KOA LPC9040NATED221M Power chip inductor Datasheet

KOA SPEER ELECTRONICS, INC.
SS-195 R6
AHA 6/29/06
Power Chip Inductors
Type LPC9040N
CERTIFIED
CERTIFIED
1. Scope
This specification shall be applied to the LPC9040N manufactured by KOA Corporation.
2. Dimensions and Construction
B
R
1
Size
D
45°±6°
C
Dimensions inches (mm)
B
C
D
A
F
+.002
9040N
A
ø.354± -.004. .193 Max. .402 Max. .079±.008 .071±.008
(ø9.0 +0.05
(4.9 Max.) (10.2 Max.) (2.0±0.2) (1.8±0.2)
-0.1 )
F
Ferrite
Core
Magnet Ceramic
Wire
Substrate
Electrode
3. Type Designation
The type designation shall be the following form:
New Type
LPC
9040N
A
TED
101
K
Type
Size
Termination
Material
Packaging
Nominal
Inductance
Tolerance
A: SnAg
(Other termination
styles available,
contact factory
for options)
TED: 10" Embossed Plastic
500 pcs/reel
101: 100µH
221: 220µH
152: 1500µH
K: ±10%
M: ±20%
9040N
PAGE 1 OF 4
Bolivar Drive
■
P.O. Box 547
■
Bradford, PA 16701
■
USA
■
814-362-5536
■
Fax 814-362-8883
■
www.koaspeer.com
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.
KOA SPEER ELECTRONICS, INC.
SS-195 R6
4. Standard Applications
Part
Designation
Inductance
(µH)
Inductance
Tolerance
LPC9040NATED100M
LPC9040NATED150K
LPC9040NATED220K
LPC9040NATED330K
LPC9040NATED470K
LPC9040NATED680K
LPC9040NATED101K
LPC9040NATED151K
LPC9040NATED221K
LPC9040NATED331K
LPC9040NATED471K
LPC9040NATED681K
10
15
22
33
47
68
100
150
220
330
470
680
M: ±20%
Quality
Factor
Minimum
(MHz)
40
Self Resonant
Frequency
Minimum
(MHz)
25.0
21.0
15.0
13.5
11.5
10.0
8.0
7.0
5.0
3.3
2.8
1.2
30
20
K: ±10%
10
DC
Resistance
Maximum
(Ω)
0.07
0.09
0.11
0.14
0.20
0.27
0.41
0.55
0.81
1.86
2.07
2.65
Allowable
DC Current
Maximum
(Amps)
1.55
1.40
1.25
1.10
0.99
0.91
0.70
0.60
0.50
0.29
0.22
0.14
Measured
Frequency
(Hz)
10 kHz
5. Rating
No.
1
Item
Nominal inductance range
Specification
10 µ ~ 680 µ H (E-6 series)
Heat fluctuation of DC resistance shall be calculated to 20°C using 0.4% for each 1°C. Measuring Conditions: Normal testing is
conducted at normal temperatures (5°C ~ 35°C) and at nominal humidity (45% ~ 85% R. H.). If there is concern, the test may be
conducted at a temperature of 20 ± 2°C and at a relative humidity of 65 ± 5% R. H.
6. Environmental Characteristics
No.
1
2
3
4
Item
High temperature, leaving test
Low temperature, leaving test
Moisture leaving test
Heat shock test
Test Methods
85 ± 2°C 500 Hr
-40 ± 2°C 500 Hr
40 ± 2°C 90 ~ 95% R. H. 500 Hr
-25 ± 2°C/0.5 Hr
85 ± 2°C/0.5 Hr
85°C
0.5 Hr
100 cycles -25°C
2 hours in each direction of X, Y, Z at a frequency
range of 10 ~ 55 Hz with 1.5 mm /min.
Standard
Within ± 5%
Within ± 5%
Within ± 5%
Within ± 5%
5
Vibration test
6
7
8
9
Temperature Characteristics
Operating temperature range
Storage temperature range
Resistance to soldering heat
-40°C/+85°C Reference to L at +25°C
Within ± 10%
-30°C ~ +80°C
-40°C ~ +85°C
With the temperature of the solder at 260 ±5°C,
soak for 10 ± 1 seconds. There shall be no abnormalities.
10
Resistance to solvent
MIL-STD-202F Method 215
Within ± 5%
There shall be no abnormalities under the above conditions.
