 1-wire serial control
On-chip debug
• It supports serial writing (asynchronous mode).
Document Number: 002-04629 Rev. *D
Page 3 of 88
MB95560H Series
MB95570H Series
MB95580H Series
Part number
MB95F562H
MB95F563H
MB95F564H
MB95F562K
MB95F563K
MB95F564K
Parameter
Watch prescaler Eight different time intervals can be selected.
• It supports automatic programming (Embedded Algorithm), and program/erase/erasesuspend/erase-resume commands.
• It has a flag indicating the completion of the operation of Embedded Algorithm.
Flash memory • Flash security feature for protecting the content of the Flash memory
Number of program/erase cycles
Data retention time
1000
10000
100000
20 years
10 years
5 years
Standby mode Sleep mode, stop mode, watch mode, time-base timer mode
WNP032
Package
SOJ020
STG020
• MB95570H Series
Part number
MB95F572H
MB95F573H
MB95F574H
MB95F572K
MB95F573K
MB95F574K
Parameter
Type
Flash memory product
Clock
supervisor
It supervises the main clock oscillation.
counter
Flash memory
8 Kbyte
12 Kbyte
20 Kbyte
8 Kbyte
12 Kbyte
20 Kbyte
capacity
RAM capacity
240 bytes
496 bytes
496 bytes
240 bytes
496 bytes
496 bytes
Power-on reset
Yes
Low-voltage
No
Yes
detection reset
Reset input
Dedicated
Selected through software
• Number of basic instructions
: 136
• Instruction bit length
: 8 bits
• Instruction length
: 1 to 3 bytes
CPU functions
• Data bit length
: 1, 8 and 16 bits
• Minimum instruction execution time : 61.5 ns (machine clock frequency = 16.25 MHz)
• Interrupt processing time
: 0.6 µs (machine clock frequency = 16.25 MHz)
• I/O ports (Max) : 4
• I/O ports (Max) : 5
General• CMOS I/O
:3
• CMOS I/O
:3
purpose I/O
• N-ch open drain: 1
• N-ch open drain: 2
Time-base timer Interval time: 0.256 ms to 8.3 s (external clock frequency = 4 MHz)
Hardware/
• Reset generation cycle
Main oscillation clock at 10 MHz: 105 ms (Min)
software
watchdog timer • The sub-CR clock can be used as the source clock of the hardware watchdog timer.
Wild register
It can be used to replace 3 bytes of data.
LIN-UART
No LIN-UART
8/10-bit A/D
2 channels
converter
8-bit or 10-bit resolution can be selected.
Document Number: 002-04629 Rev. *D
Page 4 of 88
MB95560H Series
MB95570H Series
MB95580H Series
Part number
MB95F572H
MB95F573H
MB95F574H
MB95F572K
MB95F573K
MB95F574K
Parameter
1 channel
• The timer can be configured as an "8-bit timer  2 channels" or a "16-bit timer  1 channel".
• It has the following functions: interval timer function, PWC function, PWM function and input
8/16-bit
composite timer capture function.
• Count clock: it can be selected from internal clocks (7 types) and external clocks.
• It can output square wave.
2 channels
External
• Interrupt by edge detection (The rising edge, falling edge, or both edges can be selected.)
interrupt
• It can be used to wake up the device from the standby mode.
• 1-wire serial control
On-chip debug
• It supports serial writing (asynchronous mode).
Watch prescaler Eight different time intervals can be selected.
• It supports automatic programming (Embedded Algorithm), and program/erase/erasesuspend/erase-resume commands.
• It has a flag indicating the completion of the operation of Embedded Algorithm.
Flash memory • Flash security feature for protecting the content of the Flash memory
Number of program/erase cycles
Data retention time
1000
10000
100000
20 years
10 years
5 years
Standby mode Sleep mode, stop mode, watch mode, time-base timer mode
PDA008
Package
SOD008
• MB95580H Series
Part number
MB95F582H
MB95F583H
MB95F584H
MB95F582K
MB95F583K
MB95F584K
Parameter
Type
Flash memory product
Clock
supervisor
It supervises the main clock oscillation.
counter
Flash memory
8 Kbyte
12 Kbyte
20 Kbyte
8 Kbyte
12 Kbyte
20 Kbyte
capacity
RAM capacity
240 bytes
496 bytes
496 bytes
240 bytes
496 bytes
496 bytes
Power-on reset
Yes
Low-voltage
No
Yes
detection reset
Reset input
Dedicated
Selected through software
• Number of basic instructions
: 136
• Instruction bit length
: 8 bits
• Instruction length
: 1 to 3 bytes
CPU functions
• Data bit length
: 1, 8 and 16 bits
• Minimum instruction execution time : 61.5 ns (machine clock frequency = 16.25 MHz)
• Interrupt processing time
: 0.6 µs (machine clock frequency = 16.25 MHz)
• I/O ports (Max) : 12
• I/O ports (Max) : 13
General• CMOS I/O
: 11
• CMOS I/O
: 11
purpose I/O
• N-ch open drain: 1
• N-ch open drain: 2
Document Number: 002-04629 Rev. *D
Page 5 of 88
MB95560H Series
MB95570H Series
MB95580H Series
Part number
MB95F582H
MB95F583H
MB95F584H
MB95F582K
MB95F583K
MB95F584K
Parameter
Time-base timer Interval time: 0.256 ms to 8.3 s (external clock frequency = 4 MHz)
Hardware/
• Reset generation cycle
software
Main oscillation clock at 10 MHz: 105 ms (Min)
watchdog timer • The sub-CR clock can be used as the source clock of the hardware watchdog timer.
Wild register
It can be used to replace 3 bytes of data.
• A wide range of communication speed can be selected by a dedicated reload timer.
• It has a full duplex double buffer.
LIN-UART
• Both clock synchronous serial data transfer and clock asynchronous serial data transfer are
enabled.
• The LIN function can be used as a LIN master or a LIN slave.
5 channels
8/10-bit A/D
converter
8-bit or 10-bit resolution can be selected.
1 channel
• The timer can be configured as an "8-bit timer  2 channels" or a "16-bit timer  1 channel".
8/16-bit
• It has the following functions: interval timer function, PWC function, PWM function and input
composite timer capture function.
• Count clock: it can be selected from internal clocks (7 types) and external clocks.
• It can output square wave.
6 channels
External
• Interrupt by edge detection (The rising edge, falling edge, or both edges can be selected.)
interrupt
• It can be used to wake up the device from the standby mode.
• 1-wire serial control
On-chip debug
• It supports serial writing (asynchronous mode).
Watch prescaler Eight different time intervals can be selected.
• It supports automatic programming (Embedded Algorithm), and program/erase/erasesuspend/erase-resume commands.
• It has a flag indicating the completion of the operation of Embedded Algorithm.
Flash memory • Flash security feature for protecting the content of the Flash memory
Number of program/erase cycles
Data retention time
1000
10000
100000
20 years
10 years
5 years
Standby mode Sleep mode, stop mode, watch mode, time-base timer mode
WNP032
Package
STB016
SO016
Document Number: 002-04629 Rev. *D
Page 6 of 88
MB95560H Series
MB95570H Series
MB95580H Series
2. Packages And Corresponding Products
• MB95560H Series
Part number
MB95F562H
MB95F562K
MB95F563H
MB95F563K
MB95F564H
MB95F564K



