NXP LPC4333JET100 Errata sheet lpc435x/3x/2x/1x Datasheet

ES_LPC435x/3x/2x/1x
Errata sheet LPC435x/3x/2x/1x
Rev. 2 — 20 October 2012
Errata sheet
Document information
Info
Content
Keywords
LPC4357FET256; LPC4357JET256; LPC4357JBD208; LPC4353FET256;
LPC4353JET256; LPC4353JBD208; LPC4337FET256; LPC4337JET256;
LPC4337JBD144; LPC4337JET100; LPC4333FET256; LPC4333JET256;
LPC4333JBD144; LPC4333JET100; LPC4327JBD144; LPC4327JET100;
LPC4325JBD144; LPC4325JET100; LPC4323JBD144; LPC4323JET100;
LPC4322JBD144; LPC4322JET100; LPC4317JBD144; LPC4317JET100;
LPC4315JBD144; LPC4315JET100; LPC4313JBD144; LPC4313JET100;
LPC4312JBD144; LPC4312JET100 errata
Abstract
This errata sheet describes both the known functional problems and any
deviations from the electrical specifications known at the release date of
this document.
Each deviation is assigned a number and its history is tracked in a table.
ES_LPC435x/3x/2x/1x
NXP Semiconductors
Errata sheet LPC435x/3x/2x/1x
Revision history
Rev
Date
2
20121020
1.1
1
Description
20120808
20120717
•
•
•
•
•
•
•
•
Added PWR.1, IRC.1.
Removed AES.1, ETM.1, RGU.1, SPIFI.1; documented in user manual.
Updated EEPROM.1, C_CAN.1, IBAT.1.
Added LPC432x and LPC431x parts.
Document title changed from ES_LPC4357_53_37_33 to ES_LPC435X_3X_2X_1X.
Added RGU.1 and EEPROM.1.
Corrected C_CAN0/C_CAN1 peripheral assignment.
Initial version.
Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
ES_LPC435X_3X_2X_1X
Errata sheet
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Rev. 2 — 20 October 2012
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ES_LPC435x/3x/2x/1x
NXP Semiconductors
Errata sheet LPC435x/3x/2x/1x
1. Product identification
The LPC435x/3x/2x/1x devices (hereafter referred to as ‘LPC43xx’) typically have the
following top-side marking:
LPC43xxxxxxxx
xxxxxxxx
xxxYYWWxR[x]
The last/second to last letter in the last line (field ‘R’) will identify the device revision. This
Errata Sheet covers the following revisions of the LPC43xx:
Table 1.
Device revision table
Revision identifier (R)
Revision description
‘-’
Initial device revision
Field ‘YY’ states the year the device was manufactured. Field ‘WW’ states the week the
device was manufactured during that year.
2. Errata overview
Table 2.
Functional problems table
Functional
problems
Short description
Revision identifier
Detailed description
C_CAN.1
Writes to CAN registers write through to other
peripherals
‘-’
Section 3.1
EEPROM.1
Limited EEPROM retention and endurance
‘-’ (with date code
<1242)
Section 3.2
MCPWM.1
MCPWM abort pin not functional
‘-’
Section 3.3
PMC.1
PMC.x power management controller fails to wake up
from deep sleep, power down, or deep power down
‘-’
Section 3.4
Table 3.
AC/DC deviations table
AC/DC
deviations
Short description
Product version(s)
Detailed description
IBAT.1
VBAT supply current higher than expected
‘-’
Section 4.1
IRC.1
IRC frequency variation higher than expected
‘-’
Section 4.2
PWR.1
Higher than expected IO current
‘-’
Section 4.3
Table 4.
Errata notes table
Errata notes
Short description
Revision identifier
Detailed description
n/a
n/a
n/a
n/a
ES_LPC435X_3X_2X_1X
Errata sheet
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Errata sheet LPC435x/3x/2x/1x
3. Functional problems detail
3.1 C_CAN.1: Writes to CAN registers write through to other peripherals
Introduction:
Controller Area Network (CAN) is the definition of a high performance communication
protocol for serial data communication. The C_CAN controller is designed to provide a full
implementation of the CAN protocol according to the CAN Specification Version 2.0B. The
C_CAN controller allows to build powerful local networks with low-cost multiplex wiring by
supporting distributed real-time control with a very high level of security.
Problem:
On the LPC43xx, there is an issue with the C_CAN controller AHB bus address decoding
that applies to both C_CAN controllers. It affects the C_CAN controllers when peripherals
on the same bus are used. Writes to the ADC, DAC, I2C, and I2S peripherals can update
registers in the C_CAN controller. Specifically, writes to I2C0, MCPWM, and I2S can affect
C_CAN1. Writes to I2C1, DAC, ADC0, and ADC1 can affect C_CAN0. The spurious
C_CAN controller writes will occur at the address offset written to the other peripherals on
the same bus. For example, a write to ADC0 CR register which is at offset 0 in the ADC,
will result in the same value being written to the C_CAN0 CNTL register which is at offset
0 in the C_CAN controller. Writes to the C_CAN controller will not affect other peripherals.
