LITEON LTS-5325CKR-P Led display Datasheet

LED Display
Product Data Sheet
LTS-5325CKR-P
Spec No.: DS30-2013-0047
Effective Date: 06/07/2013
Revision: -
LITE-ON DCC
RELEASE
BNS-OD-FC001/A4
LITE-ON Technology Corp. / Optoelectronics
No.90,Chien 1 Road, Chung Ho, New Taipei City 23585, Taiwan, R.O.C.
Tel: 886-2-2222-6181 Fax: 886-2-2221-1948 / 886-2-2221-0660
http://www.liteon.com/opto
LITE-ON TECHNOLOGY CORPORATION
Property of Lite-on Only
LED DISPLAY
LTS-5325CKR-P
DATA SHEET
ITEM
1
Description
New Spec
PART NO.: LTS-5325CKR-P
BNS-OD-C131/A4
By
Reo Lin
PAGE:
DATE
2013/01/31
1 of 10
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Property of Lite-on Only
FEATURES
*0.56 inch (14.22 mm) DIGIT HEIGHT
*CONTINUOUS UNIFORM SEGMENTS
*LOW POWER REQUIREMENT
*EXCELLENT CHARACTERS APPEARANCE
*HIGH BRIGHTNESS & HIGH CONTRAST
*WIDE VIEWING ANGLE
*SOLID STATE RELIABILITY
*CATEGORIZED FOR LUMINOUS INTENSITY
DESCRIPTION
The LTS-5325CKR-P is a 0.56 inch (14.22 mm) digit height single digit
SMD display. This device utilizes AllnGaP SUPER RED LED chips
which are made from AlInGaP on a non-transparent GaAs substrate.
The display has gray face and white segments.
DEVICE
PART NO.
AllnGaP SUPER RED
LTS-5325CKR-P
PART NO.: LTS-5325CKR-P
BNS-OD-C131/A4
DESCRIPTION
Common Cathode
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PACKAGE DIMENSIONS
Solder Pad Vs Painting Diagram
P la stic b u rr
0 .1 4 m m M a x
P a in tin g
0 .1 4 m m
P a in tin g 4 0 0 μ in ch
A u 4 μ in ch
S o ld e r P a d
PCB
N i 1 5 0 μ in ch M in
R e fle cto r
C u 1 2 0 0 μ in ch M in
S c a le : 5 :1
NOTES:
1. Plastic pins’ burr maximum 0.14 mm, warping of PCB maximum 0.06 mm.
2. All dimensions are in millimeters. Tolerances are  0.25mm (0.01“) unless otherwise noted.
3. Solder pad materials and thickness: Cu: 1200μinch Ni: Min 150μinch Au: 4μinch.
PART NO.: LTS-5325CKR-P
BNS-OD-C131/A4
PAGE:
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INTERNAL CIRCUIT DIAGRAM
PIN CONNECTION
No.
CONNECTION
1
ANODE E
2
3
D
COMMON CATHODE
4
ANODE
5
ANODE DP
6
ANODE
B
7
ANODE
A
8
C
COMMON CATHODE
9
ANODE
F
10
ANODE
G
PART NO.: LTS-5325CKR-P
BNS-OD-C131/A4
ANODE
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ABSOLUTE MAXIMUM RATING AT Ta = 25°C
PARAMETER
MAXIMUM RATING
UNIT
Power Dissipation Per Segment
70
mW
Peak Forward Current Per Segment
(Frequency 1Khz,10% duty cycle )
60
mA
25
mA
mA/°C
Continuous Forward Current Per Segment
Forward Current Derating from 25°C
0.28
-35°C to +105°C
Operating Temperature Range
-35°C to +105°C
Storage Temperature Range
Soldering Conditions: 1/16 inch Below Seating Plane for 3 Seconds at 260°C
ELECTRICAL / OPTICAL CHARACTERISTICS AT Ta = 25°C
PARAMETER
SYMBOL MIN. TYP. MAX. UNIT TEST CONDITION
321
1050
μcd
IF=1mA
Luminous Intensity
IV
Peak Emission Wavelength
p
639
nm
IF=20mA
Spectral Line Half-Width

20
nm
IF=20mA
Dominant Wavelength
d
631
nm
IF=20mA
Forward Voltage Per Segment
VF
2.0
2.6
V
IF=20mA
Reverse Current Per Segment(2)
IR
100
uA
VR=5V
IV-m
2:1
Luminous Intensity Matching Ratio
13650
IF=10mA
IF=1mA
Note:
1. Luminous intensity is measured with a light sensor and filter combination that approximates
the CIE (Commision Internationale De L’Eclairage) eye-response curve.