X
X
X
X



X
X
X
X



X
X
X
X



X
X
X
X



X
X
X
X



X
X
X
X
MB95F572H
MB95F572K
MB95F573H
MB95F573K
MB95F574H
MB95F574K
X
X
X
X
X


X
X
X
X
X


X
X
X
X
X


X
X
X
X
X


X
X
X
X
X


X
X
X
X
X


MB95F582H
MB95F582K
MB95F583H
MB95F583K
MB95F584H
MB95F584K

X
X


X
X

X
X


X
X

X
X


X
X

X
X


X
X

X
X


X
X

X
X


X
X
Package
WNP032
SOJ020
STG020
STB016
SO016
PDA008
SOD008
• MB95570H Series
Part number
Package
WNP032
SOJ020
STG020
STB016
SO016
PDA008
SOD008
• MB95580H Series
Part number
Package
WNP032
SOJ020
STG020
STB016
SO016
PDA008
SOD008
: Available
X: Unavailable
Document Number: 002-04629 Rev. *D
Page 7 of 88
MB95560H Series
MB95570H Series
MB95580H Series
3. Differences Among Products And Notes On Product Selection
• Current consumption
When using the on-chip debug function, take account of the current consumption of Flash memory program/erase.
For details of current consumption, see “Electrical Characteristics”.
• Package
For details of information on each package, see “Packages And Corresponding Products” and “Package Dimension”.
• Operating voltage
The operating voltage varies, depending on whether the on-chip debug function is used or not.
For details of the operating voltage, see “Electrical Characteristics”.
• On-chip debug function
The on-chip debug function requires that VCC, VSS and one serial wire be connected to an evaluation tool. For details
of the connection method, refer to “CHAPTER 21 EXAMPLE OF SERIAL PROGRAMMING CONNECTION” in “New
8FX MB95560H/570H/580H Hardware Manual”.
Document Number: 002-04629 Rev. *D
Page 8 of 88
MB95560H Series
MB95570H Series
MB95580H Series
NC
NC
NC
NC
NC
NC
NC
NC
32
31
30
29
28
27
26
25
4. Pin Assignment
X1/PF1
X0/PF0
1
2
VSS
X1A/PG2
3
4
X0A/PG1
Vcc
5
6
WNP032
(MB95560H Series)
C
RST/PF2
7
8
The number of usable pins is 20.
X0/PF0
X1/PF1
1
2
Vss
X1A/PG2
3
4
X0A/PG1
Vcc
C
RST/PF2
TO10/P62
TO11/P63
5
6
7
8
9
10
Document Number: 002-04629 Rev. *D
9
10
11
12
13
14
15
16
TO11/P63
TO10/P62
NC
NC
NC
NC
P00/AN00
P64/EC1
(TOP VIEW)
(TOP VIEW)
SOJ020
STG020
(MB95560H Series)
24
23
P07/INT07
P12/EC0/DBG
22
21
20
19
P06/INT06/TO01
P05/INT05/AN05/TO00
P04/INT04/AN04/SIN/EC0
P03/INT03/AN03/SOT
18
17
P02/INT02/AN02/SCK
P01/AN01
20
19
P12/EC0/DBG
P07/INT07
18
17
P06/INT06/TO01
P05/INT05/AN05/TO00
16
15
14
13
12
11
P04/INT04/AN04/SIN/EC0
P03/INT03/AN03/SOT
P02/INT02/AN02/SCK
P01/AN01
P00/AN00
P64/EC1
Page 9 of 88
RST/PF2
8
X0/PF0
1
X1/PF1
Vss
2
3
X1A/PG2
X0A/PG1
Vcc
RST/PF2
C
4
5
6
7
8
Vss
Vcc
C
RST/PF2
1
2
3
4
Document Number: 002-04629 Rev. *D
NC
NC
NC
NC
NC
NC
NC
NC
26
25
18
P02/INT02/AN02/SCK
17
P01/AN01
The number of usable pins is 16.
15
16
6
7
P06/INT06/TO01
P05/INT05/AN05/TO00
P04/INT04/AN04/SIN/EC0
P03/INT03/AN03/SOT
14
C
22
21
20
19
NC
NC
5
WNP032
(MB95580H Series)
NC
X0A/PG1
Vcc
P07/INT07
P12/EC0/DBG
11
12
13
3
4
24
23
NC
NC
NC
VSS
X1A/PG2
(TOP VIEW)
9
10
1
2
NC
NC
X1/PF1
X0/PF0
32
31
30
29
28
27
MB95560H Series
MB95570H Series
MB95580H Series
(TOP VIEW)
STB016
SO016
(MB95580H Series)
(TOP VIEW)
PDA008
SOD008
(MB95570H Series)
16
P12/EC0/DBG
15
14
P07/INT07
P06/INT06/TO01
13
12
11
10
9
P05/INT05/AN05/TO00
P04/INT04/AN04/SIN/EC0
P03/INT03/AN03/SOT
P01/AN01
P02/INT02/AN02/SCK
8
7
6
5
P12/EC0/DBG
P06/INT06/TO01
P05/AN05/TO00
P04/INT04/AN04/EC0
Page 10 of 88
MB95560H Series
MB95570H Series
MB95580H Series
5. Pin Functions (MB95560H Series, 32 pins)
Pin no.
1
2
3
4
5
6
7
8
9
Pin name
PF1
X1
PF0
X0
VSS
PG2
X1A
PG1
X0A
VCC
C
PF2
RST
P63
I/O
circuit
type*
B
B
—
C
C
—
—
A
E
TO11
10
P62
E
TO10
11
12
13
14
15
NC
P00
—
D
AN00
16
P64
E
EC1
17
P01
D
AN01
P02
18
INT02
AN02
SCK
D
Document Number: 002-04629 Rev. *D
Function
General-purpose I/O port
Main clock I/O oscillation pin
General-purpose I/O port
Main clock input oscillation pin
Power supply pin (GND)
General-purpose I/O port
Subclock I/O oscillation pin
General-purpose I/O port
Subclock input oscillation pin
Power supply pin
Decoupling capacitor connection pin
General-purpose I/O port
Reset pin
Dedicated reset pin on MB95F562H/F563H/F564H
General-purpose I/O port
High-current pin
8/16-bit composite timer ch. 1 output pin
General-purpose I/O port
High-current pin
8/16-bit composite timer ch. 1 output pin
It is an internally connected pin. Always leave it unconnected.
General-purpose I/O port
High-current pin
A/D converter analog input pin
General-purpose I/O port
High-current pin
8/16-bit composite timer ch. 1 clock input pin
General-purpose I/O port
High-current pin
A/D converter analog input pin
General-purpose I/O port
High-current pin
External interrupt input pin
A/D converter analog input pin
LIN-UART clock I/O pin
Page 11 of 88
MB95560H Series
MB95570H Series
MB95580H Series
Pin no.
Pin name
I/O
circuit
type*
P03
19
20
INT03
AN03
SOT
P04
INT04
AN04
SIN
EC0
D
D
P05
21
INT05
AN05
TO00
D
P06
22
23
24
INT06
TO01
P12
EC0
DBG
P07
E
F
E
INT07
25
26
27
28
29
30
31
32
NC
—
Function
General-purpose I/O port
High-current pin
External interrupt input pin
A/D converter analog input pin
LIN-UART data output pin
General-purpose I/O port
External interrupt input pin
A/D converter analog input pin
LIN-UART data input pin
8/16-bit composite timer ch. 0 clock input pin
General-purpose I/O port
High-current pin
External interrupt input pin
A/D converter analog input pin
8/16-bit composite timer ch. 0 output pin
General-purpose I/O port
High-current pin
External interrupt input pin
8/16-bit composite timer ch. 0 output pin
General-purpose I/O port
8/16-bit composite timer ch. 0 clock input pin
DBG input pin
General-purpose I/O port
High-current pin
External interrupt input pin
It is an internally connected pin. Always leave it unconnected.
*: For the I/O circuit types, see “I/O Circuit Type”.
Document Number: 002-04629 Rev. *D
Page 12 of 88
MB95560H Series
MB95570H Series
MB95580H Series
6. Pin Functions (MB95560H Series, 20 pins)
Pin no.
1
2
3
4
5
6
7
8
9
Pin name
PF0
X0
PF1
X1
VSS
PG2
X1A
PG1
X0A
VCC
C
PF2
RST
P62
I/O
circuit
type*
B
B
—
C
C
—
—
A
E
TO10
10
P63
E
TO11
11
P64
E
EC1
12
P00
D
AN00
13
P01
D
AN01
P02
14
INT02
AN02
SCK
D
P03
15
INT03
AN03
SOT
D
Document Number: 002-04629 Rev. *D
Function
General-purpose I/O port
Main clock input oscillation pin
General-purpose I/O port
Main clock I/O oscillation pin
Power supply pin (GND)
General-purpose I/O port
Subclock I/O oscillation pin
General-purpose I/O port
Subclock input oscillation pin
Power supply pin
Decoupling capacitor connection pin
General-purpose I/O port
Reset pin
Dedicated reset pin on MB95F562H/F563H/F564H
General-purpose I/O port
High-current pin
8/16-bit composite timer ch. 1 output pin
General-purpose I/O port
High-current pin
8/16-bit composite timer ch. 1 output pin
General-purpose I/O port
High-current pin
8/16-bit composite timer ch. 1 clock input pin
General-purpose I/O port
High-current pin
A/D converter analog input pin
General-purpose I/O port
High-current pin
A/D converter analog input pin
General-purpose I/O port
High-current pin
External interrupt input pin
A/D converter analog input pin
LIN-UART clock I/O pin
General-purpose I/O port
High-current pin
External interrupt input pin
A/D converter analog input pin
LIN-UART data output pin
Page 13 of 88
MB95560H Series
MB95570H Series
MB95580H Series
Pin no.
Pin name
16
P04
INT04
AN04
SIN
EC0
I/O
circuit
type*
D
P05
17
INT05
AN05
TO00
D
P06
18
19
20
INT06
TO01
P07
INT07
P12
EC0
DBG
E
E
F
Function
General-purpose I/O port
External interrupt input pin
A/D converter analog input pin
LIN-UART data input pin
8/16-bit composite timer ch. 0 clock input pin
General-purpose I/O port
High-current pin
External interrupt input pin
A/D converter analog input pin
8/16-bit composite timer ch. 0 output pin
General-purpose I/O port
High-current pin
External interrupt input pin
8/16-bit composite timer ch. 0 output pin
General-purpose I/O port
High-current pin
External interrupt input pin
General-purpose I/O port
8/16-bit composite timer ch. 0 clock input pin
DBG input pin
*: For the I/O circuit types, see “I/O Circuit Type”.
Document Number: 002-04629 Rev. *D
Page 14 of 88
MB95560H Series
MB95570H Series
MB95580H Series
7. Pin Functions (MB95570H Series, 8 pins)
Pin no.
Pin name
I/O
circuit
type*
1
VSS
—
Power supply pin (GND)
2
VCC
—
Power supply pin
3
C
—
Decoupling capacitor connection pin
PF2
4
RST
General-purpose I/O port
A
P04
5
6
INT04
AN04
D
External interrupt input pin
A/D converter analog input pin
EC0
8/16-bit composite timer ch. 0 clock input pin
P05
General-purpose I/O port
High-current pin
AN05
D
INT06
E
TO01
General-purpose I/O port
High-current pin
External interrupt input pin
8/16-bit composite timer ch. 0 output pin
P12
EC0
A/D converter analog input pin
8/16-bit composite timer ch. 0 output pin
P06
8
Reset pin
Dedicated reset pin on MB95F572H/F573H/F574H
General-purpose I/O port
TO00
7
Function
General-purpose I/O port
F
DBG
8/16-bit composite timer ch. 0 clock input pin
DBG input pin
*: For the I/O circuit types, see “I/O Circuit Type”.
Document Number: 002-04629 Rev. *D
Page 15 of 88
MB95560H Series
MB95570H Series
MB95580H Series
8. Pin Functions (MB95580H Series, 32 pins)
Pin no.
1
2
3
4
5
Pin name
PF1
X1
PF0
X0
VSS
PG2
X1A
PG1
X0A
I/O
circuit
type*
B
B
—
C
C
Function
General-purpose I/O port
Main clock I/O oscillation pin
General-purpose I/O port
Main clock input oscillation pin
Power supply pin (GND)
General-purpose I/O port
Subclock I/O oscillation pin
General-purpose I/O port
Subclock input oscillation pin
6
VCC
—
Power supply pin
7
C
—
Decoupling capacitor connection pin
PF2
8
RST
General-purpose I/O port
A
Reset pin
Dedicated reset pin on MB95F582H/F583H/F584H
—
It is an internally connected pin. Always leave it unconnected.
D
General-purpose I/O port
High-current pin
9
10
11
12
13
NC
14
15
16
17
P01
AN01
A/D converter analog input pin
General-purpose I/O port
High-current pin
P02
18
19
INT02
D
External interrupt input pin
AN02
A/D converter analog input pin
SCK
LIN-UART clock I/O pin
P03
General-purpose I/O port
High-current pin
INT03
D
External interrupt input pin
AN03
A/D converter analog input pin
SOT
LIN-UART data output pin
Document Number: 002-04629 Rev. *D
Page 16 of 88
MB95560H Series
MB95570H Series
MB95580H Series
Pin no.
20
21
Pin name
I/O
circuit
type*
P04
General-purpose I/O port
INT04
External interrupt input pin
AN04
D
LIN-UART data input pin
EC0
8/16-bit composite timer ch. 0 clock input pin
P05
General-purpose I/O port
High-current pin
INT05
D
A/D converter analog input pin
TO00
8/16-bit composite timer ch. 0 output pin
INT06
E
EC0
General-purpose I/O port
High-current pin
External interrupt input pin
8/16-bit composite timer ch. 0 output pin
P12
24
External interrupt input pin
AN05
TO01
23
A/D converter analog input pin
SIN
P06
22
Function
General-purpose I/O port
F
8/16-bit composite timer ch. 0 clock input pin
DBG
DBG input pin
P07
General-purpose I/O port
High-current pin
E
INT07
External interrupt input pin
25
26
27
28
29
NC
—
It is an internally connected pin. Always leave it unconnected.
30
31
32
*: For the I/O circuit types, see “I/O Circuit Type”.
Document Number: 002-04629 Rev. *D
Page 17 of 88
MB95560H Series
MB95570H Series
MB95580H Series
9. Pin Functions (MB95580H Series, 16 pins)
Pin no.
1
2
3
4
5
6
Pin name
PF0
X0
PF1
X1
VSS
PG2
X1A
PG1
X0A
VCC
I/O
circuit
type*
B
B
—
C
C
—
PF2
7
8
RST
C
10
INT02
General-purpose I/O port
Main clock I/O oscillation pin
Power supply pin (GND)
General-purpose I/O port
Subclock I/O oscillation pin
General-purpose I/O port
Subclock input oscillation pin
Power supply pin
Reset pin
Dedicated reset pin on MB95F582H/F583H/F584H
—
Decoupling capacitor connection pin
General-purpose I/O port
High-current pin
D
External interrupt input pin
AN02
A/D converter analog input pin
SCK
LIN-UART clock I/O pin
P01
General-purpose I/O port
High-current pin
D
A/D converter analog input pin
General-purpose I/O port
High-current pin
P03
12
Main clock input oscillation pin
A
AN01
11
General-purpose I/O port
General-purpose I/O port
P02
9
Function
INT03
D
External interrupt input pin
AN03
A/D converter analog input pin
SOT
LIN-UART data output pin
P04
General-purpose I/O port
INT04
External interrupt input pin
AN04
D
A/D converter analog input pin
SIN
LIN-UART data input pin
EC0
8/16-bit composite timer ch. 0 clock input pin
Document Number: 002-04629 Rev. *D
Page 18 of 88
MB95560H Series
MB95570H Series
MB95580H Series
Pin no.
Pin name
I/O
circuit
type*
General-purpose I/O port
High-current pin
P05
13
INT05
D
A/D converter analog input pin
TO00
8/16-bit composite timer ch. 0 output pin
INT06
E
TO01
15
16
External interrupt input pin
AN05
P06
14
Function
P07
General-purpose I/O port
High-current pin
External interrupt input pin
8/16-bit composite timer ch. 0 output pin
E
General-purpose I/O port
High-current pin
INT07
External interrupt input pin
P12
General-purpose I/O port
EC0
F
DBG
8/16-bit composite timer ch. 0 clock input pin
DBG input pin
*: For the I/O circuit types, see “I/O Circuit Type”.
Document Number: 002-04629 Rev. *D
Page 19 of 88
MB95560H Series
MB95570H Series
MB95580H Series
10. I/O Circuit Type
Type
Circuit
A
Remarks
Reset input / Hysteresis input
Reset output / Digital output
• N-ch open drain output
• Hysteresis input
• Reset output
N-ch
B
P-ch
Port select
Digital output
N-ch
Digital output
Standby control
Hysteresis input
Clock input
• Oscillation circuit
• High-speed side
Feedback resistance:
approx. 1 M
• CMOS output
• Hysteresis input
X1
X0
Standby control / Port select
P-ch
Port select
Digital output
N-ch
Digital output
Standby control
Hysteresis input
C
Port select
R
Pull-up control
P-ch
P-ch
• Oscillation circuit
• Low-speed side
Feedback resistance:
approx.10 M
Digital output
N-ch
Digital output
Standby control
Hysteresis input
• CMOS output
• Hysteresis input
• Pull-up control available
Clock input
X1A
X0A
Standby control / Port select
Port select
R
Pull-up control
Digital output
P-ch
Digital output
N-ch
Digital output
Standby control
Hysteresis input
Document Number: 002-04629 Rev. *D
Page 20 of 88
MB95560H Series
MB95570H Series
MB95580H Series
Type
Circuit
Remarks
D
Pull-up control
R
P-ch
Digital output
P-ch
•
•
•
•
CMOS output
Hysteresis input
Pull-up control available
Analog input
Digital output
N-ch
Analog input
A/D control
Standby control
Hysteresis input
E
Pull-up control
R
P-ch
• CMOS output
• Hysteresis input
• Pull-up control available
Digital output
P-ch
Digital output
N-ch
Standby control
Hysteresis input
F
Standby control
Hysteresis input
• N-ch open drain output
• Hysteresis input
Digital output
N-ch
11. Handling Precautions
Any semiconductor devices have inherently a certain rate of failure. The possibility of failure is greatly affected by the
conditions in which they are used (circuit conditions, environmental conditions, etc.). This page describes precautions
that must be observed to minimize the chance of failure and to obtain higher reliability from your Cypress semiconductor
devices.
11.1 Precautions for Product Design
This section describes precautions when designing electronic equipment using semiconductor devices.
 Absolute Maximum Ratings
Semiconductor devices can be permanently damaged by application of stress (voltage, current, temperature, etc.) in
excess of certain established limits, called absolute maximum ratings. Do not exceed these ratings.
 Recommended Operating Conditions
Recommended operating conditions are normal operating ranges for the semiconductor device. All the device's
electrical characteristics are warranted when operated within these ranges.
Always use semiconductor devices within the recommended operating conditions. Operation outside these ranges
may adversely affect reliability and could result in device failure.
No warranty is made with respect to uses, operating conditions, or combinations not represented on the data sheet.
Users considering application outside the listed conditions are advised to contact their sales representative beforehand.
Document Number: 002-04629 Rev. *D
Page 21 of 88
MB95560H Series
MB95570H Series
MB95580H Series
 Processing and Protection of Pins
These precautions must be followed when handling the pins which connect semiconductor devices to power supply
and input/output functions.
(1) Preventing Over-Voltage and Over-Current Conditions
Exposure to voltage or current levels in excess of maximum ratings at any pin is likely to cause deterioration
within the device, and in extreme cases leads to permanent damage of the device. Try to prevent such overvoltage
or over-current conditions at the design stage.
(2) Protection of Output Pins
Shorting of output pins to supply pins or other output pins, or connection to large capacitance can cause large
current flows. Such conditions if present for extended periods of time can damage the device.
Therefore, avoid this type of connection.
(3) Handling of Unused Input Pins
Unconnected input pins with very high impedance levels can adversely affect stability of operation. Such pins
should be connected through an appropriate resistance to a power supply pin or ground pin.
 Latch-up
Semiconductor devices are constructed by the formation of P-type and N-type areas on a substrate. When subjected
to abnormally high voltages, internal parasitic PNPN junctions (called thyristor structures) may be formed, causing
large current levels in excess of several hundred mA to flow continuously at the power supply pin. This condition is
called latch-up.
CAUTION: The occurrence of latch-up not only causes loss of reliability in the semiconductor device, but can cause
injury or damage from high heat, smoke or flame. To prevent this from happening, do the following:
(1) Be sure that voltages applied to pins do not exceed the absolute maximum ratings. This should
include attention to abnormal noise, surge levels, etc.
(2) Be sure that abnormal current flows do not occur during the power-on sequence.
 Observance of Safety Regulations and Standards
Most countries in the world have established standards and regulations regarding safety, protection from electromagnetic interference, etc. Customers are requested to observe applicable regulations and standards in the design of
products.
 Fail-Safe Design
Any semiconductor devices have inherently a certain rate of failure. You must protect against injury, damage or loss
from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire
protection, and prevention of over-current levels and other abnormal operating conditions.
 Precautions Related to Usage of Devices
Cypress semiconductor devices are intended for use in standard applications (computers, office automation and other
office equipment, industrial, communications, and measurement equipment, personal or household devices, etc.).
CAUTION: Customers considering the use of our products in special applications where failure or abnormal operation
may directly affect human lives or cause physical injury or property damage, or where extremely high levels of reliability
are demanded (such as aerospace systems, atomic energy controls, sea floor repeaters, vehicle operating controls,
medical devices for life support, etc.) are requested to consult with sales representatives before such use. The
company will not be responsible for damages arising from such use without prior approval.
Document Number: 002-04629 Rev. *D
Page 22 of 88
MB95560H Series
MB95570H Series
MB95580H Series
11.2 Precautions for Package Mounting
Package mounting may be either lead insertion type or surface mount type. In either case, for heat resistance during
soldering, you should only mount under Cypress’s recommended conditions. For detailed information about mount
conditions, contact your sales representative.
 Lead Insertion Type
Mounting of lead insertion type packages onto printed circuit boards may be done by two methods: direct soldering
on the board, or mounting by using a socket.
Direct mounting onto boards normally involves processes for inserting leads into through-holes on the board and
using the flow soldering (wave soldering) method of applying liquid solder. In this case, the soldering process usually
causes leads to be subjected to thermal stress in excess of the absolute ratings for storage temperature. Mounting
processes should conform to Cypress recommended mounting conditions.
If socket mounting is used, differences in surface treatment of the socket contacts and IC lead surfaces can lead to
contact deterioration after long periods. For this reason it is recommended that the surface treatment of socket contacts
and IC leads be verified before mounting.
 Surface Mount Type
Surface mount packaging has longer and thinner leads than lead-insertion packaging, and therefore leads are more
