BAL-CW1250D3 50 Ω nominal input / conjugate match balun to CW1250/CW1260/CW1150/CW1160, with integrated harmonic filter Description STMicroelectronics BAL-CW1250D3 is a balun (balanced/unbalanced device) designed to transform a single ended signal to differential signals in WLAN application. This BAL-CW1250D3, with low insertion losses in the bandwidth 2400 MHz to 2500 MHz, has been customized for CW1250, CW1150, CW1260, CW1160 transceiver. The differential output embeds an integrated matching network adapted to the transceiver. Lead-free Flip-Chip package 5 bumps Datasheet − production data Features • 50 Ω nominal input / match ST-Ericsson RF IC CW1250, CW1150, CW1260, CW1160 The BAL-CW1250D3 has been designed using STMicroelectronics IPD (integrated passive device) technology on non-conductive glass substrate to optimize RF performance. Figure 1. Pinout diagram (top view) • Low insertion loss • Low amplitude imbalance 3 GND 2 1 A SE • Low phase imbalance • DC blocking access on single RF input VCC B 2 • Small footprint: < 1.2 mm DIFF DIFF C Benefits • Extremely low profile (< 550 µm after reflow) • Integrate matching network • High RF performance • RF components count and area reduction Applications • Balun with integrated matching for ST-Ericsson RF IC CW1250, C1150, CW1260 September 2015 This is information on a product in full production. DocID024678 Rev 2 1/10 www.st.com 10 Characteristics 1 BAL-CW1250D3 Characteristics Table 1. Absolute maximum ratings (limiting values) Value Symbol Parameter Unit Min PIN Average power RFIN ESD ratings MIL STD883C (HBM: C = 100 pF, R = 1.5 kΩ, air discharge) VESD TOP Typ Max 24 dBm 2000 ESD ratings charged device model (JESD22-C101-D) 500 ESD ratings machine model (MM: C = 200 pF, R = 25 Ω, L = 500 nH) 200 Operating temperature V -30 to +85 °C Table 2. Impedances (Tamb = 25 °C) Value Symbol Parameter Unit Min ZOUT ZIN Nominal differential output impedance Nominal input impedance Typ Max matched Ω 50 Ω Table 3. RF performance (Tamb = 25 °C) Value Symbol Parameter Unit Min Frequency range (bandwidth) IL Insertion loss in bandwidth 0.97 dB Single ended return loss in bandwidth -21 dB Differential return loss in bandwidth -24 dB RL DIFF 2400 Max F RL SE 2/10 Typ φimb Phase imbalance -10 Aimb Amplitude imbalance -1 Att2f0 2nd harmonic attenuation DocID024678 Rev 2 2500 0.1 -19 MHz 10 ° 1 dB dB BAL-CW1250D3 1.1 Characteristics Measurements Figure 2. Insertion loss Figure 3. Single indeed return loss S21 (dB) -0.90 S11 (dB) -20 -0.92 -22 -0.94 -24 -0.96 -26 -0.98 -28 F (GHz) F (GHz) -30 -1.0 2.40 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 2.41 2.40 2.50 Figure 4. Differential return loss -24 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 2.50 Figure 5. Amplitude imbalance S22 (dB) -0.37 -26 -0.36 -28 -0.35 -30 -0.34 -32 -0.33 -34 -0.32 -36 -0.31 Absolute Aimb (dB) -0.30 -38 F (GHz) -40 2.40 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 2.50 2.41 2.40 Figure 6. Phase imbalance 2.62 F (GHz) -0.29 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 2.50 Figure 7. Second harmonic attenuation Absolute PHimb (deg) -18.5 S21 (dB) 2.60 -19.0 2.58 2.56 -19.5 2.54 -20.0 2.52 2.50 -20.5 2.48 F (GHz) 2.40 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 F (GHz) -21.0 2.46 2.50 2.40 2.41 DocID024678 Rev 2 