Material Content Data Sheet Sales Product Name BFS 17W H6327 MA# MA000858900 Package PG-SOT323-3-1 Issued Weight* Construction Element Material Group Substances CAS# if applicable chip non noble metal noble metal inorganic material inorganic material non noble metal non noble metal non noble metal non noble metal organic material plastics inorganic material non noble metal noble metal < 10% arsenic gold silicon silicon titanium chromium copper copper carbon black epoxy resin silicondioxide tin silver 7440-38-2 7440-57-5 7440-21-3 7440-21-3 7440-32-6 7440-47-3 7440-50-8 7440-50-8 1333-86-4 60676-86-0 7440-31-5 7440-22-4 leadframe wire encapsulation leadfinish plating *deviation 29. August 2013 Weight [mg] 5.96 mg Average Mass [%] Sum [%] Average Mass [ppm] 0.000 0.00 14 0.008 0.14 1402 0.029 0.48 0.001 0.01 0.003 0.04 441 0.008 0.13 1323 2.617 43.91 44.09 439060 440913 0.005 0.09 0.09 888 888 0.031 0.53 0.677 11.35 2.439 40.92 52.80 409240 528051 0.133 2.23 2.23 22264 22264 0.010 0.17 0.17 1680 0.62 4789 2. 3. 5280 113531 Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 6205 88 Important Remarks: 1. Sum [ppm] 1680 1000000