easily deformed or bent. The use of packages with higher pin counts and narrower pin pitch results in increased
susceptibility to open connections caused by deformed pins, or shorting due to solder bridges.
You must use appropriate mounting techniques. Cypress recommends the solder reflow method, and has established
a ranking of mounting conditions for each product. Users are advised to mount packages in accordance with Cypress
ranking of recommended conditions.
 Lead-Free Packaging
CAUTION: When ball grid array (BGA) packages with Sn-Ag-Cu balls are mounted using Sn-Pb eutectic soldering,
junction strength may be reduced under some conditions of use.
 Storage of Semiconductor Devices
Because plastic chip packages are formed from plastic resins, exposure to natural environmental conditions will cause
absorption of moisture. During mounting, the application of heat to a package that has absorbed moisture can cause
surfaces to peel, reducing moisture resistance and causing packages to crack. To prevent, do the following:
(1) Avoid exposure to rapid temperature changes, which cause moisture to condense inside the product. Store
products in locations where temperature changes are slight.
(2) Use dry boxes for product storage. Products should be stored below 70% relative humidity, and at temperatures
between 5°C and 30°C.
When you open Dry Package that recommends humidity 40% to 70% relative humidity.
(3) When necessary, Cypress packages semiconductor devices in highly moisture-resistant aluminum laminate bags,
with a silica gel desiccant. Devices should be sealed in their aluminum laminate bags for storage.
(4) Avoid storing packages where they are exposed to corrosive gases or high levels of dust.
 Baking
Packages that have absorbed moisture may be de-moisturized by baking (heat drying). Follow the Cypress recommended conditions for baking.
Condition: 125°C/24 h
 Static Electricity
Because semiconductor devices are particularly susceptible to damage by static electricity, you must take the following
precautions:
Document Number: 002-04629 Rev. *D
Page 23 of 88
MB95560H Series
MB95570H Series
MB95580H Series
(1) Maintain relative humidity in the working environment between 40% and 70%.
Use of an apparatus for ion generation may be needed to remove electricity.
(2) Electrically ground all conveyors, solder vessels, soldering irons and peripheral equipment.
(3) Eliminate static body electricity by the use of rings or bracelets connected to ground through high resistance (on
the level of 1 M).
Wearing of conductive clothing and shoes, use of conductive floor mats and other measures to minimize shock
loads is recommended.
(4) Ground all fixtures and instruments, or protect with anti-static measures.
(5) Avoid the use of styrofoam or other highly static-prone materials for storage of completed board assemblies.
11.3 Precautions for Use Environment
Reliability of semiconductor devices depends on ambient temperature and other conditions as described above.
For reliable performance, do the following:
(1) Humidity
Prolonged use in high humidity can lead to leakage in devices as well as printed circuit boards. If high humidity
levels are anticipated, consider anti-humidity processing.
(2) Discharge of Static Electricity
When high-voltage charges exist close to semiconductor devices, discharges can cause abnormal operation. In
such cases, use anti-static measures or processing to prevent discharges.
(3) Corrosive Gases, Dust, or Oil
Exposure to corrosive gases or contact with dust or oil may lead to chemical reactions that will adversely affect
the device. If you use devices in such conditions, consider ways to prevent such exposure or to protect the devices.
(4) Radiation, Including Cosmic Radiation
Most devices are not designed for environments involving exposure to radiation or cosmic radiation. Users should
provide shielding as appropriate.
(5) Smoke, Flame
CAUTION: Plastic molded devices are flammable, and therefore should not be used near combustible substances.
If devices begin to smoke or burn, there is danger of the release of toxic gases.
Customers considering the use of Cypress products in other special environmental conditions should consult with
sales representatives.
12. Notes On Device Handling
• Preventing latch-ups
When using the device, ensure that the voltage applied does not exceed the maximum voltage rating.
In a CMOS IC, if a voltage higher than VCC or a voltage lower than VSS is applied to an input/output pin that is neither
a medium-withstand voltage pin nor a high-withstand voltage pin, or if a voltage out of the rating range of power supply
voltage mentioned in "24.1 Absolute Maximum Ratings" of "Electrical Characteristics" is applied to the VCC pin or the
VSS pin, a latch-up may occur.
When a latch-up occurs, power supply current increases significantly, which may cause a component to be thermally
destroyed.
• Stabilizing supply voltage
Document Number: 002-04629 Rev. *D
Page 24 of 88
MB95560H Series
MB95570H Series
MB95580H Series
Supply voltage must be stabilized.
A malfunction may occur when power supply voltage fluctuates rapidly even though the fluctuation is within the
guaranteed operating range of the VCC power supply voltage.
As a rule of voltage stabilization, suppress voltage fluctuation so that the fluctuation in VCC ripple (p-p value) at the
commercial frequency (50 Hz/60 Hz) does not exceed 10% of the standard VCC value, and the transient fluctuation
rate does not exceed 0.1 V/ms at a momentary fluctuation such as switching the power supply.
• Notes on using the external clock
When an external clock is used, oscillation stabilization wait time is required for power-on reset, wake-up from subclock
mode or stop mode.
13. Pin Connection
• Treatment of unused pins
If an unused input pin is left unconnected, a component may be permanently damaged due to malfunctions or latchups. Always pull up or pull down an unused input pin through a resistor of at least 2 k. Set an unused input/output
pin to the output state and leave it unconnected, or set it to the input state and treat it the same as an unused input
pin. If there is an unused output pin, leave it unconnected.
• Power supply pins
To reduce unnecessary electro-magnetic emission, prevent malfunctions of strobe signals due to an increase in the
ground level, and conform to the total output current standard, always connect the VCC pin and the VSS pin to the
power supply and ground outside the device. In addition, connect the current supply source to the VCC pin and the
VSS pin with low impedance.
It is also advisable to connect a ceramic capacitor of approximately 0.1 µF as a decoupling capacitor between the
VCC pin and the VSS pin at a location close to this device.
• DBG pin
Connect the DBG pin to an external pull-up resistor of 2 k or above.
After power-on, ensure that the DBG pin does not stay at “L” level until the reset output is released.
The DBG pin becomes a communication pin in debug mode. Since the actual pull-up resistance depends on the tool
used and the interconnection length, refer to the tool document when selecting a pull-up resistor.
• RST pin
Connect the RST pin to an external pull-up resistor of 2 k or above.
To prevent the device from unintentionally entering the reset mode due to noise, minimize the interconnection length
between a pull-up resistor and the RST pin and that between a pull-up resistor and the VCC pin when designing the
layout of the printed circuit board.
The PF2/RST pin functions as the reset input/output pin after power-on. In addition, the reset output of the PF2/RST
pin can be enabled by the RSTOE bit in the SYSC register, and the reset input function and the general purpose I/O
function can be selected by the RSTEN bit in the SYSC register.
• C pin
Use a ceramic capacitor or a capacitor with equivalent frequency characteristics. The decoupling capacitor for the
VCC pin must have a capacitance equal to or larger than the capacitance of CS. For the connection to a decoupling
capacitor CS, see the diagram below. To prevent the device from unintentionally entering a mode to which the device
is not set to transit due to noise, minimize the distance between the C pin and CS and the distance between CS and
the VSS pin when designing the layout of a printed circuit board.
Document Number: 002-04629 Rev. *D
Page 25 of 88
MB95560H Series
MB95570H Series
MB95580H Series
• DBG/RST/C pins connection diagram
DBG
C
RST
Cs
14. Block Diagram (MB95560H Series)
F2MC-8FX CPU
PF2*1/RST*2
Dual operation Flash with
security function
(8/12/20 Kbyte)
Reset with LVD
PF1/X1*2
PF0/X0*2
PG2/X1A*2
Oscillator
circuit
CR
oscillator
RAM (240/496 bytes)
PG1/X0A*2
Interrupt controller
Clock control
On-chip debug
Wild register
P02*3/INT02 to P07*3/INT07
Internal bus
(P12*1/DBG)
(P05*3/TO00)
8/16-bit composite timer ch. 0
(P06*3/TO01)
P12*1/EC0, (P04/EC0)
8/10-bit A/D converter
(P00*3/AN00 to P05*3/AN05)
External interrupt
(P62*3/TO10)
(P02*3/SCK)
(P03*3/SOT)
8/16-bit composite timer ch. 1
LIN-UART
(P63*3/TO11)
P64*3/EC1
(P04/SIN)
C
Port
Port
Vcc
Vss
*1: PF2 and P12 are N-ch open drain pins.
*2: Software option
*3: P00 to P03, P05 to P07 and P62 to P64 are high-current pins.
Note: Pins in parentheses indicate that functions of those pins are shared among different resources.
Document Number: 002-04629 Rev. *D
Page 26 of 88
MB95560H Series
MB95570H Series
MB95580H Series
15. Block Diagram (MB95570H Series)
F2MC-8FX CPU
PF2*1/RST*2
Dual operation Flash with
security function
(8/12/20 Kbyte)
Reset with LVD
RAM (240/496 bytes)
CR oscillator
Clock control
(P12*1/DBG)
On-chip debug
Internal bus
Interrupt controller
(P05*3/TO00)
8/16-bit composite timer ch. 0
(P06*3/TO01)
P12*1/EC0, (P04/EC0)
Wild register
8/10-bit A/D converter
P04/INT04,
P06*3/INT06
P05*3/AN05, (P04/AN04)
External interrupt
C
Port
Port
Vcc
Vss
*1: PF2 and P12 are N-ch open drain pins.
*2: Software option
*3: P05 and P06 are high-current pins.
Note: Pins in parentheses indicate that functions of those pins are shared among different resources.
Document Number: 002-04629 Rev. *D
Page 27 of 88
MB95560H Series
MB95570H Series
MB95580H Series
16. Block Diagram (MB95580H Series)
F2MC-8FX CPU
PF2*1/RST*2
Dual operation Flash with
security function
(8/12/20 Kbyte)
Reset with LVD
PF1/X1*2
PF0/X0*2
PG2/X1A*2
Oscillator
circuit
CR
oscillator
RAM (240/496 bytes)
PG1/X0A*2
Interrupt controller
Clock control
On-chip debug
Wild register
P02*3/INT02
to
P07*3/INT07
Internal bus
(P12*1/DBG)
(P05*3/TO00)
8/16-bit composite timer ch. 0
(P06*3/TO01)
P12*1/EC0, (P04/EC0)
8/10-bit A/D converter
(P01*3/AN01 to P05*3/AN05)
External interrupt
(P02*3/SCK)
(P03*3/SOT)
LIN-UART
(P04/SIN)
C
Port
Port
Vcc
Vss
*1: PF2 and P12 are N-ch open drain pins.
*2: Software option
*3: P01 to P03 and P05 to P07 are high-current pins.
Note: Pins in parentheses indicate that functions of those pins are shared among different resources.
Document Number: 002-04629 Rev. *D
Page 28 of 88
MB95560H Series
MB95570H Series
MB95580H Series
17. CPU Core
• Memory space
The memory space of the MB95560H/570H/580H is 64 Kbyte in size, and consists of an I/O area, a data area, and
a program area. The memory space includes areas intended for specific purposes such as general-purpose registers
and a vector table. The memory maps of the MB95560H/570H/580H are shown below.8
• Memory maps
MB95F562H/F562K/F572H/
F572K/F582H/F582K
MB95F563H/F563K/F573H/
F573K/F583H/F583K
0000H
0000H
I/O area
0080H
0090H
0100H
0180H
Access prohibited
RAM 240 bytes
Register
Access prohibited
0F80H
Flash 4 Kbyte
Access prohibited
F000H
FFFFH
Access prohibited
Flash 4 Kbyte
Document Number: 002-04629 Rev. *D
I/O area
0F80H
C000H
Access prohibited
Extension I/O area
1000H
Access prohibited
B000H
Access prohibited
RAM 496 bytes
Register
0200H
0280H
Extension I/O area
1000H
Access prohibited
C000H
Access prohibited
RAM 496 bytes
0080H
0090H
0100H
Register
0200H
0280H
Extension I/O area
B000H
0000H
I/O area
0080H
0090H
0100H
0F80H
1000H
MB95F564H/F564K/F574H/
F574K/F584H/F584K
Flash 4 Kbyte
Access prohibited
B000H
Access prohibited
Flash 20 Kbyte
E000H
Flash 8 Kbyte
FFFFH
FFFFH
Page 29 of 88
MB95560H Series
MB95570H Series
MB95580H Series
18. I/O Map (MB95560H Series)
Address
0000H
0001H
0002H
0003H
0004H
0005H
0006H
0007H
0008H
0009H
000AH
000BH
000CH
000DH
000EH
000FH
to
0015H
0016H
0017H
0018H
to
0027H
0028H
0029H
002AH
002BH
002CH
002DH
to
0032H
0033H
0034H
0035H
0036H
0037H
0038H
0039H
003AH
to
0048H
Register
abbreviation
PDR0
DDR0
PDR1
DDR1
—
WATR
PLLC
SYCC
STBC
RSRR
TBTC
WPCR
WDTC
SYCC2
STBC2
Register name
Port 0 data register
Port 0 direction register
Port 1 data register
Port 1 direction register
(Disabled)
Oscillation stabilization wait time setting register
PLL control register
System clock control register
Standby control register
Reset source register
Time-base timer control register
Watch prescaler control register
Watchdog timer control register
System clock control register 2
Standby control register 2
—
PDR6
DDR6
(Disabled)
Port 6 data register
Port 6 direction register
—
PDRF
DDRF
PDRG
DDRG
PUL0
(Disabled)
Port F data register
Port F direction register
Port G data register
Port G direction register
Port 0 pull-up register
—
PUL6
—
PULG
T01CR1
T00CR1
T11CR1
T10CR1
(Disabled)
Port 6 pull-up register
(Disabled)
Port G pull-up register
8/16-bit composite timer 01 status control register 1
8/16-bit composite timer 00 status control register 1
8/16-bit composite timer 11 status control register 1
8/16-bit composite timer 10 status control register 1
—
Document Number: 002-04629 Rev. *D
(Disabled)
R/W Initial value
R/W 00000000B
R/W 00000000B
R/W 00000000B
R/W 00000000B
—
—
R/W 11111111B
R/W 000X0000B
R/W XXX11011B
R/W 00000000B
R/W 000XXXXXB
R/W 00000000B
R/W 00000000B
R/W 00XX0000B
R/W XXXX0011B
R/W 00000000B
—
—
R/W
R/W
00000000B
00000000B
—
—
R/W
R/W
R/W
R/W
R/W
00000000B
00000000B
00000000B
00000000B
00000000B
—
—
R/W
—
R/W
R/W
R/W
R/W
R/W
00000000B
—
00000000B
00000000B
00000000B
00000000B
00000000B
—
—
Page 30 of 88
MB95560H Series
MB95570H Series
MB95580H Series
Address
0049H
004AH
004BH
004CH,
004DH
004EH
004FH
0050H
0051H
0052H
0053H
Register
Register name
abbreviation
EIC10
External interrupt circuit control register ch. 2/ch. 3
EIC20
External interrupt circuit control register ch. 4/ch. 5
EIC30
External interrupt circuit control register ch. 6/ch. 7
—
LVDR
—
SCR
SMR
SSR
RDR
TDR
ESCR
ECCR
0054H
0055H
0056H
to
006BH
006CH
006DH
006EH
006FH
0070H
0071H
0072H
0073H
0074H
0075H
0076H
0077H
ADC1
ADC2
ADDH
ADDL
—
FSR2
FSR
SWRE0
FSR3
FSR4
WREN
WROR
0078H
—
0079H
007AH
007BH
007CH
007DH
007EH
007FH
0F80H
0F81H
0F82H
ILR0
ILR1
ILR2
ILR3
ILR4
ILR5
—
WRARH0
WRARL0
WRDR0
(Disabled)
LVDR reset voltage selection ID register
(Disabled)
LIN-UART serial control register
LIN-UART serial mode register
LIN-UART serial status register
LIN-UART receive data register
LIN-UART transmit data register
LIN-UART extended status control register
LIN-UART extended communication control register
—
(Disabled)
8/10-bit A/D converter control register 1
8/10-bit A/D converter control register 2
8/10-bit A/D converter data register (upper)
8/10-bit A/D converter data register (lower)
(Disabled)
Flash memory status register 2
Flash memory status register
Flash memory sector write control register 0
Flash memory status register 3
Flash memory status register 4
Wild register address compare enable register
Wild register data test setting register
Mirror of register bank pointer (RP) and direct bank pointer
(DP)
Interrupt level setting register 0
Interrupt level setting register 1
Interrupt level setting register 2
Interrupt level setting register 3
Interrupt level setting register 4
Interrupt level setting register 5
(Disabled)
Wild register address setting register (upper) ch. 0
Wild register address setting register (lower) ch. 0
Wild register data setting register ch. 0
Document Number: 002-04629 Rev. *D
R/W Initial value
R/W
R/W
R/W
00000000B
00000000B
00000000B
—
—
R/W
—
R/W
R/W
R/W
R/W
R/W
R/W
R/W
00000000B
—
00000000B
00000000B
00001000B
00000000B
00000000B
00000100B
000000XXB
—
—
R/W 00000000B
R/W 00000000B
R/W 00000000B
R/W 00000000B
—
—
R/W 00000000B
R/W 000X0000B
R/W 00000000B
R
000XXXXXB
R/W 00000000B
R/W 00000000B
R/W 00000000B
—
—
R/W
R/W
R/W
R/W
R/W
R/W
—
R/W
R/W
R/W
11111111B
11111111B
11111111B
11111111B
11111111B
11111111B
—
00000000B
00000000B
00000000B
Page 31 of 88
MB95560H Series
MB95570H Series
MB95580H Series
Address
Register
abbreviation
0F83H
WRARH1
Wild register address setting register (upper) ch. 1
R/W
00000000B
0F84H
WRARL1
Wild register address setting register (lower) ch. 1
R/W
00000000B
0F85H
WRDR1
Wild register data setting register ch. 1
R/W
00000000B
0F86H
WRARH2
Wild register address setting register (upper) ch. 2
R/W
00000000B
0F87H
WRARL2
Wild register address setting register (lower) ch. 2
R/W
00000000B
0F88H
WRDR2
Wild register data setting register ch. 2
R/W
00000000B
0F89H
to
0F91H
—
—
—
0F92H
T01CR0
8/16-bit composite timer 01 status control register 0
R/W
00000000B
0F93H
T00CR0
8/16-bit composite timer 00 status control register 0
R/W
00000000B
0F94H
T01DR
8/16-bit composite timer 01 data register
R/W
00000000B
0F95H
T00DR
8/16-bit composite timer 00 data register
R/W
00000000B
0F96H
TMCR0
8/16-bit composite timer 00/01 timer mode control register
R/W
00000000B
0F97H
T11CR0
8/16-bit composite timer 11 status control register 0
R/W
00000000B
0F98H
T10CR0
8/16-bit composite timer 10 status control register 0
R/W
00000000B
0F99H
T11DR
8/16-bit composite timer 11 data register
R/W
00000000B
0F9AH
T10DR
8/16-bit composite timer 10 data register
R/W
00000000B
0F9BH
TMCR1
8/16-bit composite timer 10/11 timer mode control register
R/W
00000000B
0F9CH
to
0FBBH
—
—
—
0FBCH
BGR1
LIN-UART baud rate generator register 1
R/W
00000000B
0FBDH
BGR0
LIN-UART baud rate generator register 0
R/W
00000000B
0FBEH
to
0FC2H
—
—
—
0FC3H
AIDRL
R/W
00000000B
0FC4H
to
0FE3H
—
—
—
0FE4H
CRTH
Main CR clock trimming register (upper)
R/W 000XXXXXB
0FE5H
CRTL
Main CR clock trimming register (lower)
R/W 000XXXXXB
0FE6H
—
0FE7H
CRTDA
0FE8H
Register name
(Disabled)
(Disabled)
(Disabled)
A/D input disable register (lower)
(Disabled)
(Disabled)
R/W Initial value
—
—
Main CR clock temperature dependent adjustment register
R/W 000XXXXXB
SYSC
System configuration register
R/W
11000011B
0FE9H
CMCR
Clock monitoring control register
R/W
00000000B
0FEAH
CMDR
Clock monitoring data register
R
00000000B
Document Number: 002-04629 Rev. *D
Page 32 of 88
MB95560H Series
MB95570H Series
MB95580H Series
Address
Register
abbreviation
0FEBH
WDTH
Watchdog timer selection ID register (upper)
R
XXXXXXXXB
0FECH
WDTL
Watchdog timer selection ID register (lower)
R
XXXXXXXXB
0FEDH
to
0FFFH
—
—
—
Register name
(Disabled)
R/W Initial value
• R/W access symbols
R/W : Readable / Writable
R
: Read only
• Initial value symbols
0
: The initial value of this bit is “0”.
1
: The initial value of this bit is “1”.
X
: The initial value of this bit is undefined.
Note: Do not write to an address that is “(Disabled)”. If a “(Disabled)” address is read, an indeterminate value is returned.
Document Number: 002-04629 Rev. *D
Page 33 of 88
MB95560H Series
MB95570H Series
MB95580H Series
19. I/O Map (MB95570H Series)
Address
0000H
0001H
0002H
0003H
0004H
0005H
0006H
0007H
0008H
0009H
000AH
000BH
000CH
000DH
000EH
000FH
to
0027H
0028H
0029H
002AH,
002BH
002CH
002DH
to
0035H
0036H
0037H
0038H
to
0049H
004AH
004BH
004CH,
004DH
004EH
004FH
to
006BH
Register
abbreviation
PDR0
DDR0
PDR1
DDR1
—
WATR
PLLC
SYCC
STBC
RSRR
TBTC
WPCR
WDTC
SYCC2
STBC2
Register name
Port 0 data register
Port 0 direction register
Port 1 data register
Port 1 direction register
(Disabled)
Oscillation stabilization wait time setting register
PLL control register
System clock control register
Standby control register
Reset source register
Time-base timer control register
Watch prescaler control register
Watchdog timer control register
System clock control register 2
Standby control register 2
—
PDRF
DDRF
(Disabled)
Port F data register
Port F direction register
—
PUL0
(Disabled)
Port 0 pull-up register
—
T01CR1
T00CR1
(Disabled)
8/16-bit composite timer 01 status control register 1
8/16-bit composite timer 00 status control register 1
—
EIC20
EIC30
(Disabled)
External interrupt circuit control register ch. 4/ch. 5
External interrupt circuit control register ch. 6/ch. 7
—
LVDR
(Disabled)
LVDR reset voltage selection ID register
—
Document Number: 002-04629 Rev. *D
(Disabled)
R/W Initial value
R/W 00000000B
R/W 00000000B
R/W 00000000B
R/W 00000000B
—
—
R/W 11111111B
R/W 000X0000B
R/W XXX11011B
R/W 00000000B