Work-around:
Workarounds include: Using a different C_CAN peripheral. Peripherals I2C1, DAC, ADC0,
and ADC1 can be used at the same time as C_CAN1 is active without any interference.
The I2C0, MCPWM, and I2S peripherals can be used at the same time as C_CAN0 is
active without any interference. Another workaround is to gate the register clock to the
CAN peripheral in the CCU. This will prevent any writes to other peripherals from taking
effect in the CAN peripheral. However, gating the CAN clock will prevent the CAN
peripheral from operating and transmitting or receiving messages. This workaround is
most useful if your application is modal and can switch between different modes such as
an I2S mode and a CAN mode. Another workaround is to avoid writes to the peripherals
while CAN is active. For example, the ADC could be configured to sample continuously or
when triggered by a timer, before the CAN is configured. Afterwards, C_CAN0 can be
used since the ADC will operate without requiring additional writes.
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Errata sheet
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Rev. 2 — 20 October 2012
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ES_LPC435x/3x/2x/1x
Errata sheet LPC435x/3x/2x/1x
3.2 EEPROM.1: Limited EEPROM retention and endurance
Introduction:
The LPC43xx contain a 16384 byte EEPROM memory with endurance of > 100 k erase /
program cycles.
Problem:
On the LPC43xx LBGA parts with date code <1242, EEPROM endurance and retention
may be less than specified. All newer parts will have fully tested EEPROMs.
Work-around:
Using longer EEPROM write times will increase retention.
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Errata sheet
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Rev. 2 — 20 October 2012
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Errata sheet LPC435x/3x/2x/1x
3.3 MCPWM.1: MCPWM Abort pin is not functional
Introduction:
The Motor Control PWM engine is optimized for three-phase AC and DC motor control
applications, but can be used in many other applications that need timing, counting,
capture, and comparison. The MCPWM contains a global Abort input that can force all of
the channels into a passive state and cause an interrupt.
Problem:
The MCPWM Abort input is not functional.
Work-around:
The MCPWM Abort function can be emulated in software with the use of a non-maskable
interrupt combined with an interrupt handler that shuts down the PWM. This will result in a
small delay on the order of 50 main clock cycles or about 1/3 of a microsecond at
150 MHz. Alternatively, the State Configurable Timer (SCT) can be configured to
implement MCPWM functionality including an Abort input. The SCT can respond to
external inputs in one clock cycle.
ES_LPC435X_3X_2X_1X
Errata sheet
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Rev. 2 — 20 October 2012
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Errata sheet LPC435x/3x/2x/1x
3.4 PMC.1: PMC.x power management controller fails to wake up from
Deep Sleep, Power Down, or Deep Power Down
Introduction:
The PMC implements the control sequences to enable transitioning between different
power modes and controls the power state of each peripheral. In addition, wake-up from
any of the power-down modes based on hardware events is supported.
Problem:
When the chip is in a transition from active to Deep Sleep, Power Down, or Deep Power
Down, wakeup events are not captured and they will block further wakeup events from
propagating. The time window for this transition is 6 uS and is not affected by the chip
clock speed. After a wakeup event is received during the PMC transition, the chip can only
recover by using an external hardware reset or by cycling power.
Work-around:
Make sure that a wakeup signal is not received during the Deep Sleep, Power Down, or
Deep Power Down transition period. An example circuit to work around this could include
an external 6 uS one shot which could be triggered via software using a GPIO line when
entering Deep Sleep, Power Down, or Deep Power Down mode. The one-shot's output
could be used to gate the wakeup signal(s) to prevent receiving a wakeup signal during
the PMC transition period. Depending on the system design, it may also be needed to
latch the wakeup signal(s) so that they will still be present after the one-shot's 6 uS
timeout.
Run mode
PMC transition period
6 us
PMC state
Keep-out area
Low power mode
PMC software
trigger
Wakeup signal
asserted (ok)
Fig 1.
ES_LPC435X_3X_2X_1X
Errata sheet
PMC wakeup keep-out area
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Errata sheet LPC435x/3x/2x/1x
4. AC/DC deviations detail
4.1 IBAT.1: VBAT supply current higher than expected
Introduction:
The LPC43xx contain a Real-Time Clock which measures the passage of time. The RTC
has an ultra-low power design to support battery powered systems with a dedicated
battery supply pin.
Problem:
On the LPC43xx, high current consumption of about 70 uA or higher may occur on the
VBAT power supply pin due to current drain from the RTC_ALARM and SAMPLE pins.
On the LPC43xx, at temperatures lower than 0 C, high current consumption up to 25 uA
may occur on the VBAT power supply pin while VDD is present if VDD < VBAT. This is
seen during Deep Sleep, Power Down, and Deep Power Down modes.
Work-around:
VBAT current consumption due to RTC_ALARM and SAMPLE pins can be lowered
significantly by configuring the RTC_ALARM pin and SAMPLE pins as "Inactive" by
setting the ALARMCTRL 7:6 field in CREG0 to 0x3 and the SAMPLECTRL 13:12 field in
CREG0 to 0x3. These bits persist through power cycles and reset, as long as VBAT is
present.