2. Reverse voltage is only for IR test. It can not continue to operate at this situation.
3. Cross talk specification ≦ 2.5 %
PART NO.: LTS-5325CKR-P
BNS-OD-C131/A4
PAGE:
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TYPICAL ELECTRICAL / OPTICAL CHARACTERISTIC CURVES
(25oC Ambient Temperature Unless Otherwise Noted)
PART NO.: LTS-5325CKR-P
BNS-OD-C131/A4
PAGE:
6 of 10
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SMT SOLDERING INSTRUCTION
(Number of reflow process shall be less than 2 times, and cooling process to normal temperature is
required between the first and the second soldering process)
Note:
1. Recommended soldering condition:
Reflow Soldering (Two times only)
Pre-heat:
120~150°C
Pre-heat time:
120sec. Max.
Peak temperature:
260°C Max.
Soldering time:
5sec. Max.
Soldering Iron (One time only)
Temperature
300°C Max.
Soldering time
3sec. Max.
2. Number of reflow process shall be less than 2 times, and cooling process to normal temperature is
required between the first and the second soldering process.
PART NO.: LTS-5325CKR-P
BNS-OD-C131/A4
PAGE:
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RECOMMENDED SOLDERING PATTERN (UNIT: MM)
PACKING REEL DIMENSIONS
5 6
01
1
1112
02
03
00
05
04
PS
6
8 9 10
2 34
7
PART NO.: LTS-5325CKR-P
BNS-OD-C131/A4
PAGE:
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PACKING CARRIER DIMENSIONS
1. Taping parts:
1.
2.
3.
4.
5.
6.
7.
1 0 sp ro ck et h o le p itch cu m ulative tolerance ± 0.20.
C arrier cam b er is w ithin 1 m m in 250 m m .
M aterial : B lack C o n d u ctive P olystyrene A lloy.
A ll d im en sio n s m eet E IA -481-D requirem ents.
T h ickn ess : 0.30 ± 0 .0 5m m .
P ack in g leng th p er 2 2" reel : 44 .5 M eters.(1 :3)
C o m p on en t lo ad p er 1 3" reel : 70 0 pcs.
2. Trailer part/ Leader part:
(40m m M IN .)
(400m m M IN .)
(40m m M IN .)
D IR E C T IO N O F P U L L IN G O U T
PART NO.: LTS-5325CKR-P
BNS-OD-C131/A4
PAGE:
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MOISTURE PROOF PACKAGING
All N/D SMD displays are shipped in moisture proof package. The displays should be stored at 30°C or
less and 90% RH or less. Once the package opened, moisture absorption begins.
UNITS IN A SEALED
MOISTURE-PROOF
PACKAGE
PACKAGE IS
OPENED (UNSEALED)
ENVIRONMENT LESS
THAN 30oC, AND
LESS THAN 60% RH?
YES
BAKING IS NOT
NECESSARY
NO
PACKAGE IS
OPENED MORE
THAN 1 WEEK
DAYS?
NO
YES
PERFORM
RECOMMENDED
BAKING CONDITIONS
Baking Conditions
If the parts are not stored in dry conditions, they must be baked before reflow to prevent damage to the
parts.
Package
Temperature
Time
In Reel
≧48hours
60°C
≧4hours
100°C
In Bulk
≧2hours
125°C
Baking should only be done once.
PART NO.: LTS-5325CKR-P
BNS-OD-C131/A4
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