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 2.50 3/10 Package information 2 BAL-CW1250D3 Package information • Epoxy meets UL94, V0 • Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 2.1 Flip-Chip package information Figure 8. Flip-Chip package outline 7RSYLHZ ' VLGHYLHZ %RWWRPYLHZ $ $ 9&& 6( FFF & ' ',))3 ( & ( *1' ',))1 E ' I' $ Table 4. Flip-Chip package mechanical data Description Parameter Min. Typ. Max. Unit A Bump height + substrate thickness 0.570 0.630 0.690 mm A1 Bump height 0.155 0.205 0.255 mm A2 Substrate thickness 0.400 b Bump diameter 0.215 0.255 0.295 mm D Y dimension of the die 1.150 1.200 1.250 mm D1 Y pitch E X dimension of the die E1 X pitch 0.400 mm fD Distance from bump to edge of die on Y axis 0.105 mm 0.760 0.940 0.990 ccc mm 1.040 0.05 $ 4/10 mm 0.025 DocID024678 Rev 2 mm mm mm BAL-CW1250D3 Package information Figure 9. Footprint PP PP PP $ & % Figure 10. Footprint - 3 mils stencil -non solder mask defined Figure 11. Footprint - 3 mils stencil - solder mask defined &RSSHUSDGGLDPHWHU PUHFRPPHQGHG PPLQLPXP PPD[LPXP 6ROGHUPDVNRSHQLQJ PUHFRPPHQGHG PPLQLPXP PPD[LPXP 6ROGHUPDVNRSHQLQJ PUHFRPPHQGHG PPLQLPXP PPD[LPXP &RSSHUSDGGLDPHWHU PUHFRPPHQGHG PPLQLPXP 6ROGHUVWHQFLORSHQLQJ PUHFRPPHQGHG 6ROGHUVWHQFLORSHQLQJ PUHFRPPHQGHG Figure 12. Footprint - 5 mils stencil -non solder mask defined Figure 13. Footprint - 5 mils stencil - solder mask defined &RSSHUSDGGLDPHWHU PUHFRPPHQGHG PPLQLPXP PPD[LPXP 6ROGHUPDVNRSHQLQJ PUHFRPPHQGHG PPLQLPXP PPD[LPXP 6ROGHUPDVNRSHQLQJ PUHFRPPHQGHG PPLQLPXP PPD[LPXP &RSSHUSDGGLDPHWHU PUHFRPPHQGHG PPLQLPXP 6ROGHUVWHQFLORSHQLQJ PUHFRPPHQGHG 6ROGHUVWHQFLORSHQLQJ PUHFRPPHQGHG GHSHQGLQJRQSDVWHLWFDQJRGRZQWRP GHSHQGLQJRQSDVWHLWFDQJRGRZQWRP DocID024678 Rev 2 5/10 Package information BAL-CW1250D3 Figure 14. Recommended land pattern (used for balun characterization) Figure 15. Marking 6/10 DocID024678 Rev 2 BAL-CW1250D3 Package information Figure 16. Flip-Chip tape and reel specifications Dot identifying Pin A1 location 2.0 Ø 1.50 4.0 8.0 3.5 1.30 ± 0.05 1.75 0.22 ST ST ST xxz yww xxz yww xxz yww 1.09 ± 0.05 4.0 0.71± 0.05 All dimensions are typical values in mm Note: User direction of unreeling More information is available in the STMicroelectronics Application note: AN2348 Flip-Chip: “Package description and recommendations for use” DocID024678 Rev 2 7/10 Application information 3 BAL-CW1250D3 Application information Figure 17. Application schematic 2.4G/5G RF transceiver BAL-CW1250D3 2.4GHz FEM BPF 2.4GHz F 2.4GHz PA Z DIP2450-01D3 5GHz PA Bluetooth Rx/Tx 2.4GHz LNA 5GHz LNA 5GHz FEM Note: BPF50-01D3 More information is available in the application notes: AN2348 Flip-Chip package description and recommendations for use 8/10 DocID024678 Rev 2 BAL-CW1250D3 4 Ordering information Ordering information Table 5. Ordering information 5 Part Number Marking Package Weight Base Qty Delivery Mode BAL-CW1250D3 SG Flip-Chip 1.46 mg 5000 Tape and reel(7”) Revision history Table 6. Document revision history Date Revision Changes 23-May-2013 1 Initial release. 23-Sep-2015 2 Updated Figure 8. Added Figure 10, Figure 11, Figure 12, Figure 13 and Table 4. Reformatted to current standards. DocID024678 Rev 2 9/10 BAL-CW1250D3 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2015 STMicroelectronics – All rights reserved 10/10 DocID024678 Rev 2