To work-around the current consumption at temperatures less than 0 C, keep the VBAT
voltage less than VDD. For example, use a 3.0 V VBAT voltage with a 3.3 V VDD supply.
This also avoids current consumption during active mode which can occur when VBAT >
VDD (see datasheet for details).
4.2 IRC.1: IRC frequency variation higher than expected
Introduction:
The IRC is used as the clock source for the WWDT and/or as the clock that drives the
PLLs and the CPU. The nominal IRC frequency is 12 MHz. The IRC is trimmed to 1 %
accuracy over the entire voltage and temperature range.
Problem:
On LPC43xx flash-based parts, the IRC currently has a non-linear behavior at high
temperatures. This results in worse IRC accuracy than specified in the Data Sheet.
Work-around:
Many of the peripherals on these parts require use of an external crystal to meet timing
accuracy even at the specified accuracy. The IRC is typically used during boot up and
during UART and CAN In-Application Programming. It is recommended to avoid use of
UART and CAN IAP at elevated temperatures to ensure accuracy.
ES_LPC435X_3X_2X_1X
Errata sheet
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Rev. 2 — 20 October 2012
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NXP Semiconductors
Errata sheet LPC435x/3x/2x/1x
Table 5.
Errata sheet spec: ±2 %
Tamb = +55 C to +85 C; 2.2 V  VDD(REG)(3V3)  3.6 V.[1]
Symbol
Parameter
Conditions
Min
Typ[2]
Max
Unit
fosc(RC)
internal RC oscillator
frequency
-
11.76
12.00
12.24
MHz
Table 6.
Errata sheet spec: ±3.5 %
Tamb = +85 C to +105 C; 2.2 V  VDD(REG)(3V3)  3.6 V.[1]
Symbol
Parameter
Conditions
Min
Typ[2]
Max
Unit
fosc(RC)
internal RC oscillator
frequency
-
11.58
12.00
12.42
MHz
[1]
Parameters are valid over operating temperature range unless otherwise specified.
[2]
Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply
voltages.
4.3 PWR.1: Higher than expected IO current
Introduction:
The LPC43xx contain several low-power modes.
Problem:
On the LPC43xx, high current consumption of about 70 uA or higher may occur on the
VDDIO power supply pin in the 256 BGA package.
Work-around:
In Deep Power Down mode the VDDREG, VDDA and VDDIO supplies can be powered off
to reduce those supply currents to zero. In other modes no work-around is possible.
5. Errata notes detail
5.1 n/a
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Errata sheet LPC435x/3x/2x/1x
6. Legal information
6.1
Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
6.2
Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
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punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
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Notwithstanding any damages that customer might incur for any reason
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Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
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authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
ES_LPC435X_3X_2X_1X
Errata sheet
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
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Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
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6.3
Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
All information provided in this document is subject to legal disclaimers.
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Errata sheet LPC435x/3x/2x/1x
7. Contents
1
2
3
3.1
3.2
3.3
3.4
4
4.1
4.2
4.3
5
5.1
6
6.1
6.2
6.3
7
Product identification . . . . . . . . . . . . . . . . . . . . 3
Errata overview . . . . . . . . . . . . . . . . . . . . . . . . . 3
Functional problems detail . . . . . . . . . . . . . . . . 4
C_CAN.1: Writes to CAN registers write through
to other peripherals. . . . . . . . . . . . . . . . . . . . . . 4
Introduction: . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
Problem: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
Work-around: . . . . . . . . . . . . . . . . . . . . . . . . . . .4
EEPROM.1: Limited EEPROM retention and
endurance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Introduction: . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
Problem: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
Work-around: . . . . . . . . . . . . . . . . . . . . . . . . . . .5
MCPWM.1: MCPWM Abort pin is not functional 6
Introduction: . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Problem: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Work-around: . . . . . . . . . . . . . . . . . . . . . . . . . . .6
PMC.1: PMC.x power management controller fails
to wake up from Deep Sleep, Power Down, or
Deep Power Down . . . . . . . . . . . . . . . . . . . . . . 7
Introduction: . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Problem: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Work-around: . . . . . . . . . . . . . . . . . . . . . . . . . . .7
AC/DC deviations detail . . . . . . . . . . . . . . . . . . 8
IBAT.1: VBAT supply current higher than
expected . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Introduction: . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Problem: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Work-around: . . . . . . . . . . . . . . . . . . . . . . . . . . .8
IRC.1: IRC frequency variation higher than
expected . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Introduction: . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Problem: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Work-around: . . . . . . . . . . . . . . . . . . . . . . . . . . .8
PWR.1: Higher than expected IO current . . . . . 9
Introduction: . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
Problem: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
Work-around: . . . . . . . . . . . . . . . . . . . . . . . . . . .9
Errata notes detail . . . . . . . . . . . . . . . . . . . . . . . 9
n/a. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Legal information. . . . . . . . . . . . . . . . . . . . . . . 10
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2012.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 20 October 2012
Document identifier: ES_LPC435X_3X_2X_1X
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