R/W 000XXXXXB
R/W 00000000B
R/W 00000000B
R/W 00XX0000B
R/W XXXX0011B
R/W 00000000B
—
—
R/W
R/W
00000000B
00000000B
—
—
R/W
00000000B
—
—
R/W
R/W
00000000B
00000000B
—
—
R/W
R/W
00000000B
00000000B
—
—
R/W
00000000B
—
—
Page 34 of 88
MB95560H Series
MB95570H Series
MB95580H Series
006CH
006DH
006EH
006FH
0070H
0071H
0072H
0073H
0074H
0075H
0076H
0077H
Register
abbreviation
ADC1
ADC2
ADDH
ADDL
—
FSR2
FSR
SWRE0
FSR3
FSR4
WREN
WROR
0078H
—
0079H
007AH
007BH,
007CH
007DH
007EH
007FH
0F80H
0F81H
0F82H
0F83H
0F84H
0F85H
0F86H
0F87H
0F88H
0F89H
to
0F91H
0F92H
0F93H
0F94H
0F95H
0F96H
0F97H
to
0FC2H
ILR0
ILR1
Address
Register name
8/10-bit A/D converter control register 1
8/10-bit A/D converter control register 2
8/10-bit A/D converter data register (upper)
8/10-bit A/D converter data register (lower)
(Disabled)
Flash memory status register 2
Flash memory status register
Flash memory sector write control register 0
Flash memory status register 3
Flash memory status register 4
Wild register address compare enable register
Wild register data test setting register
Mirror of register bank pointer (RP) and direct bank pointer
(DP)
Interrupt level setting register 0
Interrupt level setting register 1
—
ILR4
ILR5
—
WRARH0
WRARL0
WRDR0
WRARH1
WRARL1
WRDR1
WRARH2
WRARL2
WRDR2
(Disabled)
Interrupt level setting register 4
Interrupt level setting register 5
(Disabled)
Wild register address setting register (upper) ch. 0
Wild register address setting register (lower) ch. 0
Wild register data setting register ch. 0
Wild register address setting register (upper) ch. 1
Wild register address setting register (lower) ch. 1
Wild register data setting register ch. 1
Wild register address setting register (upper) ch. 2
Wild register address setting register (lower) ch. 2
Wild register data setting register ch. 2
—
T01CR0
T00CR0
T01DR
T00DR
TMCR0
(Disabled)
8/16-bit composite timer 01 status control register 0
8/16-bit composite timer 00 status control register 0
8/16-bit composite timer 01 data register
8/16-bit composite timer 00 data register
8/16-bit composite timer 00/01 timer mode control register
—
Document Number: 002-04629 Rev. *D
(Disabled)
R/W Initial value
R/W 00000000B
R/W 00000000B
R/W 00000000B
R/W 00000000B
—
—
R/W 00000000B
R/W 000X0000B
R/W 00000000B
R
000XXXXXB
R/W 00000000B
R/W 00000000B
R/W 00000000B
—
—
R/W
R/W
11111111B
11111111B
—
—
R/W
R/W
—
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
11111111B
11111111B
—
00000000B
00000000B
00000000B
00000000B
00000000B
00000000B
00000000B
00000000B
00000000B
—
—
R/W
R/W
R/W
R/W
R/W
00000000B
00000000B
00000000B
00000000B
00000000B
—
—
Page 35 of 88
MB95560H Series
MB95570H Series
MB95580H Series
Address
Register
abbreviation
0FC3H
AIDRL
0FC4H
to
0FE3H
—
0FE4H
CRTH
Main CR clock trimming register (upper)
R/W 000XXXXXB
0FE5H
CRTL
Main CR clock trimming register (lower)
R/W 000XXXXXB
0FE6H
—
0FE7H
CRTDA
0FE8H
Register name
A/D input disable register (lower)
(Disabled)
(Disabled)
R/W Initial value
R/W
00000000B
—
—
—
—
Main CR clock temperature dependent adjustment register
R/W 000XXXXXB
SYSC
System configuration register
R/W
11000011B
0FE9H
CMCR
Clock monitoring control register
R/W
00000000B
0FEAH
CMDR
Clock monitoring data register
R
00000000B
0FEBH
WDTH
Watchdog timer selection ID register (upper)
R
XXXXXXXXB
0FECH
WDTL
Watchdog timer selection ID register (lower)
R
XXXXXXXXB
0FEDH
to
0FFFH
—
—
—
(Disabled)
• R/W access symbols
R/W : Readable / Writable
R
: Read only
• Initial value symbols
0
: The initial value of this bit is “0”.
1
: The initial value of this bit is “1”.
X
: The initial value of this bit is undefined.
Note: Do not write to an address that is “(Disabled)”. If a “(Disabled)” address is read, an indeterminate value is returned.
Document Number: 002-04629 Rev. *D
Page 36 of 88
MB95560H Series
MB95570H Series
MB95580H Series
20. I/O Map (MB95580H Series)
Address
0000H
0001H
0002H
0003H
0004H
0005H
0006H
0007H
0008H
0009H
000AH
000BH
000CH
000DH
000EH
000FH
to
0027H
0028H
0029H
002AH
002BH
002CH
002DH
to
0034H
0035H
0036H
0037H
0038H
to
0048H
0049H
004AH
004BH
004CH,
004DH
004EH
004FH
Register
abbreviation
PDR0
DDR0
PDR1
DDR1
—
WATR
PLLC
SYCC
STBC
RSRR
TBTC
WPCR
WDTC
SYCC2
STBC2
Register name
Port 0 data register
Port 0 direction register
Port 1 data register
Port 1 direction register
(Disabled)
Oscillation stabilization wait time setting register
PLL control register
System clock control register
Standby control register
Reset source register
Time-base timer control register
Watch prescaler control register
Watchdog timer control register
System clock control register 2
Standby control register 2
—
PDRF
DDRF
PDRG
DDRG
PUL0
(Disabled)
Port F data register
Port F direction register
Port G data register
Port G direction register
Port 0 pull-up register
—
PULG
T01CR1
T00CR1
(Disabled)
Port G pull-up register
8/16-bit composite timer 01 status control register 1
8/16-bit composite timer 00 status control register 1
—
EIC10
EIC20
EIC30
(Disabled)
External interrupt circuit control register ch. 2/ch. 3
External interrupt circuit control register ch. 4/ch. 5
External interrupt circuit control register ch. 6/ch. 7
—
LVDR
—
(Disabled)
LVDR reset voltage selection ID register
(Disabled)
Document Number: 002-04629 Rev. *D
R/W Initial value
R/W 00000000B
R/W 00000000B
R/W 00000000B
R/W 00000000B
—
—
R/W 11111111B
R/W 000X0000B
R/W XXX11011B
R/W 00000000B
R/W 000XXXXXB
R/W 00000000B
R/W 00000000B
R/W 00XX0000B
R/W XXXX0011B
R/W 00000000B
—
—
R/W
R/W
R/W
R/W
R/W
00000000B
00000000B
00000000B
00000000B
00000000B
—
—
R/W
R/W
R/W
00000000B
00000000B
00000000B
—
—
R/W
R/W
R/W
00000000B
00000000B
00000000B
—
—
R/W
—
00000000B
—
Page 37 of 88
MB95560H Series
MB95570H Series
MB95580H Series
Address
0050H
0051H
0052H
0053H
0054H
0055H
0056H
to
006BH
006CH
006DH
006EH
006FH
0070H
0071H
0072H
0073H
0074H
0075H
0076H
0077H
Register
abbreviation
SCR
SMR
SSR
RDR
TDR
ESCR
ECCR
Register name
LIN-UART serial control register
LIN-UART serial mode register
LIN-UART serial status register
LIN-UART receive data register
LIN-UART transmit data register
LIN-UART extended status control register
LIN-UART extended communication control register
—
ADC1
ADC2
ADDH
ADDL
—
FSR2
FSR
SWRE0
FSR3
FSR4
WREN
WROR
0078H
—
0079H
007AH
007BH
007CH
007DH
007EH
007FH
0F80H
0F81H
0F82H
0F83H
0F84H
0F85H
0F86H
0F87H
0F88H
ILR0
ILR1
ILR2
—
ILR4
ILR5
—
WRARH0
WRARL0
WRDR0
WRARH1
WRARL1
WRDR1
WRARH2
WRARL2
WRDR2
(Disabled)
8/10-bit A/D converter control register 1
8/10-bit A/D converter control register 2
8/10-bit A/D converter data register (upper)
8/10-bit A/D converter data register (lower)
(Disabled)
Flash memory status register 2
Flash memory status register
Flash memory sector write control register 0
Flash memory status register 3
Flash memory status register 4
Wild register address compare enable register
Wild register data test setting register
Mirror of register bank pointer (RP) and direct bank pointer
(DP)
Interrupt level setting register 0
Interrupt level setting register 1
Interrupt level setting register 2
(Disabled)
Interrupt level setting register 4
Interrupt level setting register 5
(Disabled)
Wild register address setting register (upper) ch. 0
Wild register address setting register (lower) ch. 0
Wild register data setting register ch. 0
Wild register address setting register (upper) ch. 1
Wild register address setting register (lower) ch. 1
Wild register data setting register ch. 1
Wild register address setting register (upper) ch. 2
Wild register address setting register (lower) ch. 2
Wild register data setting register ch. 2
Document Number: 002-04629 Rev. *D
R/W Initial value
R/W
R/W
R/W
R/W
R/W
R/W
R/W
00000000B
00000000B
00001000B
00000000B
00000000B
00000100B
000000XXB
—
—
R/W 00000000B
R/W 00000000B
R/W 00000000B
R/W 00000000B
—
—
R/W 00000000B
R/W 000X0000B
R/W 00000000B
R
000XXXXXB
R/W 00000000B
R/W 00000000B
R/W 00000000B
—
—
R/W
R/W
R/W
—
R/W
R/W
—
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
11111111B
11111111B
11111111B
—
11111111B
11111111B
—
00000000B
00000000B
00000000B
00000000B
00000000B
00000000B
00000000B
00000000B
00000000B
Page 38 of 88
MB95560H Series
MB95570H Series
MB95580H Series
Address
0F89H
to
0F91H
0F92H
0F93H
0F94H
0F95H
0F96H
0F97H
to
0FBBH
0FBCH
0FBDH
0FBEH
to
0FC2H
0FC3H
0FC4H
to
0FE3H
0FE4H
0FE5H
0FE6H
0FE7H
0FE8H
0FE9H
0FEAH
0FEBH
0FECH
0FEDH
to
0FFFH
Register
abbreviation
Register name
—
(Disabled)
T01CR0
T00CR0
T01DR
T00DR
TMCR0
8/16-bit composite timer 01 status control register 0
8/16-bit composite timer 00 status control register 0
8/16-bit composite timer 01 data register
8/16-bit composite timer 00 data register
8/16-bit composite timer 00/01 timer mode control register
—
BGR1
BGR0
(Disabled)
LIN-UART baud rate generator register 1
LIN-UART baud rate generator register 0
—
AIDRL
(Disabled)
A/D input disable register (lower)
—
CRTH
CRTL
—
CRTDA
SYSC
CMCR
CMDR
WDTH
WDTL
(Disabled)
Main CR clock trimming register (upper)
Main CR clock trimming register (lower)
(Disabled)
Main CR clock temperature dependent adjustment register
System configuration register
Clock monitoring control register
Clock monitoring data register
Watchdog timer selection ID register (upper)
Watchdog timer selection ID register (lower)
—
(Disabled)
R/W Initial value
—
—
R/W
R/W
R/W
R/W
R/W
00000000B
00000000B
00000000B
00000000B
00000000B
—
—
R/W
R/W
00000000B
00000000B
—
—
R/W
00000000B
—
—
R/W
R/W
—
R/W
R/W
R/W
R
R
R
000XXXXXB
000XXXXXB
—
000XXXXXB
11000011B
00000000B
00000000B
XXXXXXXXB
XXXXXXXXB
—
—
• R/W access symbols
R/W : Readable / Writable
R
: Read only
• Initial value symbols
0
: The initial value of this bit is “0”.
1
: The initial value of this bit is “1”.
X
: The initial value of this bit is undefined.
Note: Do not write to an address that is “(Disabled)”. If a “(Disabled)” address is read, an indeterminate value is returned.
Document Number: 002-04629 Rev. *D
Page 39 of 88
MB95560H Series
MB95570H Series
MB95580H Series
21. Interrupt Source Table (MB95560H Series)
Interrupt source
Interrupt
request
number
Vector table address
Upper
Lower
Priority order of
Bit name of interrupt sources
interrupt level of the same level
(occurring
setting register
simultaneously)
External interrupt ch. 4
IRQ00
FFFAH
FFFBH
L00 [1:0]
External interrupt ch. 5
IRQ01
FFF8H
FFF9H
L01 [1:0]
IRQ02
FFF6H
FFF7H
L02 [1:0]
IRQ03
FFF4H
FFF5H
L03 [1:0]
IRQ04
FFF2H
FFF3H
L04 [1:0]
8/16-bit composite timer ch. 0
(lower)
IRQ05
FFF0H
FFF1H
L05 [1:0]
8/16-bit composite timer ch. 0
(upper)
IRQ06
FFEEH
FFEFH
L06 [1:0]
LIN-UART (reception)
IRQ07
FFECH
FFEDH
L07 [1:0]
LIN-UART (transmission)
IRQ08
FFEAH
FFEBH
L08 [1:0]
—
IRQ09
FFE8H
FFE9H
L09 [1:0]
—
IRQ10
FFE6H
FFE7H
L10 [1:0]
—
IRQ11
FFE4H
FFE5H
L11 [1:0]
—
IRQ12
FFE2H
FFE3H
L12 [1:0]
—
IRQ13
FFE0H
FFE1H
L13 [1:0]
IRQ14
FFDEH
FFDFH
L14 [1:0]
—
IRQ15
FFDCH
FFDDH
L15 [1:0]
—
IRQ16
FFDAH
FFDBH
L16 [1:0]
—
IRQ17
FFD8H
FFD9H
L17 [1:0]
8/10-bit A/D converter
IRQ18
FFD6H
FFD7H
L18 [1:0]
Time-base timer
IRQ19
FFD4H
FFD5H
L19 [1:0]
Watch prescaler
IRQ20
FFD2H
FFD3H
L20 [1:0]
IRQ21
FFD0H
FFD1H
L21 [1:0]
8/16-bit composite timer ch. 1
(lower)
IRQ22
FFCEH
FFCFH
L22 [1:0]
Flash memory
IRQ23
FFCCH
FFCDH
L23 [1:0]
External interrupt ch. 2
External interrupt ch. 6
External interrupt ch. 3
External interrupt ch. 7
—
8/16-bit composite timer ch. 1
(upper)
—
Document Number: 002-04629 Rev. *D
High
Low
Page 40 of 88
MB95560H Series
MB95570H Series
MB95580H Series
22. Interrupt Source Table (MB95570H Series)
Interrupt source
Interrupt
request
number
Vector table address
Priority order of
Bit name of interrupt sources
interrupt level of the same level
(occurring
setting register
simultaneously)
Upper
Lower
IRQ00
FFFAH
FFFBH
L00 [1:0]
IRQ01
FFF8H
FFF9H
L01 [1:0]
IRQ02
FFF6H
FFF7H
L02 [1:0]
IRQ03
FFF4H
FFF5H
L03 [1:0]
IRQ04
FFF2H
FFF3H
L04 [1:0]
8/16-bit composite timer ch. 0
(lower)
IRQ05
FFF0H
FFF1H
L05 [1:0]
8/16-bit composite timer ch. 0
(upper)
IRQ06
FFEEH
FFEFH
L06 [1:0]
—
IRQ07
FFECH
FFEDH
L07 [1:0]
—
IRQ08
FFEAH
FFEBH
L08 [1:0]
—
IRQ09
FFE8H
FFE9H
L09 [1:0]
—
IRQ10
FFE6H
FFE7H
L10 [1:0]
—
IRQ11
FFE4H
FFE5H
L11 [1:0]
—
IRQ12
FFE2H
FFE3H
L12 [1:0]
—
IRQ13
FFE0H
FFE1H
L13 [1:0]
—
IRQ14
FFDEH
FFDFH
L14 [1:0]
—
IRQ15
FFDCH
FFDDH
L15 [1:0]
—
IRQ16
FFDAH
FFDBH
L16 [1:0]
—
IRQ17
FFD8H
FFD9H
L17 [1:0]
8/10-bit A/D converter
IRQ18
FFD6H
FFD7H
L18 [1:0]
Time-base timer
IRQ19
FFD4H
FFD5H
L19 [1:0]
Watch prescaler
IRQ20
FFD2H
FFD3H
L20 [1:0]
—
IRQ21
FFD0H
FFD1H
L21 [1:0]
—
IRQ22
FFCEH
FFCFH
L22 [1:0]
IRQ23
FFCCH
FFCDH
L23 [1:0]
External interrupt ch. 4
—
—
External interrupt ch. 6
—
—
—
Flash memory
Document Number: 002-04629 Rev. *D
High
Low
Page 41 of 88
MB95560H Series
MB95570H Series
MB95580H Series
23. Interrupt Source Table (MB95580H Series)
Interrupt source
Interrupt
request
number
Vector table address
Upper
Lower
Priority order of
Bit name of interrupt sources
interrupt level of the same level
(occurring
setting register
simultaneously)
External interrupt ch. 4
IRQ00
FFFAH
FFFBH
L00 [1:0]
External interrupt ch. 5
IRQ01
FFF8H
FFF9H
L01 [1:0]
IRQ02
FFF6H
FFF7H
L02 [1:0]
IRQ03
FFF4H
FFF5H
L03 [1:0]
IRQ04
FFF2H
FFF3H
L04 [1:0]
8/16-bit composite timer ch. 0
(lower)
IRQ05
FFF0H
FFF1H
L05 [1:0]
8/16-bit composite timer ch. 0
(upper)
IRQ06
FFEEH
FFEFH
L06 [1:0]
LIN-UART (reception)
IRQ07
FFECH
FFEDH
L07 [1:0]
LIN-UART (transmission)
IRQ08
FFEAH
FFEBH
L08 [1:0]
—
IRQ09
FFE8H
FFE9H
L09 [1:0]
—
IRQ10
FFE6H
FFE7H
L10 [1:0]
—
IRQ11
FFE4H
FFE5H
L11 [1:0]
—
IRQ12
FFE2H
FFE3H
L12 [1:0]
—
IRQ13
FFE0H
FFE1H
L13 [1:0]
—
IRQ14
FFDEH
FFDFH
L14 [1:0]
—
IRQ15
FFDCH
FFDDH
L15 [1:0]
—
IRQ16
FFDAH
FFDBH
L16 [1:0]
—
IRQ17
FFD8H
FFD9H
L17 [1:0]
8/10-bit A/D converter
IRQ18
FFD6H
FFD7H
L18 [1:0]
Time-base timer
IRQ19
FFD4H
FFD5H
L19 [1:0]
Watch prescaler
IRQ20
FFD2H
FFD3H
L20 [1:0]
—
IRQ21
FFD0H
FFD1H
L21 [1:0]
—
IRQ22
FFCEH
FFCFH
L22 [1:0]
IRQ23
FFCCH
FFCDH
L23 [1:0]
External interrupt ch. 2
External interrupt ch. 6
External interrupt ch. 3
External interrupt ch. 7
—
Flash memory
Document Number: 002-04629 Rev. *D
High
Low
Page 42 of 88
MB95560H Series
MB95570H Series
MB95580H Series
24. Electrical Characteristics
24.1 Absolute Maximum Ratings
Parameter
Symbol
Power supply voltage*1
Input voltage*
1
Output voltage*
1
Maximum clamp current
Total maximum clamp
current
“L” level maximum
output current
Rating
VCC
VSS  0.3
VSS  6
V
VI
VSS  0.3
VSS  6
V
*2
VO
VSS  0.3
VSS  6
V
*2
ICLAMP
2
2
mA
Applicable to specific pins*3
|ICLAMP|
—
20
mA
Applicable to specific pins*3
IOL
—
15
mA
4
—
“L” level average current
IOLAV2
“L” level total average
output current
“H” level maximum
output current
mA
IOL
—
100
mA
IOLAV
—
50
mA
IOH
—
15
mA
“H” level average
current
4
—
mA
IOH
—
100
mA
IOHAV
—
50
mA
Power consumption
Pd
—
320
mW
Operating temperature
TA
40
85
°C
Storage temperature
Tstg
55
150
°C
“H” level total average
output current
Total average output current=
operating current  operating ratio
(Total number of pins)
Other than P00 to P03, P05 to P07, P62 to
P64*4
Average output current=
operating current  operating ratio (1 pin)
P00 to P03, P05 to P07, P62 to P64*4
Average output current=
operating current  operating ratio (1 pin)
8
IOHAV2
Other than P00 to P03, P05 to P07, P62 to
P64*4
Average output current=
operating current  operating ratio (1 pin)
P00 to P03, P05 to P07, P62 to P64*4
Average output current=
operating current  operating ratio (1 pin)
12
IOHAV1
“H” level total maximum
output current
Remarks
Max
IOLAV1
“L” level total maximum
output current
Unit
Min
Total average output current=
operating current  operating ratio
(Total number of pins)
*1: These parameters are based on the condition that VSS is 0.0 V.
Document Number: 002-04629 Rev. *D
Page 43 of 88
MB95560H Series
MB95570H Series
MB95580H Series
*2: VI and VO must not exceed VCC  0.3 V. VI must not exceed the rated voltage. However, if the maximum current to/
from an input is limited by means of an external component, the ICLAMP rating is used instead of the VI rating.
*3: Applicable to the following pins: P00 to P07, P62 to P64, PF0, PF1, PG1, PG2 (P00, and P62 to P64 are only available
on MB95F562H/F562K/F563H/F563K/F564H/F564K. P01, P02, P03, P07, PF0. PF1, PG1, and PG2 are only available on MB95F562H/F562K/F563H/F563K/F564H/F564K/F582H/F582K/F583H/F583K/F584H/F584K.)
• Use under recommended operating conditions.
• Use with DC voltage (current).
• The HV (High Voltage) signal is an input signal exceeding the VCC voltage. Always connect a limiting resistor between
the HV (High Voltage) signal and the microcontroller before applying the HV (High Voltage) signal.
• The value of the limiting resistor should be set to a value at which the current to be input to the microcontroller pin
when the HV (High Voltage) signal is input is below the standard value, irrespective of whether the current is transient
current or stationary current.
• When the microcontroller drive current is low, such as in low power consumption modes, the HV (High Voltage)
input potential may pass through the protective diode to increase the potential of the VCC pin, affecting other devices.
• If the HV (High Voltage) signal is input when the microcontroller power supply is off (not fixed at 0 V), since power
is supplied from the pins, incomplete operations may be executed.
• If the HV (High Voltage) input is input after power-on, since power is supplied from the pins, the voltage of power
supply may not be sufficient to enable a power-on reset.
• Do not leave the HV (High Voltage) input pin unconnected.
• Example of a recommended circuit:
• Input/Output equivalent circuit
Protective diode
VCC
P-ch
Limiting
resistor
HV(High Voltage) input (0 V to 16 V)
N-ch
R
*4: P62 and P63 are only available on MB95F562H/F562K/F563H/F563K/F564H/F564K.
WARNING: Semiconductor devices may be permanently damaged by application of stress (including, without
limitation, voltage, current or temperature) in excess of absolute maximum ratings.
Do not exceed any of these ratings.
Document Number: 002-04629 Rev. *D
Page 44 of 88
MB95560H Series
MB95570H Series
MB95580H Series
24.2 Recommended Operating Conditions
Parameter
Power supply
voltage
Symbol
VCC
Decoupling
capacitor
CS
Operating
temperature
TA
Value
Min
Max
2.4*1, *2
5.5*1
2.3
5.5
2.9
5.5
2.3
5.5
0.022
1
40
85
5
35
(VSS = 0.0 V)
Unit
Remarks
In normal operation
V
Other than on-chip debug
Hold condition in stop mode mode
In normal operation
Hold condition in stop mode
On-chip debug mode
µF *3
°C
Other than on-chip debug mode
On-chip debug mode
*1: The value varies depending on the operating frequency, the machine clock and the analog guaranteed range.
*2: The minimum power supply voltage becomes 2.88 V when a product with the low-voltage detection reset is used.
*3: Use a ceramic capacitor or a capacitor with equivalent frequency characteristics. The decoupling capacitor for the
VCC pin must have a capacitance equal to or larger than the capacitance of CS. For the connection to a decoupling
capacitor CS, see the diagram below. To prevent the device from unintentionally entering an unknown mode due to
noise, minimize the distance between the C pin and CS and the distance between CS and the VSS pin when designing
the layout of a printed circuit board.
• DBG / RST / C pins connection diagram
*
DBG
C
RST
Cs
*: Connect the DBG pin to an external pull-up resistor of 2 k or above. After power-on, ensure that the
DBG pin does not stay at “L” level until the reset output is released. The DBG pin becomes a communication pin in debug mode. Since the actual pull-up resistance depends on the tool used and the
interconnection length, refer to the tool document when selecting a pull-up resistor.
WARNING: The recommended operating conditions are required in order to ensure the normal operation of the
semiconductor device. All of the device's electrical characteristics are warranted when the device is
operated under these conditions.
Any use of semiconductor devices will be under their recommended operating condition.
Operation under any conditions other than these conditions may adversely affect reliability of device and
could result in device failure.
No warranty is made with respect to any use, operating conditions or combinations not represented on this
data sheet. If you are considering application under any conditions other than listed herein, please contact
sales representatives beforehand.
Document Number: 002-04629 Rev. *D
Page 45 of 88
MB95560H Series
MB95570H Series
MB95580H Series
24.3 DC Characteristics
Parameter Symbol
(VCC = 5.0 V  10%, VSS = 0.0 V, TA = 40 °C to 85 °C)
Pin name
Open-drain
output
application
voltage
“H” level
output
voltage
“L” level
output
voltage
Input leak
current (Hi-Z