Measurement: Inductance HIOKI 3520 DC Superposed characteristics LCR Meter YHP 4262A DC Resistance HIOKI 3520
Frequency: Inductance 1 KHz DC Superposed characteristics 10 KHz
PAGE 2 OF 4
Bolivar Drive
■
P.O. Box 547
■
Bradford, PA 16701
■
USA
■
814-362-5536
■
Fax 814-362-8883
■
www.koaspeer.com
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.
KOA SPEER ELECTRONICS, INC.
SS-195 R6
7. Packaging
7.1 Direction of Travel
Perform taping so that the grooved section (R1)
is in the opposite direction of travel.
7.2 Taping
The tapes for taping shall be embossed carrier tapes of 16 mm width
and 12 mm pitches. The standard quantity per reel shall be 500 pieces.
7.5 Markings
Top tape seperation strength: 20 ~ 70 g.
The following information is provided
on the reel.
2.0 ± 0.05
4.0 ± 0.1
ø1.5+0.1
-0
2.0 ± 0.05
7.5 ± 0.05
1.75 ± 0.05
7.3 Dimensions of Carrier Tape
Terminal 1
start
ø4.0 ± 0.1
(1) Product name (2) Part number (3) Quality
(4) Lot number (5) Manufacture origin
2.2 ± 0.1
2 ± 0.5
(unit: mm)
ø13
± 0.5
16.0 ± 0.3
ø80
+0
ø9.4-0.2 Terminal 2
45°
0.3
± 0.1
ø21 ± 0.8
ø380
+0
2.0-0.2
+0
1.0-0.2
12.0 ± 0.1
17.0
2.0
(unit: mm)
7.6 Packaging Method
A specially designed cardboard box is used
for the external packaging and can hold a
maximum of 15 reels.
7.4 Packaging Method
End
...
...
... ..
... ..
Empty
Filled
40 mm min.
Heat
...
...
Empty
7.7 Lot Number
(Example) January 21, 2006
Tape leader
500 pieces 50 mm min. 150 mm min.
Feed Direction
41
21
Year and
Month of
Manufacture
D
K
Manufacture
Day of
Plant
Manufacture
Additional
Number
41...2006.1 42...2006.2 43...2006.3
PAGE 3 OF 4
Bolivar Drive
■
P.O. Box 547
■
Bradford, PA 16701
■
USA
■
814-362-5536
■
Fax 814-362-8883
■
www.koaspeer.com
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.
KOA SPEER ELECTRONICS, INC.
SS-195 R6
8.4 Cleaning
8. General Information
There is no problem using organic solvents.
Since these chip inductors are a coil of
ultra-thin wire, they are susceptible to
vibration. If an ultrasonic cleaning unit is
used, check for any possibility of problem
generation before practical use, since such
cleaning units differ considerably in vibration
level and mode. Although the conditions
vary depending on the printed board size,
Ultrasonic cleaning is generally used in
the conditions described in the following
examples:
8.1 Storage
Chip inductors shall not be stored under high
temperature and high humidity conditions.
Especially, do not store taping where they are
exposed to heat or direct sunlight, otherwise,
material may be deformed, causing problems
during mounting.
8.2 Mounting
Placement force should not be excessive.
8.3 Soldering
When using a soldering iron, temperature
shall not exceed 350°C and within 3 seconds.
Soldering iron time shall be allowed only one
time. After soldering, chip inductors shall not
be stressed excessively.
9. Soldering
Power:
Within 20W/L
Cleaning times: Within 5 minutes
8.5 Pattern Design
When low or more chip inductors are closely
mounted, they must be separated by means
of solder resists to prevent excessive solder.
10. Land Pattern
Design
9.1 Conditions for
Reflow Soldering
11. Packaging Box
(unit: mm)
(unit: mm)
Content marking
230
380
Temperature (°C)
The time and temperature
for reflow solder applications
are as shown below.
200
4.0 ± 0.2
160
Time
Within 90
seconds
Within 30
seconds
Within 45
seconds
3.0 ± 0.2
Within 6
seconds
380
7
2.6 ± 0.2
PAGE 4 OF 4
Bolivar Drive
■
P.O. Box 547
■
Bradford, PA 16701
■
USA
■
814-362-5536
■
Fax 814-362-8883
■
www.koaspeer.com
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.
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