output leak
current)
Internal
pull-up
resistor
Input
capacitance
Unit
Remarks
Min
Typ
Max
—
0.7 VCC
—
VCC  0.3
V
Hysteresis input
P04
VIHS
P00* to P03* ,
P05 to P07*4,
P12,
P62 to P64*3,
PF0*4, PF1*4,
PG1*4, PG2*4
—
0.8 VCC
—
VCC  0.3
V
Hysteresis input
VIHM
PF2
—
0.8 VCC
—
VCC  0.3
V
Hysteresis input
VIL
P04
—
VSS  0.3
—
0.3 VCC
V
Hysteresis input
VILS
P00* to P03* ,
P05 to P07*4,
P12,
P62 to P64*3,
PF0*4, PF1*4,
PG1*4, PG2*4
—
VSS  0.3
—
0.2 VCC
V
Hysteresis input
VILM
PF2
—
VSS  0.3
—
0.2 VCC
V
Hysteresis input
VD
P12, PF2
—
VSS  0.3
—
VSS  5.5
V
3
“L” level
input voltage
Value
VIH
3
"H" level
input voltage
Condition
4
4
VOH1
P04, PF0*4,
PF1*4, PG1*4,
PG2
IOH = 4 mA
VCC  0.5
—
—
V
VOH2
P00*3 to P03*4,
P05 to P07*4, IOH = 8 mA
P62 to P64*3
VCC 0.5
—
—
V
VOL1
P04, P12,
PF0 to PF2*4,
PG1*4, PG2*4
—
—
0.4
V
VOL2
P00*3 to P03*4,
P05 to P07*4, IOL = 12 mA
P62 to P64*3
—
—
0.4
V
All input pins
5
—
5
When the internal
µA pull-up resistor is
disabled
P00*3 to P07*4,
P62 to P64*3, VI = 0 V
PG1*4, PG2*4
25
50
100
When the internal
k pull-up resistor is
enabled
Other than VCC
f = 1 MHz
and VSS
—
5
15
pF
ILI
RPULL
CIN
Document Number: 002-04629 Rev. *D
IOL = 4 mA
0.0 V < VI < VCC
Page 46 of 88
MB95560H Series
MB95570H Series
MB95580H Series
(VCC = 5.0 V  10%, VSS = 0.0 V, TA = 40 °C to 85 °C)
Parameter
Symbol
Pin name
Condition
Value
Min
—
FCH = 32 MHz
FMP = 16 MHz
Main clock mode
(divided by 2)
3.5
Unit
Remarks
4.4
Except during
Flash memory
mA
programming and
erasing
—
7.4
9.8
During Flash
memory
mA
programming and
erasing
—
5.1
6.4
mA At A/D conversion
—
1.2
1.5
mA
—
65
71
µA
ICCLS*6
FCL = 32 kHz
FMPL = 16 kHz
Subsleep mode
(divided by 2)
TA = 25 °C
—
5.4
7
µA
In deep standby
mode
ICCT*6
FCL = 32 kHz
Watch mode
TA = 25 °C
—
4.8
6.9
µA
In deep standby
mode
ICCMCR
FCRH = 4 MHz
FMP = 4 MHz
Main CR clock mode
—
1.1
1.4
mA
ICCSCR
Sub-CR clock mode
(divided by 2)
TA = 25 °C
—
58
64
µA
ICCTS
FCH = 32 MHz
Time-base timer
mode
TA = 25 °C
—
290
340
µA
In deep standby
mode
—
4.1
6.5
µA
In deep standby
mode
ICC
FCH = 32 MHz
FMP = 16 MHz
Main sleep mode
(divided by 2)
ICCS
ICCL
Power supply
current*5
Typ*1 Max*2
VCC
(External clock
FCL = 32 kHz
operation)
FMPL = 16 kHz
Subclock mode
(divided by 2)
TA = 25 °C
VCC
ICCH
VCC
Main stop mode
(External clock (single external
operation)
clock product)/
Substop mode (dual
external clock
product)
TA = 25 °C
Document Number: 002-04629 Rev. *D
Page 47 of 88
MB95560H Series
MB95570H Series
MB95580H Series
Parameter
Power supply
current*5
Symbol
Pin name
Condition
(VCC = 5.0 V  10%, VSS = 0.0 V, TA = 40 °C to 85 °C)
Value
Unit
Remarks
Min Typ*1 Max*2
ILVD
Current
consumption for the
low-voltage
detection circuit
—
3.6
6.6
µA
ICRH
Current
consumption for the
main CR oscillator
—
220
280
µA
ICRL
Current
consumption for the
sub-CR oscillator
oscillating at
100 kHz
—
5.1
9.3
µA
Current
consumption
difference between
normal standby
mode and deep
standby mode
TA = 25 °C
—
20
30
µA
VCC
INSTBY
*1: VCC = 5.0 V, TA =  25 °C
*2: VCC = 5.5 V, TA =  85 °C (unless otherwise specified)
*3: P00, P62, P63 and P64 are only available on MB95F562H/F562K/F563H/F563K/F564H/F564K.
*4: P01, P02, P03, P07, PF0, PF1, PG1 and PG2 are only available on MB95F562H/F562K/F563H/F563K/F564H/F564K/
F582H/F582K/F583H/F583K/F584H/F584K.
*5: • The power supply current is determined by the external clock. When the low-voltage detection option is selected,
the power-supply current will be the sum of adding the current consumption of the low-voltage detection circuit (ILVD)
to one of the value from ICC to ICCH. In addition, when both the low-voltage detection option and the CR oscillator
are selected, the power supply current will be the sum of adding up the current consumption of the low-voltage
detection circuit, the current consumption of the CR oscillators (ICRH, ICRL) and a specified value. In on-chip debug
mode, the CR oscillator (ICRH) and the low-voltage detection circuit are always enabled, and current consumption
therefore increases accordingly.
• See “24.4 AC Characteristics: Clock Timing” for FCH and FCL.
• See “24.4 AC Characteristics: Source Clock / Machine Clock” for FMP and FMPL.
*6: In sub-CR clock mode, the power supply current value is the sum of adding ICRL to ICCLS or ICCT. In addition, when the
sub-CR clock mode is selected with FMPL being 50 kHz, the current consumption increases accordingly.
Document Number: 002-04629 Rev. *D
Page 48 of 88
MB95560H Series
MB95570H Series
MB95580H Series
24.4 AC Characteristics
24.4.1 Clock Timing
Parameter
Symbol Pin name Condition
X0, X1
FCH
X0
X0, X1
—
X1: open
*
Min
1
1
1
3.92
FCRH
—
—
3.8
7.84
7.6
9.8
Clock
frequency
9.5
FMCRPLL
—
—
11.76
11.4
15.68
15.2
—
FCL
X0A, X1A
—
—
FCRL
—
Document Number: 002-04629 Rev. *D
—
50
(VCC = 2.4 V to 5.5 V, VSS = 0.0 V, TA = 40 °C to 85 °C)
Value
Unit
Remarks
Typ
Max
When the main oscillation
—
16.25 MHz
circuit is used
—
12
MHz When the main external clock
—
32.5 MHz is used
Operating conditions
4
4.08 MHz • The main CR clock is used.
• 0 °C TA 70 °C
Operating conditions
• The main CR clock is used.
4
4.2 MHz
• 40 °C  TA < 0 °C,
70 °C <TA 85 °C
Operating conditions
8
8.16 MHz • PLL multiplication rate: 2
• 0 °C TA 70 °C
Operating conditions
• PLL multiplication rate: 2
8
8.4 MHz
• 40 °C  TA < 0 °C,
70 °C <TA 85 °C
Operating conditions
10
10.2 MHz • PLL multiplication rate: 2.5
• 0 °C TA 70 °C
Operating conditions
• PLL multiplication rate: 2.5
10
10.5 MHz
• 40 °C  TA < 0 °C,
70 °C <TA 85 °C
Operating conditions
12
12.24 MHz • PLL multiplication rate: 3
• 0 °C TA 70 °C
Operating conditions
• PLL multiplication rate: 3
12
12.6 MHz
• 40 °C  TA < 0 °C,
70 °C <TA 85 °C
Operating conditions
16
16.32 MHz • PLL multiplication rate: 4
• 0 °C TA 70 °C
Operating conditions
• PLL multiplication rate: 4
16
16.8 MHz
• 40 °C  TA < 0 °C,
70 °C <TA 85 °C
When the suboscillation circuit
32.768 —
kHz
is used
When the sub-external clock is
32.768 —
kHz
used
When the sub-CR clock is
100
150 kHz
used
Page 49 of 88
MB95560H Series
MB95570H Series
MB95580H Series
(VCC = 2.4 V to 5.5 V, VSS = 0.0 V, TA = 40 °C to 85 °C)
Parameter
Symbol Pin name Condition
X0, X1
Clock cycle
time
tHCYL
X0
X1: open
X0, X1
*
X0A, X1A
—
X0
X1: open
X0, X1
*
tLCYL
Input clock
pulse width
Input clock
rising time and
falling time
CR oscillation
start time
—
tWH1,
tWL1
tWH2,
tWL2
X0A
tCR,
tCF
X0, X0A X1: open
X0, X1,
*
X0A, X1A
—
Min
Value
Typ
Max
61.5
—
1000
ns
83.4
30.8
—
33.4
12.4
—
—
30.5
—
—
1000
1000
—
—
—
ns
ns
µs
ns
ns
—
15.2
—
When an external clock is
used, the duty ratio should
µs range between 40% and 60%.
—
—
5
ns
—
—
5
When an external clock is
ns used
µs
tCRHWK
—
—
—
—
50
tCRLWK
—
—
—
—
30
Unit
Remarks
When the main oscillation
circuit is used
When an external clock is
used
When the subclock is used
When the main CR clock is
used
When the sub-CR clock is
µs
used
*: The external clock signal is input to X0 and the inverted external clock signal to X1.
• Input waveform generated when an external clock (main clock) is used
tHCYL
tWH1
tWL1
tCR
tCF
0.8 VCC 0.8 VCC
X0, X1
0.2 VCC
0.2 VCC
0.2 VCC
• Figure of main clock input port external connection
When a crystal oscillator or
a ceramic oscillator is used
X0
When an external clock is used When an external clock
(X1 is open)
is used
X0
X1
FCH
X1
X1
Open
FCH
Document Number: 002-04629 Rev. *D
X0
FCH
Page 50 of 88
MB95560H Series
MB95570H Series
MB95580H Series
• Input waveform generated when an external clock (subclock) is used
tLCYL
tWH2
tCR
tWL2
tCF
0.8 VCC 0.8 VCC
X0A
0.2 VCC
0.2 VCC
0.2 VCC
• Figure of subclock input port external connection
When a crystal oscillator or
a ceramic oscillator is used
X0A
X1A
FCL
When an external clock
is used
X0A
X1A
Open
FCL
Document Number: 002-04629 Rev. *D
Page 51 of 88
MB95560H Series
MB95570H Series
MB95580H Series
24.4.2 Source Clock / Machine Clock
Parameter
Source clock
cycle time*1
Symbol
tSCLK
Pin
name
—
FSP
Source clock
frequency
Machine clock
cycle time*2
(minimum
instruction
execution
time)
—
FSPL
tMCLK
Min
Value
Typ
Max
61.5
—
2000
ns
62.5
—
1000
ns
—
61
—
µs
—
20
—
µs
0.5
—
—
—
4
16.384
16.25
—
—
MHz
MHz
kHz
—
50
—
kHz
61.5
—
32000
ns
250
—
1000
ns
61
—
976.5
µs
20
—
320
µs
0.031
0.25
1.024
—
—
—
3.125
—
Unit
—
FMP
Machine clock
frequency
(VCC = 5.0 V  10%, VSS = 0.0 V, TA = 40 °C to 85 °C)
—
FMPL
16.25 MHz
16
MHz
16.384 kHz
50
kHz
Remarks
When the main external clock is used
Min: FCH = 32.5 MHz, divided by 2
Max: FCH = 1 MHz, divided by 2
When the main CR clock is used
Min: FCRH = 4 MHz, multiplied by 4
Max: FCRH = 4 MHz, divided by 4
When the suboscillation clock is used
FCL = 32.768 kHz, divided by 2
When the sub-CR clock is used
FCRL = 100 kHz, divided by 2
When the main oscillation clock is used
When the main CR clock is used
When the suboscillation clock is used
When the sub-CR clock is used
FCRL = 100 kHz, divided by 2
When the main oscillation clock is used
Min: FSP = 16.25 MHz, no division
Max: FSP = 0.5 MHz, divided by 16
When the main CR clock is used
Min: FSP = 4 MHz, no division
Max: FSP = 4 MHz, divided by 4
When the suboscillation clock is used
Min: FSPL = 16.384 kHz, no division
Max: FSPL = 16.384 kHz, divided by 16
When the sub-CR clock is used
Min: FSPL = 50 kHz, no division
Max: FSPL = 50 kHz, divided by 16
When the main oscillation clock is used
When the main CR clock is used
When the suboscillation clock is used
When the sub-CR clock is used
FCRL = 100 kHz
*1: This is the clock before it is divided according to the division ratio set by the machine clock division ratio select bits
(SYCC:DIV[1:0]). This source clock is divided to become a machine clock according to the division ratio set by the
machine clock division ratio select bits (SYCCDIV[1:0]). In addition, a source clock can be selected from the following.
• Main clock divided by 2
• Main CR clock
• PLL multiplication of main CR clock (Select a multiplication rate from 2, 2.5, 3 and 4.)
• Subclock divided by 2
• Sub-CR clock divided by 2
*2: This is the operating clock of the microcontroller. A machine clock can be selected from the following.
• Source clock (no division)
• Source clock divided by 4
• Source clock divided by 8
• Source clock divided by 16
Document Number: 002-04629 Rev. *D
Page 52 of 88
MB95560H Series
MB95570H Series
MB95580H Series
• Schematic diagram of the clock generation block
FCH
(Main oscillation clock)
Divided by 2
FMCRPLL
(Main CR PLL clock)
SCLK
(Source clock)
FCRH
(Main CR clock)
FCL
(Suboscillation clock)
Division circuit
×
1
× 1/4
× 1/8
× 1/16
MCLK
(Machine clock)
Divided by 2
Machine clock divide ratio select bits
(SYCC:DIV[1:0])
FCRL
(Sub-CR clock)
Divided by 2
Clock mode select bits
(SYCC:SCS[2:0])
Document Number: 002-04629 Rev. *D
Page 53 of 88
MB95560H Series
MB95570H Series
MB95580H Series
• Operating voltage - Operating frequency (TA = 40°C to 85°C)
Without the on-chip debug function
5.5
Operating voltage (V)
5.0
A/D converter operation range
4.0
3.5
3.0
2.7
2.4
16 kHz
3 MHz
10 MHz
16.25 MHz
Source clock frequency (FSP/FSPL)
• Operating voltage - Operating frequency (TA = 40 °C to 85 °C)
With the on-chip debug function
5.5
Operating voltage (V)
5.0
A/D converter operation range
4.0
3.5
2.9
3.0
16 kHz
3 MHz
12.5 MHz
16.25 MHz
Source clock frequency (FSP)
Document Number: 002-04629 Rev. *D
Page 54 of 88
MB95560H Series
MB95570H Series
MB95580H Series
24.4.3 External Reset
Parameter
RST “L” level
pulse width
Symbol
tRSTL
(VCC = 5.0 V  10%, VSS = 0.0 V, TA = 40 °C to 85 °C)
Value
Min
Max
2 tMCLK*1
—
Unit
ns
Remarks
In normal operation
*1: See “Source Clock / Machine Clock” for tMCLK.
tRSTL
RST
0.2 VCC
Document Number: 002-04629 Rev. *D
0.2 VCC
Page 55 of 88
MB95560H Series
MB95570H Series
MB95580H Series
24.4.4 Power-on Reset
Parameter
(VSS = 0.0 V, TA = 40 °C to 85 °C)
Symbol
Condition
Power supply rising time
tR
Power supply cutoff time
tOFF
Value
Unit
Min
Max
—
—
50
ms
—
1
—
ms
Remarks
Wait time until power-on
tOFF
tR
2.5 V
VCC
0.2 V
0.2 V
0.2 V
Note: A sudden change of power supply voltage may activate the power-on reset function. When changing the power
supply voltage during the operation, set the slope of rising to a value below within 30 mV/ms as shown below.
VCC
2.3 V
Set the slope of rising to
a value below 30 mV/ms.
Hold condition in stop mode
VSS
24.4.5 Peripheral Input Timing
Parameter
(VCC = 5.0 V  10%, VSS = 0.0 V, TA = 40 °C to 85 °C)
Symbol
Peripheral input “H” pulse width
tILIH
Peripheral input “L” pulse width
tIHIL
Value
Pin name
INT02 to INT07*1,*2, EC0*1, EC1*3
Unit
Min
Max
2 tMCLK*4
—
ns
2t
—
ns
*
4
MCLK
*1: INT04, INT06 and EC0 are available on all products.
*2: INT02, INT03, INT05 and INT07 are only available on MB95F562H/F562K/F563H/F563K/F564H/F564K/F582H/
F582K/F583H/F583K/F584H/F584K.
*3: EC1 is only available on MB95F562H/F562K/F563H/F563K/F564H/F564K.
*4: See “Source Clock / Machine Clock” for tMCLK.
tILIH
0.8 VCC
INT02 to INT07,
EC0, EC1
Document Number: 002-04629 Rev. *D
tIHIL
0.8 VCC
0.2 VCC
0.2 VCC
Page 56 of 88
MB95560H Series
MB95570H Series
MB95580H Series
24.4.6 LIN-UART Timing (only available on MB95F562H/F562K/F563H/F563K/F564H/F564K/F582H/F582K/F583H/F583K/F584H/
F584K)
Sampling is executed at the rising edge of the sampling clock*1, and serial clock delay is disabled*2.
(ESCR register: SCES bit = 0, ECCR register: SCDE bit = 0)
(VCC = 5.0 V  10%, AVSS = VSS = 0.0 V, TA = 40 °C to 85 °C)
Parameter
Symbol Pin name
Serial clock cycle time
Value
Condition
Max
5 tMCLK*3
—
ns
50
tSCYC
SCK
SCK  SOT delay time
tSLOVI
Valid SIN  SCK 
tIVSHI
t
SCK  valid SIN hold time
tSHIXI
SCK, SOT Internal clock
operation output pin:
SCK, SIN CL = 80 pF  1 TTL
SCK, SIN
Serial clock “L” pulse width
tSLSH
SCK
3t
Serial clock “H” pulse width
tSHSL
SCK
t
SCK  SOT delay time
tSLOVE
Valid SIN  SCK 
tIVSHE
SCK  valid SIN hold time
tSHIXE
SCK, SOT External clock
SCK, SIN operation output pin:
SCK, SIN CL = 80 pF  1 TTL
50
ns
MCLK 3
*  80
—
ns
0
—
ns
*  tR
—
ns
*  10
—
ns
MCLK 3
MCLK 3
—
t
Unit
Min
ns
30
—
ns
*  30
—
ns
MCLK 3
2t
*  60
MCLK 3
SCK fall time
tF
SCK
—
10
ns
SCK rise time
tR
SCK
—
10
ns
*1: There is a function used to choose whether the sampling of reception data is performed at a rising edge or a falling
edge of the serial clock.
*2: The serial clock delay function is a function used to delay the output signal of the serial clock for half the clock.
*3: See “Source Clock / Machine Clock” for tMCLK.
• Internal shift clock mode
tSCYC
0.8 VCC
SCK
0.2 VCC
0.2 VCC
tSLOVI
0.8 VCC
SOT
0.2 VCC
tIVSHI
tSHIXI
0.7 VCC 0.7 VCC
SIN
0.3 VCC 0.3 VCC
Document Number: 002-04629 Rev. *D
Page 57 of 88
MB95560H Series
MB95570H Series
MB95580H Series
• External shift clock mode
tSLSH
tSHSL
0.8 VCC
0.8 VCC
0.8 VCC
SCK
0.2 VCC
tF
0.2 VCC
tR
tSLOVE
0.8 VCC
SOT
0.2 VCC
tIVSHE
tSHIXE
0.7 VCC 0.7 VCC
SIN
0.3 VCC 0.3 VCC
Sampling is executed at the falling edge of the sampling clock*1, and serial clock delay is disabled*2.
(ESCR register: SCES bit = 1, ECCR register: SCDE bit = 0)
(VCC = 5.0 V  10%, VSS = 0.0 V, TA = 40 °C to 85 °C)
Parameter
Serial clock cycle time
Symbol Pin name
Condition
Value
Unit
Min
Max
5 tMCLK*3
—
ns
tSCYC
SCK
SCK  SOT delay time
tSHOVI
50
50
ns
Valid SIN  SCK 
tIVSLI
tMCLK*3  80
—
ns
SCK  valid SIN hold time
tSLIXI
SCK, SOT Internal clock
operation output pin:
SCK, SIN CL = 80 pF  1 TTL
SCK, SIN
0
—
ns
Serial clock “H” pulse width
tSHSL
SCK
3 tMCLK*3  tR
—
ns
Serial clock “L” pulse width
tSLSH
SCK
tMCLK*3  10
—
ns
SCK  SOT delay time
tSHOVE
—
2 tMCLK*3  60
ns
Valid SIN  SCK 
tIVSLE
30
—
ns
SCK  valid SIN hold time
tSLIXE
SCK, SOT External clock
SCK, SIN operation output pin:
SCK, SIN CL = 80 pF  1 TTL
tMCLK*3  30
—
ns
SCK fall time
tF
SCK
—
10
ns
SCK rise time
tR
SCK
—
10
ns
*1: There is a function used to choose whether the sampling of reception data is performed at a rising edge or a falling
edge of the serial clock.
*2: The serial clock delay function is a function used to delay the output signal of the serial clock for half the clock.
*3: See “Source Clock / Machine Clock” for tMCLK.
Document Number: 002-04629 Rev. *D
Page 58 of 88
MB95560H Series
MB95570H Series
MB95580H Series
• Internal shift clock mode
tSCYC
0.8 VCC
0.8 VCC
SCK
0.2 VCC
tSHOVI
0.8 VCC
SOT
0.2 VCC
tIVSLI
tSLIXI
0.7 VCC 0.7 VCC
SIN
0.3 VCC 0.3 VCC
• External shift clock mode
tSHSL
0.8 VCC
tSLSH
0.8 VCC
SCK
0.2 VCC
tR
tF
0.2 VCC
0.2 VCC
tSHOVE
0.8 VCC
SOT
0.2 VCC
tIVSLE
tSLIXE
0.7 VCC 0.7 VCC
SIN
0.3 VCC 0.3 VCC
Document Number: 002-04629 Rev. *D
Page 59 of 88
MB95560H Series
MB95570H Series
MB95580H Series
Sampling is executed at the rising edge of the sampling clock*1, and serial clock delay is enabled*2.
(ESCR register: SCES bit = 0, ECCR register: SCDE bit = 1)
(VCC = 5.0 V  10%, VSS = 0.0 V, TA = 40 °C to 85 °C)
Parameter
Symbol Pin name
Value
Condition
Serial clock cycle time
tSCYC
SCK
SCK  SOT delay time
tSHOVI
Valid SIN  SCK 
tIVSLI
SCK  valid SIN hold time
tSLIXI
SCK, SOT Internal clock
SCK, SIN operation output pin:
SCK, SIN CL = 80 pF  1 TTL
SOT  SCK  delay time
tSOVLI
SCK, SOT
t
Unit
Min
Max
5 tMCLK*3
—
ns
50
50
ns
MCLK 3
*  80
—
ns
0
—
ns
*  70
—
ns
3t
MCLK 3
*1: There is a function used to choose whether the sampling of reception data is performed at a rising edge or a falling
edge of the serial clock.
*2: The serial clock delay function is a function that delays the output signal of the serial clock for half clock.
*3: See “Source Clock / Machine Clock” for tMCLK.
tSCYC
0.8 VCC
SCK
0.2 VCC
0.8 VCC
SOT
0.8 VCC
0.2 VCC
0.2 VCC
tIVSLI
SIN
0.2 VCC
tSHOVI
tSOVLI
tSLIXI
0.7 VCC
0.7 VCC
0.3 VCC
0.3 VCC
Sampling is executed at the falling edge of the sampling clock*1, and serial clock delay is enabled*2.
(ESCR register: SCES bit = 1, ECCR register: SCDE bit = 1)
(VCC = 5.0 V  10%, VSS = 0.0 V, TA = 40 °C to 85 °C)
Parameter
Symbol Pin name
Value
Condition
Serial clock cycle time
tSCYC
SCK
SCK  SOT delay time
tSLOVI
Valid SIN  SCK 
tIVSHI
SCK  valid SIN hold time
tSHIXI
SCK, SOT Internal clock
SCK, SIN operating output pin:
SCK, SIN CL = 80 pF  1 TTL
SOT  SCK  delay time
tSOVHI
SCK, SOT
t
Unit
Min
Max
5 tMCLK*3
—
ns
50
50
ns
MCLK 3
*  80
—
ns
0
—
ns
*  70
—
ns
3t
MCLK 3
*1: There is a function used to choose whether the sampling of reception data is performed at a rising edge or a falling
edge of the serial clock.
*2: The serial clock delay function is a function that delays the output signal of the serial clock for half clock.
*3: See “Source Clock / Machine Clock” for tMCLK.
Document Number: 002-04629 Rev. *D
Page 60 of 88
MB95560H Series
MB95570H Series
MB95580H Series
tSCYC
0.8 VCC
SCK
0.8 VCC
0.2 VCC
tSOVHI
SOT
tSLOVI
0.8 VCC
0.8 VCC
0.2 VCC
0.2 VCC
tIVSHI
SIN
tSHIXI
0.7 VCC
0.7 VCC
0.3 VCC
0.3 VCC
24.4.7 Low-voltage Detection
Parameter
(VSS = 0.0 V, TA = 40 °C to 85 °C)
Symbol
Release voltage*
Detection voltage*
VDL
VDL
Value
Min
Typ
Max
2.52
2.7
2.88
2.61
2.8
2.99
2.89
3.1
3.31
3.08
3.3
3.52
2.43
2.6
2.77
2.52
2.7
2.88
2.80
3
3.20
2.99
3.2
3.41
Unit
Remarks
V
At power supply rise
V
At power supply fall
Hysteresis width
VHYS
—
100
—
mV
Power supply start voltage
Voff
—
—
2.3
V
Power supply end voltage
Von
4.9
—
—
V
Power supply voltage
change time
(at power supply rise)
tr
650
—
—
µs
Slope of power supply that the reset
release signal generates within the
rating (VDL+)
Power supply voltage
change time
(at power supply fall)
tf
650
—
—
µs
Slope of power supply that the reset
detection signal generates within the
rating (VDL-)
Reset release delay time
td1
—
—
30
µs
Reset detection delay time
td2
—
—
30
µs
LVD threshold voltage
transition stabilization time
tstb
10
—
—
µs
*: The release voltage and the detection voltage can be selected by using the LVD reset voltage selection ID register
(LVDR) in the low-voltage detection reset circuit. For details of the LVDR register, refer to “CHAPTER 18 LOWVOLTAGE DETECTION RESET CIRCUIT” in “New 8FX MB95560H/570H/580H Hardware Manual”.
Document Number: 002-04629 Rev. *D
Page 61 of 88
MB95560H Series
MB95570H Series
MB95580H Series
VCC
Von
Voff
time
tf
tr
VDL+
VHYS
VDL-
Internal reset signal
time
td2
Document Number: 002-04629 Rev. *D
td1
Page 62 of 88
MB95560H Series
MB95570H Series
MB95580H Series
24.5 A/D Converter
24.5.1 A/D Converter Electrical Characteristics
Parameter
Symbol
(VCC = 2.7 V to 5.5 V, VSS = 0.0 V, TA = 40 °C to 85 °C)
Value
Unit
Min
Typ
Max
Resolution
—
—
10
bit
Total error
3
—
3
LSB
2.5
—
2.5
LSB
1.9
—
1.9
LSB
Linearity error
—
Differential linearity
error
Remarks
Zero transition
voltage
V0T
VSS  1.5 LSB VSS  0.5 LSB VSS  2.5 LSB
V
Full-scale transition
voltage
VFST
VCC  4.5 LSB
VCC  2 LSB
VCC  0.5 LSB
V
1
—
10
µs
4.5 V  VCC  5.5 V
3
—
10
µs
2.7 V  VCC < 4.5 V
2.7 V  VCC  5.5 V,
with external
impedance < 3.3 k
Compare time
—
Sampling time
—
0.6
—

µs
Analog input current
IAIN
0.3
—
0.3
µA
Analog input voltage
VAIN
VSS
—
VCC
V
Document Number: 002-04629 Rev. *D
Page 63 of 88
MB95560H Series
MB95570H Series
MB95580H Series
24.5.2 Notes on Using A/D Converter
• External impedance of analog input and its sampling time
The A/D converter of the MB95560H/570H/580H has a sample and hold circuit. If the external impedance is too high
to keep sufficient sampling time, the analog voltage charged to the capacitor of the internal sample and hold circuit
is insufficient, adversely affecting A/D conversion precision. Therefore, to satisfy the A/D conversion precision standard, considering the relationship between the external impedance and minimum sampling time, either adjust the
register value and operating frequency or decrease the external impedance so that the sampling time is longer than
the minimum value. In addition, if sufficient sampling time cannot be secured, connect a capacitor of about 0.1 µF to
the analog input pin.
• Analog input equivalent circuit
Analog input
Comparator
R
C
During sampling: ON
VCC
R
C
4.5 V ≤ VCC ≤ 5.5 V
2.7 V ≤ VCC < 4.5 V
1.45 kΩ (Max)
2.7 kΩ (Max)
14.89 pF (Max)
14.89 pF (Max)
Note: The values are reference values.
• Relationship between external impedance and minimum sampling time
[External impedance = 0 kΩ to 100 kΩ]
[External impedance = 0 kΩ to 20 kΩ]
100000
20000
External impedance [kΩ]
External impedance [kΩ]
80000
60000
40000
15000
10000
5000
20000
0
0
0
2
4
6
8
10
12
0
0.5
Minimum sampling time [μs]
1
1.5
2
2.5
Minimum sampling time [μs]
Minimum sampling time with VCC > 2.7 V
Minimum sampling time with VCC > 2.4 V
• A/D conversion error
As |VCC  VSS| decreases, the A/D conversion error increases proportionately.
Document Number: 002-04629 Rev. *D
Page 64 of 88
MB95560H Series
MB95570H Series
MB95580H Series
24.5.3 Definitions of A/D Converter Terms
• Resolution
It indicates the level of analog variation that can be distinguished by the A/D converter.
When the number of bits is 10, analog voltage can be divided into 210 = 1024.
• Linearity error (unit: LSB)
It indicates how much an actual conversion value deviates from the straight line connecting the zero transition point
(“0000000000”  “0000000001”) of a device to the full-scale transition point (“1111111111”  “1111111110”) of
the same device.
• Differential linear error (unit: LSB)
It indicates how much the input voltage required to change the output code by 1 LSB deviates from an ideal value.
• Total error (unit: LSB)
It indicates the difference between an actual value and a theoretical value. The error can be caused by a zero transition error, a full-scale transition errors, a linearity error, a quantum error, or noise.
Ideal I/O characteristics
Total error
VFST
3FFH
3FFH
2 LSB
3FDH
Digital output
Digital output
3FDH
004H
003H
Actual conversion
characteristic
3FEH
3FEH
V0T
{1 LSB × (N-1) + 0.5 LSB}
004H
VNT
003H
1 LSB
002H
002H
001H
Actual conversion
characteristic
Ideal characteristic
001H
0.5 LSB
VSS
Analog input
1 LSB =
VCC − VSS
(V)
1024
N
VCC
VSS
Analog input
VCC
VNT − {1 LSB × (N − 1) + 0.5 LSB}
Total error of
=
[LSB]
digital output N
1 LSB
: A/D converter digital output value
VNT : Voltage at which the digital output transits from (N − 1)H to NH
Document Number: 002-04629 Rev. *D
Page 65 of 88
MB95560H Series
MB95570H Series
MB95580H Series
Zero transition error
Full-scale transition error
004H
Ideal characteristic
Actual conversion
characteristic
3FFH
Actual conversion
characteristic
002H
Digital output
Digital output
003H
Actual conversion
characteristic
Ideal
characteristic
3FEH
VFST
(measurement
value)
3FDH
Actual conversion
characteristic
001H
3FCH
V0T (measurement value)
VSS
Analog input
VCC
VSS
Linearity error
3FFH
3FEH
Ideal characteristic
(N+1)H
Actual conversion
characteristic
{1 LSB × N + V0T}
VFST
(measurement
value)
VNT
004H
Digital output
Digital output
3FDH
002H
VCC
Differential linearity error
Actual conversion
characteristic
V(N+1)T
NH
VNT
(N−1)H
Actual conversion
characteristic
003H
Analog input
Ideal
characteristic
Actual conversion
characteristic
(N−2)H
001H
V0T (measurement value)
VSS
Analog input
VCC
Linearity error of digital output N =
VSS
VCC
VNT − {1 LSB × N + V0T}
1 LSB
Differential linearity error of digital output N =
N
Analog input
V(N+1)T − VNT
− 1
1 LSB
: A/D converter digital output value
VNT : Voltage at which the digital output transits from (N − 1)H to NH
V0T (ideal value) = VSS + 0.5 LSB [V]
VFST (ideal value) = VCC − 2 LSB [V]
Document Number: 002-04629 Rev. *D
Page 66 of 88
MB95560H Series
MB95570H Series
MB95580H Series
24.6 Flash Memory Program/Erase Characteristics
Value
Parameter
Min
Typ
Max
Unit
Remarks
Sector erase time
(2 Kbyte sector)
—
0.3*1
1.6*2
s
The time of writing 00H prior to
erasure is excluded.
Sector erase time
(16 Kbyte sector)
—
0.6*1
3.1*2
s
The time of writing 00H prior to
erasure is excluded.
Byte writing time
—
17
272
µs
System-level overhead is excluded.
100000
—
—
cycle
Power supply voltage at
program/erase
2.4
—
5.5
V
Flash memory data retention
time
5*3
—
—
Program/erase cycle
year Average TA = 85 °C
*1: VCC = 5.5 V, TA = 25 °C, 0 cycle
*2: VCC = 2.4 V, TA = 85 °C, 100000 cycles
*3: This value was converted from the result of a technology reliability assessment. (The value was converted from the
result of a high temperature accelerated test using the Arrhenius equation with an average temperature of 85 °C).
Document Number: 002-04629 Rev. *D
Page 67 of 88
MB95560H Series
MB95570H Series
MB95580H Series
25. Sample Characteristics
• Power supply current temperature characteristics
ICC  VCC
TA  25 °C, FMP  2, 4, 8, 10, 16 MHz (divided by 2)
Main clock mode with the external clock operating
ICC  TA
VCC  5.5 V, FMP  10, 16 MHz (divided by 2)
Main clock mode with the external clock operating
20
20
FMP = 16 MHz
FMP = 10 MHz
FMP = 8 MHz
FMP = 4 MHz
FMP = 2 MHz
15
ICC[mA]
ICC[mA]
15
FMP = 16 MHz
FMP = 10 MHz
10
5
10
5
0
0
2
3
4
5
6
−50
7
0
VCC[V]
+50
+100
+150
TA[°C]
ICCS  VCC
TA  25 °C, FMP  2, 4, 8, 10, 16 MHz (divided by 2)
Main sleep mode with the external clock operating
ICCS  TA
VCC  5.5 V, FMP  10, 16 MHz (divided by 2)
Main sleep mode with the external clock operating
10
10
FMP = 16 MHz
FMP = 10 MHz
FMP = 8 MHz
FMP = 4 MHz
FMP = 2 MHz
8
FMP = 16 MHz
FMP = 10 MHz
8
ICCS[mA]
ICCS[mA]
6
4
6
4
2
2
0
−50
0
2
3
4
5
6
0
7
+50
+100
+150
TA[°C]
VCC[V]
ICCL  VCC
TA  25 °C, FMPL  16 kHz (divided by 2)
Subclock mode with the external clock operating
ICCL  TA
VCC  5.5 V, FMPL  16 kHz (divided by 2)
Subclock mode with the external clock operating
100
100
80
75
ICCL[μA]
ICCL[μA]
60
50
40
25
20
0
−50
0
2
3
4
5
6
7
0
+50
+100
+150
TA[°C]
VCC[V]
Document Number: 002-04629 Rev. *D
Page 68 of 88
MB95560H Series
MB95570H Series
MB95580H Series
ICCLS  TA
VCC  5.5 V, FMPL  16 kHz (divided by 2)
Subsleep mode with the external clock operating
80
80
70
70
60
60
50
50
ICCLS[μA]
ICCLS[μA]
ICCLS  VCC
TA  25 °C, FMPL  16 kHz (divided by 2)
Subsleep mode with the external clock operating
40
30
40
30
20
20
10
10
0
2
3
4
5
6
0
7
−50
VCC[V]
0
+50
+100
+150
TA[°C]
ICCT  VCC
TA  25 °C, FMPL  16 kHz (divided by 2)
Watch mode with the external clock operating
ICCT  TA
VCC  5.5 V, FMPL  16 kHz (divided by 2)
Watch mode with the external clock operating
20
20
16
16
ICCT[μA]
ICCT[μA]
12
12
8
8
4
4
0
−50
0
2
3
4
5
6
0
7
+50
+100
+150
TA[°C]
VCC[V]
ICCTS  VCC
TA  25 °C, FMP  2, 4, 8, 10, 16 MHz (divided by 2)
Time-base timer mode with the external clock
operating
ICCTS  TA
VCC  5.5 V, FMP  10, 16 MHz (divided by 2)
Time-base timer mode with the external clock
operating
1.4
1.4
FMP = 16 MHz
FMP = 10 MHz
FMP = 8 MHz
FMP = 4 MHz
FMP = 2 MHz
1.2
FMP = 16 MHz
FMP = 10 MHz
1.2
1.0
ICCTS[mA]
1.0
ICCTS[mA]
0.8
0.6
0.8
0.6
0.4
0.2
0.4
0
0.2
−50
0
+50
+100
+150
TA[°C]
0.0
2
3
4
5
6
7
VCC[V]
Document Number: 002-04629 Rev. *D
Page 69 of 88
MB95560H Series
MB95570H Series
MB95580H Series
ICCH  TA
VCC  5.5 V, FMPL  (stop)
Substop mode with the external clock stopping
20
20
15
15
ICCH[μA]
ICCH[μA]
ICCH  VCC
TA  25 °C, FMPL  (stop)
Substop mode with the external clock stopping
10
5
10
5
0
0
1
2
3
4
5
6
7
−50
VCC[V]
0
+50
+100
+150
TA[°C]
ICCMCR  TA
VCC  5.5 V, FMP  4 MHz (no division)
Main clock mode with the main CR clock operating
20
20
15
15
ICCMCR[mA]
ICCMCR[mA]
ICCMCR  VCC
TA  25 °C, FMP  4 MHz (no division)
Main clock mode with the main CR clock operating
10
5
10
5
0
0
2
3
4
5
6
−50
7
0
VCC[V]
ICCSCR  VCC
TA  25 °C, FMPL  50 kHz (divided by 2)
Subclock mode with the sub-CR clock operating
+100
+150
ICCSCR  TA
VCC  5.5 V, FMPL  50 kHz (divided by 2)
Subclock mode with the sub-CR clock operating
200
200
150
150
ICCSCR[μA]
ICCSCR[μA]
+50
TA[°C]
100
50
100
50
0
0
2
3
4
5
VCC[V]
Document Number: 002-04629 Rev. *D
6
7
−50
0
+50
+100
+150
TA[°C]
Page 70 of 88
MB95560H Series
MB95570H Series
MB95580H Series
• Input voltage characteristics
VIHI  VCC and VILI  VCC
TA  25 °C
VIHS  VCC and VILS  VCC
TA  25 °C
5
5
VIHI
VILI
VIHS
VILS
4
3
3
VIHI/VILI[V]
VIHS/VILS[V]
4
2
2
1
1
0
0
2
3
4
5
6
2
7
3
4
5
6
7
VCC[V]
VCC[V]
VIHM  VCC and VILM  VCC
TA  25 °C
5
VIHM
VILM
VIHM/VILM[V]
4
3
2
1
0
2
3
4
5
6
7
VCC[V]
Document Number: 002-04629 Rev. *D
Page 71 of 88
MB95560H Series
MB95570H Series
MB95580H Series
• Output voltage characteristics
(VCC  VOH2)  IOH
TA  25 °C
1.0
1.0
0.8
0.8
VCC − VOH2[V]
VCC − VOH1[V]
(VCC  VOH1)  IOH
TA  25 °C
0.6
0.6
0.4
0.4
0.2
0.2
0.0
0.0
0
−2
−4
−6
−8
−10
0
−2
−4
IOH[mA]
−6
−8
−10
8
10
IOH[mA]
VCC = 2.4 V
VCC = 2.7 V
VCC = 3.5 V
VCC = 4.5 V
VCC = 5.0 V
VCC = 5.5 V
VCC = 2.4 V
VCC = 2.7 V
VCC = 3.5 V
VCC = 4.5 V
VCC = 5.0 V
VCC = 5.5 V
VOL1  IOL
TA  25 °C
VOL2  IOL
TA  25 °C
1.0
0.6
0.8
0.4
VOL1[V]
VOL2[V]
0.6
0.4
0.2
0.2
0.0
0.0
0
0
2
4
6
8
10
2
4
6
IOL[mA]
IOL[mA]
VCC = 2.4 V
VCC = 2.7 V
VCC = 3.5 V
VCC = 4.5 V
VCC = 5.0 V
VCC = 5.5 V
Document Number: 002-04629 Rev. *D
VCC = 2.4 V
VCC = 2.7 V
VCC = 3.5 V
VCC = 4.5 V
VCC = 5.0 V
VCC = 5.5 V
Page 72 of 88
MB95560H Series
MB95570H Series
MB95580H Series
• Pull-up characteristics
RPULL  VCC
TA  25 °C
250
200
RPULL[kΩ]
150
100
50
0
2
3
4
5
6
VCC[V]
Document Number: 002-04629 Rev. *D
Page 73 of 88
MB95560H Series
MB95570H Series
MB95580H Series
26. Mask Options
Part Number
No.
MB95F562K
MB95F563K
MB95F564K
MB95F572K
MB95F573K
MB95F574K
MB95F582K
MB95F583K
MB95F584K
MB95F562H
MB95F563H
MB95F564H
MB95F572H
MB95F573H
MB95F574H
MB95F582H
MB95F583H
MB95F584H
Selectable/Fixed
Fixed
1
Low-voltage detection reset Without low-voltage detection reset With low-voltage detection reset
2
Reset
Document Number: 002-04629 Rev. *D
With dedicated reset input
Without dedicated reset input
Page 74 of 88
MB95560H Series
MB95570H Series
MB95580H Series
27. Ordering Information
Part number
MB95F562HWQN-G-SNE1
MB95F562KWQN-G-SNE1
MB95F563HWQN-G-SNE1
MB95F563KWQN-G-SNE1
MB95F564HWQN-G-SNE1
MB95F564KWQN-G-SNE1
MB95F562HWQN-G-SNERE1
MB95F562KWQN-G-SNERE1
MB95F563HWQN-G-SNERE1
MB95F563KWQN-G-SNERE1
MB95F564HWQN-G-SNERE1
MB95F564KWQN-G-SNERE1
MB95F562HPF-G-SNE2
MB95F562KPF-G-SNE2
MB95F563HPF-G-SNE2
MB95F563KPF-G-SNE2
MB95F564HPF-G-SNE2
MB95F564KPF-G-UNE2
MB95F562HPFT-G-SNE2
MB95F562KPFT-G-SNE2
MB95F563HPFT-G-SNE2
MB95F563KPFT-G-SNE2
MB95F564HPFT-G-SNE2
MB95F564KPFT-G-UNE2
MB95F562KPFT-G-UNERE2
MB95F563HPFT-G-UNERE2
MB95F563KPFT-G-UNERE2
MB95F564KPFT-G-UNERE2
MB95F582HWQN-G-SNE1
MB95F582KWQN-G-SNE1
MB95F583HWQN-G-SNE1
MB95F583KWQN-G-SNE1
MB95F584HWQN-G-SNE1
MB95F584KWQN-G-SNE1
MB95F582HWQN-G-SNERE1
MB95F582KWQN-G-SNERE1
MB95F583HWQN-G-SNERE1
MB95F583KWQN-G-SNERE1
MB95F584HWQN-G-SNERE1
MB95F584KWQN-G-SNERE1
MB95F582HPFT-G-SNE2
MB95F582KPFT-G-SNE2
MB95F583HPFT-G-SNE2
MB95F583KPFT-G-SNE2
MB95F584HPFT-G-SNE2
MB95F584KPFT-G-SNE2
Document Number: 002-04629 Rev. *D
Package
Packing
Tray
32-pin plastic QFN
(WNP032)
Reel
20-pin plastic SOP
(SOJ020)
Tube
Tube
20-pin plastic TSSOP
(STG020)
Reel
Tray
32-pin plastic QFN
(WNP032)
Reel
16-pin plastic TSSOP
(STB016)
Tube
Page 75 of 88
MB95560H Series
MB95570H Series
MB95580H Series
Part number
MB95F582HPF-G-SNE2
MB95F582KPF-G-SNE2
MB95F583HPF-G-SNE2
MB95F583KPF-G-SNE2
MB95F584HPF-G-SNE2
MB95F584KPF-G-SNE2
MB95F572HPH-G-SNE2
MB95F572KPH-G-SNE2
MB95F573HPH-G-SNE2
MB95F573KPH-G-SNE2
MB95F574HPH-G-SNE2
MB95F574KPH-G-SNE2
MB95F572HPF-G-SNE2
MB95F572KPF-G-SNE2
MB95F573HPF-G-SNE2
MB95F573KPF-G-SNE2
MB95F574HPF-G-SNE2
MB95F574KPF-G-SNE2
Document Number: 002-04629 Rev. *D
Package
Packing
16-pin plastic SOP
(SO016)
Tube
8-pin plastic DIP
(PDA008)
Tube
8-pin plastic SOP
(SOD008)
Tube
Page 76 of 88
MB95560H Series
MB95570H Series
MB95580H Series
28. Package Dimension
Package Type
Package Code
QFN 32
WNP032
002-15160 **
Document Number: 002-04629 Rev. *D
Page 77 of 88
MB95560H Series
MB95570H Series
MB95580H Series
Package Type
Package Code
SOP 20
SOJ020
002-16348 **
Document Number: 002-04629 Rev. *D
Page 78 of 88
MB95560H Series
MB95570H Series
MB95580H Series
Package Type
Package Code
TSSOP 20
STG020
002-15916 **
Document Number: 002-04629 Rev. *D
Page 79 of 88
MB95560H Series
MB95570H Series
MB95580H Series
Package Type
Package Code
TSSOP 16
STB016
002-15914 **
Document Number: 002-04629 Rev. *D
Page 80 of 88
MB95560H Series
MB95570H Series
MB95580H Series
Package Type
Package Code
SOP 16
SO016
002-15861 **
Document Number: 002-04629 Rev. *D
Page 81 of 88
MB95560H Series
MB95570H Series
MB95580H Series
Package Type
Package Code
DIP 8
PDA008
002-16909 **
Document Number: 002-04629 Rev. *D
Page 82 of 88
MB95560H Series
MB95570H Series
MB95580H Series
Package Type
Package Code
SOP 8
SOD008
002-15858 **
Document Number: 002-04629 Rev. *D
Page 83 of 88
MB95560H Series
MB95570H Series
MB95580H Series
29. Major Changes In This Edition
Spansion Publication Number: DS702-00010
Page
Section
—
—
Details
Changed the series name.
MB95560H Series  MB95560H/570H/580H Series
Added information on the MB95570H Series.
Added information on the MB95580H Series.
■ PIN CONNECTION
• DBG pin
Revised details of “• DBG pin”.
• RST pin
Revised details of “• RST pin”.
28
• C pin
Corrected the following statement.
The decoupling capacitor for the VCC pin must have a
capacitance larger than CS.

The decoupling capacitor for the VCC pin must have a
capacitance equal to or larger than the capacitance of CS.
39
■ I/O MAP (MB95570H Series)
Corrected the R/W attribute of the CMDR register.
R/W  R
27
Corrected the R/W attribute of the WDTH register.
R/W  R
Corrected the R/W attribute of the WDTL register.
R/W  R
42
■ I/O MAP (MB95580H Series)
Corrected the R/W attribute of the CMDR register.
R/W  R
Corrected the R/W attribute of the WDTH register.
R/W  R
Corrected the R/W attribute of the WDTL register.
R/W  R
46
■ ELECTRICAL CHARACTERISTICS
1. Absolute Maximum Ratings
Corrected the rating of the parameter ““L” level total
maximum output current”.
48  100
Corrected the rating of the parameter ““H” level total
maximum output current”.
48  100
Document Number: 002-04629 Rev. *D
Page 84 of 88
MB95560H Series
MB95570H Series
MB95580H Series
Page
48
Section
Details
2. Recommended Operating Conditions Revised note *2.
The value is 2.88 V when the low-voltage detection reset
is used.

The minimum power supply voltage becomes 2.18 V
when a product with the low-voltage detection reset is
used.
Corrected the following statement in note *3.
The decoupling capacitor for the VCC pin must have a
capacitance larger than CS.

The decoupling capacitor for the VCC pin must have a
capacitance equal to or larger than the capacitance of CS.
Revised the remark in “• DBG/RST/C pins connection
diagram”.
49
3. DC Characteristics
Revised the remark of the parameter “Input leak current
(Hi-Z output leak current)”.
When pull-up resistance is disabled

When the internal pull-up resistor is disabled
Renamed the parameter “Pull-up resistance” to “Internal
pull-up resistor”.
Revised the remark of the parameter “Internal pull-up
resistor”.
When pull-up resistance is enabled

When the internal pull-up resistor is enabled
53
4. AC Characteristics
(1) Clock Timing
Document Number: 002-04629 Rev. *D
Corrected the pin names of the parameter “Input clock
rising time and falling time”.
X0  X0, X0A
X0, X1  X0, X1, X0A, X1A
Page 85 of 88
MB95560H Series
MB95570H Series
MB95580H Series
• Major changes from third edition to fourth edition
Page
Section
23 to 26 ■ HANDLING PRECAUTIONS
Details
New section
35
■ I/O MAP (MB95560H Series)
Corrected the R/W attribute of the CMDR register.
R/W  R
52
■ ELECTRICAL CHARACTERISTICS
4. AC Characteristics
(1) Clock Timing
Corrected the operating conditions of FCRH of the
parameter “Clock frequency”.
0 °C TA <70 °C

0 °C TA 70 °C
70 °C TA <85 °C

70 °C TA 85 °C
Corrected the operating conditions of FMCRPLL of the
parameter “Clock frequency”.
0 °C TA <70 °C

0 °C TA 70 °C
70 °C TA <85 °C

70 °C <TA 85 °C
68
5. A/D Converter
(1) A/D Converter Electrical
Characteristics
Corrected the symbol of the parameter “Zero transition
voltage”.
VOT  V0T
69
5. A/D Converter
(2) Notes on Using A/D Converter
• Analog input equivalent circuit
Corrected the range of VCC.
2.7 V VCC <5.5 V

2.7 V VCC <4.5 V
Corrected the values of R.
3.3 k  1.45 k
5.7 k  2.7 k
70, 71
5. A/D Converter
Corrected the symbol of the zero transition voltage.
(3) Definitions of A/D Converter Terms
VOT  V0T
NOTE: Please see “Document History” about later revised information.
Document Number: 002-04629 Rev. *D
Page 86 of 88
MB95560H Series
MB95570H Series
MB95580H Series
Document History Page
Document Title: MB95560H Series, MB95570H Series, MB95580H Series, New 8FX 8-bit Microcontrollers
Document Number: 002-04629
Revision
ECN
Orig. of
Change
Submission
Date
**
-
AKIH
05/27/2013
Migrated to Cypress and assigned document number 002-04629.
No change to document contents or format.
*A
5193921
AKIH
03/29/2016
Updated to Cypress template
Updated 24.4.3 External Reset
Added MB95F564KPF-G-UNE2, MB95F564KPFT-G-UNE2 in "Ordering Information".
*B
5420206
HTER
02/06/2017
Changed package code as the following in 1.Product Line-up (Page4, 6), 2.Packages And
Corresponding Products (Page 7), 4.Pin Assignment (Page 9 to 10), 27.Ordering Information
(Page 75 to 76) and 28.Package Dimensions (Page 77 to 83).
“LCC-32P-M19” to “WNP032”
“FPT-20P-M09” to “SOJ020”
“FPT-20P-M10” to “STG020”
“FPT-16P-M08” to “STB016”
“FPT-16P-M23” to “SO016”
“DIP-8P-M03” to “PDA008”
“FPT-8P-M08” to “SOD008”
Added Part number “MB95F564KPFT-G-UNERE2, MB95F562KPFT-G-UNERE2,
MB95F563KPFT-G-UNERE2” in 27.Ordering Information (Page 75).
Deleted Part number “MB95F564KPF-G-SNE2, MB95F564KPFT-G-SNE2” in 27.Ordering Information (Page 75).
*C
5761469
AESATP12
06/08/2017
Updated logo and copyright.
*D
5895915
HUAL
09/27/2017
Added Part number “MB95F563HPFT-G-UNERE2” and Packing information in 27.Ordering
Information (Page 75).
Document Number: 002-04629 Rev. *D
Description of Change
Page 87 of 88
MB95560H Series
MB95570H Series
MB95580H Series
Sales, Solutions, and Legal Information
Worldwide Sales and Design Support
Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office
closest to you, visit us at Cypress Locations.
Products
PSoC® Solutions
ARM® Cortex® Microcontrollers
Automotive
cypress.com/arm
cypress.com/automotive
Clocks & Buffers
Interface
cypress.com/clocks
cypress.com/interface
Internet of Things
Memory
cypress.com/iot
cypress.com/memory
Microcontrollers
cypress.com/mcu
PSoC
cypress.com/psoc
Powermanagement ICs
Cypress Developer Community
Forums | WICED IOT Forums | Projects | Video | Blogs |
Training | Components
Technical Support
cypress.com/support
cypress.com/pmic
Touch Sensing
cypress.com/touch
USB Controllers
Wireless/Connectivity
PSoC 1 | PSoC 3 | PSoC 4 | PSoC 5LP| PSoC 6
cypress.com/usb
cypress.com/wireless
© Cypress Semiconductor Corporation, 2011-2017. This document is the property of Cypress Semiconductor Corporation and its subsidiaries, including Spansion LLC ("Cypress"). This document,
including any software or firmware included or referenced in this document ("Software"), is owned by Cypress under the intellectual property laws and treaties of the United States and other
countries worldwide. Cypress reserves all rights under such laws and treaties and does not, except as specifically stated in this paragraph, grant any license under its patents, copyrights,
trademarks, or other intellectual property rights. If the Software is not accompanied by a license agreement and you do not otherwise have a written agreement with Cypress governing the use of the
Software, then Cypress hereby grants you a personal, non-exclusive, nontransferable license (without the right to sublicense) (1) under its copyright rights in the Software (a) for Software provided
in source code form, to modify and reproduce the Software solely for use with Cypress hardware products, only internally within your organization, and (b) to distribute the Software in binary code form
externally to end users (either directly or indirectly through resellers and distributors), solely for use on Cypress hardware product units, and (2) under those claims of Cypress's patents that are
infringed by the Software (as provided by Cypress, unmodified) to make, use, distribute, and import the Software solely for use with Cypress hardware products. Any other use, reproduction,
modification, translation, or compilation of the Software is prohibited.
TO THE EXTENT PERMITTED BY APPLICABLE LAW, CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS DOCUMENT OR ANY SOFTWARE
OR ACCOMPANYING HARDWARE, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. To the extent
permitted by applicable law, Cypress reserves the right to make changes to this document without further notice. Cypress does not assume any liability arising out of the application or use of any
product or circuit described in this document. Any information provided in this document, including any sample design information or programming code, is provided only for reference purposes. It is
the responsibility of the user of this document to properly design, program, and test the functionality and safety of any application made of this information and any resulting product. Cypress products
are not designed, intended, or authorized for use as critical components in systems designed or intended for the operation of weapons, weapons systems, nuclear installations, life-support devices or
systems, other medical devices or systems (including resuscitation equipment and surgical implants), pollution control or hazardous substances management, or other uses where the failure of the
device or system could cause personal injury, death, or property damage ("Unintended Uses"). A critical component is any component of a device or system whose failure to perform can be reasonably
expected to cause the failure of the device or system, or to affect its safety or effectiveness. Cypress is not liable, in whole or in part, and you shall and hereby do release Cypress from any claim,
damage, or other liability arising from or related to all Unintended Uses of Cypress products. You shall indemnify and hold Cypress harmless from and against all claims, costs, damages, and other
liabilities, including claims for personal injury or death, arising from or related to any Unintended Uses of Cypress products.
Cypress, the Cypress logo, Spansion, the Spansion logo, and combinations thereof, WICED, PSoC, CapSense, EZ-USB, F-RAM, and Traveo are trademarks or registered trademarks of Cypress in
the United States and other countries. For a more complete list of Cypress trademarks, visit cypress.com. Other names and brands may be claimed as property of their respective owners.
Document Number: 002-04629 Rev. *D
Revised September 27, 2017
Page 88 of 88
Similar pages